TW484237B - An optical device with a tape packaging type - Google Patents

Abstract

An optical device with a tape packaging type is provided for low cost packaging and high stability. It comprises: an optical sensor chip having a plurality of electrodes on its sensible surface; a flexible circuit board having an upside, an underside and a window; a plurality of metal circuits formed on the flexible circuit board and each of them having an inner lead extending into the window for bonding the corresponding electrode; a base having a recession which is corresponding to the window and located under the underside of the flexible circuit board, and having a surrounding dam which extends on the upside of the flexible circuit board; and a transparent cover connecting with the surrounding dam for sealing the optical sensor chip.

Description

484237 V. Description of the invention (1) [Field of the invention] The present invention relates to an optical device for tape and reel packaging, in particular _ kind of optical device for tape and reel packaging with inner lead bonding. '[Prior art] The conventional optical device has a light-sensing chip that is appropriately protected. Usually, the light-sensing chip is installed in a grooved talman substrate, and then sealed with a transparent glass cover, and The space in which the light-sensing chip is sealed is usually vacuum or filled with pure gas to prevent water and gas from invading. However, the packaging cost of this structure is relatively high. In order to reduce the packaging and cost of optical devices, as shown in Figures 6 and 7, in US Patent No. 6,011,294 "low-cost CCD package" [丨 wc〇st CC \ package], an image sensor is disclosed. The CCD package of the component, f, is formed by a plastic base 12, a plastic ring frame 14 and a glass cover 16 in a closed space. The glass cover 16 is located on the top surface 24 of the ring frame to seal the light. Two pieces of 11: One of the soft circuit 18 is located on the plastic base 12 and the plastic i is the conductive finger 19 on the substrate 20. The light sensing chip 11 is two and the top surface of the type 18 is with the bonding wire 29 inside. Electrical connection,…, and its shortcomings are light and salty y fixing bases, which make it poorly fixed to the soft circuit 18 without offset and lateral displacement. At the same time, if the angle and position of the soft electric sound light sensing, this soft circuit 18 is set with the lower surface = degree greater than the width of the plastic base 12, sticking a plastic ring frame, so that the seal = the false base 12 and its upper surface Sticky 484237 V. Description of the invention (2)

[Objective J] The main purpose of the present invention is to provide a tape-and-reel packaged optical device, which uses a base formed by a stamper to carry the light-sensing chip and fix the soft circuit board, so that the light-sensing chip is firmly combined with the base to achieve low Finish = Equipped with high stability optics. '' A secondary object of the present invention is to provide a tape and reel packaged optical device. A soft circuit substrate is provided with a metal circuit, and the inner pins of the circuit are thermocompression bonded to the light sensing chip, and the pins outside the metal circuit extend to Same—σ ^ eliminates the effect of bonding with the surface of the circuit board [surface _ to the effect of flexible assembly and adjustable margin. The purpose of this method is to provide a tape-sealed mold for an optical device to form a "carrying and connecting soft circuit substrate and light-sensing chip and a base for pressing optics. The packaged optical device includes: a surface to a wafer; a plurality of bumps are formed on the front surface; to the bottom; the bottom of the soft circuit board has-the above table extension: υ: υ; 2 Soft circuit substrate and its internal pins ~ base, connected to the corresponding convexity of the light-sensing wafer; light-sensitive rigid wafer, two with grooves and a bank, where the groove is used to accommodate and below the surface, the bank Extends onto a flexible circuit board

A transparent cover is combined with the dike to seal the light sensing chip. [Detailed description of the invention] Please refer to the attached drawings to illustrate the present invention by the following embodiments: According to the optical device of the tape and reel package of the present invention, in the first specific embodiment, FIG. 1 is the optical of the tape and reel package A schematic cross-sectional view of the device 100, and FIG. 2 is a top view of the optical device 100 in the tape and reel before prior t0 molding. The reel-packaged optical device 100 mainly includes a soft circuit substrate 110, a light sensing chip 130, a base 1440, and a transparent cover 150, wherein the light sensing chip 130 (optical sensor chip ] Is a charge coupled device (Charge Coupled device, CCD), a photodiode, an infrared sensor [infrared sensor], or a scene > image sensor [image sens〇r], which has a purpose The photosensitive front side 'and a plurality of gold bumps 131 [gold bumps]' are formed on the periphery of the front side as the output end of the light sensing chip 13 for the pins inside the metal circuit 120 on the flexible circuit substrate 110 121 fierce connection. The flexible circuit substrate 110 is taken from a reel of a polyimide soft material and can be wound around a reel. The flexible circuit substrate 110 can be a single-layer circuit board or a multilayer circuit board. In this embodiment, a single-layer circuit board is used as an example. The soft circuit substrate 110 has an upper surface 111, a lower surface 丨 2 and a window 11 3 corresponding to the light sensing chip 130. In this implementation, In the example, the size of the window 1 丨 3 is slightly smaller than the light-sensing chip 130, and a plurality of metal circuits 120 such as copper are formed on the upper surface 111. Each metal circuit 120 has an inner pin 484237. 5. Description of the invention (4) 'One " [inner lead] and an outer pin 122, of which the inner pin 121 extends to the above-mentioned self-port 113.' The corresponding light-sensing chip 130 is soldered by a thermal compression method. Block 31, preferably, the plurality of metal wires 12 and pins other than pins 120 extend in the same direction and can be combined with an electrical socket. In addition, a soft circuit substrate 11 is formed around the window 113 There are a plurality of through holes 11 4 for thermosetting plastic The flow of the filler is usually used as a reel of the flexible circuit board 1 10 and is formed with fixed pitch holes 115 on both sides for transmission, and has at least one defined sealing area 116 [molding area] [As shown in FIG. 2], as the area where the bottom fl40 is formed as a stamper, "in addition", an adhesive 132 such as a hot-melt adhesive is formed around the lower surface 112 of the flexible circuit board n0 near the window 113 to fix the light feeling Test chip 1 3 0. The base 140 is formed by filling a thermosetting plastic filler with a mold filling technology [molding & injection], and is formed in the above-mentioned sealing area. The base 140 has a groove 141 for receiving light. The chip 130 is measured. The groove 141 is located below the lower surface 112 of the soft circuit substrate corresponding to the window 113, and the base ho has a bank 142 extending to the upper surface of the soft electrical substrate 110. m, using bonding, heat sealing, ultrasonic or laser welding, etc. ^ Combined with a transparent cover 15 such as glass, in this embodiment, the transparent cover 150 is fixed to the surroundings with hot melt adhesive 151 The upper edge of the bank 142 is a groove. The light-sensing chip 130 can be sealed by the transparent cover 15 and the base 140. Usually, the closed space between the transparent cover 15 and the base 14 is filled with a low-humidity blunt gas. Such as nitrogen or argon, or vacuum. 1. Since the light sensing chip 130 is carried by a harder base 丨 400 and combined with the fifth, description of the invention (5) fixed, the light sensing chip i 30 is in good condition after packaging, so the tape The optical stability of the packaged optical jade 4 is better than [replaces ceramic circuit substrates]. At the same time, the quality # 六 not only can be packaged and displaced laterally at low cost; at the same time, it is not easy for the optics to tilt and shift horizontally 12. The outer lead 122 is derived first; the two tables are as follows: the human end is connected by a metal circuit system for image reduction F surface bonding, when the optical device 100 (as shown in Figure Λ Gan Er foldable mobile circuit 30) And portable electronic products can be flexibly assembled and adjusted; ^ degrees' If the ancient technology and the residence in m ΐ 置 must be surface bonded or inserted = Large flexible cable guide [Obviously the process is tedious and occupied: In addition, the packaging method for the optical device of the above tape package is described as follows. A tape is provided, which is a soft circuit substrate 110, which has An upper surface 111, a lower surface 112, and a plurality of windows 113. A plurality of metal circuits 120 are formed on the upper surface ill, and the metal circuits 12 and 12 are extended to the windows 1 and 3; providing at least one light sense. A plurality of bumps 131 are formed on the front surface of each light-sensing wafer 130, and a plurality of bumps 131 are formed on the front surface of each light-sensing wafer 130. The thermo-bonded metal circuit 120 has a lead 121 in the window 113 and is soldered to the light-sensing wafer 1. The bump of 3 0 1 3 1; the mold 140 is filled with glue to form a base 140, wherein the base 140 has a groove U1 The light sensor chip 130 is used for accommodating the light sensor chip 130. The groove 1 41 is located under the surface 112 of the soft circuit substrate no corresponding to the solid opening 113, and the base 140 has a bank 142 (via the soft circuit substrate). 110 的 通 孔 i < 1. ::

Page 9 484237

5. Description of the invention (6) 114], which extends to the upper surface 111 of the flexible circuit substrate 110; and a bank 142 in which a transparent cover 150 is combined with the base 140.

In the second specific embodiment of the present invention, another optical device 200 packaged with tape is exemplified. As shown in FIG. 4, the optical device 200 includes a flexible circuit substrate 2 10 and a light sensing chip. 230, a thermosetting filler 240 and a transparent cover 250, wherein the light sensing chip 230 is formed with a plurality of bumps 231 on the periphery of the front surface, and the soft circuit substrate 210 has an upper surface 211, a lower surface 212, and a window 213. A plurality of metal circuits 220 are formed on the upper surface 2 11. The inner pins 221 extend to the window 213 to engage the bumps 2 3 1 of the light sensing chip 2 3 0, and the outer pins 2 2 2 are Extending to one side, in addition, the optical device 200 includes adhesives 232 and 251 such as hot-melt adhesive or adhesive tape around the window 213. The adhesive 232 adheres to the lower surface 212 of the soft circuit substrate 210 and the light sensor. The chip 230 and the adhesive 251 are used to adhere to the upper surface 211 and the transparent cover 250 of the flexible circuit board 2 10 to provide an appropriate bonding force during the manufacturing process. Liquid thermosetting filler 240, formed around the wafer 23 The periphery flows through the through hole of the flexible circuit substrate 210 to the periphery of the combination of the transparent cover 25 and the flexible circuit substrate 210, and the thermosetting filler 2 4 is cured during baking, which effectively strengthens the light sensing wafer 2 3 0, The combination and sealing properties of the transparent cover 2 50 and the flexible circuit substrate 2 i [at the window 213] make the optical device 200 not only package at low cost but also firmly integrate the light sensing chip 2 3 0 to the flexible circuit substrate. 210, with good stability and tightness. In the second specific embodiment of the present invention, a packaged optical device is further exemplified, in which the same component system as that of the first-and-experience # 也 丨 4-door ~, volume T /, He Yixing basket shell target

Page 10 484237 V. Description of the invention (7) It is indicated by the same drawing number. As shown in FIG. 5, the optical device includes a soft circuit substrate 2 1 0, a light sensing wafer 2 3 0, and a thermosetting filling. Agent 240 and a transparent colloid 2 60, wherein the light sensing chip 230 is formed with a plurality of bumps 231 on the periphery of the front surface, and the flexible circuit substrate 2 10 has an upper surface 211, a lower surface 212, and a window 213 'above A plurality of metal circuits 220 are formed on the surface 211. The inner pins 221 extend to the window 213 to engage the bumps 2 3 1 of the light sensing chip 2 3 0, and the outer pins 2 2 2 extend to one side. In addition, the optical device further includes an adhesive 232 such as a hot-melt adhesive or an adhesive tape around the window 213, wherein the adhesive 2 32 is attached to the lower surface 2 1 2 of the flexible circuit substrate 21 and the light sensing chip 2 3 0 In order to prevent the thermosetting filler 2 4 0 from flowing into the front side of the light sensing wafer 23 0, the thermosetting filler 24 0 is formed under the soft circuit substrate 210 in a first molding manner after thermal compression bonding. The surface 212 covers the back surface of the light-sensing chip 230 to form a support. The base, and the transparent colloid 2 60 is a highly transparent thermosetting silicon gel, which is formed on the front side of the light sensing wafer 23 by a second molding method, making the optical device It has the advantages of low cost packaging and good stability and stability to the light sensor chip. It should be understood that the foregoing preferred embodiment is intended as an enumeration of the present invention and is not intended to limit the present invention. The scope of protection of the present invention shall be determined by the scope of the patent application attached hereto. Any change or modification made by those skilled in the art without departing from the spirit and scope of the present invention shall fall within the protection scope of the present invention. ,

Page 11. 484237 Brief description of the drawings [Explanation of the drawings] Figure 1: Sectional schematic diagram of the first embodiment of the optical device according to the tape and reel packaging of the present invention; Figure 2: In the first embodiment, Top view of a light circuit chip combined with a light-sensing chip on a flexible circuit substrate. Figure 3: A perspective view of the optical device of the tape and reel packaging of the present invention that can be applied to a foldable mobile phone. Figure 4: Tape and reel packaging according to the present invention Optical device, a schematic cross-sectional view of a second embodiment;

Figure 5: A schematic cross-sectional view of a third embodiment of the optical device packaged with tape and reel according to the present invention; Figure 6: a side cross-sectional view of US Patent No. 6,011,294 "low-cost CCD package"; and Figure 7: Top view of US Patent No. 6,011,294 "low cost CCD package". [Illustration of drawing number]

10 CCD package 11 Light sensor chip 12 Plastic base 14 Plastic ring frame 16 Glass cover 18 Flexible circuit 19 Conductor finger 20 Substrate 24 Top surface of the ring frame 29 Welding wire 100 Optical device 110 Soft circuit substrate 111 Upper surface 112 Lower surface 113 Window 114 Through hole 115 Locator 116 Sealing area Page 12 484237 Brief description of the diagram 120 Metal circuit 121 Inner pin 130 Light sensor chip 131 Bump 140 Base 141 Groove 150 Transparent cover 151 Adhesive 200 Optical device 210 Soft Circuit board 211 upper surface 212 lower surface 214 through hole 220 metal circuit 221 inner pin 230 light sensing chip 231 bump 240 thermosetting filler 250 transparent cover '260 transparent gel 300 mobile phone 122 outer pin 1 3 2 adhesive 142 Embankment 213 Window 2 3 2 Adhesive

Claims (1)

484237 VI. Scope of patent application [Scope of patent application] 1. An optical device packaged with tape and reel mainly includes: a light-sensing wafer with a plurality of bumps formed on the front surface; a soft circuit substrate, wherein the soft circuit substrate It has an upper surface, a lower surface, and a window; / a plurality of metal lines formed on the soft circuit substrate and the inner leads are extended to the window for welding the corresponding block of the light sensing chip; and the base; 'It has a groove for accommodating the light-sensing chip, and the groove is located under the lower surface of the flexible circuit substrate corresponding to the window. 2. The tape-wrapped optical device described in item 1 of the patent application scope, wherein the base has a bank extending to the upper surface of the flexible circuit substrate. 3. The tape-wrapped optical device as described in item 2 of the scope of the patent application, further comprising a transparent cover, which is combined with the base of the base. 4. The tape-wrapped optical device described in item 1 of the scope of the patent application, and / or the medium-soft circuit board has a plurality of through holes formed around the window. 5 The tape-wrapped optical device as described in item 1 of Shenyan's patent scope, wherein the pins outside the plurality of metal lines extend to the same direction. 6. A tape and reel packaged optical device, comprising: a light-sensing wafer with a plurality of bumps formed on the front surface; a soft circuit substrate, wherein the soft circuit substrate has an upper surface, a lower surface, and a window; A plurality of metal lines formed on the flexible circuit substrate and the internal pins extending to the window for soldering the bumps of the corresponding light-sensing wafer; and a thermosetting filler formed at least on the light-sensing wafer and the soft circuit / Patent application scope _ The edge of the bottom surface of the substrate, straight ,,,,, ^ ^ u D edge, so that the edge of the light sensor chip and the soft 11β lower surface are tightly packed. Shell circuit board 7 straight! : The optical package with tape and reel described in item 6 of the patent scope. 8. If the scope of patent application is too high, σ. It also includes a roll / packaged optical device that is transparent, and can be filled on the front side of the light-sensing chip. Among them, the optical circuit of the soft circuit IS Λ Λ ///, wherein the optical device of the tape package described in the item of solidity, the table S on the circuit board is partially formed by the through hole in the soft electrical 11 The described optical device in tape and reel, 19 Ν,, and the pins outside the line are extended to the same direction. 1 The optics / reel packaging of the tape and reel described in item 6 of the patent scope, the thermosetting filler is formed-bearing the light sense 13, a photo of an optical device * providing-reel, the reel; the method, comprising the steps of: A top surface and a bottom surface are a soft circuit substrate, which has a plurality of metal lines: a c window, a shape measurement chip is formed on the top surface, and an m-line crystal is measured on the front side of each light-sensing wafer. Pin inside to solder to the light sense r · * 'fel Page 15. A thermosetting filler is formed to seal the bonding edges of the light-sensing wafer and the flexible circuit substrate. , U, the tape reel packaging method of the optical device as described in item 13 of the scope of the patent application, wherein in the step of forming a thermosetting filler, a base is formed with ^ weight / Qu glue, wherein the base has a The groove is used for accommodating the light-sensing chip. The groove is located below the lower surface of the flexible circuit substrate corresponding to the window, and the base has a bank extending to the upper surface of the flexible circuit substrate. 15. The tape sealing method for an optical device according to item 14 of the scope of the patent application, further comprising the steps of: combining a transparent cover on the base of the base and the bank. 16. The tape sealing method of the optical device according to item 13 of the scope of the patent application, wherein the tape is further formed with a plurality of loops L on the shoulder of each window. Page 16