486407 A7 B7486407 A7 B7
五、發明說明（） 發明領域 本發明係與基材的化學機楠w麻知㈣ 成械研磨相關。更特定說來， 本發明係關於研磨一基材之物件及方法。V. Description of the Invention () Field of the Invention The present invention is related to the chemical mechanical polishing of the substrate and the mechanical grinding of the substrate. More specifically, the present invention relates to objects and methods for grinding a substrate.
發明背景L 積體電路-般都利用連續對導體、半導體或絕緣層加 以沉積而形成於基材（尤其是珍）之上，而在介電層沉積之 後會被加以蚀刻而形成電路特徵區。當—系列層膜連續沉 積及蝕刻之後，基材最外部或最上部的表面（基材的曝出 表面）會變得愈來愈不平滑，這種不平滑情形會使後續微 影製程的進行變得困難重重。因此’基材的表面有加以定 期平滑化的必要，而平滑化者即將外表面（導體、半導體 或絕緣層皆然）不平滑之處加以研磨而形成一相當平坦光 滑之表面謂之。 化學機械研磨是一種現行的平坦化方法之一，這種方 法一般都需要在將·基材支撐於一研磨頭的情況下進行，其 中基材的曝出表面靠住一旋轉研磨墊或移動研磨帶（此處 該兩者都稱作研磨墊）。研磨墊可為”標準，，研磨塾者或固定 研磨墊者。傳統標準研磨墊為以耐久材料製成者，而固定 粒子研磨墊則是在牽制媒介中設有粒子者。研磨頭就將一 可控之重量（即壓力）放在基材上並使其靠緊研磨塾，以進 行研磨。 在使用標準研磨塾時，研磨漿（包含至少一化學反應 試劑（如氧化物研磨用之解離子水））及研磨粒子（如氧化物 第2頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -------------_ (請先閱讀背面之注意事項再填寫本頁) 訂------—線- 經濟部智慧財產局員工消費合作社印製 486407 A 7 B7 五、發明説明（） " —— 研磨用之二氧化矽）被提供至研磨墊之表面，其中研磨漿 {請先閱讀背面之注意事項再 可包含化學反應催化劑（如氧化物研磨用之氫氧化鉀）於其 中。 在美國專利案5,578,362及5,900，164中揭示之一傳統 研磨墊為一硬式複合材料，其具有粗糙之研磨表面。該研 磨塾是由耐久之胺基甲酸酯與填充劑（如淺微囊）混合而形 成之固塊所組成，其在研磨墊上形成微孔結構。該研磨塾 還具有低可壓縮性、塑性可形變及極低張力模數等特性， 其可為Rodel公司所製之1C-1000者。 、可 在美國專利案4,728,552及4,927,432中揭示另一種傳 統研磨墊，其為軟式複合材料組成，並具有一順勢研磨表 面。這種研磨墊由聚酯纖維密網組成（如DacronTM)，其方 向大致與餐之研磨表面垂直，並在其中注入胺基甲酸酯。 以上材料所形成的研磨墊具相當之可壓縮性、塑性及彈性 可形變及極低張力模數之特性，其可為Rodel公司所製之 Suba-IV 者。 線·丨 經濟部智慧財產局員工消費合作社印製 美國專利案5,257,478中揭示一種雙層研磨塾，其上 層為IC-1000，而下層為SUBA-IV，並可為一壓力敏感黏 著層黏附至一可旋轉平檯上。 美國專利案4,841，680中揭示有另一種傳統研磨塾， 其為一種軟式多孔塑膠材料，並具有一順勢研磨表面。該 研磨墊由具管空洞結構之胺基甲酸酯組成，其中這些結構 的方向與研磨表面垂直，以使研磨墊具有海棉般之結構。 以上材料所形成之研磨墊質地非常軟，其彈性模數也很 _|_ 第 31_ 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 一 --- 486407 A7 B7 五、發明説明（ 經濟部智慧財產局員工消費合作社印製 低。這種研磨塾可以為R〇del公司所產之p〇lytex。 傳統的固定研磨粒子研磨墊在一多層片上有分立島 域或成塊的研磨材料，其中研磨材料島域係由固態樹脂瑰 組成，研磨粒子（如矽、鋁或陶瓷粒子）則散佈其中。這些 材料所形成的研磨墊不可壓縮。在對一基材進行研磨時該 研磨蟄的樹脂會被磨除而使其中的額外研磨粒子連續曝 出。這種固定研磨粒子研磨墊可為3M公司產者。 化學機械研磨之效能可由其研磨速率及在基材上形 成之整體或細部平坦度決定之，其中不適當的整體及細部 平坦度會使所形成的元件有暇疵存於其中。此外，研磨速 率能決定膜層研磨所需花費之時間及研磨設備所能得到 的最大產出量。 研磨墊表面的”光滑現象（glazing)”是研磨產出·率的一 大限制因素，以IC-1 000當作研磨材料時更是如此。光滑 現象通常發生在研磨墊因磨擦生熱、被加上剪應力及基材 與遠研磨整抵壓處被壓迫時。由於研磨塾的♦處被往下 壓，而其凹處被填上材料，研磨塾因此變得相當平滑，也 使得其不能移動其上的研磨漿，因此基材研磨所需的時間 便增加。因此，研磨墊表面必須定期回到具研磨粒子的條 件下（或稱作須加以調節），以維持高產出率。然而，這種 調節動作是有破壞性的，研磨塾的壽命會因此縮短。 研磨墊的壽命是產出率的另一項限制因素。當研磨蟄 被磨損時必須加以置換，置換時研磨機器需要暫時停機， 以將一新的研磨墊加附至平檯處。以1C-1000研磨墊為 第4頁 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再$本頁) —裝. 訂BACKGROUND OF THE INVENTION L integrated circuits are generally formed on a substrate (especially Jane) by continuously depositing a conductor, a semiconductor, or an insulating layer. After the dielectric layer is deposited, it is etched to form circuit characteristic regions. When the series film is continuously deposited and etched, the outermost or uppermost surface of the substrate (the exposed surface of the substrate) will become increasingly uneven. This unevenness will cause the subsequent lithography process to proceed. Becomes difficult. Therefore, the surface of the substrate needs to be regularly smoothed, and the smoother will grind the uneven surface of the outer surface (conductor, semiconductor or insulation layer) to form a fairly flat and smooth surface. Chemical mechanical polishing is one of the current planarization methods. This method generally requires the substrate to be supported by a polishing head. The exposed surface of the substrate rests on a rotating polishing pad or mobile polishing. Belt (both are referred to herein as polishing pads). Abrasive pads can be "standard", abrasive grinders or fixed abrasive pads. Traditional standard abrasive pads are made of durable materials, while fixed particle abrasive pads are those with particles in the containment medium. A controlled weight (that is, pressure) is placed on the substrate and placed against the grinding mill to grind it. When using a standard grinding mill, the grinding slurry (containing at least one chemical reaction reagent such as deionization for oxide grinding) Water)) and abrasive particles (such as oxides, page 2) This paper is sized for China National Standard (CNS) A4 (210 X 297 mm) -------------_ (Please read first Note on the back, please fill out this page again) Order -------- Line-Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 486407 A 7 B7 V. Description of the invention () " —— Silicon dioxide for grinding) It is provided to the surface of the polishing pad, in which the polishing slurry {please read the precautions on the back first, and then may include a chemical reaction catalyst (such as potassium hydroxide for oxide polishing). It is disclosed in US Patent Nos. 5,578,362 and 5,900,164 One traditional polishing pad is one The composite material has a rough grinding surface. The grinding pad is composed of a solid mass formed by mixing a durable urethane with a filler (such as a shallow microcapsule), which forms a microporous structure on the polishing pad. The grinding mill also has the characteristics of low compressibility, plastic deformability, and extremely low tensile modulus. It can be 1C-1000 made by Rodel. Another traditional grinding can be disclosed in U.S. patents 4,728,552 and 4,927,432. Pad, which is made of soft composite material, and has a homeopathic abrasive surface. This abrasive pad is composed of dense polyester fiber mesh (such as DacronTM), its direction is approximately perpendicular to the abrasive surface of the meal, and urethane is injected into it The polishing pad formed by the above materials has the characteristics of considerable compressibility, plasticity, elastic deformation, and extremely low tensile modulus, which can be Suba-IV manufactured by Rodel. Line · 丨 Ministry of Economics Intellectual Property Bureau ’s Consumer Co-operative Printing US Patent No. 5,257,478 discloses a double-layer grinding mill with an upper layer of IC-1000 and a lower layer of SUBA-IV, which can be attached to a pressure-sensitive adhesive layer. On a rotating platform, U.S. Pat. No. 4,841,680 discloses another conventional abrasive pad, which is a soft porous plastic material and has a homeopathic abrasive surface. The abrasive pad is composed of a urethane with a hollow tube structure. The direction of these structures is perpendicular to the polishing surface, so that the polishing pad has a sponge-like structure. The polishing pad formed by the above materials is very soft and its elastic modulus is also very _ | _ # 31_ This paper scale is applicable to China Standard (CNS) A4 specification (210X297 mm) One --- 486407 A7 B7 V. Description of the invention (printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs). Such a mill may be polytex produced by Rodel. Traditional fixed abrasive particle polishing pads have discrete islands or blocks of abrasive material on a multilayer sheet. The islands of abrasive material are composed of solid resin beads, and abrasive particles (such as silicon, aluminum, or ceramic particles) are dispersed in them. These materials form abrasive pads that are incompressible. When a substrate is ground, the resin of the grinding pad is ground away, and the extra abrasive particles therein are continuously exposed. Such fixed abrasive particle polishing pads may be produced by 3M Company. The effectiveness of chemical mechanical polishing can be determined by its polishing rate and the overall or detail flatness formed on the substrate. Inappropriate overall and detail flatness can cause defects in the formed components. In addition, the grinding rate determines the time it takes to grind the film and the maximum output that can be achieved by the grinding equipment. "Glazing" on the surface of the polishing pad is a major limiting factor for the polishing output rate, especially when IC-1 000 is used as the polishing material. The phenomenon of smoothness usually occurs when the polishing pad is heated by friction, is subjected to shear stress, and is pressed by the substrate and the remote polishing point. Since the 塾 part of the grinding pad is pressed down and the recess is filled with material, the grinding pad becomes quite smooth, which prevents it from moving the polishing slurry thereon, so the time required for substrate grinding increases. Therefore, the surface of the polishing pad must be periodically returned to the condition with the abrasive particles (or referred to as conditioning) to maintain a high yield. However, this adjustment action is destructive, and the life of the grindstone will be shortened accordingly. The life of the polishing pad is another limiting factor for yield. The grinding mill must be replaced when worn, and the grinding machine needs to be temporarily stopped during replacement to attach a new polishing pad to the platform. Take 1C-1000 polishing pad as page 4 This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297mm) (Please read the precautions on the back before $ this page) — Pack. Order
L! 經濟部智慧財產局員工消費合作社印製 五、發明説明（） 例’其一般壽命約可倕 使其處理400至800片之晶圓。 積體電路生產時的另一 亏f因素為及產品之移 定度。為達較低之產品τ ☆ # — " 不艮率，母一基材都必須在近似之 研磨條件下研磨，可是—敕知m命上 正組研磨墊的機械特性卻是不盡 相同的。此外’研磨時制妒 ^ 产 I祆衣境的改變（如溫度及酸鹼度 等）都會使研磨墊的特性改 注改4，並使其性能降低，因此每 一基材所使用之墊的機械牿怕σ欠 啊楝特性疋各不相同的，基材表面的 特性也就有其變異性存在。 傳統研磨塾的另一者吾田喜炎甘冰 Υ里因素為其對漿運送的效率。某 些研磨塾並不能有效或均 \ 1习地對漿加以運送，對具有固體 非多孔之研磨表面而言更县^ + 將 丈疋如此漿不能被有效運送所造 成的缺點是不能得到均句的麻外里 _ ^ 』j的研磨效果，這時可以在研磨墊 上加上孔洞的方式來達到改善漿運送效率的效果。 之 發明目的及概述： 一般說來，本發明之一樣態在於提出一種化學機械岍 磨方法。在該方法中，一基材與一材料接觸，其中該材料 包含有纖維網及黏著劑’其中黏著劑固定纖維於該網中； 一研磨漿送至基材及茲材料之間的介面處，而該基材及該 材料間有相對之移動。在該材料中，黏著劑結合在纖維當 中，並在網材之纖維間的縫隙處留下孔洞，其中纖維及黏 著劑使材料具有脆弱之結構。 依本發明加以實施時可得到以下之一或多項特性。該 纖維及該黏著劑形成之材料的張力模數可大於約1()5psi , 請 閲 之 注Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the Invention () Example: Its general life can be about 400 to 800 wafers. Another factor in the production of integrated circuits is the degree of displacement of the product. In order to achieve a lower product τ ☆ # — " Indeterminate rate, the mother and substrate must be polished under similar grinding conditions, but-I know that the mechanical characteristics of the positive group polishing pads are not the same . In addition, 'making jealousy when grinding ^ changes in the production environment (such as temperature and pH) will change the characteristics of the polishing pad and reduce its performance, so the mechanical pad of each substrate is afraid of σ is different, the characteristics are different, and the characteristics of the substrate surface also have its variability. Wutian Xiyan Ganbing, another of the traditional grinding mills, has a factor of its efficiency in pulp transportation. Some grinding mills are not effective or uniform. 1 It is customary to transport pulp. It is more important for solid and non-porous abrasive surfaces. ^ + The disadvantage of this kind of pulp cannot be effectively transported is that it cannot get uniform sentences. Ma Waili _ ^ 『j grinding effect, at this time you can add holes to the polishing pad to achieve the effect of improving the slurry delivery efficiency. The purpose and summary of the invention: Generally speaking, the same aspect of the present invention is to propose a chemical mechanical honing method. In this method, a substrate is in contact with a material, wherein the material includes a fiber web and an adhesive, wherein the adhesive fixes the fibers in the web; a polishing slurry is sent to the interface between the substrate and the material, There is relative movement between the substrate and the material. In this material, the adhesive binds to the fibers and leaves holes in the gaps between the fibers of the mesh. The fibers and the adhesive make the material have a fragile structure. When implemented in accordance with the present invention, one or more of the following characteristics can be obtained. The tensile modulus of the fiber and the material formed by the adhesive can be greater than about 1 (5psi), please read the note
事3 r 頁 I 訂 第5頁 本紙張尺度適用中國國家標準（CNS ) A4規格（2ΐ〇χ297公釐） 486407 A7 B7 五、發明説明（） 如大於3 X 1 〇5psi。由該纖維及該黏著劑形成之材料延長的 程度可小於約5%，如小於2%(如在斷裂前小於1%)。該材 料在被壓縮時可忍受有彈性形變’其中纖維可包含纖維素 (如亞麻、棉或木或聚醯胺（如芳族聚醯胺）），而黏著劑可 包含樹脂（如酚樹脂）°材料中纖維與黏著劑之重量比可為 約1 :1至2 :1，其中孔可佔去材料體積的一半。該纖維之 方向在該材料中大致為任意排列。該材料包含下列之一或 多者··石墨、鈣之c鹽（celite)及一彈性體。 在另一樣態中，本發明係關於一種化學機械研磨方 法，其中一半導體晶圓與一自動制動或牽握墊接觸，一研 磨漿則加至該晶圓及該墊之間的介面處，該兩者之間並存 有相對移動。 在另一樣態中，本發明係關於一種對一基材進行化學 機械研磨之物件。該物件中有一層研磨材料及一研磨表 面，其中具有纖維網及黏著材料，而該黏著材料負貴將該 纖維固定在該網之—中；而該研磨表面與基材接觸、並對基 材加以研磨。黏著材料結合在纖維當中，並在網之纖維間 的縫隙處留下孔洞，其中纖維及黏著劑使材料具脆弱之結 構。 在另一樣態中’本發明係關於一種研磨一基材之物 件。該物件包含一研磨材料層及一研磨表面，研磨材料層 中則具有纖維網及黏著材料，其中該黏著材料將該纖維固 定於該網中，而該研磨表面則與一基材接觸、並對該基材 加以研磨。黏著材料結合於纖維中，並在纖維網縫隙中留 (請先閱讀背面之注意事項再本頁) —裝· 0, 經濟部智慧財產局員工消費合作社印製 486407 A7 ______ _B7___ 五、發明説明（） 下孔洞。至少黏著劑必須是足夠脆弱的，那麼一基材及該 研磨表面之間相對移動產生的一橫向力就能夠使纖維分 散開來，並使表面處的黏著材料從該研磨材料層中剝離開 來。 在另一樣態中，本發明係關於一種研磨一基材之物 件。該物件包含一研磨材料層及一研磨表面，其中具有纖 維素網及g分樹脂’該紛樹脂能將纖維固定於該網中，而 該研磨表面與一基材接觸、並對該基材加以研磨。 在另一樣態中，本發明係關於一種化學機械研磨設 備。該設備中具有一研磨頭，用以固定一基材；一研磨墊 及一漿提供口，用以將研磨漿分散至研磨墊上。該研磨墊 包含網材及黏著材料，其中該黏著材料能將該纖維固定於 該網中。該黏著材料結合在該纖維當中，並在纖維網之間 的介面處留下孔洞，且該纖維及該黏著材料能使該研磨墊 具有脆弱之結構。 本發明貝施時可包含以下特性。研磨塾可固定至一可 旋平檯之一表面。該設備可具有複數個噴嘴，以將一洗淨 落液喷灑至該研磨墊上，其並可將研磨漿移離該研磨墊之 外。該設備同時還可包含複數個噴嘴，以將空氣導至該研 磨塾上，並將该洗淨溶液移離該研磨聲之外。 在另一樣態中，本發明係關於一種形成一研磨材料之 方法。在该方法中，一種液態黏著材料與纖維混合而形成 一漿。該漿被乾化以對該黏著材料加以硬化，並因此形成 複合材料，泫複合材料中的纖維網為黏著材料所固定， 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X29^公釐)—--~ (請先閲讀背面之注意事項再 •i4· 本買} 、11 經濟部智慧財產局員工消費合作社印製 斗504U/ Α7 經濟部智慧財產局員工消費合作社印製Event 3 r page I order page 5 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (2 ×× 297 mm) 486407 A7 B7 V. Description of the invention () If it is greater than 3 X 105 psi. The degree of elongation of the material formed from the fiber and the adhesive may be less than about 5%, such as less than 2% (such as less than 1% before breaking). The material can tolerate elastic deformation when compressed 'where the fibers can include cellulose (such as linen, cotton or wood or polyamide (such as aromatic polyamide)) and the adhesive can include resin (such as phenol resin) ° The weight ratio of fiber to adhesive in the material can be about 1: 1 to 2: 1, where the pores can take up half of the volume of the material. The orientation of the fibers is approximately arbitrary in the material. The material includes one or more of the following: graphite, celite of calcium, and an elastomer. In another aspect, the present invention relates to a chemical mechanical polishing method, in which a semiconductor wafer is in contact with an automatic braking or holding pad, and a polishing slurry is added to the interface between the wafer and the pad. There is a relative movement between the two. In another aspect, the present invention relates to an article that is subjected to chemical mechanical grinding of a substrate. The article has a layer of abrasive material and a grinding surface, which has a fiber web and an adhesive material, and the adhesive material is expensive to fix the fiber in the web; and the abrasive surface is in contact with the substrate and the substrate Grind. Adhesive materials are incorporated in the fibers and leave holes in the gaps between the fibers of the mesh. The fibers and adhesives make the material fragile. In another aspect, the present invention relates to an article for grinding a substrate. The object includes an abrasive material layer and an abrasive surface, and the abrasive material layer has a fiber web and an adhesive material, wherein the adhesive material fixes the fibers in the mesh, and the abrasive surface is in contact with a substrate, and The substrate is ground. Adhesive material is incorporated in the fiber and left in the gap of the fiber web (please read the precautions on the back before this page) — equipment · 0, printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 486407 A7 ______ _B7___ 5. Description of the invention ) Under the hole. At least the adhesive must be sufficiently fragile, then a lateral force caused by the relative movement between the substrate and the abrasive surface can disperse the fibers and peel the adhesive material at the surface from the abrasive material layer. . In another aspect, the present invention relates to an article for grinding a substrate. The article includes a grinding material layer and a grinding surface, which has a cellulose web and a g resin. The resin can fix the fibers in the web, and the grinding surface is in contact with a substrate, and the substrate is applied to the substrate. Grinding. In another aspect, the invention relates to a chemical mechanical polishing apparatus. The device has a polishing head for fixing a substrate, a polishing pad and a slurry supply port for dispersing the polishing slurry onto the polishing pad. The polishing pad includes a mesh material and an adhesive material, wherein the adhesive material can fix the fiber in the mesh. The adhesive material is incorporated in the fibers, leaving holes in the interface between the fiber webs, and the fibers and the adhesive material can make the polishing pad have a fragile structure. The present invention may include the following properties when it is used for besch. The grindstone can be fixed to one surface of a rotatable platform. The apparatus may have a plurality of nozzles to spray a washing liquid on the polishing pad, and it may remove the polishing slurry from the polishing pad. The device may also include a plurality of nozzles to direct air to the grinding pad and move the cleaning solution out of the grinding sound. In another aspect, the invention relates to a method for forming an abrasive material. In this method, a liquid adhesive material is mixed with the fibers to form a slurry. The pulp is dried to harden the adhesive material and thereby form a composite material. The fiber web in the composite material is fixed by the adhesive material. The paper size applies the Chinese National Standard (CNS) A4 specification (210X29 ^ mm) —-- ~ (Please read the precautions on the back before • i4 · This purchase}, 11 Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 504U / Α7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs
486407 A7 _B7_ 五、發明説明（） 至該墊之上’以將漿從該孔洞中移除。一氣流被送至該研 磨墊上，以將該洗淨液體從該墊中移除。 本發明之優點如以下所述之一或多者。研磨整可以傳 統汽車牽握及制動墊業中所用之技術製成，其製造成本 低。研磨塾本質上可以是長壽命的，並且不需加以調節。 因此，研磨設備中不需要調節設備的存在，研磨設備的成 本及衩雜度因此降低。若研磨塾被加以調節，其可利用另 一台研磨墊，而不需以一鍍鑽石之桌為之，如此調節裝置 的成本得以降低。研磨墊在其被磨開時可提供均勻的材料 特性’因此能在塾的壽命期間内提供均勻的研磨速率。研 磨墊不可能刮壞基材。研磨墊可加以潤濕，並可在沒有凹 溝或穿洞的條件下有效對漿進行運送。研磨塾可在無次轨 的條件下支撐至一平檯。較諸傳統墊而言，本發明之研磨 塾可在較大之溫度範圍内保有熱穩定性，因此能提升研磨 之均勻度。研磨塾的粗糙度或表面磨擦力可足以提供令人 滿意的研磨速率。 本 後 圍 範 請 中 。 利顯 專明 及加 示更 圖得 、 變 明會 說將 細點 詳優 之及 下徵 以特 過它 讀其 閱之 明 發 經濟部智慧財產局員工消費合作社印製 明 說| 單 簡 式 圖 第第第 圖 意 示 解 分 。 份圖 部意 、 示 視視 前侧 的面 備剖 設的 磨墊 研磨 械研 機之 學明 化發 i 本 為為 圖圖 1 2 示 側 面 剖 的 材 基 之 磨 研 所 墊 磨 研 之 圖 2 第 為 正 1 ο 為圖 圖 A4 \/ Ns C|ΐ 襟 家 I國 I國 I中 一用 I釐 公 7 9 2 486407 A7 B7 五、發明説明（） 第4圖為第1圖之研磨墊的製造方法流程圖。 第5圖為一具有凹溝之研磨墊的上視示意圖。 第 6圖為延伸於一研磨墊上之一漿/洗淨液臂的側示意 圖。 第7A圖為一研磨設備的上視示意圖，其中包含一調節裝 置。 第7B圖為第7A圖之調節裝置的側視圖。 第8 A及8 B圖為研磨墊的表面結構圖，兩圖分別為放大 40倍及200倍所得之結果。 圖號對照說明： 1#. (請先閲讀背面之注意事項再本頁) 經濟部智慧財產局員工消費合作社印製 10 研磨設備 14 研磨台 16 基材轉移台 18 旋轉座 20 研磨頭 22 可旋轉平檯 30 基材 40 漿/洗淨液共用提 42 漿提供管 44 噴嘴 46 空氣噴嘴 50 調節設備 52 震盪手臂 54 調節頭 56 研磨材料片 100 研磨塾 102 纖維網 104 黏著材料 106 空洞或孔 108 粗糙表面 108, 頂表面 110 平檯（研磨墊體） 110, 研磨塾 112 纖維碎片 120 黏著膠帶 140 凹溝或穿洞486407 A7 _B7_ 5. Description of the invention () Above the pad 'to remove the pulp from the hole. An air stream is sent to the polishing pad to remove the cleaning liquid from the pad. The advantages of the present invention are one or more of the following. Grinding can be made using traditional techniques used in the automotive grip and brake pad industry, and its manufacturing cost is low. Grinding cymbals can be long-lived in nature and need not be adjusted. Therefore, there is no need to adjust the existence of the grinding equipment, and the cost and impurity of the grinding equipment are reduced. If the grindstone is adjusted, it can use another polishing pad instead of a diamond-plated table, thus reducing the cost of the adjustment device. The abrasive pad provides uniform material properties when it is abraded 'and therefore provides a uniform abrasive rate over the lifetime of the cymbal. The abrasive pad cannot scratch the substrate. Abrasive pads can be moistened and can effectively transport pulp without grooves or holes. Grinding cymbals can be supported to a platform without secondary rails. Compared with traditional pads, the grinding pad of the present invention can maintain thermal stability in a larger temperature range, and thus can improve the uniformity of grinding. The roughness or surface abrasion of the grinding pad may be sufficient to provide a satisfactory grinding rate. Please refer to the following range. Lixian's special instructions and indications are more accurate, and the Bianming Society said that it will publish the details in detail and subscribe to read it. It is printed by Mingfa, Ministry of Economic Affairs, Intellectual Property Bureau, Employee Consumption Cooperatives | The figure shows the points. A copy of the drawing, showing the front side of the surface of the grinding pad grinding machine grinding machine, Xueming Huafa i This is a picture of the side of the material-based grinding grinding pad grinding diagram shown in Figure 1 2 2 The first is positive 1 ο is the picture A4 \ / Ns C | ΐ The family I country I country I use one centimeter 7 9 2 486407 A7 B7 V. Description of the invention () Figure 4 is the grinding of Figure 1 Flow chart of manufacturing method of pad. FIG. 5 is a schematic top view of a polishing pad having a groove. Fig. 6 is a schematic side view of a slurry / wash liquid arm extending on a polishing pad. Fig. 7A is a schematic top view of a grinding apparatus including an adjustment device. Fig. 7B is a side view of the adjusting device of Fig. 7A. Figures 8A and 8B are the surface structure diagrams of the polishing pads. The two figures are the results obtained by magnification of 40 times and 200 times, respectively. Comparative description of drawing numbers: 1 #. (Please read the precautions on the back before this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 10 Grinding equipment 14 Grinding table 16 Substrate transfer table 18 Rotary base 20 Grinding head 22 Rotatable Platform 30 Base material 40 Slurry / cleaning liquid common lifting 42 Slurry supply tube 44 Nozzle 46 Air nozzle 50 Adjustment device 52 Oscillating arm 54 Adjusting head 56 Abrasive material sheet 100 Abrasive fiber 102 Fibre web 104 Adhesive material 106 Hollow or hole 108 Rough Surface 108, Top surface 110 Platform (abrasive pad body) 110, Grinding pad 112 Fiber fragments 120 Adhesive tape 140 Groove or hole
、1T 第10頁 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） 486407 A7 B7 五、發明説明（ U月詳細說明： 首先請參閱第1圖，其中一研磨設備1 〇包含二如 〜1固鹤 立操作的研磨台14、一基材轉移台16及一可旋轉之 旋轉 經濟部智慧財產局員工消費合作社印製 座1 8，其中旋轉座1 8控制四獨立旋轉之研磨頭2 〇 日勺動 作。在美國專利5,73 8，5 74中有類似該種研磨設備 述，其完整内容被併入本案中以供參考。 每一研磨台14都包含一可旋轉平檯22，且都各支於 一研磨墊1 0 0。研磨墊1 0 0係以為樹脂黏著劑固定之纖維 所組成，以下將有詳細之描述。 實際操作中，一基材30為轉移台16載至一听磨^ 二員 20，該旋轉座18接著將基材30移動通過一或多研磨二 1 4，最後並將被研磨過之基材送回轉移台1 6。每一研磨5員 2 0負貴基材之接收與固定，並利用將該研磨螯1 〇 〇壓至兮 上的方式對其加以研磨。研磨時’研磨頭會旋轉並橫向或 輻射向震盪。 請參閱第2圖。研磨墊100包含兩主零件：任意方向 交錯之纖維網1 0 2及一黏著材料1 〇 4，其中該黏著材料1 〇 4 結合在該纖維1 02當中，並將該纖維固定於網中。研磨塾 1 〇 〇具有一粗糙表面1 0 8 ’其在基材研磨時與基材相接觸。 該研磨材料可使用在一圓形研磨塾中，其中該研磨餐利用 一防水雙面黏著膠帶1 2 0接附至一可旋轉平檯2 2，因此該 研磨材料可形成一單層墊，亦即其可不需要可壓縮次塾的 存在。 纖維1 0 2以在研磨中為不活潑的材料所組成，而在黏 f請先閲讀背面之注意事項再 訂' 486407 經濟部智慧財產局員工消費合作社印製 A7 ------- B7五、發明説明（]~~ " ~ 著材料1 04同時存在及曝至研磨或調節環境之剪應力下， ^4 維 10 2 — An. —般是脆弱的。例如，纖維可以由有機材料形成， 士 4、准素（如亞麻、棉或木）；其也可由聚合材料形成，如 水酶胺（如芳族聚醯胺（如Aramid™))。聚醯胺纖維係為 DUP〇lU公司所製者，其中至少有85%的氨基化合物鏈直接 接附方；兩芳香族環之間。纖維在網中可以是任意方向性 的且/又有沿任一特定軸的傾向。纖維的長度可在約5 0 及1 000微米之間變動，如介於100及500微米之間；而 纖維的切面直徑則可在約5至5 0微米之間變動，如介於 10至30微米之間。 黏著材料1 〇 4同樣由在研磨過程中不活潑的材料組 成’其在曝至研磨或調節環境之剪應力中通常為脆弱的。 例如’黏著材料可為一多孔聚樹脂，如一酚樹脂或環氧基 樹脂。然而，黏著材料i 〇4主要係與纖維黏附、且不會形 成固體塊，因此能在纖維1 02間留下相當大的空洞或孔 106 〇 由於纖維1 0 2及黏著劑1 〇 4質地都算脆弱，所以與傳 統研磨塾相較起來兩者形成之研磨墊的表面結構也是相 *脆弱。簡言之’研磨墊表面是一種任意方向排列之纖維 所組成的粗糙軟墊。由於研磨墊質地脆弱，因此其張力模 數相當大，而其塑性形變相當小（與傳統非固定研磨粒子 研磨墊之例相較而言，如IC-1 〇〇〇或Suba-iv)。此外，複 合研磨墊質地脆弱，也就是說加以磨擦力時容易碎開，如 在研磨或調節環境中接觸剪應力時。當了解的是研磨塾在 - ___ 第12貫 本紙張从適用中國國家標準（（：呢)八4胁（210/297公釐)' " "' (請先閲讀背面之注意事項再 —裝J 本頁 、-口 線-- 486407 A7 B7 五、發明説明（） 經濟部智慧財產局員工消費合作社印製 研磨時的易脆性只會發生在微細範圍 ’所以不見得吾内 眼在研磨及調節時觀察得到脫落現象才 、疋叫 舟件上是脆弱，不 過當研磨墊以刮鬍刀片稍微刮 、 丨疋一疋可以觀察出 其脆弱性的。 ^ T' 然而，縱使墊本身是脆弱的，作士 1-工洞及黏著材料還是 可以使塾具可屢縮性，以適用於化學機械研磨上。更特定 說來，當一力往下施加於墊上時，其中的空洞會消失而使 塾變得可壓縮，同時纖維之間的黏著材料鏈結也不會被破 壞，因此研磨材料在壓縮時得以容忍彈性形變之存在。 研磨墊100的某些特定研磨特性係由纖維102的組成 及硬度與黏著材料104、纖維102量、纖維102之尺寸及 形狀，塾中孔的尺寸及形狀與製造過程所決定。在一具酉分 樹脂及纖維素的研磨墊中，纖維材料與黏著材料之比可為 約1:1至2 :1，亦即重量百分比約為1. 5 : i，而其中空洞i 〇 6 所佔有的體積可以達至約一半。一般說來，黏著材料在製 造過程中增加其硬化程度可使之變得更脆弱，而較少的硬 化程度則有相反的結果。一般說來，少量纖維配以較鬆散 的纖維結構能夠增加研磨墊的表面磨擦力及研磨速率。相 反地，纖維結構較密實則會使得研磨墊的表面磨擦力減 少，研磨速率也隨之下降。 若研磨墊的表面磨擦力欲更進一步加大，這時可以在 黏著材料中加以少量之彈性體材料達成目的’如橡膠（如 樹乳橡膠等）等。如此，不僅研磨整能具有較南的表面磨 擦力，且在研磨及調節期間受基材帶來之橫向力影響之 本紙張尺度適用中國國家標準（CNS ) Μ規格（2丨〇'χ297公釐） (請先閲讀背面之注意事項再本頁) —裝. 訂 線— 486407 A7 B7 五、發明説明（） 經濟部智慧財產局員工消費合作社印製 下’研磨勢的脆弱性依然能維持至足夠 j 4及。其Έ：可加 入的添加物包含石墨，用以使墊之密度變得更大、： 研磨性；躬之C鹽（celite)(如石夕蔆土签、丨 、 ’、 未寺）則可維持纖維網材 中的多孔性。添加物在黏著材料中可以 &』’合忮或不可、、容 性者，某些添加物還可整合入纖維體中，而非散体於黏著 材料中。 由於墊材質地脆弱，纖維102及黏著材料1〇4很容 散開’亦即靠近塾1〇。表面1。8處的纖維及黏著材料： 研磨塾體110中剥離開來。不過，由於塾具可壓縮性: 以纖維仍會留在網基中，而不會因壓縮力而從研磨墊體 分離出來。例如’第3圖中的基材丨。在研磨而通：： 墊100的表面時都會產生一下壓力FD 中下歷力FD會使得基材正下方處受到直接=FL當 其中也會有彈回區。另一方面，由於墊材相當脆弱，所 橫向力FL會使纖維102的碎片112及黏著材料刚脫 研磨墊體，墊上的極薄層於是就被剪力扯開。這種狀況 能是因各獨i纖維斷開、或是由於纖維間的化學鍵斷開 致。然而’前文已提及研磨墊表面的斷開只會發生在極 微的範圍上，也就是說墊上的扯開情形不是一定可靠肉 觀察得到的。 由於整材之一致性及等向性相當均自，且纖維ι〇2 以相當均勻之密度及任意之方向散佈於墊中所以在 墊上表面處仍可維持很均勻的機械特性。因此，研磨 其壽命期限之内應具有均勾的表面磨擦力，如此研磨 易 從 所 中 磨 其 以 離 可 所 研磨 整在 速率 ---------：-->裝_^| (請先閲讀背面之注意事項再頁) 訂、 1T page 10 This paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm) 486407 A7 B7 V. Description of the invention (U month detailed description: Please refer to Figure 1 first, one of the grinding equipment 1 〇 contains Two such as ~ 1 solid grinding operation table 14, a substrate transfer table 16, and a rotatable printing stand 18 of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, where the rotating stand 18 controls four independent rotating grinding The movement of the spoon on the first 20 days. Similar to this kind of grinding equipment is described in U.S. Patent 5,73 8,5 74, the entire content of which is incorporated in this case for reference. Each grinding table 14 includes a rotatable platform 22, each supported on a polishing pad 100. The polishing pad 100 is composed of fibers fixed by a resin adhesive, which will be described in detail below. In actual operation, a substrate 30 is contained on a transfer table 16 To a grinding mill ^ two members 20, the rotary base 18 then moves the substrate 30 through one or more grinding wheels 2 4 and finally returns the ground substrate to the transfer table 16. Each grinding member 5 2 0 Receiving and fixing of negative substrates, and using the grinding chelate 1 〇 〇 Grind it by pressing it to the top. The grinding head will rotate and oscillate laterally or radiantly during grinding. Please refer to Figure 2. The polishing pad 100 includes two main parts: a fiber web 102 staggered in any direction and An adhesive material 104, wherein the adhesive material 104 is incorporated into the fiber 102, and the fiber is fixed in a mesh. The grinding stone 100 has a rough surface 1 08 'when the substrate is ground. It is in contact with the substrate. The abrasive material can be used in a circular abrasive pad, where the abrasive meal is attached to a rotatable platform 2 2 with a waterproof double-sided adhesive tape 1 2 0, so the abrasive material can be formed A single-layer pad, that is, it does not need the presence of a compressible secondary fiber. The fiber 102 is composed of an inactive material during grinding, and in the case of sticking, please read the precautions on the back before ordering. 486407 Ministry of Economic Affairs Wisdom A7 printed by the Consumer Cooperatives of the Property Bureau ------- B7 V. Description of the invention (] ~~ " ~ The material 1 04 exists simultaneously and is exposed to the shear stress of the grinding or regulating environment, ^ 4 dimension 10 2 — An. — Is generally fragile. For example, fibers can Formed from organic materials, such as quaternary materials (such as linen, cotton or wood); it can also be formed from polymeric materials, such as hydrolamine (such as aromatic polyamide (such as Aramid ™)). Polyamide fiber is DUP 〇1U company, at least 85% of the amino compound chain directly attached to the side; between the two aromatic rings. The fiber in the net can be any direction and / or have a tendency to follow any particular axis. The length of the fiber can vary between about 50 and 1,000 microns, such as between 100 and 500 microns; and the cut diameter of the fiber can vary between about 5 and 50 microns, such as between 10 and 30 Between micrometers. The adhesive material 104 is also composed of a material that is inactive during the grinding process and is generally fragile when exposed to the shear stress of the grinding or conditioning environment. For example, the 'adhesive material may be a porous polyresin, such as a phenol resin or an epoxy resin. However, the adhesive material i 〇4 is mainly adhered to the fibers and does not form a solid block, so it can leave a considerable void or hole between the fibers 102. 〇 Because the texture of the fibers 102 and the adhesive 104 are both It is fragile, so the surface structure of the polishing pad formed by the two is also fragile compared with the traditional polishing pad. In short, the surface of a polishing pad is a rough pad composed of fibers arranged in any direction. Due to the fragile texture of the polishing pad, its tensile modulus is quite large and its plastic deformation is relatively small (compared to the example of traditional non-fixed abrasive particle polishing pads, such as IC-1 00 or Suba-iv). In addition, composite polishing pads are fragile, meaning they break apart easily when subjected to friction, such as when exposed to shear stress during grinding or conditioning. When I understand that grinding is in-___ The twelfth consecutive paper from the applicable Chinese national standard ((:?) Ya 4 threats (210/297 mm) '" "' (Please read the precautions on the back before- Install J This page,-mouth line-486407 A7 B7 V. Description of the invention () The fragility when printed and grinded by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs will only occur in the fine range, so it is not necessary for my eyes to grind and It was observed that the shedding phenomenon was weak during the adjustment, but the howling boat was fragile, but when the polishing pad was slightly scraped with a razor blade, the fragility could be observed. ^ T 'However, even if the pad itself is fragile, Shishi 1-holes and adhesive materials can still make the tool shrinkable, suitable for chemical mechanical polishing. More specifically, when a force is applied to the pad, the holes in it will disappear and make the tool It becomes compressible, and at the same time, the bonding material link between the fibers will not be broken, so the abrasive material can tolerate the elastic deformation when compressed. Some specific abrasive characteristics of the abrasive pad 100 are composed of the fiber 102 and its hardness versus Adhesive material 104, the amount of fiber 102, the size and shape of fiber 102, the size and shape of the middle hole and the manufacturing process are determined. The ratio of fiber material to adhesive material in a polishing pad with a resin and cellulose can be It is about 1: 1 to 2: 1, that is, the weight percentage is about 1.5: i, and the volume occupied by the cavity i 〇6 can reach about half. Generally speaking, the adhesive material increases its volume during the manufacturing process. The degree of hardening can make it more fragile, and less hardening has the opposite result. Generally speaking, a small amount of fiber combined with a looser fiber structure can increase the surface friction and polishing rate of the polishing pad. On the contrary, The denser fiber structure will reduce the friction of the surface of the polishing pad, and the polishing rate will also decrease. If the surface friction of the polishing pad is to be further increased, then a small amount of elastomer material can be added to the adhesive material to achieve the purpose ' Such as rubber (such as tree rubber, etc.). In this way, not only can the grinding and polishing have a relatively southern surface friction, but also during the grinding and adjustment of the substrate by the lateral force of the substrate Zhang scale is applicable to Chinese National Standard (CNS) M specification (2 丨 〇'χ297 mm) (Please read the precautions on the back before this page) — binding. Thread — 486407 A7 B7 5. Invention Description () Wisdom of the Ministry of Economic Affairs The fragility of the “milling potential” printed by the Property Cooperative's Consumer Cooperative can still be maintained to a sufficient level j4 and above. Its Έ: Additives that can be added include graphite to increase the density of the pads: Grindability; bow Celite (such as Shixi Lingtuotiao, 丨, ', Weisi) can maintain the porosity in the fiber mesh. Additives can be & For sex, some additives can also be integrated into the fibrous body instead of being dispersed in the adhesive material. Due to the fragile material of the pad, the fibers 102 and the adhesive material 104 are very easy to spread apart, that is, close to 塾 10. Fibers and adhesive materials at the surface of 1.8: They are peeled off from the ground body 110. However, due to the compressibility of the braid: the fibers will remain in the mesh base and will not be separated from the polishing pad body due to compressive forces. For example, 'the substrate in FIG. 3'. When grinding through :: The surface of the pad 100 will generate a pressure FD. The middle and lower force FD will make the substrate directly under the FL = FL. There will also be a rebound area. On the other hand, because the mat material is quite fragile, the transverse force FL will cause the fragments 112 of the fibers 102 and the adhesive material to just come off the polishing pad body, and the extremely thin layer on the mat will then be torn apart by the shear force. This condition can be caused by the disconnection of individual fibers or by the chemical bonds between fibers. However, as mentioned earlier, the breakage of the surface of the polishing pad can only occur to a very small extent, that is to say, the tearing of the pad is not necessarily observable reliably. Because the uniformity and isotropy of the whole material are quite self-contained, and the fibers ι2 are scattered in the pad with a fairly uniform density and an arbitrary direction, it can still maintain very uniform mechanical characteristics at the upper surface of the pad. Therefore, the grinding should have a uniform surface friction within the life of the grinding, so that the grinding is easy to grind from the grinding at the rate of grinding and grinding ---------:-> equipment_ ^ | (Please read the precautions on the back first)
線丨 第14頁 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 經濟部智慧財產局員工消費合作社印製 五、發明説明（） 就能顯得相當均勻’這對於處理單—晶圓及整 況皆然。此外’由於研磨塾材料被扯開，塾上的 ^ 此自動翻新’此時研磨整就不需加以調節。此外，研^ 由纖維素纖維及紛樹脂黏著劑組成者可具有敎 ^土 即在不同溫度時其機械特性的改變不致影響“研磨： 性’這種溫度變動但不影響研磨特性的溫度範園要 研磨墊者為大。 奴傳統 研磨墊1〇0可以由熟知汽車牽握或制動墊之製造技 者所熟知之技術而形成。事實上，傳統汽車牽握或制 可適用於化學機械研磨上，也就是說該習用結構可用於 用途上。冑參閱g 4 ®。圖中纖維基的形成方法 Fourdnmer万法類似。首先，加以纖維之製備（步驟 其中纖維素纖維可以利用對亞麻、柿、木等以機械方式 成漿而形成。芳族聚醯胺纖維係得自於Dup〇nt公司者 該纖維與-種如黏著材料溶液（如酉分）相混合，兩者:成 混合體並與-種黏著#料得溶於纟中的〉夜體（如酒精） 合，以形成一種液體漿（步驟62)。該液體漿接著沉積= 掩蔽物或一連續帶上（步驟64)。當該液體乾凋後，溶液 蒸發，而黏著劑會固化或形成相當脆弱的樹脂黏著料 如酚樹脂等（步驟66)。該材料接著就被擠壓，以將過 液體擠出，並在纖維之間形成弱化學鍵結（步驟68)。 第5圖中，研磨墊1〇〇，表面可在其與基材表面接觸 前及/或接觸當時加以組織結構化。更特定說來，凹溝 洞140可以形成在研磨墊的頂表面1〇8,之内。在—種 術 墊 與 製 之 )混 會 多的 之 或穿 實施 (請先閲讀背面之注意事項再本頁} —裝· 訂 第15頁 本紙張从適用巾關家標準（⑽丨( 21()χ297公董 486407 A7 B7 五、發明説明（） 經濟部智慧財產局員工消費合作社印製 做法中，凹溝14 0分別如σ π 都疋同心圓’其深度約為0.02吋、 寬度..々為0 · 1 0吋、而其間的間距則為〇 2 5吋。不過，凹 溝和穿洞不是必要的’因為裝可以陷阻於纖維網的孔108 中，並可為研磨墊所帶送。 第6圖中化學機械研磨設備1 〇之每一研磨台可包 。種水/洗淨液《共用提供臂40 ’其能將該兩物體提供 至研磨塾100的表面之上。槳/洗淨液臂40可包含一或多 ’I： k供s 42 ’而些f 42則與漿分送系統相連，以將裝 32提供至研磨墊表面上，一般說來漿的提供量以能潤濕整 個研磨墊為原則。漿/洗淨液臂4〇同時包含數個喷嘴44， 以能提供高壓喷出之洗淨流體，如解離子水等。洗淨流 喷流可在每一研磨循環結束時對研磨墊加以高壓洗淨， 將使用過的漿及研磨墊上的研磨碎粒移除。漿/洗淨液 40同時可包含數個2氣噴嘴46，用以將高壓噴氣流導 研磨墊，以將研磨墊上的洗淨流體噴除，並避免在下一 磨循環時漿被稀釋。另也有不同的做法，即將噴嘴 接至洗淨流體源及加壓之氣源，以對研磨墊加以噴灑洗 及氣體沖淨；或可連接至一真空源，以將洗淨流體從研 墊上吸除。 第7A及7B圖中，化學機械研磨設備1 〇的每一平 都包含一調節設備50，每一墊調節設備5〇都具有一震 手臂5 2，該手臂5 2用以握住獨立旋轉之調節頭5 4。一 與上述相似的調節設備可見於美國專利申請案〇 9 / q 5 2 中的描述，在此將其全部内容併入以供參考。研磨塾可 體 以 臂 入 研 連 淨 磨 臺 -種 ,798 在 (請先閲讀背面之注意事項再本頁) |裝- 訂 線丨. 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） A7 經濟部智慧財產局員工消費合作社印製 五、發明説明（ 其需要維持固定條 ^ 蚀件時加入調節設備，以維持均勻的研麼 狀態。此外，士固妒击 ㈣印動作在研磨墊剛啟用時也需使用， 此時圓形研磨材料 μ竹片56也可固定至調節頭的底側。在每 際故作中，調節頭$ X p巧54會為臂52控制掃過研磨墊1〇〇上， 其中調節材料5 6 Tf /、 打Μ頂住研磨墊1〇〇。因此，對研磨墊的調 不需以昂音的播I濟 ^ 纘石碟片為之，任何與研磨所用·之相同材料 都可用於勢之^固雜 P P。一般說來，脆弱研磨塾的調節可為研 磨設備裡的其它設備來處理。例如，若研磨頭包含一底側 ::有凹溝(供漿移動用)的固定環，那麼凹溝的尖銳角就可 對研磨塾加以調節，I因此改善研磨速率。 在一實驗中，一種，，淡棕色，，纖維材料係得自於 、 A司 其由紙或务族聚酿胺纖維加於樹脂中形 成。該材料被切成一 2〇叶直徑㈣，厚度約為〇 〇4 口寸， 並被附著至一 MIRRA®研磨機器的一平檯，其中平檯的雙 面都有黏著劑。塾中沒有任何的凹溝，在研磨之前並加以 *壓水洗淨，該墊並具有良好的可潤濕性。一經過圖案化 之晶圓在一 Titan Head™上為Rodel SS-12漿及2psi的基 材壓力研磨，此時平檯的旋轉速率為93rpm，而研磨頭的 旋轉速率為87rpm，其中不加以任何調節動作。結果，研 磨塾很成功地對基材進行研磨，所得之平坦性（晶圓内之 不均勻度）並優於利用傳統IC- 1 000/Suba-IV塾堆叠結構 者。 在另一實驗中，以上述之條件對一系列基材進行研 磨’其中這些基材包含有具一熱氧化層的，，空白，，晶圓及經 (請先閲讀背面之注意事項再本頁) • «flu 1 -- I · —裝. 訂 第17頁 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 486407 A7 B7 五、發明説明（ 經濟部智慧財產局員工消費合作社印製 時（與傳、统研磨塑•材相較而言）即稱之為脆弱材料，亦即其 在破裂前所具有的彈性或塑性形變程度小於5% “ 可。例 如，研磨墊在破裂之前的延長度小於約3%、小於约、 甚或小於約1%。研磨墊100的張力模數可大於 1 ^ p S 1 , 如大於2x10，而其彎曲模數大於5x：1〇4，如大於ίο、" 另有一項可用以指出材料是否為脆弱的指標，那就是張力 點（即材料斷裂時的力道或壓力）是否與讓渡點（即材料〜 始形變所受的力道或壓力）並不明顯不同（如研磨墊材之 僅有小於5%的差異）。因此，研磨墊材的讓渡點與張力 應該是要大致相同，其中的差異可小5%，如小於1 %者 以上之延長度、讓渡點、張力點及張力模數的測試可以％ ASTM D3 68中進行，而彎曲模數測試則可在ASTm 中進行。 脆弱研磨墊1 00可用以研磨金屬（如銅）、介電質（包 氧化物及氮化物）（如矽之氧化物）及半導體（如矽）。化學 械研磨設備1 0之多平檯架構在利用脆弱質地之研磨 1 00時可進行多種的研磨製程。在一種典型實施做法中 基材在最初的兩研磨台上以質地脆弱的研磨墊加以 磨，而最後則以傳統的軟研磨墊為之；另有不同的做法 那就是以質地脆弱的研磨I當作第一研磨平檯，接著再 傳統標準研磨墊或具固定粒子之研磨墊當作第二平檯； 以上兩者順序又換的方式為之。 上述之說明僅為本發明中的較佳實施例，而非用 限定本發明之範圍，故利用這些實施例所進行的修改 間 點 在 含 機 墊 研 以 或 以 或 f請先閲讀背面之注意事項再填W4頁) —裝.^^1 -訂Line 丨 Page 14 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () will appear to be quite uniform The circle and the condition are the same. In addition, ‘the automatic refurbishment of the 塾 on the 塾 is due to the material being torn apart. At this time, the adjustment of the 整 does not need to be adjusted. In addition, those who are composed of cellulose fibers and resin adhesives can have soil, that is, a change in mechanical properties at different temperatures does not affect the "grinding: temperature" temperature change without affecting the grinding characteristics. The polishing pads are large. The traditional polishing pads 100 can be formed by techniques well-known to those skilled in the manufacture of automobile grip or brake pads. In fact, traditional automobile grips or manufacturing can be applied to chemical mechanical polishing. That is to say, the conventional structure can be used for applications. 胄 See g 4 ®. The formation method of the fiber base in the figure is similar to Fourdnmer method. First, the fiber is prepared (in which the cellulose fiber can be used for linen, persimmon, wood And other mechanically formed pulp. Aromatic polyamide fibers are obtained from Dupont Company. The fibers are mixed with a solution such as an adhesive material (such as hydrazone), both: into a mixture and with- Seed adhesion #Material is dissolved in the mash, such as alcohol, to form a liquid slurry (step 62). The liquid slurry is then deposited = a mask or a continuous band (step 64). When the liquid dry After withering, the solution evaporates, and the adhesive will solidify or form a relatively fragile resin adhesive such as phenol resin, etc. (step 66). The material is then squeezed to squeeze out the over-liquid and form a weak gap between the fibers. Chemical bonding (step 68). In FIG. 5, the polishing pad 100, the surface can be structured before and / or at the time of contact with the substrate surface. More specifically, the groove 140 can be formed on The top surface of the polishing pad is within 108. It is often mixed with or worn (see the pads and the system) (please read the precautions on the back before this page) — binding and ordering page 15 of this paper From the application of the family standard (⑽ (21 () χ297 公 董 486407 A7 B7 V. Description of the invention) In the printing practice of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, the grooves 14 0 are concentric circles such as σ π 'Its depth is about 0.02 inches, the width is 0. 10 inches, and the distance between them is 0. 25 inches. However, the grooves and holes are not necessary because the installation can trap the fiber web. Hole 108, and can be carried by the polishing pad. Each grinding table of the device 10 can be packed. The water / washing solution "shared supply arm 40 'can supply the two objects onto the surface of the grinding pad 100. The paddle / washing liquid arm 40 may include one or Many 'I: k for s 42' and some f 42 are connected to the slurry distribution system to provide the device 32 to the surface of the polishing pad. Generally speaking, the amount of slurry provided is based on the principle of wetting the entire polishing pad. / The cleaning liquid arm 40 includes several nozzles 44 at the same time, so as to provide a high-pressure spray cleaning fluid, such as deionized water, etc. The cleaning flow jet can high-pressure wash the polishing pad at the end of each polishing cycle. Clean, remove the used pulp and the abrasive particles on the polishing pad. The slurry / washing liquid 40 can also include several 2 air nozzles 46 at the same time, which is used to direct the high-pressure air jet to the polishing pad to clean the polishing pad. The fluid is sprayed out and the slurry is prevented from being diluted during the next grinding cycle. There is also a different method, that is, the nozzle is connected to the source of the cleaning fluid and the pressurized gas source to spray and wash the polishing pad and the gas is washed; or it can be connected to a vacuum source to suck the cleaning fluid from the polishing pad except. In FIGS. 7A and 7B, each level of the chemical mechanical grinding equipment 10 includes an adjustment device 50, and each pad adjustment device 50 has a shocking arm 5 2 which is used to hold an independent rotating adjustment Head 5 4. A similar adjustment device as described above can be found in the US patent application 09 / q 52, which is hereby incorporated by reference in its entirety. Grinding can be inserted into the grinding mill with the arm-Species, 798 in (Please read the precautions on the back before this page) | Binding-Thread 丨. This paper size applies to China National Standard (CNS) A4 specifications (210X297 A7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (It needs to maintain a fixed bar ^ Etching parts are added to adjust the equipment to maintain a uniform state of research. In addition, Shi Gu's jealousy stamping action is The polishing pad also needs to be used when it is just activated. At this time, the circular abrasive material μ bamboo sheet 56 can also be fixed to the bottom side of the adjustment head. In each occasion, the adjustment head $ X p 54 will control the sweep of the arm 52 On the polishing pad 100, the adjustment material 5 6 Tf /, hit M against the polishing pad 100. Therefore, the adjustment of the polishing pad does not need to be made by Ang Yin broadcast 缵 vermiculite discs, any The same materials as those used for grinding can be used for potential PP. In general, the adjustment of the fragile grinding mill can be handled by other equipment in the grinding equipment. For example, if the grinding head contains a bottom side: :: concave Groove (for slurry movement), then the groove is sharp The grinding mill can be adjusted, so that the grinding rate is improved. In one experiment, a, light brown, fiber material was obtained from A, which was formed by adding paper or polyurethane fibers to the resin. The material is cut into a 20-leaf diameter ㈣ with a thickness of about 004 inches, and is attached to a platform of a MIRRA® grinding machine, where both sides of the platform have adhesive. There is nothing in the 塾The grooves are cleaned before pressing and washed with water. The pad has good wettability. A patterned wafer on a Titan Head ™ is Rodel SS-12 slurry and 2psi substrate. Pressure grinding. At this time, the rotation speed of the platform is 93 rpm, and the rotation speed of the grinding head is 87 rpm, without any adjustment action. As a result, the grinding pad successfully polished the substrate, and the resulting flatness (in the wafer) Non-uniformity) and is superior to those using traditional IC-1 000 / Suba-IV 塾 stacked structures. In another experiment, a series of substrates were ground under the conditions described above, where the substrates contained a heat Oxide, blank, wafer And the classics (please read the precautions on the back before this page) • «flu 1-I · — installed. Page 17 of this paper size is applicable to China National Standard (CNS) A4 (210X297 mm) 486407 A7 B7 5 Description of the invention (When printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (compared with traditional plastic grinding and plastic materials), it is called a fragile material, that is, the degree of elasticity or plastic deformation before rupture Less than 5% "OK. For example, the elongation of the abrasive pad before rupture is less than about 3%, less than about, or even less than about 1%. The tensile modulus of the polishing pad 100 can be greater than 1 ^ p S 1, such as greater than 2x10, and its flexural modulus is greater than 5x: 104, such as greater than ίο, " Another indicator can be used to indicate whether the material is fragile, That is, whether the point of tension (that is, the force or pressure when the material breaks) is not significantly different from the yield point (that is, the force or pressure on the material to the initial deformation) (such as the difference of less than 5% of the abrasive pad) . Therefore, the transfer point and tension of the polishing pad should be approximately the same, and the difference can be less than 5%. For example, the extension of less than 1%, the transfer point, the tension point, and the tensile modulus can be tested by% ASTM. D3 68, while the flexural modulus test can be performed in ASTM. The fragile polishing pad 100 can be used to grind metals (such as copper), dielectrics (oxides and nitrides) (such as oxides of silicon), and semiconductors (such as silicon). The multi-platform structure of the chemical grinding equipment 10 can perform a variety of grinding processes when using the weak texture of the grinding 100. In a typical implementation, the substrate is ground on the first two polishing tables with a fragile polishing pad, and finally with a traditional soft polishing pad; a different approach is to use a fragile polishing pad. It is used as the first polishing platform, and then a conventional standard polishing pad or a polishing pad with fixed particles is used as the second platform; the above two methods are changed in order. The above descriptions are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, the modifications made using these embodiments should be studied with or without mechanical pads. Please read the notes on the back first. Matters refilled W4)-installed. ^^ 1-order
第19T 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 486407 A7 B7 五、發明說明（) 更動都不脫離在所附專利範圍所言明之範圍外，本發明 之範圍當以後述的專利申請範圍為基準。 (請先閱讀背面之注意事項再填寫本頁) . ^—訂---------線 經濟部智慧財產局員工消費合作社印製 第20頁 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）No. 19T This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) 486407 A7 B7 V. Description of the invention () Changes do not depart from the scope stated in the appended patent scope, the scope of the invention will be described later Based on the scope of patent applications. (Please read the notes on the back before filling out this page). ^ —Order --------- Printed by the Consumers' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Page 20 This paper applies Chinese National Standards (CNS) A4 size (210 X 297 mm)