TW471743U - Electrical connector - Google Patents
Electrical connectorInfo
- Publication number
- TW471743U TW471743U TW089214756U TW89214756U TW471743U TW 471743 U TW471743 U TW 471743U TW 089214756 U TW089214756 U TW 089214756U TW 89214756 U TW89214756 U TW 89214756U TW 471743 U TW471743 U TW 471743U
- Authority
- TW
- Taiwan
- Prior art keywords
- electrical connector
- connector
- electrical
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connecting Device With Holders (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW089214756U TW471743U (en) | 2000-08-25 | 2000-08-25 | Electrical connector |
US09/934,893 US6494725B2 (en) | 2000-08-25 | 2001-08-22 | Electrical connector |
JP2001304203A JP3541828B2 (ja) | 2000-08-25 | 2001-08-24 | 電気コネクタ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW089214756U TW471743U (en) | 2000-08-25 | 2000-08-25 | Electrical connector |
Publications (1)
Publication Number | Publication Date |
---|---|
TW471743U true TW471743U (en) | 2002-01-01 |
Family
ID=21672000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW089214756U TW471743U (en) | 2000-08-25 | 2000-08-25 | Electrical connector |
Country Status (3)
Country | Link |
---|---|
US (1) | US6494725B2 (zh) |
JP (1) | JP3541828B2 (zh) |
TW (1) | TW471743U (zh) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6851954B2 (en) * | 2002-07-30 | 2005-02-08 | Avx Corporation | Electrical connectors and electrical components |
US6928727B2 (en) * | 2002-07-30 | 2005-08-16 | Avx Corporation | Apparatus and method for making electrical connectors |
US6860741B2 (en) * | 2002-07-30 | 2005-03-01 | Avx Corporation | Apparatus and methods for retaining and placing electrical components |
US20040102066A1 (en) * | 2002-11-21 | 2004-05-27 | Fci Americas Technology, Inc. | Electrical connector with deflectable contacts and fusible elements |
US7029292B2 (en) * | 2003-12-16 | 2006-04-18 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector and contact |
US6979238B1 (en) * | 2004-06-28 | 2005-12-27 | Samtec, Inc. | Connector having improved contacts with fusible members |
US7731507B1 (en) * | 2006-03-17 | 2010-06-08 | Lotes Co., Ltd. | Electric connector |
US8955215B2 (en) | 2009-05-28 | 2015-02-17 | Hsio Technologies, Llc | High performance surface mount electrical interconnect |
WO2014011232A1 (en) | 2012-07-12 | 2014-01-16 | Hsio Technologies, Llc | Semiconductor socket with direct selective metalization |
WO2010147939A1 (en) * | 2009-06-17 | 2010-12-23 | Hsio Technologies, Llc | Semiconductor socket |
US9603249B2 (en) | 2009-06-02 | 2017-03-21 | Hsio Technologies, Llc | Direct metalization of electrical circuit structures |
US9184527B2 (en) | 2009-06-02 | 2015-11-10 | Hsio Technologies, Llc | Electrical connector insulator housing |
US9277654B2 (en) | 2009-06-02 | 2016-03-01 | Hsio Technologies, Llc | Composite polymer-metal electrical contacts |
WO2014011226A1 (en) | 2012-07-10 | 2014-01-16 | Hsio Technologies, Llc | Hybrid printed circuit assembly with low density main core and embedded high density circuit regions |
US9276339B2 (en) | 2009-06-02 | 2016-03-01 | Hsio Technologies, Llc | Electrical interconnect IC device socket |
WO2012078493A1 (en) | 2010-12-06 | 2012-06-14 | Hsio Technologies, Llc | Electrical interconnect ic device socket |
US9093767B2 (en) | 2009-06-02 | 2015-07-28 | Hsio Technologies, Llc | High performance surface mount electrical interconnect |
US9930775B2 (en) | 2009-06-02 | 2018-03-27 | Hsio Technologies, Llc | Copper pillar full metal via electrical circuit structure |
US9232654B2 (en) | 2009-06-02 | 2016-01-05 | Hsio Technologies, Llc | High performance electrical circuit structure |
US9613841B2 (en) | 2009-06-02 | 2017-04-04 | Hsio Technologies, Llc | Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection |
US9318862B2 (en) | 2009-06-02 | 2016-04-19 | Hsio Technologies, Llc | Method of making an electronic interconnect |
US9414500B2 (en) | 2009-06-02 | 2016-08-09 | Hsio Technologies, Llc | Compliant printed flexible circuit |
US9689897B2 (en) | 2010-06-03 | 2017-06-27 | Hsio Technologies, Llc | Performance enhanced semiconductor socket |
US10159154B2 (en) | 2010-06-03 | 2018-12-18 | Hsio Technologies, Llc | Fusion bonded liquid crystal polymer circuit structure |
US9350093B2 (en) | 2010-06-03 | 2016-05-24 | Hsio Technologies, Llc | Selective metalization of electrical connector or socket housing |
JP2012018892A (ja) * | 2010-07-09 | 2012-01-26 | Tyco Electronics Japan Kk | 電気部品 |
US9761520B2 (en) | 2012-07-10 | 2017-09-12 | Hsio Technologies, Llc | Method of making an electrical connector having electrodeposited terminals |
US8939778B2 (en) * | 2013-01-10 | 2015-01-27 | Hon Hai Precision Industry Co., Ltd. | Electrcial socket with LGA type coil contacts for IC package |
US10667410B2 (en) | 2013-07-11 | 2020-05-26 | Hsio Technologies, Llc | Method of making a fusion bonded circuit structure |
US10506722B2 (en) | 2013-07-11 | 2019-12-10 | Hsio Technologies, Llc | Fusion bonded liquid crystal polymer electrical circuit structure |
US9755335B2 (en) | 2015-03-18 | 2017-09-05 | Hsio Technologies, Llc | Low profile electrical interconnect with fusion bonded contact retention and solder wick reduction |
CN108075279B (zh) * | 2016-11-11 | 2024-01-05 | 上海莫仕连接器有限公司 | 一种电连接器 |
US10506140B2 (en) * | 2018-04-16 | 2019-12-10 | Samsung Electro-Mechanics Co., Ltd. | Camera module and method of manufacturing the same |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4004845A (en) * | 1975-04-17 | 1977-01-25 | Elco Corporation | High density electrical connector employing male blade with offset portions |
US6024584A (en) | 1996-10-10 | 2000-02-15 | Berg Technology, Inc. | High density connector |
US6016254A (en) | 1996-07-15 | 2000-01-18 | Pfaff; Wayne K. | Mounting apparatus for grid array packages |
US6139336A (en) | 1996-11-14 | 2000-10-31 | Berg Technology, Inc. | High density connector having a ball type of contact surface |
TW395604U (en) * | 1998-12-18 | 2000-06-21 | Hon Hai Prec Ind Co Ltd | Electrical connector |
TW388572U (en) | 1998-12-22 | 2000-04-21 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US6217348B1 (en) | 1999-08-09 | 2001-04-17 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector |
US6210198B1 (en) | 1999-11-24 | 2001-04-03 | Hon Hai Precision Ind. Co., Ltd. | Zero insertion force socket |
-
2000
- 2000-08-25 TW TW089214756U patent/TW471743U/zh not_active IP Right Cessation
-
2001
- 2001-08-22 US US09/934,893 patent/US6494725B2/en not_active Expired - Fee Related
- 2001-08-24 JP JP2001304203A patent/JP3541828B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2002164102A (ja) | 2002-06-07 |
JP3541828B2 (ja) | 2004-07-14 |
US6494725B2 (en) | 2002-12-17 |
US20020045368A1 (en) | 2002-04-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MM4K | Annulment or lapse of a utility model due to non-payment of fees |