TW501170B - Wafer washing apparatus and its spray head - Google Patents

Abstract

This invention provides a wafer washing apparatus and its spray head, in which the wafer washing apparatus is used to wash clean wafers consisting of a pedestal, a spray head, an ultrasonic controller and a pulse pressure controller. The pedestal is used to sustain the wafer. The spray head has a relative movement relationship with the pedestal and is used to spray water onto the wafer. The ultrasonic controller, the pulse pressure controller and the spray head are electrically connected so that the spray head can produce ultrasonic water spray or pulse water spray. There are a plural number of spray holes on the surface of the spray head facing the wafer and the water sprayed from the spray holes can cover the whole wafer surface during the relative movement between the spray head and the wafer. Moreover, there are a plural number of parallel metal lines formed on the wafer and the direction of water spray from the spray head is parallel with the direction of the formed metal lines. Through the use of the construction and arrangement of the inventive spray head, the wafer washing apparatus can wash the wafer more thoroughly and can prevent the wafer from damage during washing.

Description

501170 V. Description of the invention (1) The present invention relates to a wafer cleaning device and a spray head, and particularly to a wafer cleaning device and a wafer cleaning device capable of thoroughly cleaning the wafer without damaging the wafer. Spray head. In semiconductor manufacturing, wafer cleaning is particularly important. Its purpose is to remove metal impurities, organic contamination, and fine dust, and to consider the surface roughness and the removal of possible natural oxides. At present, many wafer cleaning equipment have been proposed. Among them, single wafer cleaning equipment has high process environment control capability and fine particle removal rate. It has a small footprint, a small amount of chemicals and pure water, and is extremely flexible. Process adjustment capabilities etc. have become the mainstream of fab cleaning equipment. Figure 1a shows a conventional single-wafer cleaning device. A wafer 2 is placed on a rotating chuck 1. The rotating chuck 1 can rotate as an arrow A, and a spray head 3 is used to spray water to the wafer. It is on circle 2 and can move like arrow b. When the wafer is cleaned by the single-wafer cleaning device shown in FIG. 1a, the wafer 2 is displayed as shown in FIG. 1b because the wafer 2 is rotated while the jet head 3 is being moved. Water spray mode 3 1. The following describes the shortcomings of the conventional equipment with reference to Figure 1b: 1 · There is only one nozzle on a spray head, and some areas 21 on the wafer may not be cleaned; 2 · When the spray direction is relative to the wafer system As shown by arrow c in Figure b, the particles on the circle are instead pushed toward the center of the wafer and cannot be removed smoothly; 3. Washing the wafer under high-speed rotation may cause damage to the wafer; Rotating and high-pressure water spraying may damage the gold on the wafer. 5993-6572TWF; 90033; Tungraing.ptd Page 4 5'Instructions of the invention (2) The line; 5. The water spray mode cannot be changed according to the change of the wafer · 6. The wafer is exposed to different water sprays on the inside and outside. The cleaning degree is not uniform. In view of this, the object of the present invention is to provide wafer cleaning equipment and sprinkler heads to clean wafers thoroughly. In the present invention, the premise of not knowing how to harm the wafer is that in the present invention, 'a spray of a round cleaning device is provided. The water is sprayed onto the wafer in a manner that the circle is relatively moved. Multiple addictions: Evil:? 丨 f f Yen meter head and Ϊ Ϊ "The water filled in the hole can cover the whole wafer during the relative movement of spray Lishuo and bb 囫: spraying again = this In the invention, a plurality of m heads are formed on a wafer with a water spraying direction and a metal wire forming direction = formed on a metal spraying head. In the present invention, the method of identifying the ten-line array is also in the present invention, the spraying hole includes at least the first _ Spraying hole array, the first 发: 丄 a to 贝 ',-// 鹿 扎 列 and Yicheng, a part of the-spraying L spraying holes are in a straight line ... The first spraying hole lining is from the spraying holes The other part of the second spray hole row is left with 4 sleepers, and it is still constructed in a linear manner. Each of the sprays: the Li spray row is parallel, and the second spray hole row is in the ^ spray hole row. Each spray nozzle corresponds to the spray nozzle. In the present invention, when the spray nozzles are all shaped holes with a radius of r, the first nozzle spray nozzles are adjacent to each other and the spray nozzles are adjacent to each other. Distance from the center hole and the second spray: center distance between the holes is a, - of ejection holes formed in columns, 'a spray, the linear distance between the basket hole row formed is b, a first spray

i! \) V. Description of the invention (3) Between the spraying holes, 4r 'a is greater than the crystal 0 to move the crystal relative to the sprinkler. The nozzle sprays water electrically; generates pulse pressure water control mode with the head; Head Π: ϊ ―, the correspondence between the soil hole and its second spray hole row = the distance is C, and (a / 3) 2 + b2 = c2, 3r. Alas, b ^ 2r In the present invention, r is between 0.1 mm and 1 mm. Diameter ^ In the present invention, the spray head is rectangular, and its length is round ^ ^ In the present invention, a wafer cleaning device is provided, and a pedestal of a wafer is placed on the substrate; The sprayer is used to spray water onto the wafer. In the present invention, the wafer cleaning equipment further includes: a pulse pressure controller with a spray controller to cause the spray head to generate ultrasonic waves, and a spray pressure controller to make the spray head The sonic controller and the pulse control set are used to control the spraying of the sprinkler head; the input device that is electrically connected to the control device is used to set the control time. In addition: the high pressure pump connected to the sprinkler head and the control device; Water supply unit connected to Pu. Hereinafter, the wafer cleaning equipment and the embodiments of the present invention will be described with reference to the drawings. A simple explanation of the formula, Figure la shows a schematic diagram of a conventional wafer cleaning equipment; Figure; Figure lb shows a schematic diagram of a conventional wafer cleaning equipment spraying water on a wafer 〇593-6572TW; 90033; Tungming.ptd

Page 6 501170 V. Description of the invention (4) Figure 2a shows the bottom view of the spray head of the wafer cleaning equipment of the present invention; Figure 2b shows the schematic view between the spray head and the wafer; Figures 3a, 3b The figure is a schematic diagram showing the spraying holes between the sprinkler heads; FIG. 4 is a diagram showing the intent of the wafer cleaning equipment of the present invention; and FIGS. 5a and 5b are the spraying modes of the sprinkler heads. [Symbol description] 1 rotary chuck, 3 spray head, 31 water spray mode, 101, 111, 112, 121 11 0 first spray hole row, 130 third spray hole row, 2 1 0 metal wire, 31 0 Ultrasonic controller, 330 control device, 350 high pressure pump, 370 base. 2 wafers, 2 1 uncleaned area, 100 spray head, 1 2 2 spray holes, 120 second spray hole row, 200 wafers, 300 wafer cleaning equipment, 3 20 pulses The pressure controller 3 40 input device and 3 60 water supply device provide a wafer cleaning device and a spraying head thereof according to the present invention. The spraying head 100 of the present invention will be described below with reference to FIGS. 2a, 2b, 3a, and 3b. As shown in Figures 2a and 2b, the spray head 100 of the present invention sprays water onto the wafer 200 in a manner that moves relative to the wafer 200 to be cleaned, and

0593-6572TWF; 90033; Tungming.ptd Page 7 501170 V. Description of the invention (5) There are a plurality of spray holes 101 on the surface. The spray holes 101 and Λ Li Kong 101 spray water on the sprinkler head 100. During the relative movement with the wafer 200, the entire surface of the wafer 200 is covered. Referring to FIG. 2b, a plurality of parallel metal lines 210 are formed on the wafer 200, and the spraying direction E of the sprinkler head 100 is parallel to the forming direction F of the metal line 21; formed by the spraying direction E and the metal line The direction F is parallel, and the metal wire 21 on the wafer 2000 will not be damaged by water spray. In addition, as shown in Figure 2b, if the sprinkler head 100 is rectangular, its length should be greater than the diameter of the wafer 200 so that water spray can cover 20 () surfaces of the wafer. In addition, as shown in FIG. 2a, the spraying holes 100 are formed on the spraying head 100 so as to form a plurality of parallel rows, and include at least a first spraying hole row 110 and a second spraying The hole row 120 and a third spray hole row 13 are formed. The first spray hole row 110 is formed by a part of the spray hole 101 in a linear manner, and the second spray hole row 120 is formed by another part of the spray hole 101. The second spray hole row 130 is formed in a linear manner, and the other part of the spray hole 100 is formed in a linear manner. The third spray hole row 130 and the second spray hole row 丨 2 {) and The first spray hole row 11 0 is parallel, and each of the second spray hole rows 丨 2 0 corresponds to each of the spray holes in the first spray hole row 110, for example, 111 corresponds to 1 2 1 and 11 2 correspond to 1 2 2. In addition, each spray hole in the third spray hole row 1 3 0 also corresponds to each spray hole in the first spray hole row 1 2 0. The following describes the relationship between the spray holes on the spray head with the first spray hole row 11 0 and the second spray hole row 120. Referring to Fig. 3a, it is assumed that the spray holes 1001 'have a radius r A circular hole, the adjacent spray hole of the first spray hole row 11

0593-6572TlVF; 90033; Tungming.ptd page 8 501170 V. Description of the invention (6) ----- (for example, 111 and 112) center distance between adjacent spray holes in the second spray hole row 12 (For example, 1 2 1 and 1 2 2), the center distance is a, the distance between the line formed by the first spray hole row 110 and the line formed by the second spray hole row 120 is b, and the first spray hole row 11 When the distance (for example, 丨 丨 丨 and 丨 2 丨) between any spray hole and its corresponding spray hole in the second spray hole row 120 is c, the parameter r, a, b, and c are generated. The following relationship: less (a / 3) 2 + b2 = c2, 3r S4r, b — 2r, 4r $ aS6r〇 ·, and through the above relationship, the area shown in Figure 3b, this area Represents the range of c; by this, the material strength of the spray head can be ensured, so that the overall strength of the spray head is insufficient due to the dense arrangement of the spray holes. Also, the above-mentioned radius! Is preferably between lm [n and lm [n. The spray head of the present invention is as described above, and the following description refers to the wafer cleaning apparatus of the present invention with reference to FIG. 4. The wafer cleaning equipment 300 is used for cleaning the wafer 200, and includes a base 370, the sprinkler head 100 as described above, the ultrasonic controller 3, the pulse pressure controller 3, and the control device 3. 3 〇. … The base 370 is used to place the wafer 200, and the ultrasonic controller 310 is electrically connected to the spray head 100, so that the spray head 100 generates ultrasonic water spray; the pulse pressure controller 320 is also connected to the spray head丨 〇〇 Electrical connection, used to make the sprinkler 100 produce pulsed water spray as shown in Figure 5b; by setting the ultrasonic wave control

〇593-6572TW; 90033; Tungming.ptd 501170 V. Description of the invention (7) Controller 310 and pulse pressure controller 32 〇 The cleaning arm waterfall head 100 with different modes on the wafer surface can be sprayed according to demand. Did not accept the ultrasonic wave, for example, under normal circumstances, the instructions of the device 320, and to generate a higher removal rate such as 5a = controller 310 and pulse pressure control, you can Pressure water spray, when 100 is needed to generate ultrasonic water spray 'in the special field, the person controls the controller 310 and the sprinkler head force controller 320 makes the sprinkler head 100 such as ^', which can be achieved by pulse Press water. The pulse-type wafer cleaning equipment 300 shown in Figure 5b by Wang Ru includes 350-350 and a water supply device 36, a control wheel 340, a high-pressure pump 35, an ultrasonic controller 31, and The high-pressure pump is used to control the money _ of the water jet $ sexual connection '33 〇 electrical connection, so as to use the outer ring; 32 and the control device out of 1 pressure pump 350 and spray _ ^: ^ 装 制 /; The 3 = lower connection is used to connect to the high head 100 through the device 360. Wwm3 50 supply deionized water to spray. By the structure of the present invention, the following advantages can be obtained: · By the way of spraying holes, · unwashed area as shown in Figure 1b ^; No damage will occur when the wafer is round; the particles on the wafer can be smoothly moved. The damage is not because the wafer is cleaned under high speed rotation, so it can reduce the damage to the wafer.

Fifth Description of the Invention (8) 4 · Due to the water spray direction and the formation of metal lines, there will be no damage; The water spray pattern of gold on the wafer can be changed inside and outside the wafer according to the change of the wafer. ; The washing degree of round is more uniform; The spraying speed of water can make 7 · shorten the washing time. Although the present invention has been based on the definition of the present invention: 'Anyone familiar with this technique, U Lu = Tu = is not used in the range of arsenic, when it can be used as Lingling without departing from the scope of the present invention, it is attached as follows: 2 And Run •, therefore, the scope of the Bao Jiaming patent of the present invention shall prevail.

Claims (1)

Case No. 6. Scope of patent application 1. A crystal sprays water to several spray holes, and the wafer moves relative to each other. 2. If an application head is used, the water spray from the crystal spray head is formed. 4. If you apply for a row of these spraying holes and a part of a first hole, another part of the second spraying hole row with another part of the hole, and each of the first spraying row, the third Each spray in the spray 5. As in the application head, when the adjacent spray holes in the spray hole row are adjacent to the straight line of the spray head and the second head 90114876, the wafer is cleaned. Shape direction and patent fan spray hole correction special spray straight to share with holes / counter-holes and other adjacent spray The sprinkler head of the Japanese equipment is moved relative to a wafer, and the water sprayed by the spray holes is provided on the surface facing the wafer. The sprinkler head and the process can cover the spray head. The entire surface of the wafer. The spraying of the wafer cleaning equipment described in item 1 is formed by a plurality of metal lines parallel to each other, and the forming directions of the metal lines are parallel. The spraying of the wafer cleaning equipment according to item 2 includes forming a plurality of parallel rows, and the spraying holes of the wafer cleaning device according to item 2 of the spraying range include at least one first spraying hole. Row, a second row of spraying holes, and the first row of spraying holes is formed by the spray lines, the second row of spraying holes is formed by the spray lines, and the third spraying hole The row is formed by the sprays in a straight line, and the third spray hole row and the. Spray hole row are parallel, and the second spray hole row is each sprayed with the first spray hole row Each spray hole in the hole-to-hole row corresponds to the second spray hole row. _ The wafer cleaning equipment described in item 4 of the profit range = j The spraying holes are all circular holes with a radius r ·, the center distance between the ^ spraying holes, and the center distance between the first spraying and a. The first spray hole array is opened. yj The distance between the straight lines formed by one spray hole array. 0593-6572TWF1; 90033; tungming.pt c Page 12 501170 __Case No. 90114876__ Article Zheng ___ 6. Any spray hole in the spray hole row of the patent application and its corresponding in the second spray hole row When the distance between the spray holes is c, (a / 3) 2 + b2 ==: c2 '3r $ c'4r' b22r '4r $ a S 6r. 6 · The spray head of the wafer cleaning equipment according to item 5 of the scope of the patent application, wherein r is between 0.1 mm and 1 mm. 7 · The spray head of the wafer cleaning equipment as described in item 2, 3, 4, 5 or 6 of the scope of patent application, which is rectangular and has a length greater than the diameter of the wafer. 8. The spray head of the wafer cleaning apparatus according to item 7 of the scope of the patent application, wherein the wafer is stationary and the spray head is moved. 9. The spray head of the wafer cleaning equipment according to item 7 of the patent application scope, wherein the spray head is stationary and the wafer is moved. 10. The spray head of the wafer cleaning apparatus according to item 7 of the scope of the patent application, wherein the spray head and the wafer move in opposite directions. 11. A wafer cleaning device for cleaning at least one wafer, including: a pedestal for placing the wafer; and 5 嫜 :: 〒 头 'has a relative movement relationship with the pedestal, and A is used for Water spray = The spray head is provided with a double action on the surface facing the wafer. The water sprayed from the spray holes is included in the spray head and the nozzle. The wafer cleaning equipment according to the item, more ... a controller, is electrically connected to the spray head 1 so that the spray head generates ultrasonic water spray; 501170 SS90U4876 said correction, which Page 14 6. Scope of patent application A pulse pressure controller, which generates pulsed water spray with Lili head; a control device, which is electrically connected to the pulse pressure controller, respectively. 1 3 · If the first scope of the patent application includes: an input device and the output of the control device; a high pressure pump, respectively, and the water supply device, and the high voltage 1 4 · as in the first scope of the patent application A plurality of water spraying directions and the shape of the metal wire are formed on the wafer. 15 · Such spraying holes as in the first patent application range form a plurality of rows. 1 6 · If the spray holes in the first patent application range include at least a first and a third spray hole row, and the first part is formed in a straight line, the first part is formed in a straight line, the other A part is formed in a linear manner, and the sprinkler row is electrically connected with the first sprinkler row and the sprinkler head, so that the sprinkler head, the ultrasonic controller, and the sprinkler head are used to control the water spray of the sprinkler head. The wafer cleaning equipment described in item 2 is further provided with an electrical connection for setting the control spray head to be connected to the control device, and connected by a pump. The wafer cleaning equipment according to item 1, ^ the parallel metal lines, and the sprinkler heads are parallel. The wafer cleaning equipment according to one aspect, wherein the wafer cleaning equipment according to one aspect is formed on the spray head in a parallel manner, and the spray hole array, a second spray hole array, and a spray hole array are formed by the spray head. One or two spraying hole rows of equal spraying holes are formed by the other second spraying hole rows of the spraying holes, the third spraying hole row, the second spraying row, and the second Every Dun / u in the salute column Spray hole κ The parent case number 90114R7i ^ r in the spray hole column, the scope of the application for a patent: the spray hole and each of the-spray hole column: each of the spray hole column-the spray hole and the first correspond. Speaking of cleaning equipment ... ^ As described in item 6 of the patent application scope, although the spray holes in the first spray hole, such as Rong, all have a radius n pattern? Adjacent to the column: the center distance between the adjacent spray holes and the first; the center distance between the spray line and the center is a, ..., spraying two J, a spraying hole, "the distance between the straight lines formed by the spraying hole row When the distance between Ren-spraying holes in the row between the spraying holes and the second spraying a in the second spraying hole row is C, (a / 3) Hb2 = c2, 3r, bj $ 6r. 1 8 · In the wafer cleaning equipment described in item 17 of the patent application scope, r is between 0.1 mm and 1 mm. 1 9 · In the wafer cleaning equipment prepared in item 11 of the patent application scope, the spraying is performed. The head is rectangular and its length is greater than the diameter of the wafer. 2 0 · In the wafer cleaning equipment described in item 11 of the patent application ', the wafer is stationary and the sprinkler head moves. 2 1 · Such as In the wafer cleaning equipment described in the scope of the patent application, the sprinkler head is stationary while the wafer is moved. 2 2 · The sprinkler head of the wafer cleaning equipment described in the scope of patent application, item 11, wherein The spray head and the wafer move in opposite directions. Wafer cleaning equipment, which is called a spray hole, and other sprays 0593-6572TWF1; 90033; tungming.pt c p. 15