TW499507B - An apparatus and method for controlling distribution of a power line - Google Patents

Abstract

An apparatus and method for controlling distribution of a power line applied in electroplating fabrication are disclosed. The apparatus includes a positive plate for decomposing an ion of a specific substance via an electric power imposed; a negative plate disposed in a specific position opposite to said positive plate for receiving said ion to form a layer of a specific substance, and disposed a conductive layer around said negative plate; an electroforming medium contained between said positive plate and said negative plate for transferring to form said power line; and a shelter disposed between said positive plate and said negative plate and having a holes for allowing said power line to go through and shoot to said negative plate.

Description

_ Γ-Γτ · —89125518 ί ψ ι Day》 ^ Works 5. Inventions (1 Qing-~~

Invention-J This case is a device for controlling the distribution of power lines and Fang Mu * cheng is used in the electroforming process. Wherever it is located, it should be affected by the distribution of the power line 13 and the distribution of the electric field. As a result, the edge of the cathode plate 12 is strong, so if there is no shielding plate, it is thicker than the middle. In response to the above deficiency, the second picture (a) (b), in the process of a positive film, the shielding layer film can be ejected to the electroformed green oxide electrode plate 11 in the current-intensive area, and if there is no uniform situation, The control of the stacking range effect is also studied on the plate 2 1, which is more or less homogeneous in the tank, which reacts more uniformly with the area formed by a negative density component. Controlling the degree of formation has a thick effect, so the edge is conductive at the nozzle metal, so the hole is stable. The use of direct current to change the metal pole plate 12 and the energized power lines can easily cause gold and the power and power lines 1 3, and the potential difference between the thin and thin gold layers is generally in the manufacturing process, and most of them are near in the manufacturing process. ± 3, such as the double electric field on the first electrode plate 11 as the line 1 3, and this effect, the current of the plurality of electrically formed metal atoms does not have a fixed ink ϋ nozzle divided by adding accumulated metal to ensure the ink map It is shown that the density distribution of the anode power line 13 series is formed by the anode metal production. The force line 13 is more concentrated and formed in an array position. Due to the hole's pore diameter control characteristics, the diameter tolerance can be connected to the current to make a cation, and then electricity is formed. The more time there is, the more the shielding plate, which belongs to the emission reduction line 13 of the ion, belongs to the phenomenon of accumulation. But it ’s big, the electric field will be a solution compared with the metal film layer.

2048-Amendment.ptc Page 5 499507 Amendment No. 89125518 V. Description of the invention (2) A single-hole masking plate 24, so that the power module 9QAb wn ^ Green 2 3 This is first concentrated through the early-hole masking plate 24 and then transmitted to the On the cathode plate 221, Yi Yi, like the no. 1 on the fighter team, can increase the projection probability in the middle of the cathode plate 22, 221 to change the m jl & As a result, the Jinlumeng a private mountain β phaeophagus layer formed on the edges of the cathode plates 22 and 221 will be thicker than the middle, and the test results obtained in the middle and the frontier 〇 * 丄 η λ ^ The margin difference is ± 10 // m, and there is still a gap from the ideal value of ± 3 from m ', so its yield is not good. Based on the above description, we can summarize several disadvantages that can be improved in conventional technology: I. The thickness of the metal layer on the cathode plate is uneven. 2 · Using the single-hole masking board, c 丄, & ancestor Murder caused the metal film layer to be mostly distributed to the middle, which caused the metal film layer distribution range to be too small. In view of the lack of know-how, the person in the post is the result of careful testing and research, and the spirit of “doing nothing” to finally develop the “device and method for controlling power line distribution (2)” in this case. Brief Description of the Invention The main purpose of this case is to improve the conventional technology in which power lines are emitted to the periphery of the cathode plate due to the edge effect, so the metal layer formed at the edge will be thicker than the middle. The second purpose of this case is to provide a device for controlling the distribution of power lines, which is applied to the electroforming process and includes: an anode piece that decomposes an ion of a specific substance in response to the application of an electric power; a cathode piece provided at A relative position of the anode member '俾 receives the ion to form a specific object thereon

2048-correction, ptc 499507 — _Case edge—891255—18 This month f month date _ amendment ___ V. Description of the invention (3) Mass accumulation layer, and a conductive layer is wound around the periphery of the cathode piece; A casting medium exists between the anode piece and the cathode piece to transfer the ions to form a power line; and a shielding device is provided between the anode plate and the cathode plate and has an opening to allow the power line to pass through It is emitted to the cathode plate through the opening. The basis is an anode, the basis is a cathode, the basis of the cathode is based on the quality system, the basis is based on the money, and the cathode is based on the shielding system from both sides of the openings of the board according to the case, and the above structure, and the above The distance between the structures is as described above. The above-mentioned structurally continuous acid, the above-mentioned structure plate distance, and the above-mentioned structure may be a device which sequentially changes the above-mentioned idea ' to control the distribution of power lines, and the material thereof may be nickel. The equipment that wants to control the distribution of power lines can be made of titanium or chromium. I want to control the distribution of the power line from 15 to 30cm. I think that the diameter of the device to control the distribution of the power line is between 1 and 3 cm. Another purpose is to provide a system that is used in the electroforming process. The distribution of the assembled distribution is between the plurality of openings and the distribution of the openings. Control power includes the following steps. Control power line nickel, vaporized nickel, and boron. Control power line is 1 ~ 5cm. Control power line porous shielding plate, which is small and symmetrical. Control power line centering the anode system. The centering of the cathode member is the centering of the anode member and the conductive layer, the centering of the electroforming medium, the centering of the shielding device, the centering of the shielding device, and the pore diameter of the shielding hole is the same from the middle distance. . The method of centering the porous shielding line distribution,

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(d) A current is passed between the anode plate and the cathode plate, and the power line is generated due to the current density of the reservoir i. According to the above conception, the device for controlling the power line distribution according to the above-mentioned concept is step ") No, wherein the anode is an anode plate, and the material can be nickel. According to the above concept, the device for controlling the power line distribution is Step & No, wherein the cathode piece is a cathode plate, and one of the anode pieces is disposed opposite to the anode to receive the ions to form a specific material stacking layer thereon, and the material may be titanium Or chromium. 1. According to the above conception, the device for controlling the power line distribution is as described in step (a), wherein the distance between the anode piece and the cathode piece is 15 ~ 30cm. As shown in step (a), the electroforming medium is composed of ammonium nickel sulfonate, nickel gasified nickel, and boric acid.-According to the above idea, in a device for controlling the distribution of power lines, as described in step (b), where The conductive layer is uniformly adhered to the periphery of the cathode plate by a conductive tape, and the width of the conductive tape is 0 · 3 ~ 0.6cm, and the material is copper. According to the above-mentioned concept, the device for controlling the distribution of power lines is as step (b).

5. The description of the invention (5), wherein the conductive layer can also be connected by a non-closed FA 丨 v 去 似 狄 复数 # and conductive tape to form a closed area outside the human body to be adhered to the periphery of the cathode plate. As shown by the electric power, in the device in which JL is distributed by the β ^ line, the shielding device and the cathode plate are shown in step (C). Root: The concept of controlling the distribution of power lines. In step (C), the root shield can be a single-hole shield. All + ": in the device of power line distribution, such as step (C) ^ & Μ Λ Φ ^ ^ A, a porous shielding plate, and the plurality of distances are sequentially smaller and w symmetrical, and the openings between the openings are shielded According to the above conception, in the device for controlling power line distribution, the opening diameter of the porous shielding plate is between K1 ~ 3cm. Root! According to the above conception, in the device for controlling power line distribution, if step ⑷ is not used, the current is The density is 2.5 ~ 10 DM. According to the above idea, in the device for controlling the distribution of power lines, the power line is emitted to the cathode plate by passing through the plurality of open-hole plates I in the shielding device in step (d). And depositing the specific material stacking layer on the preferred embodiment of the cathode: see also the third figure (a) (b), which is the first embodiment of the present case: the figure mainly includes: an anode plate 31, a The cathode plates 32, 321 are a single-hole shielding plate 34, wherein the anode plate 31 and the cathode plates 32, 321 are located at opposite positions with a distance of 15 to 30 cm, and the closing plate 34 is provided

499507

Between the anode plate 31 and the cathode plates 32 and 321, and a distance of 1 to 5 cm from the cathode plate, the material of the anode plate 31 may be nickel, and the cathode plate 32 is a glass plated with titanium. The single-hole shielding plate 34 is a non-conductive material, such as an acrylic plate. Because the electrolytic cell contains electroforming media such as nickel ammonium sulfonate, nickel chloride, and boric acid, when an electric current is applied to the anode plate, metal ions are dissociated, and the dissociated metal ions are affected by the electric field. The function will form a power line 33 between the anode plate 31 and the cathode plate 32. The power line 33 can reduce metal ions to metal atoms on the cathode plate. If the power line is arranged in a more concentrated area, it will be stacked. The more metal atoms there are, and the distribution of the power lines 33 is affected by edge effects, so it is easy to form a metal film layer on the edge of the cathode plate. Although a single-hole shielding plate 34 is added, the power lines are distributed to the middle area. So that there is still uneven distribution. As shown in the third figure (a), a conductive metal layer 35 is added around the cathode plate 32, wherein the conductive metal layer 35 is uniformly adhered to the periphery of the cathode plate by a conductive tape, and the width of the conductive tape is It is 0.3 to 0.6 cm, and the material is copper. As shown in the third figure (b), copper has better conductivity than titanium, so when the plurality of power lines 33 are emitted to the cathode plate 321, it will not be affected by the effect of the single-hole shielding plate 34. The metal film layer is formed only in the middle area, and the power lines 33 are partially distributed to both sides, so that the thickness of the metal film layer on the cathode plate 32 can be more even and the distribution range can more conform to the ideal value (about ± 3 # m). In summary, the device for controlling the distribution of power lines provided by the above-mentioned preferred implementation force t can improve the use of a single-hole shield plate in conventional technology.

499507 _ Case No. 89125518 In other years 丨 Month ^ ^ Day amendment _ V. Description of the invention (7) As a way to control the distribution of power lines, the problem of the distribution of power lines to the middle area of the cathode plate caused the metal film layer. The thickness is more even and the distribution range is more in line with the requirements, so the invention has the value of industrial development. This case may be modified by anyone who is familiar with the art, but it is not as good as the protection of the scope of the application.

2048-correction.ptc Page 11 499507 _Case No. 89125518 January 1st Amendment _ Schematic description This case has a deeper understanding through the following icons and detailed descriptions: The first picture · The conventional electroforming device schematic diagram. The second picture (a): a schematic diagram of a conventional cathode plate. The second figure (b): a schematic diagram of a shielding plate in a conventional electroforming device. The third figure (a): a schematic diagram of the cathode plate of the preferred embodiment of the present case. The third figure (b): a schematic diagram of the electroforming device of the preferred embodiment of this case. The components included in the illustration in this case are listed below: Anode plate: 11, 2 1, 3 1 Cathode plate: 12, 22, 221, 32, 321 Power line: 13, 23, 33 Single-hole shielding plate: 24, 34 Conductive metal: 35

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Claims (1)

499507 Case No. Lai Xiong 518 Amendment 6. Fan Chong, who applied for a patent: ％ -'Λ, ·-· 1. A control of the distribution of electric wires includes: used in the electroforming process, which is applied to decompose an anode piece of a specific substance, which responds to a Electricity is an ion; a cathode piece is provided at a position / pair of anode anodes on which a specific material pile is formed, and receives the separated-conductive layer; a layer is formed around the periphery of the cathode piece. An electroformed medium exists in the anode and the ions to form a power line; and a shielding device is transmitted between the anode and the cathode piece, and is provided between the anode plate and the cathode plate, with an opening to allow the power line to pass through It is emitted to the cathode plate through the opening. _ 2 · The device for controlling power line distribution as described in item 1 of the scope of patent application, wherein the anode is an anode plate, and the material may be nickel. 1, 3 · The device for controlling power line distribution as described in item 1 of the scope of the patent application, wherein the cathode member is a cathode plate, and the material thereof may be titanium or chromium. 4. The device for controlling the power line distribution according to item 1 of the scope of patent application, wherein the distance between the anode and the cathode is 15 ~ 30cm. 5. The device for controlling the distribution of power lines as described in item 1 of the scope of the patent application, wherein the material of the conductive layer may be copper. 6. The device for controlling power line distribution as described in item 1 of the scope of the patent application, wherein the electroforming medium is composed of nickel ammonium sulfonate, nickel gasification, and boric acid. 7. The device for controlling power line distribution as described in item 1 of the scope of patent application, wherein the distance between the shielding device and the cathode plate is 1 to 5 cm. 499507--t ^ Ji! 25518 彳 / year (month; ^ day_revision VI. Application for special fiber headings 11 ----- 8 ·-a method to control the distribution of power lines, is used in the electroforming process, The method includes the following steps: Μ (a) Provide an electroforming tank, which includes an anode piece and a cathode piece 'and the anode piece, which decomposes out an ion of a specific substance in response to the application of electricity' There is also an electroformed medium that exists between the anode piece and the cathode piece to transfer the ions to form a power line; (b) applying a conductive layer to the periphery of the cathode piece; (c) providing a shielding device provided at Between the anode plate and the cathode plate; and (d) passing a current between the anode plate and the cathode plate to generate the power line according to its current density. 9 · Control as described in item 8 of the scope of patent application The method of power line distribution, as shown in step (a), wherein the anode is an anode plate, and its material may be nickel. I 0 · The method of controlling power line distribution as described in item 8 of the scope of patent application, such as As shown in step (a), the cathode member is a cathode The plate is arranged at a relative position of one of the anode pieces, and the ions receive the ions to form a specific material stacking layer thereon, and the material thereof can be titanium or chromium. II · Control power line as described in item 8 of the scope of patent application The distribution method is as shown in step (a), wherein the distance between the anode and the cathode is 5 to 30 cm. 〇1 2 The method for controlling the distribution of power lines as described in item 8 of the scope of patent application, as in step ( As shown in a), the electroforming medium is composed of nickel sulfonate, nickel chloride and boric acid. 2048-correction.ptc Page 14: Application for special ^^ ___ 1 As shown in Step 3. Controlled power line distribution P '(b) described in item 8 of the patent scope, where the conductive layer is made of a conductive *, : ^ The periphery of the cathode plate, and the width of the conductive tape is 0.3 · ^ 6. The negative adhesion is steel. · BCln, and material 1 as 4 'step as described in item 8 of the patent application 2 control the distribution of the power line into 1 (4+), where the conductive layer can also be composed of multiple sections of conductive glue! 5. As applied? Exclusive or second closed area * ': Adhesive: on the periphery of the cathode plate, the control power described in the 8th patent patent Ganwei = control power line as described in item 8 of the patent application scope 17 ^ declared patent scope 8 The step (d) of controlling the power line distribution according to the item is shown in the step (d), wherein the current density is 2.5 to 10 DM. '' 1 8 · The method for controlling power line distribution as described in item 8 of the scope of patent application, as shown in step (d), wherein the power line is uniformly emitted to the opening by passing through a plurality of openings in the shielding device. The cathode plate, and the specific substance deposition layer is deposited on the cathode plate. Page 15 2048-correction, ptc