TW499507B - An apparatus and method for controlling distribution of a power line - Google Patents

An apparatus and method for controlling distribution of a power line Download PDF

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Publication number
TW499507B
TW499507B TW89125518A TW89125518A TW499507B TW 499507 B TW499507 B TW 499507B TW 89125518 A TW89125518 A TW 89125518A TW 89125518 A TW89125518 A TW 89125518A TW 499507 B TW499507 B TW 499507B
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Taiwan
Prior art keywords
power line
cathode
anode
plate
distribution
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TW89125518A
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Chinese (zh)
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Tz-Jr Mo
Jia-Shiung Guo
Yuan-Ching Gu
Li-Jr He
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Microjet Technology Co Ltd
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Abstract

An apparatus and method for controlling distribution of a power line applied in electroplating fabrication are disclosed. The apparatus includes a positive plate for decomposing an ion of a specific substance via an electric power imposed; a negative plate disposed in a specific position opposite to said positive plate for receiving said ion to form a layer of a specific substance, and disposed a conductive layer around said negative plate; an electroforming medium contained between said positive plate and said negative plate for transferring to form said power line; and a shelter disposed between said positive plate and said negative plate and having a holes for allowing said power line to go through and shoot to said negative plate.

Description

_ Γ-Γτ·—89125518 ί ψ ι 日》^ 作 五、發明样(1清—~~_ Γ-Γτ · —89125518 ί ψ ι Day》 ^ Works 5. Inventions (1 Qing-~~

發明-J 本案係為一種控制電力線分佈之裝置及方沐*〆成 用於電鑄製程上。 艸之在置及方去,其係應 則有該電力線13分佈不 電力場分佈影響,造成 因該陰極板12上受邊緣 強,因此,若無遮蔽板 較中間厚。 針對以上的缺失, 第二圖(a) (b),於一陽 片製程 遮蔽板 膜層能 喷出量 於電鑄 生氧化 極板11 受電流 密集則 中之區 堆積的 而若無 均的情 堆積程 效應的 控制, 另研究 極板2 1 上,對 或利用 較平均 能均勻 槽中, 反應, 與一陰 密度分 所形成 域越容 情形。 控制該 形發生 度有厚 作用, 則邊緣 於在噴嘴 金屬導電 ,因而孔 穩定。 利用直流 變成金屬 極板1 2之 佈及通電 之電力線 易造成金 又該電力 電力線1 3 ,且其金 薄不一的 電位差較 所形成之 發明背景 一般在 制上,大部 在製程中所 近± 3 , 如第一 極板11上之 雙電力場作 線1 3,又該 影響,電流 該複數條電 成金屬原子 並無一固定 墨水ϋ噴嘴 分藉由加入 堆積之金屬 以確保墨水 圖所示,由 陽極金屬產 用而在該陽 電力線13係 密度分佈越 力線13較集 而形成排列 之位置,因 孔的孔徑控 特性,使得 徑公差能接 電流使一陽 離子後,因 間形成電力 時間長短的 也越多,而 屬離子還原 線1 3之發射 的遮蔽板, 屬堆積會受 現象。而又 大,電場較 金屬膜層會 出一種解決的方法’請參閱 及一陰極板22、221之間加Invention-J This case is a device for controlling the distribution of power lines and Fang Mu * cheng is used in the electroforming process. Wherever it is located, it should be affected by the distribution of the power line 13 and the distribution of the electric field. As a result, the edge of the cathode plate 12 is strong, so if there is no shielding plate, it is thicker than the middle. In response to the above deficiency, the second picture (a) (b), in the process of a positive film, the shielding layer film can be ejected to the electroformed green oxide electrode plate 11 in the current-intensive area, and if there is no uniform situation, The control of the stacking range effect is also studied on the plate 2 1, which is more or less homogeneous in the tank, which reacts more uniformly with the area formed by a negative density component. Controlling the degree of formation has a thick effect, so the edge is conductive at the nozzle metal, so the hole is stable. The use of direct current to change the metal pole plate 12 and the energized power lines can easily cause gold and the power and power lines 1 3, and the potential difference between the thin and thin gold layers is generally in the manufacturing process, and most of them are near in the manufacturing process. ± 3, such as the double electric field on the first electrode plate 11 as the line 1 3, and this effect, the current of the plurality of electrically formed metal atoms does not have a fixed ink ϋ nozzle divided by adding accumulated metal to ensure the ink map It is shown that the density distribution of the anode power line 13 series is formed by the anode metal production. The force line 13 is more concentrated and formed in an array position. Due to the hole's pore diameter control characteristics, the diameter tolerance can be connected to the current to make a cation, and then electricity is formed. The more time there is, the more the shielding plate, which belongs to the emission reduction line 13 of the ion, belongs to the phenomenon of accumulation. But it ’s big, the electric field will be a solution compared with the metal film layer.

2048-修正.ptc 第5頁 499507 修正 案號 89125518 五、發明說明(2) 一單孔遮蔽板24,使電力狳9QAb w n ^ 綠2 3此先集中通過该早孔遮蔽板 24再發射至該陰極板221上,益仏,似上士斗队上 no1丄 ,^ 上,藉此可增加在該陰極板22、 221中間的投射機率,以改盖m jl & 丄丄 叹善因邊緣效應所造成在該陰極 板22、221邊緣所形成之金廬猛a私山β广 食屬層會較中間厚的問題,而經 由測試結果所得其中間與邊絵士〇 *丄η λ ^ 、遵緣相差± l〇//m,與理想值± 3 从m仍有差距’故其良率不佳。 經由上述說明,我侗I 上 我們可以歸納出習用技術中幾項可以 改進之缺點: I·該陰極板上之金屬祺層厚度不均。 2 ·利用該單孔遮蔽板,c丄、&入裔 默傲反造成該金屬膜層大多向中間 分佈,致使該金屬膜層分佈範圍過小。 職是之故’中請人鑑於f知技術之缺失,乃經悉心試 驗與研究,ϋ-本鍥而不拾之精神,終研發出本案之『控 制電力線分佈之裝置及方法(二)』。 發明簡述 本案之主要目的為改善習知技術中,電力線因受邊緣 效應作用以致多往陰極板周緣發射,因而邊緣所形成之金 屬層會較中間厚重的問題。 本案之次一目的為提供一種控制電力線分佈之裝置, 係應用於電鑄製程上,其包含:一陽極件,其因應一電力 施加而分解出一特定物質之一離子;一陰極件,設於該陽 極件之一相對位置’俾接收該離子以於其上形成一特定物2048-Amendment.ptc Page 5 499507 Amendment No. 89125518 V. Description of the invention (2) A single-hole masking plate 24, so that the power module 9QAb wn ^ Green 2 3 This is first concentrated through the early-hole masking plate 24 and then transmitted to the On the cathode plate 221, Yi Yi, like the no. 1 on the fighter team, can increase the projection probability in the middle of the cathode plate 22, 221 to change the m jl & As a result, the Jinlumeng a private mountain β phaeophagus layer formed on the edges of the cathode plates 22 and 221 will be thicker than the middle, and the test results obtained in the middle and the frontier 〇 * 丄 η λ ^ The margin difference is ± 10 // m, and there is still a gap from the ideal value of ± 3 from m ', so its yield is not good. Based on the above description, we can summarize several disadvantages that can be improved in conventional technology: I. The thickness of the metal layer on the cathode plate is uneven. 2 · Using the single-hole masking board, c 丄, & ancestor Murder caused the metal film layer to be mostly distributed to the middle, which caused the metal film layer distribution range to be too small. In view of the lack of know-how, the person in the post is the result of careful testing and research, and the spirit of “doing nothing” to finally develop the “device and method for controlling power line distribution (2)” in this case. Brief Description of the Invention The main purpose of this case is to improve the conventional technology in which power lines are emitted to the periphery of the cathode plate due to the edge effect, so the metal layer formed at the edge will be thicker than the middle. The second purpose of this case is to provide a device for controlling the distribution of power lines, which is applied to the electroforming process and includes: an anode piece that decomposes an ion of a specific substance in response to the application of an electric power; a cathode piece provided at A relative position of the anode member '俾 receives the ion to form a specific object thereon

2048-修正、ptc 499507 — _案緣——891255—18 今丨年f月 日_修正 ___ 五、發明說明(3) 質堆積層,且在該陰極件周緣繞設一導電層;一電鑄介 質,存在於該陽極件與該陰極件間,以傳遞該離子而形成 一電力線;以及一遮蔽裝置,設於該陽極板與該陰極板之 間,具有一開孔,可令該電力線穿過該開孔發射至該陰極 板上。 根據 為一陽極 根據 為一陰極 根據 該陰極件 根據 質係可為 根據 為係為錢 根據 與該陰極 根據 蔽裝置係 間自兩旁 根據 板之開孔 本案 上述構 板,且 上述構 板,且 上述構 之間距 上述構 銅。 上述構 基續酸 上述構 板距離 上述構 可為一 依序變 上述構 想’控制電力線分佈之裝 其材質可為鎳。 想’控制電力線分佈之裝 其材質可為鈦或鉻。 想’控制電力線分佈之裝 為15 〜30cm 〇 想,控制電力線分佈之装 直徑大小係介於1〜3 c m 之又一目的為提供一種 係應用於電鑄製程上,該方法包 分佈之裝 酸所組成 分佈之裝 分佈之裝 該複數個 又其開孔 分佈之裝 之間。 控制電力 括下列步 想,控制電力線 鎳、氣化鎳及硼 想,控制電力線 為1〜5cm 〇 想,控制電力線 多孔遮蔽板,且 小且兩兩對稱, 想,控制電力線 置中該陽極件係 置中該陰極件係 置中該陽極件與 置中該導電層材 置中該電鑄介質 〇 置中該遮蔽裝置 置中該其中該遮 開孔之孔徑由中 間距皆相同。。 置中該多孔遮蔽 線分佈之方法,2048-correction, ptc 499507 — _Case edge—891255—18 This month f month date _ amendment ___ V. Description of the invention (3) Mass accumulation layer, and a conductive layer is wound around the periphery of the cathode piece; A casting medium exists between the anode piece and the cathode piece to transfer the ions to form a power line; and a shielding device is provided between the anode plate and the cathode plate and has an opening to allow the power line to pass through It is emitted to the cathode plate through the opening. The basis is an anode, the basis is a cathode, the basis of the cathode is based on the quality system, the basis is based on the money, and the cathode is based on the shielding system from both sides of the openings of the board according to the case, and the above structure, and the above The distance between the structures is as described above. The above-mentioned structurally continuous acid, the above-mentioned structure plate distance, and the above-mentioned structure may be a device which sequentially changes the above-mentioned idea ' to control the distribution of power lines, and the material thereof may be nickel. The equipment that wants to control the distribution of power lines can be made of titanium or chromium. I want to control the distribution of the power line from 15 to 30cm. I think that the diameter of the device to control the distribution of the power line is between 1 and 3 cm. Another purpose is to provide a system that is used in the electroforming process. The distribution of the assembled distribution is between the plurality of openings and the distribution of the openings. Control power includes the following steps. Control power line nickel, vaporized nickel, and boron. Control power line is 1 ~ 5cm. Control power line porous shielding plate, which is small and symmetrical. Control power line centering the anode system. The centering of the cathode member is the centering of the anode member and the conductive layer, the centering of the electroforming medium, the centering of the shielding device, the centering of the shielding device, and the pore diameter of the shielding hole is the same from the middle distance. . The method of centering the porous shielding line distribution,

2048-修正.ptc 第7頁2048-fix.ptc Page 7

(d)通電流於該陽極板與該陰極板間,俾因庫i 流密度以產生該電力線。 平U應其電 根據上述構想,控制電力線分佈之裝置中如步驟“) 不,其中該陽極件係為一陽極板,且其材質可為鎳。 一根據上述構想,控制電力線分佈之裝置中如步驟(&) 所不,其中該陰極件係為一陰極板,設於該陽極件之一相 對f置’俾接收該離子以於其上形成一特定物質堆積層, 且其材質可為鈦或鉻。 、 一根據上述構想,控制電力線分佈之裝置中如步驟(a) 所不,其中該陽極件與該陰極件之間距為15〜3〇cm。 一根據上述構想’控制電力線分佈之裝置中如步驟(a) 所示其中該電鑄介質係為銨基磺酸鎳、氣化鎳及硼酸所 組成。 一根據上述構想’控制電力線分佈之裝置中如步驟(b ) 所不’其中該導電層係由一導電膠帶均勻黏附於該陰極板 周緣’又該導電膠帶寬度為0·3〜0.6cm,且材質為銅。 根據上述構想’控制電力線分佈之裝置中如步驟(b)(d) A current is passed between the anode plate and the cathode plate, and the power line is generated due to the current density of the reservoir i. According to the above conception, the device for controlling the power line distribution according to the above-mentioned concept is step ") No, wherein the anode is an anode plate, and the material can be nickel. According to the above concept, the device for controlling the power line distribution is Step & No, wherein the cathode piece is a cathode plate, and one of the anode pieces is disposed opposite to the anode to receive the ions to form a specific material stacking layer thereon, and the material may be titanium Or chromium. 1. According to the above conception, the device for controlling the power line distribution is as described in step (a), wherein the distance between the anode piece and the cathode piece is 15 ~ 30cm. As shown in step (a), the electroforming medium is composed of ammonium nickel sulfonate, nickel gasified nickel, and boric acid.-According to the above idea, in a device for controlling the distribution of power lines, as described in step (b), where The conductive layer is uniformly adhered to the periphery of the cathode plate by a conductive tape, and the width of the conductive tape is 0 · 3 ~ 0.6cm, and the material is copper. According to the above-mentioned concept, the device for controlling the distribution of power lines is as step (b).

五、發明說明(5) 所示,其中該導電層亦可由 或非封閉F A丨v赴似狄復數#又導電膠帶連接成一封閉 人外封閉區域,以黏附於該陰極板周 根據上述構想,控制電力蠄八 ° 所示,JL由β ^ 線分佈之裝置中如步驟(C) 始中該遮蔽裝置與該陰極板 卜―。 根:亡述構想’控制電力線分佈之裝置中如步驟(C) 根蔽裝置係可為一單孔遮蔽板。 所+“:電力線分佈之裝置中如步驟(C) ^ & Μ Λ Φ ^ ^ A 、多孔遮蔽板,且該複數個 鲁 距旁依序變小且w對稱,χ其開孔間 遮經t據上述構想’控制電力線分佈之裝置中其中該多孔 遮蔽板之開孔直徑大小係介K1〜3cm之間。 根!上述構想,控制電力線分佈之裝置中如步驟⑷ 不’,、中該電流密度為2.5〜l〇DM。 根據上述構想,控制電力線分佈之裝置中如步驟(d) 以% 中該電力線藉由穿過該遮蔽裝置中之複數個開孔 極板I發射至該陰極板,並沈積該特定物質堆積層於該陰 較佳實施例說明 :同時參見第三圖(a)( b ),其係本案較佳實施例之裝 一:圖其主要包含:一陽極板31、一陰極板32、321 ^ 一單孔遮蔽板34,其中該陽極板31與該陰極板32、321 、位於相對之位置,其間距為1 5〜30cm,且該遮閉板34設5. The description of the invention (5), wherein the conductive layer can also be connected by a non-closed FA 丨 v 去 似 狄 复数 # and conductive tape to form a closed area outside the human body to be adhered to the periphery of the cathode plate. As shown by the electric power, in the device in which JL is distributed by the β ^ line, the shielding device and the cathode plate are shown in step (C). Root: The concept of controlling the distribution of power lines. In step (C), the root shield can be a single-hole shield. All + ": in the device of power line distribution, such as step (C) ^ & Μ Λ Φ ^ ^ A, a porous shielding plate, and the plurality of distances are sequentially smaller and w symmetrical, and the openings between the openings are shielded According to the above conception, in the device for controlling power line distribution, the opening diameter of the porous shielding plate is between K1 ~ 3cm. Root! According to the above conception, in the device for controlling power line distribution, if step ⑷ is not used, the current is The density is 2.5 ~ 10 DM. According to the above idea, in the device for controlling the distribution of power lines, the power line is emitted to the cathode plate by passing through the plurality of open-hole plates I in the shielding device in step (d). And depositing the specific material stacking layer on the preferred embodiment of the cathode: see also the third figure (a) (b), which is the first embodiment of the present case: the figure mainly includes: an anode plate 31, a The cathode plates 32, 321 are a single-hole shielding plate 34, wherein the anode plate 31 and the cathode plates 32, 321 are located at opposite positions with a distance of 15 to 30 cm, and the closing plate 34 is provided

499507499507

於該陽極板31與該陰極板32、321之間,並與該陰極板距 離為1〜5cm,該陽極板31之材料可為鎳,該陰極板32則為 一玻璃板上鍍鈦,該單孔遮蔽板34即為一不導電材質, 如··壓克力板。 士由於在電解槽中包含有銨基磺酸鎳、氯化鎳及硼酸等 電鑄介質,當通一電流於該陽極板即會解離出金屬離子, 且所解離出的金屬離子因為受電力場作用,會在該陽極板 31與該陰極板32之間形成電力線33,藉由該電力線33可在 該陰極板上使金屬離子還原成金屬原子,若該電力線以較 集中之區域其所堆積排列的金屬原子也越多,又該電力線 33分佈係受邊緣效應所影響,因此易於陰極板邊緣形成金 屬膜層,雖然另加一單孔遮蔽板34,但卻致使電力線多往 中間之區域分佈,以致仍有分佈不均之情況存在。如第三 圖(a)所示,因此乃於該陰極板32之周圍加一導電金屬層 35,其中該導電金屬層35係由一導電膠帶均勻黏附於 該陰極板周緣,又該導電膠帶寬度為〇· 3〜〇· 6cm,且材質 為銅。如第三圖(b)所示,因銅比鈦有更佳的導電性,所 =當該複數條電力線33發射至該陰極板321時,不會因為 單孔遮蔽板34的作用影響,而僅在中間之區域形成金屬膜 層,該電力線33會有部份向兩侧分佈,因而可使該陰極板 32上的金屬膜層厚度較為平均且分佈範圍能較符合 理想值(約± 3 # m )。 綜上所述’本案於上述較佳實施力t所提供之控制電 力線分佈之裝置,即可改善在習用技術中僅以單孔遮蔽板Between the anode plate 31 and the cathode plates 32 and 321, and a distance of 1 to 5 cm from the cathode plate, the material of the anode plate 31 may be nickel, and the cathode plate 32 is a glass plated with titanium. The single-hole shielding plate 34 is a non-conductive material, such as an acrylic plate. Because the electrolytic cell contains electroforming media such as nickel ammonium sulfonate, nickel chloride, and boric acid, when an electric current is applied to the anode plate, metal ions are dissociated, and the dissociated metal ions are affected by the electric field. The function will form a power line 33 between the anode plate 31 and the cathode plate 32. The power line 33 can reduce metal ions to metal atoms on the cathode plate. If the power line is arranged in a more concentrated area, it will be stacked. The more metal atoms there are, and the distribution of the power lines 33 is affected by edge effects, so it is easy to form a metal film layer on the edge of the cathode plate. Although a single-hole shielding plate 34 is added, the power lines are distributed to the middle area. So that there is still uneven distribution. As shown in the third figure (a), a conductive metal layer 35 is added around the cathode plate 32, wherein the conductive metal layer 35 is uniformly adhered to the periphery of the cathode plate by a conductive tape, and the width of the conductive tape is It is 0.3 to 0.6 cm, and the material is copper. As shown in the third figure (b), copper has better conductivity than titanium, so when the plurality of power lines 33 are emitted to the cathode plate 321, it will not be affected by the effect of the single-hole shielding plate 34. The metal film layer is formed only in the middle area, and the power lines 33 are partially distributed to both sides, so that the thickness of the metal film layer on the cathode plate 32 can be more even and the distribution range can more conform to the ideal value (about ± 3 # m). In summary, the device for controlling the distribution of power lines provided by the above-mentioned preferred implementation force t can improve the use of a single-hole shield plate in conventional technology.

499507 _案號89125518 別年丨月〆^日 修正_ 五、發明說明(7) 作為控制電力線分佈之方式,所造成電力線多往該陰極板 中間之區域分佈的問題,進而可使該金屬膜層厚度更平均 及分佈範圍更符合所需,因此本發明實具產業發展之價 值。 本案得由熟悉技藝之人任施匠思而為諸般修飾,然皆 不脫如附申請範圍所欲保護者。499507 _ Case No. 89125518 In other years 丨 Month ^ ^ Day amendment _ V. Description of the invention (7) As a way to control the distribution of power lines, the problem of the distribution of power lines to the middle area of the cathode plate caused the metal film layer. The thickness is more even and the distribution range is more in line with the requirements, so the invention has the value of industrial development. This case may be modified by anyone who is familiar with the art, but it is not as good as the protection of the scope of the application.

2048-修正.ptc 第11頁 499507 _案號89125518 年I月日 修正_ 圖式簡單說明 本案藉由下列圖示及詳細說明,俾得一更深入了解: 第一圖··習用之電鑄裝置示意圖。 第二圖(a):習用之陰極極板示意圖。 第二圖(b):習用之電鑄裝置中另加一遮蔽板之示意圖。 第三圖(a):本案較佳實施例之陰極板示意圖。 第三圖(b):本案較佳實施例之電鑄裝置示意圖。 本案圖示中所包含之各元件列示如下: 陽極板:11、2 1、3 1 陰極板:12、22、221、32、321 電力線:13、23、33 單孔遮蔽板:24、34 導電金屬:352048-correction.ptc Page 11 499507 _Case No. 89125518 January 1st Amendment _ Schematic description This case has a deeper understanding through the following icons and detailed descriptions: The first picture · The conventional electroforming device schematic diagram. The second picture (a): a schematic diagram of a conventional cathode plate. The second figure (b): a schematic diagram of a shielding plate in a conventional electroforming device. The third figure (a): a schematic diagram of the cathode plate of the preferred embodiment of the present case. The third figure (b): a schematic diagram of the electroforming device of the preferred embodiment of this case. The components included in the illustration in this case are listed below: Anode plate: 11, 2 1, 3 1 Cathode plate: 12, 22, 221, 32, 321 Power line: 13, 23, 33 Single-hole shielding plate: 24, 34 Conductive metal: 35

2048-修正.ptc 第12頁2048-fix.ptc Page 12

Claims (1)

499507 案號賴雄518499507 Case No. Lai Xiong 518 修正 六、申嫌專利範衝: % -'Λ , ·- · 1 . 一種控制電九線分佈 包含: 用於電鑄製程上,其 施加而分解出一特定物質之 一陽極件,其因應一電力 一離子; 一陰極件,設於該陽極侔 子以於其上形成一特定物質堆之籍一/對位置,俾接收該離 設-導電層; 以層,且在該陰極件周緣繞 一電鑄介質,存在於該陽極 該離子而形成一電力線;以及 件與該陰極件間 以傳遞 一遮蔽裝置,設於該陽極板與該陰極板之間,具_ 開孔,可令該電力線穿過該開孔發射至該陰極板上、。_ 2·如申請專利範圍第1項所述之控制電力線分佈之裝置, 其中該陽極件係為一陽極板,且其材質可為鎳。1 , 3 ·如申請專利範圍第1項所述之控制電力線分佈之装置, 其中該陰極件係為一陰極板,且其材質可為鈦或鉻。 4·如申請專利範圍第1項所述之控制電力線分佈之°裝置, 其中該陽極件與該陰極件之間距為15〜30cm。 5·如申請專利範圍第1項所述之控制電力線分佈之裴置, 其中該導電層材質係可為銅。 6·如申請專利範圍第1項所述之控制電力線分佈之裝置, 其中該電鑄介質為係為銨基磺酸鎳、氣化鎳及硼酸所組 成。 7 ·如申請專利範圍第1項所述之控制電力線分佈之装置, 其中該遮蔽裝置與該陰極板距離為1〜5cm。Amendment 6. Fan Chong, who applied for a patent: % -'Λ, ·-· 1. A control of the distribution of electric wires includes: used in the electroforming process, which is applied to decompose an anode piece of a specific substance, which responds to a Electricity is an ion; a cathode piece is provided at a position / pair of anode anodes on which a specific material pile is formed, and receives the separated-conductive layer; a layer is formed around the periphery of the cathode piece. An electroformed medium exists in the anode and the ions to form a power line; and a shielding device is transmitted between the anode and the cathode piece, and is provided between the anode plate and the cathode plate, with an opening to allow the power line to pass through It is emitted to the cathode plate through the opening. _ 2 · The device for controlling power line distribution as described in item 1 of the scope of patent application, wherein the anode is an anode plate, and the material may be nickel. 1, 3 · The device for controlling power line distribution as described in item 1 of the scope of the patent application, wherein the cathode member is a cathode plate, and the material thereof may be titanium or chromium. 4. The device for controlling the power line distribution according to item 1 of the scope of patent application, wherein the distance between the anode and the cathode is 15 ~ 30cm. 5. The device for controlling the distribution of power lines as described in item 1 of the scope of the patent application, wherein the material of the conductive layer may be copper. 6. The device for controlling power line distribution as described in item 1 of the scope of the patent application, wherein the electroforming medium is composed of nickel ammonium sulfonate, nickel gasification, and boric acid. 7. The device for controlling power line distribution as described in item 1 of the scope of patent application, wherein the distance between the shielding device and the cathode plate is 1 to 5 cm. 499507 -- -t^Ji!25518 彳/年(月;^日_修正 六、申請專纖目 一 一 ----- 8 · —種控制電力線分佈之方法,係應用於電鑄製程上,談 方法包括下列步驟: Μ (a) 提供一電鑄槽,該電鑄槽係包含一陽極件及一陰極 件’且該陽極件,其因應一電力施加而分解出一特定物質 之一離子’又具一電鑄介質,存在於該陽極件與該陰極件 間,以傳遞該離子而形成一電力線; (b) 於該陰極件周緣施加一導電層; (c) 提供一遮蔽裝置,設於該陽極板與該陰極板之間; 以及 (d )通一電流於該陽極板與該陰極板間,俾因應其電流 密度以產生該電力線。 9 ·如申請專利範圍第8項所述之控制電力線分佈之方法, 如步驟(a)所示,其中該陽極件係為一陽極板,且其材質 可為鎳。 I 0 ·如申請專利範圍第8項所述之控制電力線分佈之方法, 如步驟(a )所示,其中該陰極件係為一陰極板,設於該陽 極件之一相對位置,俾接收該離子以於其上形成一特定物 質堆積層,且其材質可為鈦或鉻。 II ·如申請專利範圍第8項所述之控制電力線分佈之方法, 如步驟(a )所示,其中該陽極件與該陰極件之間距為丨5〜 30cm 〇 1 2 ·如申請專利範圍第8項所述之控制電力線分佈之方法, 如步驟(a)所示,其中該電鑄介質係為鏔基磺酸鎳、氯化 鎳及硼酸所組成。499507--t ^ Ji! 25518 彳 / year (month; ^ day_revision VI. Application for special fiber headings 11 ----- 8 ·-a method to control the distribution of power lines, is used in the electroforming process, The method includes the following steps: Μ (a) Provide an electroforming tank, which includes an anode piece and a cathode piece 'and the anode piece, which decomposes out an ion of a specific substance in response to the application of electricity' There is also an electroformed medium that exists between the anode piece and the cathode piece to transfer the ions to form a power line; (b) applying a conductive layer to the periphery of the cathode piece; (c) providing a shielding device provided at Between the anode plate and the cathode plate; and (d) passing a current between the anode plate and the cathode plate to generate the power line according to its current density. 9 · Control as described in item 8 of the scope of patent application The method of power line distribution, as shown in step (a), wherein the anode is an anode plate, and its material may be nickel. I 0 · The method of controlling power line distribution as described in item 8 of the scope of patent application, such as As shown in step (a), the cathode member is a cathode The plate is arranged at a relative position of one of the anode pieces, and the ions receive the ions to form a specific material stacking layer thereon, and the material thereof can be titanium or chromium. II · Control power line as described in item 8 of the scope of patent application The distribution method is as shown in step (a), wherein the distance between the anode and the cathode is 5 to 30 cm. 〇1 2 The method for controlling the distribution of power lines as described in item 8 of the scope of patent application, as in step ( As shown in a), the electroforming medium is composed of nickel sulfonate, nickel chloride and boric acid. 2048-修正.ptc 第14頁 :申請專^^___ 1 如3.步=專利範圍第8項所述之控制電力線分佈 P’(b)所示,其中該導電層係由一導電 * 去, :^陰極板周緣,又該導電膠帶寬度為〇· 3 ^6均句黏附 負為鋼。 · bCln,且材 1 如4’步如驟申2專利範圍第8項所述之控制電力線分佈之方土 接成1(4+)所不,其中該導電層亦可由複數段導電膠嫌 ! 5.如申?專或二封閉區* ’ :黏:於該陰極板周緣,連 甲明專利乾圍第8所述之控制電 =·如申請專利範圍第8項所述之控制電力線 17 ^ 申明專利範圍第8項所述之控制電力線分佈之方 步驟(d)所示,其中該電流密度為2· 5〜1〇DM。 ' ’ 1 8 ·如申請專利範圍第8項所述之控制電力線分佈之方法, 如步驟(d)所示,其中該電力線藉由穿過該遮蔽裝置中之 複數個開孔以均勻發射至該陰極板,並沈積該特定物質堆 積層於該陰極板上。 第15頁 2048-修正,ptc2048-correction.ptc Page 14: Application for special ^^ ___ 1 As shown in Step 3. Controlled power line distribution P '(b) described in item 8 of the patent scope, where the conductive layer is made of a conductive *, : ^ The periphery of the cathode plate, and the width of the conductive tape is 0.3 · ^ 6. The negative adhesion is steel. · BCln, and material 1 as 4 'step as described in item 8 of the patent application 2 control the distribution of the power line into 1 (4+), where the conductive layer can also be composed of multiple sections of conductive glue! 5. As applied? Exclusive or second closed area * ': Adhesive: on the periphery of the cathode plate, the control power described in the 8th patent patent Ganwei = control power line as described in item 8 of the patent application scope 17 ^ declared patent scope 8 The step (d) of controlling the power line distribution according to the item is shown in the step (d), wherein the current density is 2.5 to 10 DM. '' 1 8 · The method for controlling power line distribution as described in item 8 of the scope of patent application, as shown in step (d), wherein the power line is uniformly emitted to the opening by passing through a plurality of openings in the shielding device. The cathode plate, and the specific substance deposition layer is deposited on the cathode plate. Page 15 2048-correction, ptc
TW89125518A 2000-11-30 2000-11-30 An apparatus and method for controlling distribution of a power line TW499507B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102534733A (en) * 2010-12-24 2012-07-04 北大方正集团有限公司 Electroplating device and electroplating method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102534733A (en) * 2010-12-24 2012-07-04 北大方正集团有限公司 Electroplating device and electroplating method
CN102534733B (en) * 2010-12-24 2016-01-06 北大方正集团有限公司 Electroplanting device and electro-plating method

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