TW490863B - Manufacturing method of LED with uniform color temperature - Google Patents
Manufacturing method of LED with uniform color temperature Download PDFInfo
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- TW490863B TW490863B TW090103012A TW90103012A TW490863B TW 490863 B TW490863 B TW 490863B TW 090103012 A TW090103012 A TW 090103012A TW 90103012 A TW90103012 A TW 90103012A TW 490863 B TW490863 B TW 490863B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000007641 inkjet printing Methods 0.000 claims description 22
- 238000005516 engineering process Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 13
- 239000013078 crystal Substances 0.000 claims description 10
- 229910002601 GaN Inorganic materials 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 210000004508 polar body Anatomy 0.000 claims description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 34
- 238000005253 cladding Methods 0.000 description 7
- 239000005022 packaging material Substances 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 230000003595 spectral effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 241000206607 Porphyra umbilicalis Species 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000005404 monopole Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Ink Jet (AREA)
Description
490863 五、發明說明(l) 發明領域: 本發明係有關於發光二極體之封裝方法,特別係有關 於利用未切割成發光二極體晶粒的晶圓上,獲得每一發光 二極體之發光波長,並根據每一發光二極體之發光波長, 調制形成於發光二極體上之磷光物層之劑量,使得每一發 光二極體均能產生實質上相同色溫的光束。 發明背景: 第1 A圖至第1 G圖係分別顯示一種習知發光二極體之製 程步驟。如第1 A圖所示,利用半導體製程於一絕緣基底 (insulating substrate)18 上形成一 η 型覆蓋層(n-type cladding layer)19。接著,如第1B圖所示,於此η型覆蓋 層19上形成具有既定形狀的^ρ型覆蓋層(p~~type cladding layer)22。接著,如第1 c圖所示,於此p型覆蓋 層22上分別形成一p型電極(p-type electrode)17以及於η 型覆蓋層19上形成一 η型電極(η —type electrode)”。接 著,如第1 D圖所示,形成複數切割道l,可以切割形成複 數發光二極體晶粒。接著,如第1 E圖所示,將發光二極體 晶粒設置於一第一導線框架(1 ead frame) 1 2上;其中利用 導線21連接p型電極17與第^導線框架13,以及利用導線 23連接η型電極14與第一導線框架12。接著,如第ip圖所 示,於此發光二極體上形成一磷光物層(phosphor laver) 32。最後’ #第1G圖所示,湘封裝材料34封裝此發光二 極體1 5。 依照傳統方式,在每一個晶粒所形成之磷光物層的劑
0691-5982TWI-ptd 第4頁 五、發明說明(2) ----------- i ί1分均大致相同 '然而’即使在同-晶圓上利用半導 -二=技術形成的複數發光二極體晶粒所發射的波長,亦 非相同。因此,習知利用相同劑量與成分的磷光物層 ,t寻發光二極體發射的第一波長轉換(transform)成較 第一波長長的一第二波長亦非完全相同。進一步,每一發 ,二極體利用第一波長與第二波長調制發光的色溫亦非完 王相同。因此’ 一晶圓上形成具有相同發光色溫的發光二 極體的良率大約1 0 %而已。 發明概述: 有鑑於此,為了解決上述的問題,本發明提出一種在 晶圓上形成均勻色溫之發光二極體之製造方法,包括下列 步驟·於一晶圓上形成複數發光二極體;獲得上述晶圓上 該些發光二極體之發光波長(Hght emission wavelengths);以及根據上述發光波長於該些發光二極體 上形成一對應劑量的磷光物層,藉使該晶圓上之該些發光 二極體均能產生實質上相同色溫的光束。 本發明之另一目的在於提供一種發光二極體之製造方 法’包括下步驟:於一晶圓上形成複數發光二極體; 獲得上述晶圓上該些發光二極體之發光波長(i ight emission wavelengths);根據上述發光波長於該些發光 二極體上形成一對應劑量的磷光物層,藉使該晶圓上之該 些發光二極體均能產生實質上相同色溫的光束;將上述晶 圓上的複數發光二極體切割形成複數個具有實質上相同色 溫的發光二極體晶粒;以及封裝上述複數發光二極體晶
0691-5982TWI-ptd 第5頁 490863
皮本發明之又一目的在於提供一種形成白光磊晶片之製 造方法,包括下步驟:於一晶圓上形成複數藍光發光二極 體;獲得上述晶圓上該些藍光發光二極體之發光波長 、light emission wavelengths);以及根據上述發光波長 於4些監光發光二極體上形成一對應劑量的填光物層,藉 使該晶圓上之該些發光二極體均能產生實質上相同色溫^ 白光。
本發明之再一目的係提供一種白光發光二極體之製 造方法’包括下步驟:於一晶圓上形成複數藍光發光二極 體;獲得上述晶圓上該些藍光發光二極體之發光波長 〔light emission wavelengths);根據上述發光波長於該 些監光發光二極體上形成一對應劑量的磷光物層,藉使該 晶圓上之該些發光二極體均能產生實質上相同色溫的白 $,將上述晶圓上的複數發光二極體切割形成複數個具有 貝貝上相同色溫的白光發光二極體晶粒;以及封裝上述複 數白光發光一極體晶粒。 本發明特徵之一,係於複數發光二極體上分別形成不
同劑s的破光物層,使得來自發光二極體的第一波長與來 自礙光物的第二波長調制的色溫幾乎相同,因此可大幅提 高良率。 本發明特徵之二,在於能夠形成磊晶片型態(wafer f orm)的白光發光二極體(傳統製程均是將晶圓上的發光二 極體切成晶粒後,才形成磷光物,因此只能形成晶粒型態 ㈣863 五、發明說明(4) 的白光發光二極體),除了良率較高外,尚可節省下游封 裝成本。 簡單圖式說明: 第1 A圖至第1 G ®係分別顯示習知發光二極體之製 式; 第2係概要地顯示本發明之實施例之封裝流程圖式; =3圖係概要地顯示一晶圓上形成複數發光二極體; ,第4圖係概要地顯示於一晶圓上的複數發光二極體分 別形成不同劑量的碟光物層; 切宝i m概λ地顯示第4圖中晶圓上的複數發光二極體 切割形成後數發光二極體晶粒; 愧體 面圖r。圖係概要的顯示具有一活性層的發光二極體的剖 符號說明: 12〜第一導線框架; 1 3〜第二導線框架; 1 4〜η型電極; 1 5〜發光二極體; 1 7〜ρ型電極; 1 8〜絕緣基底; 19〜η型覆蓋層; 2 0〜活性層; 21〜導線; 22〜Ρ型覆蓋層; 490863
2 3〜導線; 3 2 c〜磷光物層 32 、 32a 、 32b 3 4〜封装材料; 實施例說明: 第2圖係概要地顯示本發明之實施例之封裝流 式。L圖V,100係於一晶圓上形成複數發光二。 第圖係概要地顯示一晶圓上形成 如第3圖所示,係於一 ¥崚其矻〗β r旻歡^九一極體。 極體。此等紫外光/藍光發光二極體包括一^: ^ ★形成於絕緣基底1 8上的一 η型覆蓋層丨9、形 此η型覆蓋層19上具有既定形狀的複數Ρ型覆蓋層22、分別 形成於此等ρ型覆蓋層上的複數ρ型電極24、以及分 於此η型覆盍層1 9之既定位置上的複數η型電極丨4。一妒 言二於此種紫外光/藍光發光二極體中,η型覆蓋層係 塑亂化鎵為材料製造,ρ型覆蓋層係以ρ型氮化鎵為材料製 造。因此’此種紫外光/藍光發光二極體發射藍光,盆桿 準波長約為450nm。 〃不 進一步,如第2圖中的符號20 0所示,讀取上述晶圓18 上的複數紫外光/藍光發光二極體之第一發光波長。於上 述晶圓1 8上,形成既定位置的複數切割道l。接著,分別 導通上述晶圓1 8上的複數紫外光/藍光發光二極體。例 如,分別對上述晶圓上的每一紫外光/藍光發光二極體之ρ 犁電極與η型電極施壓,使其發光b。因此,可以獲得上述 晶圓上複數紫外光/藍光發光二極體之對應光譜S。
0691-5982TW(-ptd 第8頁 490863
進一步,利用CIE組織於1931年制定的色座標圖 (chromaticity diagram)與色匹配函數(c〇1〇r function),可以將實施例中的紫外光/藍光發光二極體發 射的第一波長與其它物質,例如磷光物層,發射的第二波 長調制形成不同顏色的光束。 接著’如第2圖中的符號30 0所示,根據上述步驟中量 測得到的複數發光一極體之光譜圖形成不同劑量的峨光物 層。利用喷墨印刷技術(Ink Jet Printing),並根據每一 發光二極體之光譜圖,將不同劑量的磷光物分別形成於各 個發光二極體上。例如,如同第4圖中右側所示的發光二 極體,當此發光二極體發射的一第一波長為標準波長 4 5 0 n m日可’藉由上述喷墨印刷技術形成標準劑量的鱗光物 32a於此發光二極體上,以便形成色溫6〇〇〇1(的白光。例 如’如第4^圖中中間所示的發光二極體,當此發光二極體 發射的一第一波長為4 5 5nm,則藉由上述喷墨印刷技術形 成較少劑量的磷光物32b於此發光二極體上,以便形成相 同色溫的白光。例如,如第4圖左側所示的發光二極體, 當此發光二極體發射的一第一波長為44511111,則藉由上述 喷墨印刷技術形成較多劑量的磷光物32c於此發光二極體 上,以便形成相同色溫的白光。當發光二極體發射的第一 波長較標準波長長時,根據色匹配函數必須形成光譜面積 較小的第二波長,以便形成色溫60 0 0K的白光。因此,形 成於發光二極體上的磷光物之劑量較少。當發光二極體發 射的第一波長較標準波長短時,根據色匹配函數必須形成
490863 五、發明說明(7) 光譜面積較大的第二波長,以便形成色溫6 〇 〇 〇 K的白光。 因此,形成於發光二極體上的磷光物之劑量較多。此外, 於本實施例中,可應用熱泡式(thermai bubble)喷墨印刷 技術與壓電式(piezoelectric)喷墨印刷技術將磷光物形 成於此等發光二極體之表面。 對於晶圓上的複數發光二極體分別形成對應的劑量的 磷光物層後;接著,如第2圖中的符號4〇〇所示,將晶圓上 的複數發光二極體切割形成複數發光二極體晶粒。第5圖 係概要地顯示第4圖中晶圓上的複數發光二極體切割形成 複數發光二極體晶粒後,利用封裝材料34封裝每一發光二 極體。例如,將發光二極體晶粒設置於一第一導線框架1 2 上;其中利用導線21連接p型電極17與第二導線框架13, 以及利用導線2 3連接η型電極1 4與第一導線框竿1 2 了 如第2圖中的符號50 0所示,利用封裝材料封裝每一發 光二極體晶粒。可利用封裝材料形成不同曲率的透鏡,二 便形成不同的聚光長度。 於本發明中,如第6圖所示,可以於上述n型覆蓋芦19 與Ρ型覆盍層2 2之間形成一活性層2 〇,以便增加發光強 度。 Χ 於此貫施例中,亦可以調制不同比例的磷光物 成於上述晶圓之複數發光二極體表面。例如,調制兩或 三種以上的磷光物,亦可形成不同光譜面積的第二 第三波長。因此,藉由上述發光二極體發射的第—^ 第一種鱗光物發出的第二波長與第二種磷光物發出的^三 ΕΗ 0691-5982TWi -ptd 第10頁
490863 五、發明說明(8) 波長形成既定的顏色。 於本發明中,可以應用於不同發光二極體與磷光物, 形成不同色溫或顏色的發光二極體。 雖然本發明已以一較佳實施例揭露如上,然其並非用 以限定本發明,任何熟習此技藝者,在不脫離本發明之精 神和範圍,當可作些許之更動與潤飾,因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。
0691-5982TWI-ptd 第11頁
Claims (1)
- 490863 案號 90103012六、申請專利範圍 ι 一種在晶圓上形成均勻色溫之發光二極 法,包括下步驟: 體之製造方 於一晶圓上形成複數發光二極體; •獲得上述晶圓上該些發光二極體之發光波長 emission waveiengths);以及 ght 根據上述發光波長於該些發光二極體上形成一 物層,藉使該晶圓上之該些發光二極二均= 貫質上相同色溫的光束。 座生 ’其中當上 形成劑量較 ’其中當上 形成劑量較 其中利用 、、2·如申請專利範圍第1項所述之製造方法 述發光二極體之發光波長較一標準波長長時, 多的磷光物層。 、、3·如申請專利範圍第1項所述之製造方法 述發光二極體之發光波長較一標準波長短時, 少的磷光物層。 4 ·如申請專利範圍第1項所述之製造方法 κ , q q 喷墨印刷技術將上述磷光物分別形成於上述晶圓之複數發 光二極體上。 X '5二如申請專利範圍第1項所述之製造方法,其中上述 發光二極體係一氮化鎵系發光二極體。 + 6 ·如申請專利範圍第4項所述之製造方法,其中上數 喷墨印刷技術包括熱泡式喷墨印刷技術與壓電式喷墨印刷 技術。 、 、> 7 ·如申請專利範圍第1項所述之製造方法,其中上述 务光一極體係藍光或紫外光發光二極體。 i如申請專利i圍第1項所述之製造方法,其中所產第12頁 490863 案號 9010刈1?修正 六、申請專利範圍 生之貝貝上相同色溫之光束為白光 9 · 一種發光二極體之製造方法 於一晶圓上形成複數發光二換 獲得上述晶圓上該些發光二換 emission wavelengths); 根據上述發光波長於該些發光 量的磷光物層,藉使該晶圓上之 實質上相同色溫的光束; 將上述晶圓上的複數發光二换體 實質上相同色溫的發光二極體晶雜; 封I上述複數發光二極體晶雜。 1 0 ·如申請專利範圍第9項所述之製造方法,其中當上 述發光二極體之發光波長較」標举波長長時,形成劑量較 多的碟光物層。 11.如申請專利範圍第9項所述之製造方法,其中當上 谬波長短時’形成劑量較 ,包括下步驟:體; 艘之發光波長(light >極體上形成一對應劑 该呰發光二極體均能產生 切割形成複數個具有 以及 述發光二極體之發光波長較 少的鱗光物層 1 2·如申請專利範圍第9項所述之製造方法,其中利用 噴墨印刷技術將上述磷光物分別形成於上述晶圓之複數發 光二極體上。 刀 ,13·如申請專利範圍第9項所述 發光二極體係一氮化鎵系發光二極體 構 :製造方法,其中上述 b 〇 之製造方法,其中上 + 1 4 ·如申請專利範圍第1 2項所述、α,六丁丄 數喷墨印刷技術包括熱泡式噴墨印刷技術與壓電式噴墨印 刷技術。第13頁 ❿ 490863 _J號 90103012 允 β 日 鉻 π: 六、申請專利範『 ----- 1 5,如申請專利範圍第9項所述之製造方法,其中上述 發光二極體係藍光或紫外光發光二極體。 1 6·如申請專利範圍第9項所述之製造方法,其中所產 生之實質上相同色溫之光束為白光。 17· 種形成白光蠢晶片之製造方法,包括下步驟: 於一晶圓上形成複數藍光發光二極體; 獲得上述晶圓上該些藍光發光二極體之發光波長 (light emission wavelengths);以及 根據上述發光波長於該些藍光發光二極體上形成一對 應劑里的磷光物層,藉使該晶圓上之該些發光二極體均能 產生實質上相同色溫的白光。 1 8 ·如申請專利範圍第1 7項所述之製造方法,其中當 上述發光二極體之發光波長較一標準波長長時,形成劑量 較多的碟光物層。 1 9 ·如申請專利範圍第1 7項所述之製造方法,其中當 上述發光二極體之發光波長較一標準波長短時,形成劑量 較少的磷光物層。 2 0 ·如申請專利範圍第1 7項所述之製造方法,其中利 用喷墨印刷技術將上述磷光物分別形成於上述晶圓之複數 發光二極體上。 2 1 ·如申請專利範圍第1 7項所述之製造方法,其中上 述發光二極體係一氮化鎵系發光二極體。 2 2 ·如申請專利範圍第2 〇項所述之製造方法,其中上 數噴墨印刷技術包括熱泡式喷墨印刷技術與壓電式喷墨印 刷技術。490863 案號 90103012 ±η 曰 修正 六、申請專利範圍 23. ^一種白光蠢晶片’包括: 複數藍光發光二極體設於一晶圓上,且該些藍光發光 一極體分別具有對應之發光波長(light emission wavelengths);以及 一對應劑量的磷光物層根據上述發光波長分別設於該 些藍光發光二極體上,使該晶圓上之該些發光二極體均能 產生實質上相同色溫的白光。 2 4 · —種白光發光二極體之製造方法,包括下步驟· 於一晶圓上形成複數藍光發光二極體; 獲得上述晶圓上該些藍光發光二極體之發光波長 (light emission wavelengths); 根據上述發光波長於該些藍光發光二極體上形成一對 應劑量的磷光物層,藉使該晶圓上之該些發光二極體均能 產生實質上相同色溫的白光; 此 將上述晶圓上的複數發光二極體切剔形成複數個具有 實質上相同色溫的白光發光二極體晶粒;以及 封裝上述複數白光發光二極體晶粒。 其中當 形成劑量 其中當 形成劑量 2 5 ·如申請專利範圍第2 4項所述之製造方法 上述發光二極體之發光波長較/標準波長長時 較多的碌光物層。 26·如申請專利範圍第24項所述之製造方法 上述發光二極體之發光波長較/楳準波長短時 較少的磷光物層。 其中利 用喷墨印刷技術將上述碰灰物分別形成於上述晶圓之通料第15貢 27·如申請專利範圍第24項所述之製造方法 490863 _案號 90103012_年月日__ 六、申請專利範圍 發光二極體上。 2 8.如申請專利範圍第24項所述之製造方法,其中上 述發光二極體係一氮化鎵系發光二極體。 2 9.如申請專利範圍第2 7項所述之製造方法,其中上 數噴墨印刷技術包括熱泡式喷墨印刷技術與壓電式喷墨印 刷技術。0691-5982TWFl.ptc 第16頁
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DE10135306A DE10135306A1 (de) | 2001-02-12 | 2001-07-19 | Verfahren zur Herstellung von Vorrichtungen, die Licht gleicher Farbtemperatur abstrahlen |
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JP2000509912A (ja) * | 1997-03-03 | 2000-08-02 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 白色光発光ダイオード |
US6222172B1 (en) * | 1998-02-04 | 2001-04-24 | Photobit Corporation | Pulse-controlled light emitting diode source |
US6504301B1 (en) * | 1999-09-03 | 2003-01-07 | Lumileds Lighting, U.S., Llc | Non-incandescent lightbulb package using light emitting diodes |
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2001
- 2001-02-12 TW TW090103012A patent/TW490863B/zh not_active IP Right Cessation
- 2001-07-03 US US09/897,636 patent/US6395564B1/en not_active Expired - Fee Related
- 2001-07-13 GB GB0117162A patent/GB2372149B/en not_active Expired - Fee Related
- 2001-07-19 DE DE10135306A patent/DE10135306A1/de not_active Ceased
- 2001-11-12 JP JP2001345840A patent/JP2002246654A/ja active Pending
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US7169326B2 (en) | 2003-03-28 | 2007-01-30 | South Epitaxy Corporation | Fluorescent material of terbium aluminum garnet and producing methods therefor |
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DE10135306A1 (de) | 2002-08-22 |
GB2372149B (en) | 2003-04-16 |
JP2002246654A (ja) | 2002-08-30 |
GB2372149A (en) | 2002-08-14 |
GB0117162D0 (en) | 2001-09-05 |
US6395564B1 (en) | 2002-05-28 |
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