470786 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（1 ) 本發明係關於一種電鍍裝置，尤關於一種在要電鍍的 基板（例如印刷電路板）上金屬均勻分布的改良。 美國第4，8 7 9，0 0 7號專利揭示一種在電解槽 中使用之浮動屏蔽。該屏蔽包括一細長槽，其中放置電鍍 用之基板，基板被握持在槽中的垂直平面，基板之下緣是 在槽上緣平面之下。一對陽極浸入槽中，每一個與之延伸 方向浮動屏蔽縱軸平行裝在槽中的基板以一個或多個夾子 連接到一條陰極母線。在操作時，電流經由槽中電解液而 過陽極和陰極母線，因而將基板電鍍。 當一電鍍工廠向一製造者定購一電鍍裝置時，必須陳 明要由裝置電鍍之基板的 '' 板尺寸〃。在此方面， '' 板尺 寸〃意指當基板被握持在一垂直平面時之基板垂直長度。 在相關領域中實際上通常係安排成浮動屏蔽在槽中之深度 使得基板頂緣與槽之頂緣爲一固定距離。之後，製造者將 安排槽之維度，陽極以及細長槽在槽中之深度，以得到滿 意均勻電鍍結果。實際上發現若板尺寸比''設計〃之板尺 寸小之基板在槽中被電鍍，基板下緣將 ''過度電鍍〃，此 被稱爲 邊緣效應〃，其係指澱積在基板下緣或附近之金 屬比澱積在基板上其餘部分還厚。 在每次電鍍時改變陽極有可能降低"邊緣效應〃，因 爲在一次電鍍中也許需要超過4 0個陽極，而且陽極很苯 重，因此更換陽極很困難也不實際。 因此本發明目的之一在於提供一種改良式電鍍裝置， 其可克服上述缺點或至少提供交易之有效替代品。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -4 _ I 1 m In km ^^^1 0 >^—^1 nn m m t— . 、-e (請先閱讀背面之注意事項再填寫本頁) 470786 A7 B7 五、發明説明（2 ) (請先閲讀背面之注意事項再填寫本頁) 依據本發明其提供了 一種電鍍至少一基板之裝置，其 包括支撑裝置、陽極裝置、至少一容器以及阻斷裝置，其 中支撑裝置支撑基板而且與基板呈導電關係。容器容納陽 @裝置、支撑裝置和電解液。在操作時，在電解液中支撑 裝置與陽極裝置之間存在一電場，該阻斷裝置能移動以改 變通過支撑裝置和陽極裝置之間的電流大小。 有利之點爲阻斷裝置可由支撑裝置移動。阻斷裝置可 便利地移動而改變通過支撑裝置和陽極裝置之間的電流大 小。阻斷裝置可適當地包括二片狀構件，二片狀構件可彼 Jt匕移動。阻斷裝置可由電絕緣材料構成，電絕緣材料可爲 聚四氟乙烯。阻斷裝置也可爲彈性也可爲水平方向。在操 作時’基板可適當地與一陰極裝置呈電導通關係，藉此陽 極裝置和陰極裝置呈電導通關係。 以下舉例並配合所附圖式說明本發明，其中： 經濟部智慧財產局員工消費合作社印製 如圖1中所示，依據本發明之電鍍裝置係以標號1 0 標示。電鍍裝置1 〇包括承裝電解液（爲圖式淸晰之故並未 示出）之槽1 2。槽1 2之上緣1 4垂掛二排陽極1 6，圖 中僅示出其中二者。槽1 2中另有一槽1 8，其可下降到 槽1 2中或從槽1 2中升高。槽1 8包括數片容納板2 0 ’圖中僅示出一個。每個容納板2 0包括一 V形缺口來容 納要電鍍的基板2 4 (例如印刷電路板）之下緣2 2，使基板 24被握持在垂直面。在圖1中，基板2 4之垂直長度爲 1 8英吋。槽1 8兩側爲電絕緣聚丙烯膜片2 6，其細部 見圖2，稍後再述。每片聚丙烯膜片2 6附接了一片延伸 本紙張尺度適用中.國國家標準（CNS )八4規格（210X297公釐） ^786 ^786 經濟部智慧財產局員工消费合作社印製 A7 B7 五、發明説明（3 ) 橫過槽1 2長度方向之電絕緣聚四氟乙烯片2 8，其在槽 1 2中爲水平設置，且厚度約爲〇 . 5 m m。 槽1 8包括二側板3 0，當垂直長度爲1 8英吋之基 板2 4裝入容納板2 0時，側板 3 0恰接觸且靠在聚四氟 乙烯片2 8之上表面。 請參閱圖2，其中所示之聚丙烯膜片2 6包括一個外 部不透水電絕緣聚丙烯架體32·一塊電絕緣聚丙烯網狀 材料製成之穿孔布3 4橫跨內部開放空間。在此圖中僅有 部分布3 4區域畫有穿孔（五個圓形區域），以求淸晰，然而 請了解整塊布3 4均穿孔。在此種安排下，電場可跨過穿 孔布3 4而存在，但電場不能跨過聚丙烯架體3 2。聚丙 烯膜片2 6有效地將槽1 2分成一個中央、、陰極室〃和兩 個外部、、陽極室〃。穿孔布3 4中之孔的大小可防止粒子（ 例如陽極污垢）進入中央、、陽極室〃，讓電解液能自由流動 〇 如圖1中所示，雖然電場（以虛線表示）可跨過聚丙烯膜 片2 6存在，但電流不能從槽1 8底部3 6下方通過，因 爲受到聚四氟乙烯片28及/或聚丙烯架體32之阻斷。 由於到達基板2 4下端之電流量減少，在該區澱積之金屬 較少，因而降低"邊緣效應〃。 請參閱圖3，其中示出依據本發明之相同電鑛裝置 1 0，但槽1 8之容納板2 0所容納之基板2 4的垂直直 長度2 1英吋。在此可看出一部分電流可通過陽極1 6和 基板2 4下部之間，部分電流則被聚丙烯膜片2 6之不透 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -_ - 1- - --- _ I - - - II < - _ - - (請先閱讀背面之注意事項再填寫本頁) 470786 經濟部智慧財產局S工消費合作社印製 A7 _____B7 _五、發明説明U ) 水電絕緣聚丙烯架體3 2阻斷。當槽1 8下降到槽1 2中 時，側板3 0使聚四氟乙烯片2 8彼此遠離。由於其彈性 ’當槽1 8從槽1 2中上升，聚四氟乙烯片2 8將回復到 圖1中之位置。如圖3中所示，側板3 0係與聚四氟乙烯 片2 8接觸，所以在側板3 0與聚四氟乙烯片2 8之間沒 有可讓電流通過之間隙。然而，與圖1做比較，在陽極 1 6和基板2 4下部之間有較多電量通過。 請參閱圖4，其亦示出依據本發明之相同電鍍裝置 1 0，但槽1 8之容納板2 0所容納之基板2 4的垂直長 度爲24英吋。槽18較靠近槽12底部。當槽18更朝 1 2底部下降，槽1 8的兩排指狀物3 8 (圖中僅示出兩個 以求淸晰）將聚四氟乙烯片2 8更推離對方，使得側板3 0 和聚四氟乙烯片2 8之間有間隙。由圖4中可淸楚看到更 多電流可通過陽極1 6和槽1 8之底部3 6。 綜上所述，依據本發明之電鍍裝置性能多且可彈性變 化，而且 可對大範圍板尺寸提供滿意的基板電鍍性能。 然而，請了解以上僅介紹可實施本發明之實施例，在 不偏離本發明之精神下仍可有修改和改變。 圖1爲本發明電鍍裝置槪示圖’其中槽中裝有一片垂 直長度爲18英吋之基板。 圖2爲本發明使用之聚丙烯膜片側視圖。 圖3爲圖1中電鍍裝置槪示圖’其中槽中裝有一片垂 直長度爲21英吋之基板。 圖4爲1中電鍍裝置槪示圖’其中槽中裝有一片垂直 本紙張尺度適用中國國家標準（CNS ) A4規格<2丨〇 X 297公釐） -7 - —II HI 1^11 ml HI m —^1· 1'J 穿 · 、-· (請先閲讀背面之注意事項再填寫本頁) 470786 A7 B7 五、發明説明（5 ) 長度爲2 4英吋之基板。 符號說明 12 .........槽 14 .........上緣 16 .........陽極 18 .........槽 2〇.........容納板 2 2 .........下緣 2 4 .........基板 2 6………聚丙烯膜片 2 8 .........聚四氟乙烯片 3 0 .........側板 3 2 .........聚丙烯架體 3 4 .........布 3 6 .........底部 3 8 .........指狀物 (請先閱讀背面之注意事項再填寫本頁) 袈- 訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） _ 8 _470786 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the Invention (1) The present invention relates to an electroplating device, and in particular to an improvement in the uniform distribution of metal on a substrate (such as a printed circuit board) to be electroplated. U.S. Patent No. 4,8,79,007 discloses a floating shield for use in an electrolytic cell. The shield includes an elongated slot in which a substrate for electroplating is placed, the substrate is held in a vertical plane in the slot, and the lower edge of the substrate is below the upper edge plane of the slot. A pair of anodes are immersed in the tank, and each of the substrates installed in the tank parallel to the longitudinal axis of the floating shield is connected to a cathode bus bar with one or more clips. In operation, a current is passed through the anode and cathode bus bars via the electrolyte in the tank, thereby electroplating the substrate. When an electroplating plant orders an electroplating device from a manufacturer, it is necessary to state the "plate size" of the substrate to be electroplated by the device. In this regard, '' board size '' means the vertical length of the substrate when the substrate is held in a vertical plane. In the related field, the depth of the floating shield in the groove is usually arranged so that the top edge of the substrate is at a fixed distance from the top edge of the groove. After that, the manufacturer will arrange the dimensions of the grooves, the depth of the anode and the elongated grooves in the grooves to obtain a satisfactory uniform plating result. In fact, it was found that if a substrate with a smaller board size than the `` design '' board is plated in the groove, the lower edge of the board will be `` over-plated ''. This is called edge effect. It refers to the deposition on the lower edge of the substrate. Or nearby metal is thicker than the rest deposited on the substrate. Changing the anode during each electroplating may reduce " edge effect " because more than 40 anodes may be needed in a single electroplating, and the anode is very benzene heavy, making it difficult and impractical to replace the anode. It is therefore an object of the present invention to provide an improved electroplating device which can overcome the above disadvantages or at least provide an effective alternative to the transaction. This paper size applies to China National Standard (CNS) A4 (210X297 mm) -4 _ I 1 m In km ^^^ 1 0 > ^ — ^ 1 nn mmt—., -E (Please read the note on the back first Please fill in this page again for matters) 470786 A7 B7 V. Description of the invention (2) (Please read the precautions on the back before filling this page) According to the present invention, it provides a device for electroplating at least one substrate, which includes a support device and an anode device , At least one container and a blocking device, wherein the supporting device supports the substrate and is in a conductive relationship with the substrate. The container holds the anode device, the support device, and the electrolyte. In operation, an electric field exists between the supporting device and the anode device in the electrolyte, and the blocking device can be moved to change the amount of current passing between the supporting device and the anode device. The advantage is that the blocking device can be moved by the support device. The blocking device can be easily moved to change the amount of current passing between the support device and the anode device. The blocking device may suitably include a two-piece member, and the two-piece member may be moved with each other. The blocking device may be composed of an electrically insulating material, which may be polytetrafluoroethylene. The blocking device may be elastic or horizontal. During operation, the substrate may be in an electrically conducting relationship with a cathode device, whereby the anode and the cathode device are in an electrically conducting relationship. The following describes the invention by way of example and in conjunction with the accompanying drawings, wherein: Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs As shown in FIG. 1, the electroplating device according to the invention is designated by reference numeral 10. The plating device 10 includes a bath 12 for holding an electrolyte (not shown for clarity). The upper edge 14 of the tank 12 hangs two rows of anodes 16 and only two of them are shown in the figure. There is another slot 18 in slot 12, which can be lowered into or raised from slot 12. The slot 18 includes several receiving plates 2 0 ', and only one is shown in the figure. Each receiving board 20 includes a V-shaped notch to receive the lower edge 22 of the substrate 24 (such as a printed circuit board) to be plated, so that the substrate 24 is held on a vertical plane. In FIG. 1, the vertical length of the substrate 24 is 18 inches. The two sides of the slot 18 are electrically insulating polypropylene membranes 26, the details of which are shown in Fig. 2, which will be described later. Each piece of polypropylene film 2 6 is attached to a piece of paper which is extended in size. The national standard (CNS) 8 4 specifications (210X297 mm) ^ 786 ^ 786 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Cooperatives A7 B7 5 5. Description of the invention (3) An electrically insulating polytetrafluoroethylene sheet 28 across the length of the groove 12 is arranged horizontally in the groove 12 and has a thickness of about 0.5 mm. The slot 18 includes two side plates 30. When the base plate 24 having a vertical length of 18 inches is loaded into the receiving plate 20, the side plate 30 is just in contact with and rests on the surface of the Teflon sheet 28. Please refer to Fig. 2. The polypropylene diaphragm 26 shown therein includes an external water-proof electrical insulating polypropylene frame body 32. A perforated cloth 3 4 made of an electrically insulating polypropylene mesh material spans the open interior space. In this figure, only a part of the cloth 3 4 area is perforated (five circular areas) for clarity, but please understand that the entire cloth 3 4 is perforated. Under this arrangement, the electric field can exist across the perforated cloth 34, but the electric field cannot cross the polypropylene frame 32. The polypropylene diaphragm 26 effectively divides the tank 12 into a central, cathode chamber 〃 and two outer, anode chamber 〃. The size of the holes in the perforated cloth 34 can prevent particles (such as anode dirt) from entering the central and anode chambers, allowing the electrolyte to flow freely. As shown in Figure 1, although the electric field (indicated by the dotted line) can cross the polymer Acrylic diaphragms 26 exist, but current cannot pass through the bottom of the grooves 18 and 36, because they are blocked by the polytetrafluoroethylene sheet 28 and / or the polypropylene frame 32. Since the amount of current reaching the lower end of the substrate 24 is reduced, less metal is deposited in this area, thereby reducing the "edge effect". Please refer to FIG. 3, which shows the same electric mining device 10 according to the present invention, but the vertical length of the substrate 24 held by the receiving plate 20 of the slot 18 is 21 inches. It can be seen here that part of the current can pass between the anode 16 and the lower part of the substrate 24, and part of the current is impervious by the polypropylene membrane 26. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -_-1----- _ I---II <-_--(Please read the precautions on the back before filling out this page) 470786 Printed by the S Industrial Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _____B7 _5 2. Description of the invention U) Hydroelectric insulation polypropylene frame 32 is blocked. When the groove 18 is lowered into the groove 12, the side plate 30 keeps the PTFE sheets 28 away from each other. Due to its elasticity, when the slot 18 rises from the slot 12, the PTFE sheet 28 will return to the position shown in FIG. As shown in FIG. 3, the side plate 30 is in contact with the polytetrafluoroethylene sheet 28, so there is no gap between the side plate 30 and the polytetrafluoroethylene sheet 28 to allow current to pass through. However, in comparison with FIG. 1, there is more electricity passing between the anode 16 and the lower portion of the substrate 24. Please refer to FIG. 4, which also shows the same plating device 10 according to the present invention, but the vertical length of the substrate 24 held by the receiving plate 20 of the slot 18 is 24 inches. The groove 18 is closer to the bottom of the groove 12. When the groove 18 descends further toward the bottom of the 1 2, the two rows of fingers 3 8 of the groove 18 (only two are shown in the figure for clarity) push the Teflon sheet 2 8 away from each other, so that the side plate 3 There is a gap between 0 and the Teflon sheet 2 8. It can be clearly seen in Figure 4 that more current can pass through the anode 16 and the bottom 36 of the slot 18. In summary, the electroplating device according to the present invention has many properties and can be elastically changed, and can provide satisfactory substrate electroplating performance for a wide range of board sizes. However, please understand that the above only describes the embodiments in which the present invention can be implemented, and modifications and changes can be made without departing from the spirit of the present invention. Fig. 1 is a schematic view of a plating apparatus according to the present invention, in which a groove is mounted with a substrate having a vertical length of 18 inches. Figure 2 is a side view of a polypropylene membrane used in the present invention. Fig. 3 is a schematic view of the electroplating apparatus in Fig. 1 ', in which a groove is mounted with a substrate having a vertical length of 21 inches. Fig. 4 is a diagram of a plating device in 1 'wherein a slot is provided with a vertical sheet of paper. The dimensions of the paper are applicable to Chinese National Standard (CNS) A4 specifications < 2 丨 〇X 297 mm) -7-—II HI 1 ^ 11 ml HI m — ^ 1 · 1'J Wear ·,-· (Please read the precautions on the back before filling this page) 470786 A7 B7 V. Description of the invention (5) The substrate is 24 inches in length. Explanation of symbols 12 ......... Slot 14 ......... Upper edge 16 ......... Anode 18 ......... Slot 20. ........ accommodating plate 2 2 ......... low edge 2 4 ......... substrate 2 6 ......... polypropylene diaphragm 2 8 .... ..... Teflon sheet 3 0 ......... Side plate 3 2 ......... Polypropylene frame 3 4 ......... Cloth 3 6 ......... Bottom 3 8 ......... Fingers (Please read the notes on the back before filling this page) The paper size of the paper is applicable to China National Standard (CNS) A4 (210 X 297 mm) _ 8 _