TW499745B - Laser diode package - Google Patents

Laser diode package Download PDF

Info

Publication number
TW499745B
TW499745B TW086118870A TW86118870A02A TW499745B TW 499745 B TW499745 B TW 499745B TW 086118870 A TW086118870 A TW 086118870A TW 86118870A02 A TW86118870A02 A TW 86118870A02A TW 499745 B TW499745 B TW 499745B
Authority
TW
Taiwan
Prior art keywords
light
emitting diode
aforementioned
electrode
cup
Prior art date
Application number
TW086118870A
Other languages
Chinese (zh)
Inventor
Bily Wang
Original Assignee
Harvatek Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harvatek Corp filed Critical Harvatek Corp
Application granted granted Critical
Publication of TW499745B publication Critical patent/TW499745B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)

Abstract

Three LEDs, a red, a blue and a green, are mounted in a cup recessed in a substrate. Light reflected from the walls of the cup is directed toward the viewer in front of the LED and is intensified. A lens can be imbedded in the cover of the package to further intensify the light. The light intensity of each LED can be adjusted to produce any color. In another embodiment, the cup is filled with phosphorescent material which emits a colorless light when the blue LED is excited.

Description

499745 五、發明說明(1) 發光二極體之包裝(追加二) 1. 摘要499745 V. Description of the invention (1) Packaging of light-emitting diodes (Additional 2) 1. Abstract

傳統以印刷電路板為包裝基材的發光二極體之包裝,皆是 平面之包裝不具有聚光底座之設計,本發明則是將印刷電 路板基材製作出具有聚光底座的設計,使得置於其中的發 光二極體因為有聚光底座的設計,而致發光二極體之光線 因受聚光效果而獲得光線較為聚集,呈現出亮度較習知技 藝為強的發光二極體之包裝。 2. 背景說明Traditional light-emitting diode packaging using a printed circuit board as a packaging substrate is a flat packaging design without a light-condensing base. The present invention is to design a printed circuit board substrate with a light-concentrating base, so that The light-emitting diode placed in it has the design of a light-concentrating base, and the light of the light-emitting diode is more concentrated due to the light-condensing effect, showing a light-emitting diode that is brighter than conventional light-emitting diodes. package. 2. Background note

參見圖一,這是發光二極體1 3 0之包裝的習知技藝,發光 二極體1 3 0固著於印刷電路板基材1 1 0上,發光二極體1 3 0 有第一輸出入端131以及第二輸出入端132,印刷電路板基 材1 1 0上有導電材料被蝕刻產生事先設計好的電路圖案, 至少包含有第一電極121、以及第二電極122。發光二極體 130具有第一輸出入端131、以及第二輸出入端132,分別 經由打線1 3 3藕合至第一電極1 2 1、以及第二電極1 2 2。最 後,再將膠體1 9 9塗敷封裝固著發光二極體1 3 0、第一電極 1 3 1、第二電極1 3 2、以及導線1 3 3於印刷電路板基材1 1 0上 完成包裝。Referring to FIG. 1, this is a conventional technique of packaging of a light emitting diode 1 3 0. The light emitting diode 1 3 0 is fixed on a printed circuit board substrate 1 1 0, and the light emitting diode 1 3 0 has a first The I / O terminal 131 and the second I / O terminal 132 are formed by etching a conductive material on the printed circuit board substrate 110 to generate a pre-designed circuit pattern, and at least the first electrode 121 and the second electrode 122 are included. The light emitting diode 130 has a first input / output terminal 131 and a second input / output terminal 132, which are coupled to the first electrode 1 2 1 and the second electrode 1 2 2 through wires 1 3 3 respectively. Finally, the colloid 1 99 is coated and sealed to fix the light-emitting diode 1 30, the first electrode 1 3 1, the second electrode 1 3 2, and the lead 1 3 3 on the printed circuit board substrate 1 1 0. Finish packaging.

第4頁 499745 五、發明說明(2)Page 4 499745 V. Description of the invention (2)

這種習知的發光二極體1 3 0之包裝,其發光二極體1 3 0所發 射的光線會向四面八方分散射出,因此,針對前方觀察人 員的視覺而言,光源強度因為分散的關係故呈現較弱之光 源強度。參考圖二及圖三,本發明即是在印刷電路板基材 1 1 0上製作杯狀底座,然後將發光二極體置於其中,如 此,杯狀底座具有聚光效果,可以將散射於周邊的光線轉 向,使集中向杯座正前方射出,因此,就前方觀察人員的 視覺而言,同樣的發光二極體光源,經過本產品之聚光設 計之包裝,可以獲得較強的發光二極體之包裝。 3. 圖式 圖一習知技藝 圖二本發明之具有聚光底座之發光二極體之包裝實施例一 圖三本發明之具有聚光底座之發光二極體之包裝實施例二 圖四本發明之弧形帽蓋封裝實施例 圖五本發明之膠體封裝實施例 圖六本發明之透明平板封裝實施例In this conventional packaging of the light-emitting diode 130, the light emitted by the light-emitting diode 130 is scattered in all directions. Therefore, for the vision of the observer in front, the intensity of the light source is scattered. Therefore, a weak light source intensity is present. Referring to FIG. 2 and FIG. 3, the present invention is to make a cup-shaped base on a printed circuit board substrate 110, and then place a light-emitting diode therein. In this way, the cup-shaped base has a light-concentrating effect and can scatter light The surrounding light is diverted, so that the light is focused towards the front of the cup holder. Therefore, as far as the vision of the front observer is concerned, the same light emitting diode light source can be packaged with the light-concentrating design of this product to obtain a strong light-emitting diode. Polar body packaging. 3. Schematic diagram 1 Known technique FIG. 2 Packaging embodiment of the light-emitting diode with a light-concentrating base according to the present invention 1 FIG. 3 Packaging embodiment of the light-emitting diode with a light-concentrating base according to the present invention Inventive example of a curved cap package Fig. 5 Example of a colloidal package of the invention Fig. 6 Example of a transparent flat package of the invention

圖七附有透鏡之透明平板封裝量產實施例 圖八本發明之矩形帽蓋封裝實施例 圖九本發明之附有透鏡之矩形帽蓋封裝實施例 圖十A為本發明之「彩色光」發光二極體之包裝側視圖Figure 7 Example of mass production of transparent flat plate package with lens Figure 8 Example of rectangular cap package of the invention Figure 9 Example of rectangular cap package with lens of the invention Figure 10A is the "color light" of the invention Side view of packaging of light emitting diode

第5頁 五、發明說明(3) ! Γ—為a ΐ!明,「彩色光」「發光二極體之包裝頂視圖 裝十一Α為本叙明之可發出「無色光」之發光二極體之包 色光」之發光二極體之包 圖十一 β為本發明之可發出「益念土 - 裝 4 · 本發明之詳細說明 參見圖二’本發明之具有底座之發光二極體之包施例 一。本發明即是在印刷電路板基材11 〇上製作杯 '"底座 2 2 0,然後將發光二極體2 3 0置於其中,如此, 1 t ^ t t 杯狀底座兴 有聚光效果,可以將散射於周邊的光線轉向,使集中向杯 座正前方射出’因此,就前方觀察人員的视覺而二,同樣 的發光二極體光源2 3 0,經過本產品之聚光設計之1包,7 可以獲得較強的發光二極體2 3 0之包裝。 ° ^ 發光二極體23 0固著於印刷電路板基材2 1 0上的杯狀底座 2 20之中,發光二極體230有第一輸出入端231以及第 >二輸 出入端2 3 2,印刷電路板基材2 1 0上有導電材料被餘刻產^ 事先設計好的電路圖案,至少包含有第一電極221、以及 第二電極222。發光二極體230具有第一輸出入端231、以 及第二輸出入端2 3 2 ’分別經由打線2 3 3揭合至第一電極 221、以及第二電極222。最後’再將膠體299塗敷封裝固5. Explanation of the invention on page 5 (3)! Γ—for a ΐ! Ming, "color light" "top view of the packaging of light-emitting diodes" eleven A is the light-emitting diode that can emit "colorless light" described in this description The package of the light-emitting diode of the body is shown in Figure 11. β is the invention which can be issued "benefit soil-equipment 4 · For a detailed description of the invention, please refer to Figure 2 'The light-emitting diode with a base of the invention Package Example 1. The present invention is to make a cup "base 2 2 0" on a printed circuit board substrate 11 and then place a light emitting diode 2 3 0 therein. Thus, a 1 t ^ cup base It has a light-concentrating effect, which can divert the light scattered around the periphery, so that the light is focused towards the front of the cup holder. Therefore, the vision of the observer in front is the same. The same light-emitting diode light source 2 3 0 passes through this product. Concentrated design of 1 package, 7 can get stronger light-emitting diodes 2 3 0 packaging. ° ^ light-emitting diodes 23 0 fixed to the printed circuit board substrate 2 1 0 cup base 2 20 of In the light-emitting diode 230, there is a first input / output terminal 231 and a second input / output terminal 2 3 2, a printed circuit. A conductive material is produced on the substrate 2 10 in a engraved manner ^ A pre-designed circuit pattern includes at least a first electrode 221 and a second electrode 222. The light emitting diode 230 has a first input / output terminal 231 and a first The two I / O terminals 2 3 2 ′ are respectively peeled to the first electrode 221 and the second electrode 222 through the wire 2 3 3. Finally, the gel 299 is coated and sealed.

499745 五、發明說明(4) 以及導 著發光二極體230、第一電極231、第二電極232 線2 3 3於印刷電路板基材2 1 〇上完成包裝。 參見圖三,為本發明之具有底座之發光二極體之包裝實施 2 —。發光一極體3 3 0固著於印刷電路板基材3 1 〇上的杯狀 =座320之中。杯狀底座320表面包含有金屬導電材料 藉著金屬的光滑表面之對光之優良反射效果,可以 升杯狀底座320的聚光效果,發光二極體33〇有第一輸出 = 331以及第二輸出入端33 2,印刷電路板基材31〇上有 ί ϊ=Γ刻產生/先設計好的電路圖案,s少包含有 f二電極321、以及第二電極32 2。發光二極體33〇且有第 一輸出入端331經由打線3 3 3藕合至第一 ^ 極體33。的第二輸出入端3 3 2直接點著藕! η ί 第-電極331、第二電極3 3 2、以 發光二極體33〇、 基材3 1 0上完成包裝。 、本3 3 3於印刷電路板 參見圖四,為本發明之封膠另_警 可以是矩型帽蓋)直接罩蓋且固著、列’弧型帽蓋499(也 基材3 1 0上各元件之目的。弧型帽簦^材3 1 0上,達到保護 多個單元互相連接的形態,於適卷 9可以是衝壓成形的 片罩蓋在基材3 1 0上面有數佰到數^置塗/^黏膠以後,整 完成所有單元之帽蓋封裝製程。 固產品單元上’一次499745 V. Description of the invention (4) and the light-emitting diode 230, the first electrode 231, the second electrode 232, and the wires 2 3 3 are packaged on the printed circuit board substrate 2 10. Referring to Fig. 3, a packaging implementation of a light emitting diode with a base according to the present invention is implemented. The light-emitting monopole 3 3 0 is fixed in the cup-shaped seat 320 on the printed circuit board substrate 3 1 0. The surface of the cup-shaped base 320 contains a metal conductive material, which has an excellent reflection effect on light through the smooth surface of the metal. It can raise the light-concentrating effect of the cup-shaped base 320. The light-emitting diode 33 has a first output = 331 and a second At the input / output terminal 33 2, the printed circuit board substrate 31 0 has a circuit pattern generated / designed first, and s less includes an f two electrode 321 and a second electrode 32 2. The light emitting diode 33 and the first input / output terminal 331 are coupled to the first electrode 33 via a wire 3 3 3. The second input / output terminal 3 3 2 is directly lit! η The first-electrode 331, the second electrode 3 32, and the packaging are completed on the light-emitting diode 33 and the substrate 3 10. 3. This 3 3 3 is shown in Figure 4 on the printed circuit board. It is the sealant of the present invention. Another alarm can be a rectangular cap. The cap is directly covered and fixed. The arc cap 499 (also the substrate 3 1 0 The purpose of the above components. The arc-shaped cap 材 ^ 3 3 0, to achieve the protection of multiple units connected to each other, in the appropriate volume 9 can be a stamped sheet cover on the base 3 1 0 hundreds to several ^ After the coating is applied, the cap packaging process is completed for all units. Once on the solid product unit

第7頁 曰 j多正 ’ /v i號86塗7,二 五、發明說明(5) 參見圖五,為本發明之封膠 > ^"~ 全面封膠技術,這是在量產栌f細例,膠體5 9 9是採用 到數仟個產品單元,採用全:上:片基材3]〇上面有數佰 膠製程。 唇一次完成所有單元之封 參見圖六,為本發明之封膠—〜 著塗敷有黏膠的支柱6〇2固^ —貫施例,透明平板699藉 在基材310上面數佰到數仟個^。二透明平板699整片罩蓋 單元之帽蓋封裝製程。 早70上,一次完成所有 參見圖七,透明平板799在 射 件702,使產品在使用時光度可光?態的透鏡元 黟的支柱的固著黏接,整片透更著塗敷有黏 面數佰到數仟個產品單元上,一 罩盍在基材310上 裝製程。 人70成所有單元之帽蓋封 參見圖八’是本發明之矩形 材3i〇m : 的形狀,直接罩蓋固著於基 材3 1 0上面的几件,完成封裝的產品。 2:i ’是本發:之附有透鏡之矩形帽蓋封裝實施例, # 、見之矩形帽蓋999具有透鏡9 02的帽蓋,直接罩蓋固 :二土? 310上面的兀件’完成封裝的產品。透鏡9 02可以 視翁要製作成為聚光型或是散光型透鏡。 499745 五、發明說明(6) 參見圖十A為本發明之「彩色光」發光二極體之包裝側視 圖。 發光一極體R、發光二極體G、以及發光二極體B,固著於 印刷電路板基材1 〇丨〇上的杯狀底座丨〇 2 〇之辛。杯狀底座 1020表面包含有金屬導電材料1〇22,藉著金屬的光滑表面 之對光之聚光反射效果,可以提升聚光效果。 發光二極體R有第一輸出入端l〇31R以及第二輸出入端 1 0 3 2 R ; 發光二極體G有第一輸出入端i〇31G以及第二輸出入端 1 0 3 2 G ; 發光二極體B有第一輸出入端1031B以及第二輸出入端 1 0 3 2 B。印刷電路板基材1 〇 1 〇上有導電材料被蝕刻產生事 先設計好的電路圖案,至少包含有三個第一電極1021R(圖 中未表示)、l〇21G、1021B,以及共用電極第二電極 1 0 2 2 〇 發光二極體R具有第一輸出入端1031R經由打線i〇33R藕合 至第一電極1021R(圖中未表示),發光二極體r的第二輸出 入端1032R直接黏著藕合於共用電極之第二電極1022。 發光二極體G具有第一輸出入端1 〇 3 1G經由打線1 0 3 3G藕合 至第一電極1021G,發光二極體G的第二輸出入端1032G直 接黏著藕合於共用電極之第二電極1022。Page 7 says "J Duozheng '/ vi No. 86 Tu 7, Twenty-fifth, the description of the invention (5) See Figure 5 for the sealant of this invention > ^ " ~ comprehensive sealant technology, which is in mass production 栌f For a detailed example, the colloid 5 9 9 is adopted to several product units, and the full: up: sheet substrate 3] is used. There are hundreds of glue processes on it. The lip completes the sealing of all the units at once. Refer to FIG. 6, which is the sealant of the present invention ~~ The pillar 602 coated with adhesive is fixed ^-According to the embodiment, the transparent flat plate 699 is borrowed from the substrate 310 to several hundred to several.仟 个 ^. Two transparent flat 699 full-piece cover units. As early as 70, complete all at once. As shown in Figure 7, the transparent flat plate 799 is on the lens 702, so that the product can be used in the light. The state of the lens element is fixed and adhered to the pillars. The entire piece is coated with adhesive surfaces of hundreds to several product units, and a cover is mounted on the substrate 310 for the manufacturing process. People 70% of all units are capped. See FIG. 8 ′, which is the shape of the rectangular material 3i0m of the present invention, and directly covers and fixes a few pieces on the base material 3 10 to complete the packaged product. 2: i ′ is the present invention: an embodiment of a rectangular cap package with a lens, #, see the rectangular cap 999 has a cap of lens 902, which directly covers the solid: two earth? The upper elements of 310 'complete the packaged product. Lens 902 can be made into a condensing or astigmatic lens. 499745 V. Description of the invention (6) See Fig. 10A for a side view of the packaging of the "color light" light-emitting diode of the present invention. The light-emitting diode R, the light-emitting diode G, and the light-emitting diode B are fixed to a cup-shaped base 1 2 0 2 0 on a printed circuit board substrate 10 2. The surface of the cup-shaped base 1020 contains a metal conductive material 1022. The light-condensing and reflecting effect of the smooth surface of the metal can enhance the light-condensing effect. The light-emitting diode R has a first output-input terminal 1031R and a second output-input terminal 1 0 3 2 R; the light-emitting diode G has a first output-input terminal 1031G and a second output-input terminal 1 0 3 2 G; the light-emitting diode B has a first input-output terminal 1031B and a second output-input terminal 1 0 3 2B. A conductive material is etched on the printed circuit board substrate 10 to produce a pre-designed circuit pattern, which includes at least three first electrodes 1021R (not shown), 1021G, 1021B, and a common electrode second electrode. 1 0 2 2 0 The light emitting diode R has a first input / output terminal 1031R coupled to the first electrode 1021R (not shown in the figure) via a wire i〇33R, and the second input / output terminal 1032R of the light emitting diode r is directly adhered. A second electrode 1022 coupled to the common electrode. The light-emitting diode G has a first input-output terminal 1 03 1G coupled to the first electrode 1021G via a wire 1 0 3 3G, and the second output-input terminal 1032G of the light-emitting diode G directly adheres to the first electrode connected to the common electrode. Two electrodes 1022.

499745 、發明說明(7) 發光二極體B具有第一輸出入端i〇31B經由打線1 0 3 3B藕合 至第二電極1021B,發光二極體B的第二輸出入端1032B直 接黏著藕合於共用電極之第二電極1022。 ^ ^ B為本發明之「彩色光」發光二極體之包裝頂視圖。 發,二極體R具有第一輸出入端1 0 3 1 R經由打線1 0 3 3R藕合 至第一電極1021R。 發光二極體G具有第一輸出入端1031G經由打線1033G藕合 至第一電極1021G。 發光二極體B具有第一輸出入端1031B經由打線1033B藕合 至第一電極1021B。 另有控制電路(圖中未表示),分別控制發光二極體R、發 光二極體G、以及發光二極體b ;由此可以調整rgB三原色 之強弱而發出靜態或是動態之彩色光線。 參見圖十一 A,為本發明之可發出「無色光」(c〇1〇rless light)之發光一極體之包裝實施例一。發光二極體固 著於印刷電路板基材1110上的杯狀底座1120之中。杯狀底 座1120表面包含有金屬導電材料η 22,藉著金屬的光滑表 面之對光之優良反射效果,可以提升杯狀底座1120的聚光 效果,發光二極體1130有第一輸出入端1131以及第二輸出 入端11 3 2,印刷電路板基材丨i丨〇上有導電材料被蝕刻產生 事先设汁好的電路圖案’至少包含有第一電極1121、以及499745. Description of the invention (7) The light-emitting diode B has a first input-output terminal i〇31B coupled to the second electrode 1021B via a wire 1 0 3 3B, and the second output-input terminal 1032B of the light-emitting diode B is directly adhered to the 藕The second electrode 1022 connected to the common electrode. ^ ^ B is a top view of the "color light" light emitting diode packaging of the present invention. The diode R has a first input / output terminal 1 0 3 1 R coupled to a first electrode 1021R via a wire 1 0 3 3R. The light emitting diode G has a first input / output terminal 1031G coupled to a first electrode 1021G via a wire 1033G. The light emitting diode B has a first input / output terminal 1031B coupled to a first electrode 1021B via a wire 1033B. Another control circuit (not shown in the figure) controls the light-emitting diode R, the light-emitting diode G, and the light-emitting diode b respectively; thus, the intensity of the three primary colors of rgB can be adjusted to emit static or dynamic colored light. Refer to FIG. 11A, which is a first embodiment of a packaging of a light-emitting monopolar body that can emit "colorless light" according to the present invention. The light emitting diode is fixed in a cup-shaped base 1120 on the printed circuit board substrate 1110. The surface of the cup-shaped base 1120 contains a metal conductive material η 22. By virtue of the excellent reflection effect of light on the smooth surface of the metal, the light-concentrating effect of the cup-shaped base 1120 can be improved. The light-emitting diode 1130 has a first input / output terminal 1131 And the second input / output terminal 11 3 2, a conductive material on the printed circuit board substrate 丨 i 丨 〇 is etched to generate a pre-set circuit pattern 'at least including the first electrode 1121, and

第10頁 五、發明說明(8) 第二電極112g。發光二極體113〇具有第一輸出入端1131經 由打線1 1 3 3藕合至第一電極丨丨2丨,發光二極體丨丨3 〇的第二 輸出入端1132直接黏著藕合於第二電極1122。 將# g能量刺激以後可以發出無色光的螢光材料丨丨3 5或 是混入增強枯著效果之材料,填入金屬杯丨丨2 2之中,經由 發光二極體11 3 0發出之光線,可以激發螢光材料丨丨3 5而釋 放出「無色光」,由於螢光材料1135為半透明狀,因此並 不顯著影響金屬杯1 1 2 2之聚光效果。Page 10 V. Description of the invention (8) 112g of the second electrode. The light-emitting diode 113 has a first input-output terminal 1131 coupled to the first electrode via a wire 1 1 3 3, and the second output-input terminal 1132 of the light-emitting diode 丨 3 is directly bonded to the first electrode. Second electrode 1122. Fluorescent material that can emit colorless light after stimulation with #g energy 丨 3 5 or mixed with material to enhance the effect of dryness, fill it into the metal cup 丨 丨 2 2 and emit light through the light-emitting diode 11 3 0 It can excite the fluorescent material 丨 3 5 and release "colorless light". Since the fluorescent material 1135 is translucent, it does not significantly affect the light-concentrating effect of the metal cup 1 1 2 2.

參見圖十一 B ’為本發明之可發出「無色光」(c〇1〇r less 1 i gh t )之發光二極體之包裝實施例二。發光二極體丨丨3 〇固 著於印刷電路板基材丨丨丨〇上的杯狀底座丨丨2 〇之中。杯狀底 座1120表面包含有金屬導電材料1]L 22,藉著金屬的光滑表 面之對光之優良反射效果,可以提升杯狀底座丨丨2 〇的聚光 效果,發光二極體1130有第一輸出入端1131以及第二輸出 入端1 1 3 2,印刷電路板基材丨丨丨0上有導電材料被蝕刻產生 事先設計好的電路圖案,至少包含有第一電極丨丨2 1、以及 第一電極1122。發光二極體H30具有第一輪出入端U31經 由打線1133藕合至第一電極1121,發光二極體113〇的第二 輸出入端1132直接黏著藕合於第二電極1122。Referring to FIG. 11B ′, it is a second embodiment of a packaging of a light-emitting diode that can emit “colorless light” (collar 1 ght) according to the present invention. The light-emitting diodes are fixed in a cup-shaped base on the substrate of the printed circuit board. The surface of the cup-shaped base 1120 contains a metal conductive material 1] L 22. By virtue of the excellent reflection effect of the smooth surface of the metal on the light, the light-concentrating effect of the cup-shaped base 1 2 1 2 can be improved. An input / output terminal 1131 and a second input / output terminal 1 1 3 2; a conductive material on the printed circuit board substrate 丨 丨 0 is etched to generate a pre-designed circuit pattern, and at least includes a first electrode 丨 丨 2 1. And first electrode 1122. The light-emitting diode H30 has a first round input / output terminal U31 coupled to the first electrode 1121 through a wire 1133, and a second output-input terminal 1132 of the light-emitting diode 113 ° is directly bonded to the second electrode 1122.

將一種以能量刺激以後可以發出無色光的螢光材料 1 1 3 5 a,填入金屬杯1 1 2 2之中,11 3 5b是使用透明枯著材料A fluorescent material 1 1 3 5 a that can emit colorless light after being stimulated with energy is filled into a metal cup 1 1 2 2. 11 3 5b uses a transparent dead material.

第11頁 499745 五、發明說明(9) 填充金屬杯11 2 2,如此只要在1 1 3 5 b的表面區域塗敷螢光 材料1 1 3 5 a,這樣可以節省螢光材料1 1 3 5 a的使用;經由發 光二極體1 1 3 0發出之光線,可以激發螢光材料11 3 5而釋放 出「無色光」,由於螢光材料1135為半透明狀,因此並不 顯著影響金屬杯1 1 2 2之聚光效果。Page 11 499745 V. Description of the invention (9) Fill the metal cup 11 2 2 so that as long as the surface area of 1 1 3 5 b is coated with the fluorescent material 1 1 3 5 a, it can save the fluorescent material 1 1 3 5 The use of a; the light emitted by the light emitting diode 1 1 3 0 can excite the fluorescent material 11 3 5 and release "colorless light". Since the fluorescent material 1135 is translucent, it does not significantly affect the metal cup 1 1 2 2 light-gathering effect.

本案之發明技藝已經藉由上述實施例加以描述,然而,實 施例僅為列舉說明本案之發明技藝而已,本案專利申請人 並非限制本案之權利範圍於此些實施例,凡是熟悉此一行 業之技術的人士,對於前述實施例之變化、修飾,若是並 未脫離本案之發明技藝之精神時,以及下述申請專利範圍 所述之技藝範圍,均為本案專利申請人之權利範圍。The invention technology of this case has been described by the above-mentioned embodiments. However, the embodiments are only for illustrating the invention technology of this case. The patent applicant of this case does not limit the scope of the rights of this case to these embodiments. Anyone who is familiar with the technology of this industry Persons who have made changes or modifications to the foregoing embodiments without departing from the spirit of the inventive technique of the present case, as well as the technical scope described in the scope of the patent application below, are the scope of the patent applicant's rights in this case.

第12頁Page 12

Claims (1)

499745 -一 案號 86118870A02 年月日 \昼° 六、申請專利範圍 1 · 一種彩色發光二極體之包裝,包含: 紅色發光二極體(R )、綠色發光二極體(G )、以及藍色發光 二極體(B);以及 印刷電路板基材,具有金屬杯狀底座,供置放前述之發光 二極體RGB用;且在前述之印刷電路板基材表面的電路圖 案中,製作有三個第一電極以及共用之第二電極;前述之 發光二極體R,G,B分別具有第一輸出入端,且分別藕合 於前述之三個第一電極;以及第二輸出入端耦合於前述之 共用之第二電極。 2. 一種可以發出無色光之二極體之包裝,包含·· 印刷電路板基材,具有杯狀底座,供置放前述之發光二極 體用;且在前述之印刷電路板基材表面的電路圖案中,製 作有第一電極以及第二電極;前述之發光二極體具有第一 輸出入端以及第二輸出入端,分別藕合於前述之第一電極 以及第二電極; 金屬層,形成於前述之杯狀底座中形成金屬杯狀物’ k供 聚光功能;499745-Case No. 86118870A02 Month / Day ° Sixth, the scope of patent application 1 · A package of color light-emitting diodes, including: red light-emitting diode (R), green light-emitting diode (G), and blue Color light emitting diode (B); and a printed circuit board substrate having a metal cup-shaped base for placing the aforementioned light emitting diode RGB; and in a circuit pattern on the surface of the aforementioned printed circuit board substrate, making There are three first electrodes and a common second electrode; the aforementioned light-emitting diodes R, G, and B each have a first input / output terminal and are respectively coupled to the aforementioned three first electrodes; and a second output / input terminal Coupled to the aforementioned common second electrode. 2. A packaging capable of emitting colorless diodes, comprising a printed circuit board substrate having a cup-shaped base for placing the aforementioned light emitting diode; and a substrate on the surface of the aforementioned printed circuit board substrate In the circuit pattern, a first electrode and a second electrode are fabricated; the aforementioned light emitting diode has a first input / output terminal and a second input / output terminal, which are respectively combined with the aforementioned first electrode and second electrode; a metal layer, Formed in the aforementioned cup-shaped base to form a metal cup-shaped light-collecting function; 第14頁 499745 六、申請專利範圍 螢光材料,塗敷於前述之發光二極體光徑t,藉著前述之 發光二極體所發出之光源,刺激發生無色光源。 3. 如申請專利範圍第2 ·項所述之一種可以發出無色光之 二極體之包裝,更包含: 透明填充材料,填入於前述之金屬杯狀物之中;其中所述 之螢光材料係塗敷於前述之透明填充材料之上表面。Page 14 499745 6. Scope of patent application Fluorescent materials are coated on the light path t of the aforementioned light-emitting diodes, and the colorless light sources are stimulated by the light sources emitted by the aforementioned light-emitting diodes. 3. The packaging of a diode that can emit colorless light as described in item 2 of the scope of patent application, further comprising: a transparent filling material filled in the aforementioned metal cup; the fluorescent light described therein The material is applied on the upper surface of the transparent filling material. 4. 如申請專利範圍第2.項所述之一種發光二極體之包 裝,其中所述之螢光材料係填入於前述之金屬杯狀物之 中 〇 5 . 如申請專利範圍第2 ·項所述之一種發光二極體之包 裝,其中所述之螢光材料得混合其他透明填充材料填入於 前述之金屬杯狀物之中,以便節省螢光材料之使用。4. A light-emitting diode package as described in item 2. of the scope of patent application, wherein the fluorescent material is filled in the aforementioned metal cup. 5. The packaging of a light-emitting diode according to the above item, wherein the fluorescent material may be mixed with other transparent filling materials and filled in the aforementioned metal cup in order to save the use of the fluorescent material. 第14頁Page 14
TW086118870A 1997-12-11 1999-02-06 Laser diode package TW499745B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086118870A TW381313B (en) 1997-12-11 1997-12-11 Light emitted diode packages

Publications (1)

Publication Number Publication Date
TW499745B true TW499745B (en) 2002-08-21

Family

ID=21627418

Family Applications (4)

Application Number Title Priority Date Filing Date
TW086118870A TW381313B (en) 1997-12-11 1997-12-11 Light emitted diode packages
TW086118870A TW452894B (en) 1997-12-11 1998-05-21 Package of light emitting diode
TW086118870A TW499745B (en) 1997-12-11 1999-02-06 Laser diode package
TW086118870A TW501287B (en) 1997-12-11 2001-09-26 Light emitting diode package

Family Applications Before (2)

Application Number Title Priority Date Filing Date
TW086118870A TW381313B (en) 1997-12-11 1997-12-11 Light emitted diode packages
TW086118870A TW452894B (en) 1997-12-11 1998-05-21 Package of light emitting diode

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW086118870A TW501287B (en) 1997-12-11 2001-09-26 Light emitting diode package

Country Status (1)

Country Link
TW (4) TW381313B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7066626B2 (en) 2003-04-09 2006-06-27 Citizen Electronics Co., Ltd. LED lamp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7066626B2 (en) 2003-04-09 2006-06-27 Citizen Electronics Co., Ltd. LED lamp

Also Published As

Publication number Publication date
TW381313B (en) 2000-02-01
TW501287B (en) 2002-09-01
TW452894B (en) 2001-09-01

Similar Documents

Publication Publication Date Title
US6881980B1 (en) Package structure of light emitting diode
TWI255566B (en) Led
CN101493216B (en) LED light source module
US20110089815A1 (en) Light-emitting device
TW201025671A (en) LED device and method of packaging the same
JP2004356116A (en) Light emitting diode
TW201001742A (en) Photoelectric semiconductor device capable of generating uniform compound lights
TW201108390A (en) Quasioptical LED package structure for increasing color render index and brightness
JP2003017751A (en) Light emitting diode
CN109148429B (en) Light emitting diode packaging structure
JP2006019598A (en) Light emitting diode
TWM462822U (en) Dual-chip LED
JP2003124521A (en) Semiconductor light emitting device with case
TW201640056A (en) Light emitting module
TWI373856B (en)
JP2000349345A (en) Semiconductor light emitting device
JP3118164U (en) Liquid crystal panel device with light source module
CN102254909A (en) Light emitting device package
JP2015164234A (en) LED light-emitting device and manufacturing method thereof
TW499745B (en) Laser diode package
TW200910628A (en) LED package and method thereof-dual substrate
KR100649704B1 (en) Light emitting diode package and method for manufacturing the same
KR20040024747A (en) A High brightness light emitting diode and its method of making
CN102052578A (en) Light-emitting device
JP2002299692A (en) Reflection type led light source