TW480221B - Method to precisely align and adhere ink jet head chip and nozzle plate - Google Patents

Abstract

This invention provides the method to precisely align and adhere ink jet head chip and nozzle plate, which is capable of improving shortcoming such as misalignment between ink jet head chip and nozzle plate and poor sealing between the chip and the nozzle plate. According to the inventive method, chips are cut from wafer and placed on a carrier plate, while the nozzle plates are also placed on another carrier plate. A sucker heated to above 100 DEG C, preferably 185 DEG C, is used to take and heat up the nozzle plates to 185 DEG C. Image alignment technique is employed to press the chips and the nozzle plates using previously made align mark, and to bind by the adhesion generated from heating the dry film resist on the chips through the heat coming from contact with the nozzle plates.

Description

480221 V. Description of the invention α) Technology leader This invention relates to a method for accurately aligning and adhering a wafer chip of an inkjet head. More specifically, it is a method of setting a wafer and an orifice ^ to set an alignment reference mark ( Align mark), which combines the two pressures with the image alignment, and the adhesiveness produced by the dry film photoresist heat of the top layer of the wafer: the bonding method. Known technology inkjet printers have always occupied a place in the printer market. It is a basic peripheral device that has become a personal computer. With its increasing resolution, it is easy to apply to the characteristics of color printing and the characteristics of consumables. Compatible products are constantly being developed and widely loved by consumers, so that inkjet printers have not been eliminated due to the emergence of laser printers; for inkjet printers, the inkjet head is A very important part, because it is closely related to print quality, and the quality of the inkjet head depends entirely on the precision of the manufacturing process. Please refer to the first figure, which shows a typical inkjet head. The main body of the inkjet head is a wafer 1. It contains a circuit system that is controlled by software to perform inkjet action. There is a hollow in the middle. The ink storage place 2 is used to store the ink 21 from the ink cartridge. There are many ink tanks 3 on both sides of the ink storage place 2 and can communicate with the ink storage place 2 so that the ink 2 ί can flow in. By heating the heating plate (heate) r in the ink tank 3, the ink 21 is ejected from the inkjet holes 41 on the nozzle hole sheet 4; the ink tank 3 is covered with a nozzle hole sheet 4 containing many inkjet holes 41, Each ink tank 3 corresponds to an ink jet hole 41 as an outlet for shooting ink.

Page 4 480221 V. Description of the invention (2) Please refer to the second figure, which is a schematic diagram of a conventional method for bonding nozzles of an inkjet head. The wafer 5 contains dozens of wafers 1. These wafers 1 have passed through many. The processing steps, such as deposition, etching, etc., include the proper circuit system, ink storage 2 and ink tank 3, etc. The next step is to glue the nozzle plate 4 to each wafer 1. The conventional method is to dispense a suitable position on a wafer 1, and then place a nozzle 4 on the wafer with a suction nozzle! And then dispense on another wafer 1, and then place another nozzle hole 4 on this wafer 1; the same dispensing and placement steps are repeated until all wafers on wafer 5 are restored. !! Both have covered an orifice plate 4. J This wafer 5 and all the nozzle holes 4 are heated under pressure to complete the bonding step. The nozzle holes 4 are placed on the crystal to perform the steps, so that each Hajia step needs to flow out of the square water 21 precisely aligned. Smooth ^ This corresponds to each ink face 3 'can make ink live' so a single pair: step 1 does not = f will be blocked when the outlet of ink 21 is a small segment f [So, it is known: =, mother: human alignment action That is, the step that takes-takes quite a long time :: point: = obvious, repeat the same with extremely accurate f, product :: time-consuming, and because the point wins are difficult 10 " m's error " poor B said if In terms of manufacturing technology, the thickness of the wafer will generally be ± up to ± 20. If compared with other wafers, the thickness error value can be bonded to the photoresist and laminated. The pressing distance is usually 2U, which often results in the top layer of the wafer.

The situation of fΓίΓ, 'If the wafer thickness is large, a situation of photoresist layer overflow p: will be formed, so that the precision control process cannot be effectively controlled, which will cause the quality of the house to be difficult to control and need to be added., Indirect cost.增加 Increase inspection procedures and manpower, virtually =, on the other hand, in the semiconductor manufacturing process, the circuit system is first made; even on the same chip, the thickness of each position may be uniform. Therefore, it is difficult to control the quality by pressing the whole wafer. Φ In addition, the conventional technology is to bond all the wafers on the whole wafer with the spray holes and then cut and separate them. Regardless of the method of cutting, the debris generated during the cutting process (such as Supermicro) Small silicon sand), if it falls into the nozzle hole of the nozzle hole and gets stuck, even if it is removed by air jet, it may not be effectively removed, which will form a permanent blockage and affect the print quality of the inkjet head. 0 Technical Reveal

In view of the defects in the conventional manufacturing technology of the adhesive inkjet head orifice plate, L still needs to be developed by a new manufacturing method to overcome; the purpose of the present invention is to provide a precise alignment of the inkjet head wafer and the orifice plate. The method is to pre-set the alignment reference mark (Align mark) on the wafer and the orifice plate to combine the two with the image alignment. The viscosity generated by the dry film photoresist heat of the wafer Manufacturing method of the two. From the above purpose, it can be known that the steps of the method of the present invention are characterized in that the wafer (Ch ip) on the wafer is first cut and then sequentially arranged on the carrier plate at the set position, and the nozzle holes are also one by one. Arranged in another position

5. Description of the invention on page 6 (4) After loading the nozzle plate with a sucker (suckej ·) heated to 100 ° C or higher, the nozzle plate is also subjected to heat transfer to a high temperature above 100 t Then, the wafer and the orifice plate are preset with an alignment reference mark (Aligrl mark), and the two are pressed and combined by image alignment. The dry film photoresist on the top layer of the wafer resists the heat generated by the orifice plate. Sex binds the two together. The procedures in the method for accurately positioning the inkjet head wafer and the orifice plate by further alignment are further detailed, in which u) the wafers on the wafer are cut / sequentially arranged on the carrier plate, (2 ) Placing the nozzle plate on another carrier plate which has been set up. (3) The nozzle is heated by a suction cup (sucker) heated to 10 (above rc, the optimal temperature is 185 C). The film is sucked to make the nozzle hole also receive heat transfer up to 185. (: above high temperature, (4) using the wafer and the nozzle hole to set the alignment reference mark (Align mark) in advance, the two are pressed down by the image registration σ (5) The adhesiveness generated by the dry film photoresist of the uppermost layer of the wafer against the heat of the spray holes will bond the two. Among them, in step (1), the wafer needs to be coated on it before cutting. The aiming layer is a photoresist layer, and the material is a dry film photoresist. The thickness of the photoresist layer can be 10 ”to ^. The cutting method can be diamond cutting method, and the thunder sheet is additionally loaded… set… or = set Steps: Two) Like v: for the hole industry, the nozzle plate is also pre-set in step (3), the sucker first continues to maintain this warmth through the mouth, 尨 you ▲ L web temperature, and holding the nozzle plate from inflammation aspirated from the platen, diversion to the wafer 480221

Above the plate, the temperature of this spray spray reaches 185 due to the spray holes and the metal material. (; High temperature. # Of the suction cups ... In step (4), the wafer and the nozzle plate have been respectively prepared in advance with two wide = AligI1 mark, and the alignment reference mark of the two is set at the same positioning point. So that the image can be accurately combined when the registration is combined, the tolerance range is ± 5 // m, and the registration reference mark of the two can be a circle, a square, a triangle, or other geometric figures. ▲ In step (5) When the nozzle plate is pressed down and combined with the wafer, the high temperature and pressure of the nozzle plate can instantly harden the dry film photoresist on the wafer, and bond with the nozzle plate to form a tackiness to bond the two. In order to make the above-mentioned objects and procedures of the present invention clearer to the reviewers and those familiar with the art, the following illustrations and preferred embodiments of the present invention are described in detail as follows: A brief description of the first picture is typical Schematic diagram of the inkjet head; Figure 2 is a schematic diagram of the conventional method of bonding the nozzle plate of the inkjet head; Figure 3 is a schematic diagram of the wafer carrier disk of the preferred embodiment of the present invention; Figure 4 is a comparison of the present invention Perforated plate carrier Intent; Figure 5 is a schematic diagram of the alignment reference mark on the wafer and the nozzle plate of the preferred embodiment of the present invention; Figures 6 to A are schematic diagrams of another alignment reference mark in the preferred embodiment of the present invention FIG. 7 is a schematic diagram of a bonding process of a wafer and an orifice plate in a preferred embodiment of the present invention.

480221 V. Description of the invention (6) Symbols of the illustration ^ 1 Wafer 2 Ink storage place 3 Ink tank 4 Nozzle 5 Wafer 10 Wafer carrier 11 Heating plate 21 Ink 31 Photoresist layer 40 Nozzle carrier 41 The reference mark for the alignment of the nozzle 70 is shown in Figure 3. The wafer 1 has been placed on the wafer 1 in the preferred embodiment of the present invention. The Q is planned in advance so that the wafers 1 can be aligned on the wafer one by one. On the disk 10, this arrangement order is very important, so that the crystal disk 10 and the nozzle plate carrier plate 40 can cooperate with the operation of an automated machine, and the bonding of each wafer 1 and the nozzle plate 4 is made by a computer. _ Please refer to FIG. 5 at the same time. When wafer 1 is cut and placed on carrier 10, each wafer has gone through many previous processing steps, including steps such as deposition, etching, and sandblasting, so that circuits are formed in the wafer. System, ink storage place 2 and ink tank 3, etc., and a photoresist layer 31 is appropriately coated on the wafer 1. The photoresist layer 31 is a dry film photoresist, and the thickness of the photoresist layer 31 may be From 10 to 100, after the soft baking, exposure, and development procedures in the lithography step, the unnecessary parts are washed away to form ink tanks 3 which are used as Sheng Pei inks. After the wafer 1 is cut by the diamond cutting method, the laser cutting method or the rotary blade sawing method, it needs to be chipped before being placed in the carrier tray. The broken metal stuck in the ink tank 3 and caused blockage. Μ As shown in Figure 4, the nozzle plate 4 has a plurality of inks corresponding to the wafer. Page 9 480221 V. Description of the invention (7) A plurality of nozzle holes 41 of the cabin 3, and the carrier plate 40 of the nozzle plate 4 is also As with the carrier plate 10 of the wafer 1, the same number and the same location design planning are made so that the carrier plate 40 of the nozzle plate 4 and the carrier plate 10 of the wafer 1 can operate in unison. When operating in an automated machine, the suction cup is heated up to a set temperature of more than 001, and the optimal temperature is 185 ° C. After sucking up the nozzle plate 4 in the upper left and lower corners of the carrier 40, the sucker moves to the carrier 1. When the upper left lower corner of the wafer 1 is above, the shadow and alignment operation starts. The alignment reference mark 70 on the wafer 1 and the nozzle plate 4 is used as a correction to achieve high-precision positioning of the two, and the error is allowed when they are combined. Degree is ± 5 // m. The important point shown in FIG. 5 is the alignment reference mark 70. When the wafer j and the orifice plate 4 are manufactured, the same alignment reference mark 70 is set at the same location, and the alignment reference mark is shown in FIG. 5. 70 is a circle, and the registration reference number 70 can also have different graphic changes, such as a square or a triangle as shown in FIG. 6, or any other geometric figure. Figure 7 A to C show the bonding process of the wafer and the orifice plate, in which a) after a photoresist layer 31 is coated on the wafer 1 and B) after soft baking exposure and development procedures in a lithography step, Wash away the unnecessary parts to form an ink tank 21 = ink tank 3. The ink 21 flows in from the ink storage 2 and its inflow direction is from the direction perpendicular to the paper surface; and the wafer below the ink tank 3 1 is processed into heating plate After the product is completely bonded to the wafer, it can be bonded to the wafer 1 with a slight error compared to the image 1 and 41. Each white on the nozzle plate 4 can be accurately aligned with the opening of the ink tank 3. , So that the inkjet page ίο page 480221 V. Description of the invention (8) The overall quality of the head can be ensured.

Compared with the conventional technique, the method for accurately aligning and bonding the inkjet head wafer and the nozzle plate according to the present invention shows that the advantages of this creation are 1) the wafer is first cut and then arranged on the carrier plate, so that the nozzle plate and the wafer The bonding is performed in a one-to-one manner, and each bonding member can be completely bonded by sucking pneumatic pressure, which improves the lack of poor bonding caused by the uneven thickness of each wafer in the past when the whole wafer was bonded. ; 2) Use the dry film photoresist polymer to harden and form stickiness when heated, for glue-free adhesion, completely improve the past chip and nozzle hole adhesive need to be glued one by one, labor and time, and dispensing Disadvantages of unevenness; 3) The wafer and the nozzle plate are separated into different independent spaces (carrier disks), and then the nozzle plate is moved to the wafer with the suction cup as the bonding medium, and the image alignment technology in the three-dimensional space is used. To make the two stick together, this plane and space position conversion and use, make the entire adhesion industry process more smooth, and automated machinery operations, can save labor and time; 4) in the wafer and nozzle orifice ^ preset Registration reference mark To facilitate bonding between the two alignment to achieve 咼 precision bonding, in order to improve the yield and quality of products. The above-mentioned advantages s have not been seen in the conventional bonding method. It is obvious that the present invention is previously unseen, and after multiple implementation verifications, it has been confirmed that the present invention can indeed achieve the set requirements for bonding. The present invention is shown to have unquestionable practicality. # Details of the method of the present invention for precisely aligning the inkjet head wafer and the orifice plate: the implementation steps have been fully disclosed above, but it is not intended to limit anyone skilled in the art who is familiar with this technology, without departing from the spirit of the invention The equivalent changes and modifications made by He Fan according to the scope of patent application of the present invention are

480221 V. Description of the invention (9) Should belong to the scope of this creation patent 41 # 1 ^ 1 Page 12 480221 Schematic description of the first diagram The first diagram is a schematic diagram of a typical inkjet head; the second diagram is a conventional adhesive spray Schematic diagram of nozzle head nozzle method; Figure 3 is a schematic diagram of a wafer carrier disk of a preferred embodiment of the present invention; Figure 4 is a schematic diagram of a nozzle disc cutting plate of a preferred embodiment of the present invention; Figure 5 It is a schematic diagram of the alignment reference mark on the wafer and the orifice plate of the preferred embodiment of the present invention; Figures 6 to A are schematic diagrams of another alignment reference mark in the preferred embodiment of the present invention; Figure 7A ~ C is a schematic diagram of the bonding process of the wafer and the orifice plate in the preferred embodiment of the present invention. Explanation of symbols: wafer 2 ink storage place 3 ink tank 4 nozzle plate 5 wafer 10 wafer carrier 11 heating plate 21 ink 31 photoresist layer 40 nozzle plate carrier 41 nozzle 70 alignment reference mark 糌

Claims (1)

" f «U221 VI. Patent Application Fan Yuan1 · A method for precisely registering the inkjet head wafer and the orifice plate by alignment, the inkjet head is composed of a wafer and an orifice plate as its main body, wherein, the Both the wafer and the nozzle plate have at least one alignment reference mark, and a photoresist layer is appropriately coated on the wafer; the nozzle plate has a plurality of nozzle holes corresponding to a plurality of ink tanks on the wafer; The bonding step of the nozzle plate includes: (1) cutting and separating the wafer from the wafer, (2) sucking up the nozzle plate with a suction cup heated to more than 1000 ° C so that the nozzle plate is also subjected to heat transfer It can reach a high temperature of more than 1000 ° C. (1 2) The registration reference mark is set on the wafer and the orifice plate in advance, and the two are pressed down and combined by the image registration. (4) The photoresist on the top layer of the wafer The layer meets the heat of the nozzle plate and produces stickiness, which binds the two. The precise alignment of the inkjet head wafer and step described in the first item of the range: Method ′ # 11, the step (1) also includes the following steps 4 1 2; placed in order on the carrier disc at the set position. • Alignment of the inkjet head wafer and the diamond cutting method as described by the sprayer. ) The cutting of the wafer can be done 2 · As in the method of applying patent No. 1 for the nozzle plate method, in which the ink head wafer is aligned at H and the laser cutting method is used. The cutting of the wafer in the wafer can be done in the same way as in the patent application No. 丨 W level alignment bonding inkjet head wafer and the patent application nozzle hole method, wherein the wafer cutting in this step (1) can be bladed The mining method is Q. The method for precisely aligning the inkjet head wafer and the orifice plate as described in item 1 of the patent application range, wherein the material of the photoresist layer is a polymer dry film photoresist. 7 · The method of precisely registering the inkjet head wafer and the orifice plate as described in item 1 of the patent application scope, wherein the heating temperature in step (3) is 185 as the optimal temperature. 8 · Accurate alignment of the inkjet head chip and The method of spraying holes, wherein the thickness of the photoresist layer is 10 // 111 to 10 () β m 〇9. As described in the patent application scope item 丨, the inkjet head wafer and the spray holes are precisely aligned. The method of filming, wherein the alignment reference mark in step (4) may be a circular mark. 10. The method of precisely aligning and adhering multiple wafers of an inkjet head wafer as described in item i of the scope of patent application ', wherein the alignment mark in this step 对 may be a square mark. • The method for precisely aligning the bonded inkjet head wafer ^ as described in item J of the patent scope, wherein ′ the reference mark in step (4) may be a square mark. For 12 sprays, please refer to the special Λ range / 1 item of Kongshen Tablet for accurate registration of the bonded inkjet head crystal. “The registration reference mark in this step 可 can be a geometric mark. Page 15