JPH0592563A - Ink jet head and production thereof - Google Patents

Abstract

PURPOSE:To simply, inexpensively and accurately form an ink passage by applying a silicone resin to the respective ink contact parts of a plurality of a photosensitive resin members and the ink passage part of the photosensitive resin member between said contact parts to laminate and bond both of them. CONSTITUTION:A dry film photoresist 2 is laminated to the surface of a substrate 1 and a photomask having predetermined patterns 3a, 3b is superposed on the upper surface of the photoresist 2. The photoresist 2 is exposed from above and the exposed part is dissolved to form a cured photoresist film 2H having a roughened surface. Hereinafter, in the almost same way, second and third photoresist films not shown in the drawings are successively arranged to the upper surface of the photoresist film 2H. At this time, a silicone resin is applied to the respective ink contact parts of the first and third photoresist films and the ink passage part of the second photoresist film to be cured. Then, these parts are laminated and bonded to form ink passages.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet head, and more particularly to an ink jet head for producing recording ink droplets used for so-called ink jet recording systems.

[0002]

2. Description of the Related Art An ink jet head applied to an ink jet recording system generally comprises a fine ink ejection port (orifice), an ink passage and a part of the ink passage, or an ink ejection pressure generating portion provided outside a substrate. ing. Conventionally, as a method for producing such an inkjet head, for example, by cutting, photolithography, etching or the like on glass or a metal plate, or by exposing a photosensitive resin to form fine grooves, the grooves are formed. There is known a method of forming an ink passage by joining a plate to another suitable plate, or a method of forming an ink passage by sandwiching an intermediate substrate between substrates having this groove and further forming substrates having this groove. It was being done.

[0003]

However, in the head manufactured by such a conventional method, the roughness of the inner wall surface of the ink passage to be machined is too great, and it is difficult to obtain the ink passage due to the difference in etching, etc. The ink ejection characteristics of the inkjet head are likely to vary. In addition, there is a drawback that chipping or cracking of the plate is likely to occur during cutting, resulting in poor manufacturing yield.

When photolithography or etching is performed, there are many manufacturing steps, which is disadvantageous in that the manufacturing cost increases.

Further, as a problem common to the above-mentioned conventional methods, a grooved plate having a groove formed as an ink passage and a cover plate provided with an energy generating element are generally different materials and different from each other. Since the so-called wettability with respect to the ink in the passage is different, the uniformity of the ink meniscus shape at the time of ink supply, that is, refilling after the ink is ejected from the passage is lost, The connectivity of the ink ejection characteristics is impaired.

The thin-film laminated ink jet head uses a vacuum apparatus such as vapor deposition, sputtering, and CVD, and has many manufacturing steps, leading to an increase in manufacturing cost. Further, a drawback common to the above-mentioned conventional methods is a cycle. The time is long and the productivity has been declining.

Further, in the step of forming the ink passage by using the photosensitive resin, the compatibility between the ink component and the photosensitive resin is poor. The photosensitive resin (photopolymer) is originally based on an acrylic resin-based polymer as a sensitizer, and has a water absorbing effect on water-based ink. Reliability of swelling of photosensitive resin due to ink absorption, dimensional change and rigidity, especially Young's modulus reduction, elution of uncured photosensitive resin due to ink attack, and reduction of adhesion to the substrate due to ink infiltration The technical problem of decline has occurred. Therefore, the development of an inkjet head having a configuration that solves these drawbacks has been earnestly desired.

The present invention has been made in view of the above problems. 1. An ink jet head which is precise, has high durability and reliability, and has stable ejection performance. 2. An ink passage is accurate and the yield is high. It is another object of the present invention to provide an ink jet head having a finely processed structure which is faithfully designed, and an ink jet head having a multi-array fine ink discharge nozzle by a simple method.

[0009]

An ink jet head of the present invention that achieves the above-mentioned various objects comprises a first photosensitive resin member on a substrate having a rough surface formed by utilizing photosensitivity, and A pattern-shaped second photosensitive resin member having a rough surface formed by utilizing photosensitivity for forming an ink passage communicating with an ejection port for ejecting ink after being laminated on the rough surface; After laminating on the rough surface, a third photosensitive resin member having a rough surface formed by utilizing photosensitivity, and a fourth photosensitive resin member on the rough surface via a fourth photosensitive resin member, etc. In an ink jet head in which the above substrates are simultaneously laminated to form an ink passage, a silicone resin is applied to the ink contact portion of the first photosensitive resin member before the patterned second photosensitive resin member is laminated. Is applied, and the third photosensitive resin member is laminated Before applying the silicone resin to the ink passage portion of the second patterned photosensitive resin member, and before laminating the fourth photosensitive resin member, the ink of the third photosensitive resin member is laminated. An inkjet head is characterized in that a silicone resin is applied to a contact portion to form an ink passage, and a manufacturing method thereof.

[0010]

【Example】

(Example 1) Hereinafter, the present invention will be described in detail based on examples. An embodiment of the present invention will be described according to the manufacturing process shown in FIGS.

As shown in FIG. 1, glass, ceramic,
After cleaning and drying the surface of a suitable substrate 1 such as plastic or metal, as shown in the cross-sectional view of FIG. 2, a dry film photoresist 2 (film thickness, About 15 microns to 1
00 micron) at a rate of 0.5 to 0.4 f / min and pressure conditions of 1 to 3 kg / cm ² .

Incidentally, FIG. 2 is a sectional view corresponding to a section taken along line X, X'in FIG. At this time, the dry film photoresist 2 is pressure-bonded and fixed to the substrate surface 1A, and is not peeled from the substrate surface 1A even when a considerable external pressure is applied thereafter.

Subsequently, as shown in FIG. 3, a photomask 3 having predetermined patterns 3A and 3B is superposed on the dry film photoresist 2 provided on the substrate surface 1A, and then, from above the photomask 3. Exposure (arrow in the figure)
I do. At this time, the pattern 3A sufficiently covers the area of the ink passage on the substrate 1 and does not transmit light.
Therefore, the dry film photoresist 2 in the area covered with the pattern 3A is not exposed. At this time, it is necessary to align the planned position of the ink discharge pressure generating element 10 on the back surface of the substrate 1 with the pattern 3A by a known method. That is, at least on the outer side of the ink enormous flow path (ink pressurizing chamber) formed later through the substrate,
Care is taken to arrange the elements 10 in a planned manner. or,
The pattern 3B is a fine pattern and is located so as to surround the pattern 3A.

Since the pattern 3B is very minute, the dry film photoresist 2 is exposed minutely according to the pattern 3B. The fine pattern 3B can be set in various ways such as a lattice shape, a dot shape, a parallel line shape, or a curved shape of a combination thereof, and is not particularly limited as long as it is fine.

When exposure is performed as described above, pattern 3
The dry film photoresist 2 outside the region undergoes a polymerization reaction to be cured and becomes insoluble in the solvent. On the other hand, in the figure which is not exposed, the dry film photoresist 2 which is shaded is not cured and remains soluble in the solvent.

After the exposure operation, the dry film photoresist 2 is immersed in a volatile organic solvent such as trichloroethane or methyl ethyl ketone to dissolve and remove the unpolymerized (uncured) dry film photoresist 2. As shown in FIG. 4, a hardened photoresist film 2H having a roughened surface is formed on the substrate 1.

The surface roughness is preferably 0.1 to 10 μm, which is unevenness which effectively realizes the anchor effect with the dry film photoresist 2 to be superposed later. The cured photoresist film 2H is further cured for the purpose of improving solvent resistance. As the method, it is preferable to carry out thermal polymerization (heating at 130 to 160 ° C. for about 10 to 60 minutes), irradiation with ultraviolet rays, or a combination of both.

FIG. 5 is a cross-sectional view corresponding to the section taken along the line Y, Y'in FIG. At this time, although not in the figure,
Preliminary polypropylene according to the cross-sectional shape of the ink passage
Cut out plastic film such as polyethylene / polyethylene terephthalate and harden photoresist film 2H
Keep it on top of. Liquid or film type silicone resin is poured or positioned according to the cross-sectional shape of the ink passage. The coating amount can be adjusted from 1 micron to 8 by adjusting the amount and viscosity of the poured silicone resin or the film thickness.
A thickness of up to 0 micron is appropriate in terms of ink resistance and ejection energy transfer efficiency.

The curing method may be linked to the method for curing the photosensitive resin, or may be heat-polymerized alone (1 degree Celsius).
It is also possible to perform heating at 30 to 160 degrees for about 10 to 60 minutes), to irradiate with ultraviolet rays, or to use both of them together. Then, the plastic film is peeled off.

FIG. 6 is a sectional view of the section taken along the line Y, Y'in FIG.

Next, after the surface of the cured photoresist film 2H of the intermediate product of FIG. 5 is cleaned and dried, this film 2H is formed.
Similarly to the previous step, dry film photoresist 4 (film thickness, about 25 to 100 microns) heated to about 80 to 105 degrees Celsius is used at a rate of 0.5 to 0.4 f / min. Laminate under a pressure condition of 0.1 kg / cm ² or less.

What is important in this step is to prevent a part of the dry film photoresist 4 to be laminated from dripping into the ink passage portion formed in the cured photoresist film 2H. Therefore, the laminating pressure (1 to 3 kg / cm ² ) shown in the previous step causes sagging of the dry film photoresist 4, so the laminating pressure is set to 0.1 kg / cm ² or less.

As another method for preventing the ink from flowing into the ink passage portion, the cured photoresist film 2 is previously formed.
Read the clearance for the thickness of H (15 to 100 microns) and crimp it. Thereby, the laminating pressure can be adjusted to 0.1 kg / cm ² or less.

At this time, the dry film photoresist 4 is pressure-bonded and fixed to the surface of the cured photoresist film 2H,
After that, even if a considerable external pressure is applied, it does not peel off. Subsequently, as shown in FIG. 7, a photomask 5 having a predetermined pattern 5P is superposed on the newly provided dry film photoresist 4, and then the photomask 5 is formed.
Is exposed (indicated by an arrow in the figure) from above. The pattern 5P corresponds to a region that will later be configured as an ink supply chamber, an ink passage, and an ejection port.
P does not transmit light. Therefore, the dry film photoresist 4 in the area covered with the pattern 5P is not exposed. At this time, it is necessary to align the position of the ink discharge pressure generating element 10 (not shown), which will be provided later on the substrate 1, with the pattern 5P by a known method. In other words, at least the element 10 should be positioned outside the substrate 1 of the ink expansion passage to be formed later.

As described above, when the dry film photoresist 4 is exposed to light, the dry film photoresist 4 outside the area of the pattern 5P undergoes a polymerization reaction and is cured, and remains insoluble in the solvent. After the exposure operation, the dry film photoresist 4 is dipped in a volatile organic solvent, for example, trichloroethane or methyl ethyl ketone to dissolve and remove the unpolymerized (uncured) photoresist to form a cured photoresist film 4H. 8 according to pattern 5P
The recess shown in is formed.

After that, the cured photoresist film 4H left on the previous resist film 2H is further cured for the purpose of improving the solvent resistance. As a method thereof, it is preferable to perform heating by heat polymerization (130 ° C. to 160 ° C.) for about 10 to 60 minutes, perform ultraviolet irradiation, or use both of them together.

Although not shown in FIG. 8, a plastic film such as polypropylene, polyethylene, or polyethylene terephthalate is cut out in advance according to the cross-sectional shape of the ink passage, and adhered onto the cured photoresist film 4H. Liquid or film type silicone resin is poured or positioned according to the cross-sectional shape of the ink passage. The coating amount is adjusted by the amount of the silicone resin to be poured and the viscosity or the film thickness, and a thickness of 1 micron to 100 microns is suitable from the viewpoint of ink resistance and ejection energy transfer efficiency.

The curing method is linked with the method for curing the photosensitive resin. Or heat polymerization alone (13 degrees Celsius
It is also possible to perform heating at 0 to 160 degrees for 10 to 60 minutes), to irradiate with ultraviolet rays, or to use both of them together. Then, the plastic film is peeled off.

Among the recesses thus formed in the hardened photoresist film 4H, 6A is an ink pressurizing chamber 6A in the completed ink jet head product, and 6B is an ink passage corresponding to an ink discharge passage.

The islands 6C formed by the cured photoresist film 6A left in the ink passages in FIG. 8 serve as pillars for preventing the ceiling plate (not shown) which will be overlaid later from sagging. The shapes and sizes of these can be freely defined as long as they do not hinder the circulation of ink. The ink passage wall surface of the cured photoresist film 4H is roughened when removing the unpolymerized (uncured) photoresist.

Incidentally, FIG. 9 is a sectional view corresponding to a section taken along line Z, Z'in FIG.

Further, as shown in FIG. 10, a dry film photoresist 8 forming an ink pressurizing chamber of the ink path is further adhered to the surface of the cured resist film 4H having the ink path formed by a laminator. At the laminating pressure (1 to 3 kg / cm ² ) shown in the previous step, the laminating pressure is set to 0.1 to prevent the dry film photoresist 8 from sagging.
The pressure is set to kg / cm ² or less, or the clearance of the thickness (15 to 100 μm) of the cured photoresist film 4H is read in advance and pressure bonding is performed. As a result, the dry film photoresist 8 is pressure-bonded and fixed to the surface of the hardened photoresist film 4H, and is not peeled off even when a considerable external pressure is applied thereafter.

FIG. 11 is a sectional view taken along line V, V ′ of FIG. 10, showing the dry film photoresist 8 exposed using the photomask 3.

As shown in FIG. 11, a photomask 3 is overlaid and exposed from above (arrow in the figure), and a dry film photoresist 8 is placed in a volatile organic solvent such as trichloroethane or methyl ethyl ketone. Immerse and develop.

After that, either thermal polymerization or ultraviolet irradiation is carried out, and both of them are used together for curing treatment. FIG. 12 is a perspective view at that time.

A plastic film matching the cross-sectional shape of the ink passage is brought into close contact with the cured photoresist film, and silicone resin is poured into the ink passage. After thermal polymerization or irradiation with ultraviolet rays, the plastic film is peeled off.

Incidentally, FIG. 13 is a cross-sectional view corresponding to the section taken along the line U, U'in FIG.

Next, another substrate 1 and the cured photoresist are laminated with a dry film photoresist 9 interposed therebetween. At that time, a silicone resin film is preliminarily laminated on one side of the dry film photoresist 9 at a portion located in the ink pressurizing chamber. Then, after the exposure, in that state, heating is performed at 150 to 200 degrees Celsius for about 10 to 60 minutes to perform thermal polymerization, ultraviolet irradiation, or a combination of these is used for curing.

As described above, after the dry film photoresist 9 is hardened and the joining of the dry film photoresist 9 and the hardened film 8H is completed, a piezo element or the like is provided outside the substrate 1 as shown in FIG. A desired number of the ink pressure ejection generating elements (ink ejection energy generating elements) 10 are arranged. Although not shown, a signal input electrode is connected to the ink ejection generation element 10.

The dicing method usually used in the semiconductor industry is adopted, and the ink discharge ports 11 are cut to be aligned. Then, the cut surface is polished and smoothed, and the ink supply port 1
1 or an ink supply pipe for connecting an ink tank (not shown) to the ink supply port 11 or connecting the ink tank to the ink supply port 11 (not shown). (Not shown) is attached to complete the ink jet head.

In the above embodiments, the photoresist film 2H is used.
Corresponds to the first photosensitive resin member, the photoresist film 4H corresponds to the patterned photosensitive resin member, and the photoresist film 8H corresponds to the second photosensitive resin member.

In the above-mentioned embodiments, a dry film type, that is, a solid type is used as the photosensitive composition (photoresist) for forming the groove, but the present invention is not limited to this, and the photoresist 2 is used. 4, 8, 9
A liquid photosensitive composition can also be used as the above.

In the case of a liquid, a method using a squeegee used for producing a relief image, that is, a wall having the same height as a desired photosensitive composition film pressure is used as a film forming method of the photosensitive composition on a substrate. It is a method of removing the excess composition by placing it around the substrate and using a squeegee. in this case,
A suitable viscosity of the photosensitive composition is 100 to 300 CPS. Further, the height of the wall placed around the substrate needs to be determined in consideration of the reduction in evaporation of the solvent component of the photosensitive composition.

In addition, a liquid photosensitive resin can be applied and molded as a thin film on a substrate by a high-speed spin coater. On the other hand, in the case of a solid, the photosensitive composition sheet is heated and pressure-bonded onto the substrate to be adhered. There is a method of forming a film.

In the present invention, the method of using a semi-solid dry film type is advantageous in that the handling and the control of the thickness can be performed easily and accurately. Examples of such a semi-solid material include, for example, ALPHO series manufactured by Nippon Synthetic Rubber Co., Ltd., Ozatech Co., Ltd. of Nippon Synthetic Chemical Industry Co., Ltd., Dialon of Mitsubishi Rayon Co., Ltd., Photec of Hitachi Chemical Co., Ltd., Sunfort of Asahi Kasei Co., Ltd., RISTON Bakurel of DuPont Co., Ltd., and Audil of Tokyo Ohka Co., Ltd. There are commercially available photosensitive resins under the trade names such as.

In liquid form, Taiyo Ink PSR series,
There are photosensitive resins that are commercially available under the trade names of Tokyo Ohka Co. PMR series and Toray Photo Nice. In addition to the above, the photosensitive composition used in the present invention includes many photosensitive materials such as photosensitive resins and photoresists used in the field of ordinary photolithography.

The silicone resin usable in the present invention is TSE series, YE series, TUV of Toshiba Silicone Co.
Series, Shin-Etsu Silicone KE series, etc.

Examples of these photosensitive materials include diazoresin, p-diazoquinone, and photopolymerization type photopolymers using, for example, a vinyl monomer and a polymerization initiator,
A dimerization type photopolymer using polyvinyl cinnamate etc. and a sensitizer, a mixture of orthonaphthoquinonediazide and a volatile type phenol resin, a mixture of polyvinyl alcohol and a diazo resin, 4-glycidyl ethylene oxide and benzophenone or glycidical chalcone are copolymerized. Polyether type photopolymer, copolymer of N, N-dimethylmethacrylamide and acrylamide benzophenone, unsaturated polyester photosensitive resin [eg, APR (Asahi Kasei), Tevista (Teijin), Sonne (Kansai Paint), etc. ], Unsaturated urethane oligomer photosensitive resin, photosensitive composition obtained by mixing photopolymerization initiator and polymer in bifunctional acrylic monomer, dichromic acid photoresist, non-chromium water-soluble photoresist, polyvinyl cinnamate System Torejisuto, cyclization Gomuajido based photoresist, and the like.

(Embodiment 2) The present invention will be described in detail below based on an embodiment. An embodiment of the present invention will be described according to the manufacturing process shown in FIGS.

As shown in FIG. 1, glass, ceramic,
After cleaning and drying the surface of a suitable substrate 1 such as plastic or metal, a dry film photoresist that is exposed to wavelength A heated to about 80 to 105 degrees Celsius as shown in the sectional view of FIG. 2 (film thickness, about 1
5 to 100 microns) 0.5 to 0.4 f /
Laminate under pressure conditions of speed of 1 to 3 kg / cm ² .

Note that FIG. 2 is a sectional view corresponding to a section taken along line X, X'in FIG. At this time, the dry film photoresist 2 is pressure-bonded and fixed to the substrate surface 1A, and is not peeled from the substrate surface 1A even when a considerable external pressure is applied thereafter.

Next, as shown in FIG. 16, the surface of the dry film photoresist 2 is set to 80 ° C. as in the previous step.
Dry film photoresist 4 (film thickness, about 25
Micron to 100 micron) 0.5 to 0.4 f /
Lamination is performed at a speed of 1 minute and under a pressure condition of 0.1 kg / cm ² or less.

Subsequently, as shown in FIG. 17, a photomask 3 having predetermined patterns 3A and 3B is superposed on a dry film photoresist 4 provided on the substrate surface 1A, and then, from above the photomask 3. Exposure with a wavelength A (arrow in the figure) is performed. At this time, the pattern 3A sufficiently covers the area of the ink passage on the substrate 1 and does not transmit light. Therefore, the dry film photoresists 2 and 4 in the area covered with the pattern 3A are not exposed.

Since the pattern 3B is very minute, the dry film photoresist 2 is exposed minutely according to the pattern 3B. The fine pattern 3B can be set in various ways such as a lattice shape, a dot shape, a parallel line shape, or a curved shape of a combination thereof, and is not particularly limited as long as it is fine.

Further, as shown in FIG. 18, a photomask 5 having predetermined patterns 5A and 5B is superposed on a dry film photoresist 4 provided on the substrate surface 1A, and then a wavelength is applied from above the photomask 5. Exposure is performed at B (arrow in the figure). At this time, the pattern 5A sufficiently covers the area of the ink passage on the substrate 1 and does not transmit light. Therefore, the dry film photoresists 2 and 4 in the area covered with the pattern 5A are not exposed.

When the exposure is carried out as described above, the dry film photoresists 2 and 4 outside the areas of the patterns 3 and 5 undergo a polymerization reaction to be cured and become insoluble in the solvent. On the other hand,
In the figure which is not exposed, the dry film photoresists 2 and 4 which are shaded are not cured and remain soluble in the solvent.

After the exposure operation, the dry film photoresists 2 and 4 are immersed in a volatile organic solvent such as trichloroethane or methyl ethyl ketone to form an unpolymerized (uncured) dry film photoresists 2 and 4. 19 is a perspective view when the substrate 1 is dissolved and removed.
A hardened photoresist film 4H having a roughened surface is formed thereon.

The surface roughness is preferably 0.1 to 10 μm, which is unevenness which effectively realizes the anchor effect with the dry film photoresist 6 to be superposed later. The cured photoresist film 4H is further cured for the purpose of improving solvent resistance. As the method, it is preferable to carry out thermal polymerization (heating at 130 to 160 ° C. for about 10 to 60 minutes), irradiation with ultraviolet rays, or a combination of both.

Although not shown in FIG. 19, a plastic film such as polypropylene, polyethylene, or polyethylene terephthalate is cut out in advance according to the cross-sectional shape of the ink passage and adhered onto the cured photoresist film 2H. Liquid or film type silicone resin is poured or positioned according to the cross-sectional shape of the ink passage. The coating amount is adjusted by the amount and viscosity of the silicone resin to be poured, or the film thickness, and a thickness of 1 to 80 μm is appropriate from the viewpoint of ink resistance and ejection energy transfer efficiency.

The curing method may be linked to the method for curing the photosensitive resin, or may be independently heat-polymerized (1 degree Celsius).
It is also possible to perform heating at 30 to 160 degrees for about 10 to 60 minutes), to irradiate with ultraviolet rays, or to use both of them together. Then, the plastic film is peeled off.

FIG. 20 is a sectional view of the section taken along the line W, W'in FIG. Figure 2
7 shows the difference between the wavelength A and the wavelength B.

As described above, by using the dry film photoresist 4 having a photosensitive region of two wavelengths or more,
As can be seen from the comparison with Example 1, the positioning accuracy of the dry film photoresist 4 to be bonded is not dependent on the mechanical accuracy of the laminator and the rigidity of the dry film photoresist 4, but the accuracy of the stepper used in the semiconductor industry. Therefore, it is possible to significantly improve accuracy. Two layers of dry film photoresist 2 during development,
Since 4 is processed at the same time, dripping is prevented and pressure operation is not required due to pressure and heat treatment during the second lamination.
This is an effective method for improving workability and quality.

Since the uncured dry film photoresists are attached to each other, the adhesion is improved as compared with the case where the dry film photoresists are attached after curing.

Positioning / exposure
The development process could be simplified once, and the productivity was improved, the quality was stabilized, and the yield was improved.

Of the recesses thus formed in the cured photoresist film 4H, 6A is the ink pressurizing chamber 6A in the finished ink jet head, and 6B is the ink passage corresponding to the ink discharge passage.

The islands 6C formed by the hardened photoresist film 6A left in the ink passages in FIG. 19 serve as pillars for preventing the ceiling plate (not shown) that will be overlaid later from sagging. The shapes and sizes of these can be freely defined as long as they do not hinder the circulation of ink. The ink passage wall surface of the cured photoresist film 4H is roughened when removing the unpolymerized (uncured) photoresist.

Further, as shown in the perspective view 21, a dry film photoresist 8 forming an ink pressurizing chamber of the ink path is further adhered to the surface of the hardened resist film 4H having the ink path formed by a laminator. With the laminating pressure (1 to 3 kg / cm ² ) shown in the previous step, the laminating pressure was set to 0.
The pressure is set to 1 kg / cm ² or less, or a clearance corresponding to the thickness (15 to 100 μm) of the cured photoresist film 4H is read in advance and pressure bonding is performed. As a result, the dry film photoresist 8 is pressure-bonded and fixed to the surface of the hardened photoresist film 4H, and is not peeled off even when a considerable external pressure is applied thereafter.

FIG. 22 is a sectional view taken along the line S, S ′ in FIG. 21, showing the dry film photoresist 8 exposed using the photomask 3.

As shown in FIG. 22, a photomask 3 is overlaid and exposed (arrow in the figure), and the dry film photoresist 8 is exposed to a volatile organic solvent such as trichloroethane or methyl ethyl ketone. Immerse and develop.

After that, either thermal polymerization or ultraviolet irradiation is performed, and both of them are used in combination for curing treatment. FIG. 23 is a perspective view at that time.

A plastic film matching the cross-sectional shape of the ink passage is brought into close contact with the cured photoresist film, and silicone resin is poured into the ink passage. After thermal polymerization or irradiation with ultraviolet rays, the plastic film is peeled off.

Incidentally, FIG. 24 is a sectional view corresponding to a section taken along the line P, P'in FIG.

Next, another substrate 1 and the cured photoresist are laminated with the dry film photoresist 9 interposed therebetween. At that time, a silicone resin film is preliminarily laminated on one side of the dry film photoresist 9 at a portion located in the ink pressurizing chamber. Then, after the exposure, in that state, heating is performed at 150 to 200 degrees Celsius for about 10 to 60 minutes to perform thermal polymerization, ultraviolet irradiation, or a combination of these is used for curing.

As described above, after the dry film photoresist 9 is hardened and the joining of the dry film photoresist 9 and the previously hardened film 8H is completed, as shown in FIG. A desired number of the ink pressure ejection generating elements (ink ejection energy generating elements) 10 are arranged. Although not shown, a signal input electrode is connected to the ink ejection generation element 10.

The dicing method usually used in the semiconductor industry is adopted, and the ink ejection ports 11 are cut to be aligned. Then, the cut surface is polished and smoothed, and the ink supply port 1
1 or an ink supply pipe for connecting an ink tank (not shown) to the ink supply port 11 or connecting the ink tank to the ink supply port 11 (not shown). (Not shown) is attached to complete the ink jet head.

In the above embodiment, the photoresist film 2H is used.
Corresponds to the first photosensitive resin member, the photoresist film 4H corresponds to the patterned photosensitive resin member, and the photoresist film 8H corresponds to the second photosensitive resin member.

Although a dry film type, that is, a solid type is used as the photosensitive composition (photoresist) for forming the grooves in the above-mentioned embodiments, the present invention is not limited to this, and the photoresist 2 is used. 4, 8, 9
A liquid photosensitive composition can also be used as the above.

As a method for forming this photosensitive composition on a substrate, in the case of a liquid, a method using a squeegee used when producing a relief image, that is, a wall having the same height as the desired photosensitive composition film pressure is used. It is a method of removing the excess composition by placing it around the substrate and using a squeegee. in this case,
A suitable viscosity of the photosensitive composition is 100 to 300 CPS. Further, the height of the wall placed around the substrate needs to be determined in consideration of the reduction in evaporation of the solvent component of the photosensitive composition.

In addition, a liquid photosensitive resin can be applied and molded as a thin film on a substrate by a high-speed spin coater. On the other hand, in the case of a solid, the photosensitive composition sheet is heated and pressure-bonded onto the substrate to be adhered. There is a method of forming a film.

In the present invention, the method of using a semi-solid dry film type is advantageous in that the handling and the control of the thickness can be performed easily and accurately. Examples of such a semi-solid material include, for example, ALPHO series manufactured by Nippon Synthetic Rubber Co., Ltd., Ozatech Co., Ltd. of Nippon Synthetic Chemical Industry Co., Ltd., Dialon of Mitsubishi Rayon Co., Ltd., Photec of Hitachi Chemical Co., Ltd., Sunfort of Asahi Kasei Co., Ltd., RISTON Bakurel of DuPont Co., Ltd., and Audil of Tokyo Ohka Co., Ltd. There are commercially available photosensitive resins under the trade names such as.

In liquid form, Taiyo Ink PSR series,
There are photosensitive resins that are commercially available under the trade names of Tokyo Ohka Co. PMR series and Toray Photo Nice. In addition to the above, the photosensitive composition used in the present invention includes many photosensitive materials such as photosensitive resins and photoresists used in the field of ordinary photolithography.

The silicone resin usable in the present invention is TSE series, YE series, TUV of Toshiba Silicone Co., Ltd.
Series, Shin-Etsu Silicone KE series, etc.

Examples of these photosensitizers include diazoresin, p-diazoquinone, and photopolymerization type photopolymers using a vinyl monomer and a polymerization initiator.
A dimerization type photopolymer using polyvinyl cinnamate etc. and a sensitizer, a mixture of orthonaphthoquinonediazide and a volatile type phenol resin, a mixture of polyvinyl alcohol and a diazo resin, 4-glycidyl ethylene oxide and benzophenone or glycidical chalcone are copolymerized. Polyether type photopolymer, copolymer of N, N-dimethylmethacrylamide and acrylamide benzophenone, unsaturated polyester photosensitive resin [eg, APR (Asahi Kasei), Tevista (Teijin), Sonne (Kansai Paint), etc. ], Unsaturated urethane oligomer photosensitive resin, photosensitive composition obtained by mixing photopolymerization initiator and polymer in bifunctional acrylic monomer, dichromic acid photoresist, non-chromium water-soluble photoresist, polyvinyl cinnamate System Torejisuto, cyclization Gomuajido based photoresist, and the like.

Examples of these photosensitive materials include diazoresin, p-diazoquinone, and photopolymerization type photopolymers using a vinyl monomer and a polymerization initiator, for example.
A dimerization type photopolymer using polyvinyl cinnamate etc. and a sensitizer, a mixture of orthonaphthoquinonediazide and a volatile type phenol resin, a mixture of polyvinyl alcohol and a diazo resin, 4-glycidyl ethylene oxide and benzophenone or glycidical chalcone are copolymerized. Polyether type photopolymer, copolymer of N, N-dimethylmethacrylamide and acrylamide benzophenone, unsaturated polyester photosensitive resin [eg, APR (Asahi Kasei), Tevista (Teijin), Sonne (Kansai Paint), etc. ], Unsaturated urethane oligomer photosensitive resin, photosensitive composition obtained by mixing photopolymerization initiator and polymer in bifunctional acrylic monomer, dichromic acid photoresist, non-chromium water-soluble photoresist, polyvinyl cinnamate System Torejisuto, cyclization Gomuajido based photoresist, and the like.

[0085]

As described above, the effects of the present invention can be enumerated variously as follows. a. Most of the inner surface of the ink passage is made of the same material and has the same wettability with the ink, and the wall surface of the ink passage is finely roughened, so that the ink refill is fast and stable, and the ink ejection characteristics are stable. It can be improved.

Further, by coating the entire surface of the portion contacting the ink with the silicone resin, the problem of long-term reliability deterioration due to the ink penetrating into the photoresist, which has been a conventional problem, is solved at once. In other words, we were able to propose an ink jet head that can be used permanently regardless of the type of ink.

In particular, according to the present invention, both the first photosensitive resin member and the patterned photosensitive resin member are bonded to each other, and the second photosensitive resin member and the patterned photosensitive member are bonded to each other. It is not limited to the bonding of conductive resins, but the rough surface formed by utilizing the photosensitivity is effectively used as the bonding surface, so that the bonding strength can be significantly improved, which is high. It can be an inkjet head having strength.

B. Since the main process of manufacturing the head is based on the so-called printing technique, it is possible to extremely easily form the head fine portion with a desired pattern. Moreover, a large number of heads having the same structure can be simultaneously processed.

C. Continuous and mass production is possible, and the number of manufacturing processes is relatively small, so the productivity is good.

D. The main constituent members can be easily and reliably aligned, and a head with high dimensional accuracy can be obtained with a high yield.

E. A high density multi-array inkjet head is obtained in a simple manner.

F. Since it is not necessary to use an etching solution (strong acids such as hydrofluoric acid), it is also excellent in safety and hygiene.

G. Since the adhesive is rarely used, the adhesive does not flow to block the groove or adhere to the ink ejection pressure generating element to cause a functional deterioration.

H. Since the ink and the photosensitive resin do not come into direct contact with each other, the elution of the photosensitive resin with the ink can be prevented and the ejection performance does not deteriorate. Further, not only water-based ink but also oil-based ink can be applied.

I. When the gap between the ink ejection port and the ink ejection pressure generating element is determined and the ink ejection port is cut, the processing condition can be easily set because the material forming the ink ejection port is single. Moreover, since the ink ejection ports are formed of the same material, it is easy to obtain flatness of the cut surface after cutting.

J. As revealed in the above example, the ink ejection pressure generating element is covered with the photosensitive resin film outside the site to prevent contact with the ink (because the liquid contact portion is the smallest). It is possible to prevent disconnection due to corrosion of the electric signal input electrode, and improve the reliability of the head.

K. Dense main components of the inkjet head are formed by photolithography, and because this photolithography is performed in a clean room generally used in the semiconductor industry, dust enters inside the ink passage during the assembly of the inkjet head. Can be minimized.

L. According to the method for manufacturing the ink jet head of the present invention, the shape-accurate shape of the main constituent parts on the order of micron can be realized by photolithography regardless of the accuracy of the laminator pressure, speed and temperature when forming the ink passage. Therefore, the improved ink path dimensional accuracy stabilizes the ink flight speed and ink particle size, resulting in a marked improvement in printing quality.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a manufacturing process of the present invention.

FIG. 2 is an explanatory diagram of a manufacturing process of the present invention.

FIG. 3 is an explanatory diagram of a manufacturing process of the present invention.

FIG. 4 is an explanatory diagram of a manufacturing process of the present invention.

FIG. 5 is an explanatory diagram of a manufacturing process of the present invention.

FIG. 6 is an explanatory diagram of a manufacturing process of the present invention.

FIG. 7 is an explanatory view of the manufacturing process of the present invention.

FIG. 8 is an explanatory diagram of a manufacturing process of the present invention.

FIG. 9 is an explanatory view of the manufacturing process of the present invention.

FIG. 10 is an explanatory diagram of the manufacturing process of the present invention.

FIG. 11 is an explanatory diagram of the manufacturing process of the present invention.

FIG. 12 is an explanatory view of the manufacturing process of the present invention.

FIG. 13 is an explanatory diagram of the manufacturing process of the present invention.

FIG. 14 is an explanatory diagram of the manufacturing process of the present invention.

FIG. 15 is an explanatory diagram of the manufacturing process of the present invention.

FIG. 16 is an explanatory diagram of the manufacturing process of the present invention.

FIG. 17 is an explanatory diagram of the manufacturing process of the present invention.

FIG. 18 is an explanatory view of the manufacturing process of the present invention.

FIG. 19 is an explanatory view of the manufacturing process of the present invention.

FIG. 20 is an explanatory diagram of the manufacturing process of the present invention.

FIG. 21 is an explanatory diagram of the manufacturing process of the present invention.

FIG. 22 is an explanatory diagram of the manufacturing process of the present invention.

FIG. 23 is an explanatory diagram of the manufacturing process of the present invention.

FIG. 24 is an explanatory diagram of the manufacturing process of the present invention.

FIG. 25 is an explanatory diagram of the manufacturing process of the present invention.

FIG. 26 is an explanatory diagram of the manufacturing process of the present invention.

FIG. 27 is an explanatory diagram of the manufacturing process of the present invention.

[Explanation of symbols]

1 substrate 1A substrate surface 2, 4, 8, 9 dry film photoresist 2H, 4H, 8H cured dry film photoresist film 3, 5 photomask 3A, 3B, 5P photomask pattern 6A ink pressurization chamber (expansion of ink passage) 6B ink passage 6C dry film island 7 silicone resin 10 ink ejection pressure generating element 11 ink ejection port A, B exposure light of wavelengths A, B

Claims (6)

[Claims] 1. A first photosensitive resin member having a rough surface formed by utilizing photosensitivity, and a second photosensitive resin member having a rough surface formed by utilizing photosensitivity. A pattern-shaped photoconductor for forming an ink passage communicating with an ejection port for ejecting ink such that the rough surfaces of the first photosensitive resin member and the second photosensitive resin member are inside. In an ink jet head, in which a passage for the ink is formed by being joined via a flexible resin member,
A silicone resin is applied and cured on the ink contact portion of the first photosensitive resin member, and a silicone resin is applied and cured on the ink contact portion of the second photosensitive resin member, and the second patterned photosensitive resin is applied. An ink-jet head, characterized in that a silicone resin is applied to an ink passage portion of a member and laminated and joined to form an ink passage. 2. Used for ejecting ink outside a substrate supporting a photosensitive resin forming the ink passage and at a position of an enlarged portion of the ink passage (hereinafter referred to as an ink pressurizing chamber). The ink-jet head according to claim 1, further comprising an energy generating element that generates a certain energy. 3. The ink jet head according to claim 1, wherein the energy generating element is a piezoelectric element. 4. The surface of the patterned photosensitive resin member that forms the ink passage is roughened.
The described inkjet head. 5. A first photosensitive resin member on a substrate having a rough surface formed by utilizing photosensitivity, and an ink communicating with an ejection port for ejecting ink after being laminated on the rough surface. A pattern-shaped second photosensitive resin member having a rough surface formed using photosensitivity for forming a passage, and a rough film formed using photosensitivity after being laminated on the rough surface. An ink jet head in which a third photosensitive resin member having a surface and another substrate are simultaneously laminated on the rough surface via a fourth photosensitive resin member to form an ink passage, Before stacking the patterned second photosensitive resin member,
Before the silicone resin is applied to the ink contact portion of the first photosensitive resin member and the third photosensitive resin member is laminated, the silicone is applied to the ink passage portion of the second patterned photosensitive resin member. An inkjet characterized in that a silicone resin is applied to an ink contact portion of the third photosensitive resin member to form a passage for the ink before the resin is applied and the fourth photosensitive resin member is laminated. Head manufacturing method. 6. The ink jet head according to claim 1, wherein the photosensitive region of the photosensitive resin member has a photosensitive region of two wavelengths or more in a wavelength range from an electron beam to infrared rays.