4/01U1 五、發明說明（1) 1 ·本技藝適用領域 本技*適用於將擴晶單元上的晶片轉換至目標單元之技 藝:包含j晶片之量產包裝提供後續之切割成為顆粒單元 產πα 1光學晶片之線性定位包裝產生線性發光產品或是線 f生义光產、光學晶片顯示板之定位包裝產生面性發光產 ^口，7Γ面性受光產品· · ·等。本技藝所述之晶片，包 含光學晶片以及非光學晶片，皆適用之。光學晶片則包含 舍光晶片如發光二極體（light emitted diode)、雷射二 極體（laser diode)、光二極體（ph〇t〇 di〇de) · · · 專 以及受光晶片如影像感測器（i m a g e s e n s o r) · · · 等0 2·背景說明 習知技藝的機械手臂以兩次上下運動，加上來回擺動，才 月匕元成一個晶片之位置轉換，如圖1至圖4所示，以及另一 實施例圖5 ·所示： 圖1 ·習知技藝—晶圓安置於擴晶膠布上 ,、、、頁示βθ圓1 〇女置在擴晶膠布1 2上，然後，經過精密切割將 晶片11各別分開。 圖2 ·習知技藝—擴晶以後 將圖1之擴晶膠布丨2擴散開來，晶片丨丨即隨之展開。4 / 01U1 V. Description of the invention (1) 1 · Field of application of this technology * This technology is applicable to the technology of converting wafers on the expansion unit to the target unit: mass production packaging containing j wafers provides subsequent cutting to become granular unit production The linear positioning package of πα 1 optical chip produces a linear light emitting product or a linear product, and the positioning packaging of an optical chip display panel generates a planar light emitting product. 7Γ planar light receiving product. The wafers described in this technology include both optical wafers and non-optical wafers. Optical chips include light-emitting diodes such as light-emitting diodes, laser diodes, and light-emitting diodes such as image sensors. Image sensor · · · etc. 0 2 · Background Description The mechanical arm of the conventional technique moves twice up and down and swings back and forth to transform the position of the moon into a wafer, as shown in Figures 1 to 4. Figure 5 shows another example: Figure 1 · Know-how—wafers are placed on crystal expanding tapes, and β-circle 10 is placed on the crystal expanding tapes 12 and then, The precision dicing separates the wafers 11 separately. Figure 2 · Know-how—After crystal expansion, spread the crystal expansion tape 丨 2 of Figure 1 and the wafer 丨 丨 will unfold accordingly.
第4頁 立 發明說明（2) 立 發明說明（2) 圖 片11面 一次垂 擺動機 垂直運 手臂14 桌1 3上 至指定 著感測 置的晶 待被吸 朝上方，安置在機械 直運動吸取位於擴晶 械手臂1 4到目標單元 動將晶片11安置於目 第二次擺動回到原來 ’移動桌1 3依據軟體 之位置。擴晶單元12 裔（圖中未表示）偵測 片11移動到機械手臂 附移轉之。 圖3.習知技藝—晶片轉換頂視 將擴晶以後之擴晶單元丨2以晶 手臂14的下方。機械手臂以第 膠布1 2上面之晶片1 1，第一次 15上方，機械手臂丨4以第二次 標單元15的對應位置上，機械 位置。目標單元15安置於移動 私式攜V目標單元1 5隨時移動 也安置在一個移動單元上，隨 晶片11的位置，將等待轉換位 14的吸盤（圖中未表示）下方等 圖4· 顯示 習知技藝—晶片轉換安置於工作母板 •片11轉換安置完成之工作母板15。 本技藝有鑒於機械 轉動才完成一片晶 技藝構想出：將目 且將擴晶單元上下 直運動便可以完成 手臂14的兩次垂直運 片11的移轉，浪費時 標單元直接安置在擴 反轉，於是，只要機 晶片移轉的動作。 動、外加兩次水平 間頗巨。因此，本 日日單元的下方，並 械手臂1 4 一次的垂 臂系 。將擴 圖5.另一習知技藝-水平移動之機械手臂 圖示為另外一種習知技藝，$是水平移動的機械手 統’移動塊241下方具有—個吸取頭（圖中未表 五、發明說明（3) 方’安置在機械手臂 第一次垂直運動吸取 '塊2 41沿著水平軸2 4 2 動塊2 4 1上的吸取頭 標單元1 5的對應位置 移動回到擴晶單元1 2 ’移動桌1 3依據軟體 之位置。擴晶單元】2 器（圖中未表示）偵測 片11移動到移動塊 ，以後之擴晶單元1 2以晶片11 系統的下方。移動塊241的吸写 ，於擴晶膠布1 2上面之晶片j j 第^次水平動到目標單元】5上 以第二次垂直運動將晶片11安 上私動塊2 41沿著水平軸2 4 2 上方。目標單元15安置於移動 程式攜帶目標單元15隨時移動 也安置在一個移動單元上，隨 晶片11的位置，將等待轉換位 41的下方等待被吸附移轉之 3·本技藝之詳細說明 圖6 ·本技藝實施例一將擴θ :示擴晶單元上下翻：於視圖 應:手二下乂目標單元15則安置心:4式/2定位於 良目軚早7015安置於移動卓 你擴日日早兀12下方對 程式攜帶目標單元15隨時移動至’移動桌13依據軟體 =置在一個移動單元上，隨著感曰：j位置。#晶單元12 曰曰片11的位置，將等待轉 二曰态（圖中未表示）偵測 24的推桿26(圖7)下方等待被推置頂的移曰曰轉片^移動到機械手臂 圖？·本技藝實施例一—晶片轉換 第6頁 五、發明說明（4) 目尸Ϊ^ 24的推桿26將擴晶單元12上的晶片1 1轉換至 的情形。如此便可完成如圖4所示之轉換完 本技%藝實施例二—晶片轉換單元 2 5，： t，701 5可以改為具有黏性材料於表面的轉換單元 ί以單元15上面對應的位置不具有黏性時，則 方式+料於表面的轉換單元25，依據前述圖6的 付定位好的晶片11之後，依據本圖示壓合於工 圖9·本技藝實施例二—加熱 顯示圖8將轉換罝$ 9 ς ^ 程序，晶片11可以〜地工對母板15壓合以後’經過加熱 乂％度地黏者於工作母板i 5上。 t·0'曰#實施例二—分離晶片轉換單元 25不：3穩度地黏著於工作母板15以後，剝離轉換單元 25如此便可完成如圖4所示之轉換完成之結果換早疋- 圖11 ·本技藝實施例三有一 顯示晶片轉換板可以是m::轉換早兀 構成者。 ^^^#附著於黏纟薄膜上面所 圖12· 本技藝實施例四—機械手臂另一設計Page 4 Description of the invention (2) Description of the invention (2) Picture 11 side vertical swing machine vertical transport arm 14 table 1 3 to the designated sensor to be sucked upwards, placed in a mechanical straight movement suction Located at the crystal expander arm 14 to the target unit, move the wafer 11 to the second position to swing back to the original 'mobile table 1 3 according to the position of the software. The crystal expansion unit 12 (not shown in the figure) detection piece 11 moves to the robot arm and moves it. Figure 3. Know-how—Top View of Wafer Conversion The crystal expansion unit 丨 2 is crystallized under the arm 14. The robotic arm takes the wafer 1 1 above the first adhesive tape 12 and above the first time 15 and the robotic arm 4 takes the mechanical position corresponding to the second position of the unit 15. The target unit 15 is placed on the mobile private V-target unit 15. It is also moved on a mobile unit at any time. Depending on the position of the wafer 11, the suction cup (not shown in the figure) waiting for the conversion bit 14 is waiting. Know-how—wafer conversion is placed on the working mother board • Sheet 11 is converted and placed on the working mother board 15. In this technique, a piece of crystal technology is completed in view of the mechanical rotation. The objective is to move the crystal expansion unit straight up and down to complete the two vertical movements of the arm 14. The waste time stamping unit is directly placed in the expansion and inversion. So, as long as the movement of the machine chip. The movement and the two levels are quite large. Therefore, below the unit of the day, the vertical arm system of the robot arm 1 4 is used. Expand Figure 5. Another conventional technique-the horizontal movement of the mechanical arm is shown as another conventional technique. $ Is the horizontal movement of the robotic system. 'Moving block 241 has a suction head (not shown in the figure. Description of the invention (3) Fang 'placed on the first vertical movement of the robotic arm to suck' block 2 41 moves along the horizontal axis 2 4 2 on the moving block 2 4 1 to the corresponding position of the suction head unit 15 back to the crystal expansion unit 1 2 'Mobile table 1 3 According to the position of the software. Crystal expansion unit] 2 (not shown in the figure) The detection piece 11 moves to the moving block, and the subsequent crystal expansion unit 1 2 is under the chip 11 system. Moving block 241 The second step of moving the wafer jj on the expansion tape 1 2 horizontally to the target unit] 5 is to mount the wafer 11 on the moving block 2 41 along the horizontal axis 2 4 2 with the second vertical movement. The target unit 15 is placed on the mobile program. The target unit 15 is moved at any time and is also placed on a mobile unit. Depending on the position of the wafer 11, it will wait for the transfer position 41 to wait for the transfer. 3 · Detailed description of this technique Figure 6 · The first embodiment of this technology will expand θ: Turning down: in the view should be: the second and the next target unit 15 placement heart: 4 type / 2 positioning in Liangmu 軚 early 7015 placed on the mobile Zhuoyou expansion day and early morning 12 to the program to carry the target unit 15 at any time to 'Mobile table 13 is placed on a mobile unit according to software =, with the following position: j position. # 晶 Unit 12 The position of the film 11 will wait for the second state (not shown in the figure) to detect the push of 24. Below the lever 26 (Fig. 7) waiting to be pushed to the top, the moving piece ^ moved to the robotic arm?? The first embodiment of this technology-wafer conversion page 6 V. Description of the invention (4) The push of the corpse ^ 24 The situation in which the rod 26 converts the wafer 1 1 on the crystal expansion unit 12 to this. In this way, the conversion shown in FIG. 4 can be completed. The second embodiment of the present technology-the wafer conversion unit 25, t, 7015 can be changed. For a conversion unit with a sticky material on the surface, if the corresponding position on the unit 15 is not sticky, then the conversion unit 25 that is on the surface is added, and after the wafer 11 is positioned according to the foregoing FIG. 6, The figure is pressed on the working figure 9 · The second embodiment of this technique—heating display Figure 8 will convert 罝 $ 9 ^ In order, the wafer 11 can be bonded to the mother board 15 by geotechnical bonding. After being heated, the wafer 11 can be adhered to the working mother board i 5. The second embodiment is separated wafer conversion unit 25: 3 After it is firmly adhered to the working mother board 15, the conversion unit 25 is peeled off so that the conversion result shown in Fig. 4 can be completed. Change early-Figure 11 · A third embodiment of the present technology has a display chip conversion board that can be m: : Transform the predator. ^^^ # Attached to the adhesive film Figure 12 · Example 4 of this technique—another design of the robot arm
476101 五、發明說明（5) 顯示本技藝的機械手臂34也可以設計為體積較 桿。 、乂 S 1推 圖1 3·本技藝實施例五—有凹槽之晶片轉換單元 J示本技藝的轉換單元45，t可以設計成為具有 。凹槽46為依據母板之各單元位置之對應位置= 具有凹槽46的轉換單元45安置於擴晶單元12下方拉。 下之晶片41。 ’接收落 = 14·本技藝實施例五-母板覆蓋於有凹槽的轉 ^示具有凹槽的轉換單元45，在接收晶片早^上 作母板15之對應位置覆蓋在具有凹單: H ί實施例五—翻轉定位晶片於母板上 ‘ ^將圖1 4的7C件組合整個翻轉， ^的指以立置κ乍母板15的 二作母板 锡材料，然後，將整個元件植人：：置事先已經塗佈有銲 便：以將到位的晶片定位於指定的位二：=解 , 由於光學晶片是只有兩支腳或是少數腳ί:位 的表面張力等自動對位效果，：經==;解以後 476101 五 〆發明說明（6) '—"' -—--- = ?實施例來間述，㈣佳實施例僅是 ^範圍於二Ϊ:之精？：在，並非用於限制本技藝之 用下述權利請；：：， 知此一相關技藝之人士，採 或是些微的改變】藝、：是採用其均等技藝、 範圍之所在，；炎π正=方法，仍μ不脫離本技藝之權利 亦為本案權利人所欲保護之權利範圍。 •圖式的簡單說明 圖1 圖2 圖3 圖4 圖5 習知技藝 習知技藝 習知技藝 習知技藝 另一習知 〜晶圓安置於擴晶膠布上 〜擴晶以後 〜晶片轉換—頂視圖 〜晶片轉換安置於工作母板 技藝—水平移動之機械手臂 圖 圖 圖 圖 圖 圖 本技藝督# ^ 7·本技藝實二：一-將擴晶單元反轉-頂視圖 本技藝實！' 一-晶片轉換安置於工作母板 本技藝；：：二-晶片轉換單元 ίο.本技藝476101 V. Description of the invention (5) The robot arm 34 showing the technique can also be designed to have a relatively large volume.乂 S 1 push Figure 1 3 · Fifth embodiment of the technology—notched wafer conversion unit J shows the conversion unit 45, t of this technology can be designed to have. The groove 46 is a corresponding position according to the position of each unit of the mother board = the conversion unit 45 having the groove 46 is disposed below the crystal expansion unit 12 and pulled.下 的 片 41。 The next wafer 41. 'Receiving drop = 14 · Embodiment 5 of this technology-the mother board is covered with a grooved conversion unit ^ shows a conversion unit 45 with a groove, and the corresponding position of the mother board 15 on the receiving wafer is covered with a concave unit: H. Example 5—Flip and position the wafer on the mother board. ^ The 7C pieces in Figure 1 4 are assembled and flipped together. Planting :: Placed with solder joints in advance: to position the wafer in place at the specified position 2: = Solution, because the optical wafer has only two or a few feet, the surface tension and other automatic alignment Effect: 476101 After the solution = 476101 Five 〆 invention description (6) '— "'-----=? The examples are described in brief, the best embodiment is only ^ in the scope of Ϊ: the essence? : Now, it is not used to limit the use of this technique. The following rights please; ::, those who know the relevant technique, adopt or change it slightly] art,: is to use their equivalent skills, the scope, Positive = method, the right that does not depart from this technique is also the scope of rights that the right holder wants to protect. • Simplified illustration of the drawing Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Another know-how Know-how Know-how Know-how Know-how Know-how Another skill ~ Wafer is placed on the crystal expansion tape ~ After crystal expansion ~ Wafer conversion-top View ~ Wafer conversion is placed on the working mother board technology—horizontal moving robot arm diagram diagram diagram diagram diagram this technique supervisor # ^ 7 · this technique practice two: one-reverse the crystal expansion unit-top view this technique practice! '' One-wafer conversion is placed on the working mother board. This technology; :: Two-wafer conversion unit. Ίο. This technology
u.本技蓺/例二—分離晶片轉換單元 本技真貫施例三_有孔之晶片轉換單元 476101 五、發明說明（7) 圖12. 本技藝實施例四_機械手臂另一設計 圖1 3. 本技藝實施例五_有凹槽之晶片轉換單元 圖1 4.本技藝實施例五_母板覆蓋於有凹槽的轉換單元上 圖1 5. 本技藝實施例五_翻轉定位晶片於母板上 5.元件編號表 晶圓1 0 晶片11， 41 擴晶膠布1 2 X - Y移動桌1 3 機械手臂14，24，34 工作母板1 5 移動頭2 4 1 水平滑動軸2 4 2 轉換單元25 有孔基材3 5 孔36 黏性薄膜37 凹槽基材4 5 凹槽4 6u. This technique / Example 2—Separate wafer conversion unit The third embodiment of this technology is true _Perforated wafer conversion unit 476101 V. Description of the invention (7) Figure 12. Example 4 of this technology _ Another design drawing of a robotic arm 1 3. The fifth embodiment of the technology _ grooved wafer conversion unit Figure 1 4. The fifth embodiment of the technology _ mother board covers the grooved conversion unit Figure 1 5. The fifth embodiment of the technology _ flip positioning wafer On the motherboard 5. Component number table Wafer 1 0 Wafer 11, 41 Expander tape 1 2 X-Y mobile table 1 3 Robotic arm 14, 24, 34 Working mother board 1 5 Moving head 2 4 1 Horizontal sliding shaft 2 4 2 Conversion unit 25 Perforated substrate 3 5 Hole 36 Adhesive film 37 Groove substrate 4 5 Groove 4 6
第10頁Page 10