517100 A7 B7 五、發明説明（1 ) 本發明之領域： (請先閲讀背面之注意事項再填寫本頁) 本發明係關於一種電鍍裝置，而尤其與在即將被電鍍 之基板’例如印刷電路板上之金屬的均勻分佈方面具有改 善這樣的一種裝置有關。 習知技術之說明： 美國專利第4，8 7 9，0 0 7揭示一種使用於電解 槽中之浮動屏蔽，該屏蔽包括一伸長之溝槽，其中裝載被 用來電鑛之基板。該基板被垂直地支承於溝槽中，並且該 基板之下緣在溝槽之上緣的平面之下，一對陽極浸入電解 槽中，每一個陽極平行於浮動屏蔽之縱軸延伸，在溝槽中 所裝載之基板藉由一個或多個夾鉗而被連接至陰極匯流條 。在操作時，電流經由電解槽中的電解液通過陽極與陰極 匯流條之間，而藉以電鍍該基板。 經濟部智慧財產局員工消費合作社印製 當電鍍工廠向製造商訂購電鍍裝置時，必須指定意欲 被此裝置所電鍍之基板的“板子大小”，關於這一點，“ 板子大小”意謂基板的垂直長度，當其被支承於垂直平面 之時。在相關的領域中，如此配置在基板之頂緣離電解槽 之頂緣一段固定的距離之該電解槽中之浮動屏蔽的深度係 一種平常的實行，製造商然後將安排該電解槽之尺寸、陽 極、和電解槽中之溝槽的深度而使得將有一令人滿意及均 勻之電鍍的結果。實際上發現如果有比所想要之板子尺寸 短的板子尺寸之基板被電鍍於電解槽中，那麼該基板之下 緣被過電鍍，此即眾所皆知的“邊緣效應”而且意謂在基 本紙張尺度適用中.國國家標準（CNS ) A4規格（210X29?公釐） 4 517100 A7 B7 五、發明説明（2 ) 板的下緣之上或其周圍所沉積之金屬較在該基板的剩餘部 分之上所沉積的金屬爲厚。 當可能藉由改變在每一電解工作中所使用的陽極來降 低此“邊緣效應”時，因爲在單一槽中可能有超過4 0支 陽極’而且它們非常的重，所以更換陽極係非常困難且不 切實際的。 本發明之槪述： 因此本發明之目的在於提供一種改良的電解裝置，在 該電解裝置中減少上述之缺點，或者至少提供一種有效的 替代方案來取代。 依據本發明，有一種用以電鍍至少一基板之裝置被提 供’其包括支承機構、陽極機構、至少一容器及阻斷機構 ’其中該支承機構支承該基板並且與該基板間成電導通關 係’其中該容器容納該陽極機構、該支承機構以及電解液 ，其中嘻操作時，電場存在於介在該支承機構與該陽極機 構之間的該電解液內，其中該阻斷機構可移動以改變通過 該支承機構與該陽極機構間之電流的量，並且其中該阻斷 機構包括複數個實際爲剛性的阻斷構件。 有利的是，該裝置可以包括至少兩塊板，每一塊板與 至少一阻斷構件絞接地嚙合。 方便的是，該阻斷構件的每一個可以相關於其所絞接 嚙合之板而做樞軸地移動。 適合的是，該阻斷構件可以實際上由聚丙烯所做成。 本紙張尺度適用中.國國家標準（CNS ) A4規格（210X297公釐）· C— (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產苟員工消費合作社印製 517100 A7 ------- B7 ______ 五、發明説明（3 ) 附圖之簡略說明： (請先閲讀背面之注意事項再填寫本頁) 本發明現在將經由示例並參考伴隨之附圖來做說明， 其中： 圖1係顯示一電鍍裝置之示意圖，其中溝槽裝載有垂 直長度1 8英吋的基板； 圖2係在圖1中所顯示之電鑛裝置中所使用之聚丙烯 隔膜的側面圖； 圖3係在圖1中所顯示之電鍍裝置的示意圖，其中溝 槽裝載有垂直長度2 1英吋的基板； 圖4係在圖1中所顯示之電鍍裝置的示意圖，其中溝 槽裝載有垂直長度2 4英吋的基板； 圖5係顯示一依據本發明之電鍍裝置實施例的示意圖 ’其中溝槽裝載有垂直長度18英吋的基板； 圖6在圖5中所顯示之電鍍裝置的示意圖，其中溝槽 裝載有垂直長度21英吋的基板； 經濟部智慧財產苟員工消費合泎社印製 圖7係在圖5中所顯示之電鍍裝置的示意圖，其中溝 槽裝載有垂直長度2 4英吋的基板； 圖8 A及圖8 B分別係在圖5中所顯示之電鍍裝置中 所使用之側板的側面圖及端面圖； 圖9 A及圖9 B分別係在圖5中所顯示之電鍍裝置中 所使用之阻斷板的側面圖及端面圖；以及 圖1 0係顯示介於在圖5中所顯示之電鑛裝置中的側 板與阻斷板間之嚙合的透視圖。 & 本纸張尺度適用中.國國家標準（CNS ) A4規格（21〇><297公釐） 517100 A7 B7 經濟邹智慧財產苟員工消費合阼钍印製 五、發明説明（4 ) 主要元件對照表 10 電鍍裝置 12 電解槽 .14 電解槽的上緣 16 陽極 18 溝槽 20 收納板 22 基板的下緣 2 4 基板 26 聚丙烯隔膜 28 彈性且電絕緣的聚四氟乙烯薄片 30 側板 32 不可浸透之電絕緣的聚丙烯外框 3 4 穿孔布 36 溝槽的底部 100 電鍍裝置 102 阻隔板 104 溝槽 106 側板 108 背板 110 圓桿 112 孔 114圓桿 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）. (請先閱讀背面之注意事項再填寫本頁) £· 訂 517100 A7 B7 五、發明説明（5 ) 較佳實施例之詳細說明： (請先閱讀背面之注意事項再填寫本頁) 如在圖1中所顯示，一電鍍裝置通常被標明爲1〇。 該電鍍裝置1 0包括一含有電解液之電解槽1 2，爲了淸 晰起見，在任何圖式中並未顯示電解液。兩列陽極1 6自 該槽1 2的上緣1 4懸垂而下，在此僅顯示兩個陽極1 6 。在該槽1 2之內爲一溝槽1 8，其可能深入該槽1 2之 中或者從那裡升起。該溝槽.1 8包括複數個收納板2 0， 在此僅顯示其一。每一個收納板2 0包括一 V型槽口，即 將被電鍍之基板2 4的底側2 2，例如印刷電路板，可以 被收納於其中而使得基板2 4被支承於實際爲垂直平面之 上。在圖1中，基板之垂直長度爲1 8英吋，在溝槽1 8 的任何一側之上爲一電絕緣的聚丙烯隔膜2 6，‘其詳細情 形被顯示在圖2中且說明於下。附著於每一個聚丙烯隔膜 經濟部智慧財產¾員工消費合阼社印製 2 6爲一延伸跨越該槽1 2之長度之彈性且電絕緣的聚四 氟乙烯薄片2 8，該聚四氟乙烯薄片2 8假定在該槽1 2 中的一般性水平結構，該聚四氟乙烯薄片2 8爲具有大約 0 · 5毫米（mm)的厚度。 轉到圖2，其顯示一包括一不可浸透之電絕緣的聚丙 烯外框3 2，連帶一由伸展橫越內部開口區域之電絕緣的 聚丙烯網狀材料所做成之穿孔布3 4的聚丙烯隔膜2 6。 爲了淸楚起見，在此圖形中，顯示出穿孔的地方祇有在布 3 4的一些區域（5塊圓形區域），但是應該了解整塊布 3 4都是穿孔的。明顯的，有了這樣的配置’當電場能夠 _^___：----»___ 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X297公釐）· 517100 Α7 Β7 五、發明説明（6 ) (請先閱讀背面之注意事項再填寫本頁) 存在於橫跨該穿孔布3 4之處的同時，沒有電場能夠存在 於橫跨該聚丙烯框3 2之處，該聚丙烯隔膜2 6有效地將 該槽分成一個中央“陰極隔間”以及兩個外部“陽極隔間 ”。當允許電解液經過那裡之自由移動的同時，在該穿孔 .布3 4中之孔係如此地按大小順序排列以致於防止像陽極 澱渣一樣的粒子進入中央“陰極隔間”。 如同在圖1中能夠看到，雖然電場（就像以散列的線 表示）可以存在於橫跨該聚丙烯隔膜2 6之處，但是沒有 電流能夠從溝槽1 8之底部的下面通過，因爲電流被聚四 氟乙烯薄片2 8及/或聚丙烯框3 2所阻斷之故。由於減 少了到達基板之底端的電流量，所以較少的金屬將被沉積 於此區域中，因此降低“邊緣效應”。 經濟部智慧財產局員工消費合作社印製 轉到圖3，顯示相同的電鍍裝置1 0。由溝槽1 8之 收納板2 0所收納的基板2 4現在具有2 1英吋的垂直長 度’可以看到當一些電流通過陽極1 6與基板的底部之間 的同時，部分電流被聚丙烯隔膜2 6之不可浸透之電絕緣 的聚丙烯外框3 2所阻斷，也可以見到當溝槽1 8深入電 解槽1 2之中時，側板3 〇擠壓聚四氟乙烯薄片2 8而使 彼此遠離。由於它們的彈性，例如在電鍍之後，當溝槽 1 8從電解槽1 2中升起時，如在圖1中所顯示，聚四氟 乙烯薄片2 8將會回復它們的位置。如在圖3中所顯示， 側板3 0與聚四氟乙烯薄片2 8接觸而使得在介於該側板 3〇與該聚四氟乙烯薄片2 8之間沒有電流能夠經由它而 通過的間隙。但是，當與在圖1中的狀況相較之時，較多 本紙張尺度適用中關家鮮（CNS ) Α4· ( 210X297公釐〉 9 517100 A7 B7 五、發明説明（7 ) 的電流通過陽極1 6與基板2 4的底部之間° (請先閲讀背面之注意事項再填寫本頁) 至於圖4，再次顯示相同的電鍍裝置1 0。由溝槽 1 8之收納板2 0所收納的基板2 4現在具有2 4英吋的 垂直長度，可以看到溝槽1 8非常接近電解槽1 2的底部 .。當溝槽1 8更加朝向電解槽1 2的底部深入之時，該溝 槽1 8的兩列指狀物3 8 (爲了淸楚起見，在此僅顯示其 二）擠壓聚四氟乙烯薄片2 8而使彼此更加遠離，使得間 隙存在於側板3 0與聚四氟乙烯薄片2 8之間’如在圖4 中淸楚地顯示，更多的電流可以通過陽極1 6與溝槽1 8 的底部之間。 在圖5中顯示一依據本發明之一般被標明爲1 0 0之 電鍍裝置的實施例，該電鍍裝置1 0 0之結構，除了彈性 的聚四氟乙烯薄片2 8被複數個由聚丙烯所做之剛性電絕 緣阻隔板1 0 2所取代以外，基本上和在圖1至圖4中所 顯示之電鍍裝置1 0的結構相同，該電鍍裝置1 0 0之結 構將說明於下。 經濟部智慧財產局員工消費合作社印製 如在圖5至圖7中所顯示，阻隔板1 〇 2基本上以和 該彈性的聚四氟乙烯薄片2 8相同的方式操作，而且當一 溝槽1 0 4向下沉入時，該阻隔板1 〇 2能夠被擠壓而彼 此遠離，阻隔板1 0 2的密度係使得它們如在圖5中所顯 示將漂浮且假定在電解液中的位置，除非它們被溝槽 1 0 4所作動。 圖8 A及8 B顯示一側板1 〇 6，而阻隔板1 〇 2可 以與其相嚙合。該側板1 〇 6包括一以四圓桿1 1 〇所固 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐} 4^ 517100 A7 _____ B7 五、發明説明（8 ) (請先閱讀背面之注意事項再填寫本頁) 定之背板1 0 8，該側板1 〇 6包括四個孔1 1 2，用以 加強將其固定於裝置1 〇 〇。圖9A及9 B顯示當也包括 一圓桿1 1 4時的阻隔板1 〇 2。如在圖1 〇中所顯示， 每一個阻隔板1 0 2之圓桿1 1 4可以與圓桿1 1 〇的其 中之一相嚙合’以便當其被溝槽1 0 4所作動時，致使該 阻隔板1 0 2相關於該側板1 0 6而樞接。 從前面的討論中可以淸楚地看到，依據本發明之電鍍 裝置的性能爲多方面且具彈性的，並且能夠在一寬廣的板 子尺寸範圍之上提供基板之令人滿意電鍍性能。 但是也應注意上述僅說明一實施例，藉此本發明可以 被實施，並且修正及改變可以在那裡被達成而不會違反本 發明之精神。 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X297公釐} 44517100 A7 B7 V. Description of the invention (1) Field of the invention: (Please read the precautions on the back before filling out this page) The invention relates to a plating device, and is particularly relevant to substrates to be plated, such as printed circuit boards. The aspect of the uniform distribution of metals has been improved with such a device. Description of Conventional Technology: U.S. Patent No. 4,87,9,007 discloses a floating shield for use in an electrolytic cell. The shield includes an elongated groove in which a substrate used for electromagnetism is loaded. The substrate is vertically supported in the trench, and the lower edge of the substrate is below the plane of the upper edge of the trench. A pair of anodes are immersed in the electrolytic cell, and each anode extends parallel to the longitudinal axis of the floating shield and is in the trench. The substrate loaded in the tank is connected to the cathode bus bar by one or more clamps. In operation, an electric current is passed between the anode and cathode bus bars through the electrolyte in the electrolytic cell, thereby electroplating the substrate. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs When an electroplating factory orders an electroplating device from a manufacturer, it must specify the "board size" of the substrate that is intended to be plated by this device. In this regard, "board size" means the verticality of the substrate Length when it is supported on a vertical plane. In the related field, the depth of the floating shield in the electrolytic cell thus arranged at a fixed distance from the top edge of the substrate to the top edge of the electrolytic cell is a common practice. The manufacturer will then arrange the size of the electrolytic cell, The depth of the grooves in the anode and the electrolytic cell makes a satisfactory and uniform electroplating result. In fact, it has been found that if a substrate with a board size shorter than the desired board size is plated in the electrolytic cell, the lower edge of the substrate is over-plated. This is a well-known "edge effect" and means The basic paper size is applicable. National National Standard (CNS) A4 specification (210X29? Mm) 4 517100 A7 B7 V. Description of the invention (2) The metal deposited on or around the lower edge of the board is more than the remaining of the board The metal deposited on the part is thick. When it is possible to reduce this "edge effect" by changing the anode used in each electrolytic operation, because there may be more than 40 anodes in a single tank and they are very heavy, it is very difficult to replace the anode system and unrealistic. Summary of the invention: It is therefore an object of the present invention to provide an improved electrolysis device in which the above disadvantages are reduced, or at least an effective alternative is provided to replace it. According to the present invention, there is provided a device for electroplating at least one substrate, which includes a support mechanism, an anode mechanism, at least one container, and a blocking mechanism, wherein the support mechanism supports the substrate and establishes an electrical conduction relationship with the substrate. Wherein the container contains the anode mechanism, the support mechanism, and the electrolyte, and during the operation, an electric field exists in the electrolyte interposed between the support mechanism and the anode mechanism, and the blocking mechanism is movable to change the passage through the The amount of current between the support mechanism and the anode mechanism, and wherein the blocking mechanism includes a plurality of blocking members that are actually rigid. Advantageously, the device may include at least two plates, each plate being twisted into engagement with at least one blocking member. Conveniently, each of the blocking members can be pivotally moved in relation to the plates to which they are engaged. Suitably, the blocking member may actually be made of polypropylene. This paper size is applicable. National National Standard (CNS) A4 specification (210X297 mm) · C— (Please read the precautions on the back before filling out this page) Ordered by the Ministry of Economic Affairs Intellectual Property Employees Cooperatives 517100 A7- ----- B7 ______ V. Description of the invention (3) Brief description of the drawings: (Please read the notes on the back before filling out this page) The present invention will now be described by way of example and with reference to the accompanying drawings, where : Figure 1 is a schematic view of a plating device in which a trench is loaded with a substrate having a vertical length of 18 inches; Figure 2 is a side view of a polypropylene diaphragm used in the electric mining device shown in Figure 1; 3 is a schematic view of the electroplating device shown in FIG. 1, in which the trench is loaded with a substrate having a vertical length of 21 inches; FIG. 4 is a schematic view of the electroplating device shown in FIG. 1, in which the trench is provided with a vertical length 2 4 inch substrate; FIG. 5 is a schematic view showing an embodiment of an electroplating device according to the present invention, wherein the groove is loaded with a substrate having a vertical length of 18 inches; FIG. 6 is a schematic view of the electroplating device shown in FIG. Which groove A substrate with a vertical length of 21 inches is loaded; printed by the Intellectual Property of the Ministry of Economic Affairs and the Consumers' Union of Japan. Figure 7 is a schematic view of the plating device shown in Figure 5, where the groove is loaded with a substrate with a vertical length of 24 inches. Figures 8A and 8B are side and end views of the side plates used in the plating apparatus shown in Figure 5, respectively; Figures 9A and 9B are respectively shown in the plating apparatus shown in Figure 5 A side view and an end view of the blocking plate used; and FIG. 10 is a perspective view showing the meshing between the side plate and the blocking plate in the electric mining device shown in FIG. 5. & This paper is applicable in China. National Standard (CNS) A4 specification (21〇 < 297 mm) 517100 A7 B7 Economy Comparison table of main components 10 Electroplating device 12 Electrolytic cell. 14 Upper edge of electrolytic cell 16 Anode 18 Groove 20 Receiving plate 22 Lower edge of substrate 2 4 Substrate 26 Polypropylene diaphragm 28 Flexible and electrically insulating Teflon sheet 30 Side plate 32 Impervious electrical insulating polypropylene frame 3 4 Perforated cloth 36 Bottom of the groove 100 Plating device 102 Barrier plate 104 Groove 106 Side plate 108 Back plate 110 Round rod 112 Hole 114 Round rod This paper size applies to Chinese national standards ( CNS) A4 specification (210X297mm). (Please read the precautions on the back before filling out this page.) Order 517100 A7 B7 V. Description of the invention (5) Detailed description of the preferred embodiment: (Please read the back Note for refilling this page) As shown in Figure 1, a plating device is usually designated as 10. The electroplating apparatus 10 includes an electrolytic cell 12 containing an electrolytic solution. For the sake of clarity, the electrolytic solution is not shown in any drawings. The two rows of anodes 16 are suspended from the upper edge 14 of the slot 12, and only two anodes 16 are shown here. Within the groove 12 is a groove 18 which may penetrate deep into the groove 12 or rise from there. The groove .18 includes a plurality of storage plates 20, and only one of them is shown here. Each storage board 20 includes a V-shaped notch, and the bottom side 22 of the substrate 24 to be plated, such as a printed circuit board, can be stored therein so that the substrate 24 is supported on an actual vertical plane. . In FIG. 1, the vertical length of the substrate is 18 inches, and on either side of the trench 18 is an electrically insulating polypropylene membrane 26. 'The details are shown in FIG. 2 and described in under. Attached to each polypropylene diaphragm is the intellectual property of the Ministry of Economic Affairs ¾ printed by the Consumer Consumption Corporation 2 6 is a flexible and electrically insulating polytetrafluoroethylene sheet 2 extending over the length of the groove 12 2, the polytetrafluoroethylene The sheet 2 8 assumes a general horizontal structure in the groove 12, and the polytetrafluoroethylene sheet 2 8 has a thickness of approximately 0.5 millimeters (mm). Turning to Fig. 2, there is shown a perforated cloth 3 4 including an impervious electrically insulating polypropylene frame 3 2 with a perforated cloth 3 4 made of an electrically insulating polypropylene mesh material extending across the internal opening area. Polypropylene diaphragm 2 6. For the sake of clarity, in this figure, it is shown that the perforations are only in some areas of the cloth 3 4 (5 circular areas), but it should be understood that the entire cloth 3 4 is perforated. Obviously, with this configuration 'When the electric field can _ ^ ___: ---- »___ This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X297 mm) · 517100 Α7 Β7 V. Description of the invention (6 ) (Please read the notes on the back before filling this page) Existing across the perforated cloth 34, no electric field can exist across the polypropylene frame 32, the polypropylene diaphragm 2 6 The tank is effectively divided into a central "cathode compartment" and two outer "anode compartments". While allowing the electrolyte to move there freely, the holes in the perforated cloth 34 are arranged in order of size so as to prevent particles like anode slag from entering the central "cathode compartment". As can be seen in Figure 1, although an electric field (as represented by a hashed line) can exist across the polypropylene diaphragm 26, no current can pass under the bottom of the trench 18, Because the current is blocked by the polytetrafluoroethylene sheet 28 and / or the polypropylene frame 32. Since the amount of current reaching the bottom end of the substrate is reduced, less metal will be deposited in this area, thus reducing the "edge effect". Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Turning to Figure 3, the same plating device 10 is shown. The substrate 2 4 accommodated by the receiving plate 20 of the groove 18 now has a vertical length of 21 inches. It can be seen that when some current passes between the anode 16 and the bottom of the substrate, part of the current is polypropylene. The impenetrable electrically insulating polypropylene frame 3 2 of the diaphragm 2 6 is blocked. It can also be seen that when the groove 18 penetrates into the electrolytic cell 12, the side plate 3 〇 extrudes the Teflon sheet 2 8 And keep each other away. Due to their elasticity, for example, when the grooves 18 are raised from the electrolytic cell 12 after electroplating, as shown in Fig. 1, the PTFE sheet 28 will return to their positions. As shown in FIG. 3, the side plate 30 is in contact with the polytetrafluoroethylene sheet 28 so that there is no gap between the side plate 30 and the polytetrafluoroethylene sheet 28 through which a current can pass. However, when compared with the situation in Figure 1, more paper sizes apply to Zhongguan Jiaxian (CNS) A4 · (210X297 mm) 9 517100 A7 B7 V. Description of the invention (7) The current passes through the anode Between 1 6 and the bottom of the substrate 2 4 (Please read the precautions on the back before filling in this page) As for Figure 4, the same plating device 10 is shown again. The storage plate 2 0 received by the groove 1 8 The substrate 24 now has a vertical length of 24 inches, and it can be seen that the groove 18 is very close to the bottom of the electrolytic cell 12. When the groove 18 is deeper toward the bottom of the electrolytic cell 12, the groove The two rows of fingers 3 8 (only the second one is shown here for the sake of clarity) squeeze the Teflon sheet 2 8 to make them farther away from each other, so that the gap exists in the side plate 3 0 and Teflon Between the vinyl sheets 2 8 'as clearly shown in Fig. 4, more current can pass between the anode 16 and the bottom of the groove 18. In Fig. 5 is shown a generally labeled Example of an electroplating device of 100, the structure of the electroplating device of 100, except for the elastic Teflon sheet 28 Except for the replacement of a plurality of rigid electrically insulating barrier plates made of polypropylene 102, the structure of the plating device 10 shown in FIGS. 1 to 4 is basically the same, and the structure of the plating device 100 will be It is described below. The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed as shown in Figs. 5 to 7 that the barrier plate 102 was basically operated in the same manner as the flexible PTFE sheet 28, and When a trench 104 sinks downward, the barrier plates 102 can be squeezed away from each other. The density of the barrier plates 102 is such that they will float as shown in FIG. 5 and are assumed to be electrolytic. Position in the fluid, unless they are moved by the groove 104. Figures 8 A and 8 B show the side plate 1 06, and the barrier plate 1 0 2 can be engaged with it. The side plate 1 0 6 includes one by four circles The size of the paper fixed by the rod 1 1 10 applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 4 ^ 517100 A7 _____ B7 V. Description of the invention (8) (Please read the precautions on the back before filling this page) The back plate 1 0 0, the side plate 1 0 6 includes four holes 1 1 2 to strengthen the It is fixed to the device 100. Figures 9A and 9B show the barrier plate 10 when a round bar 1 1 4 is also included. As shown in Figure 10, each of the barrier bars 1 102 has a round bar 1 1 4 can be engaged with one of the round bars 1 1 0 'so that when it is actuated by the groove 104, the barrier plate 102 is pivoted in relation to the side plate 106. From the previous discussion It can be clearly seen that the performance of the electroplating device according to the present invention is versatile and flexible, and can provide satisfactory plating performance of the substrate over a wide range of board sizes. However, it should also be noted that the above describes only one embodiment, whereby the present invention can be implemented, and modifications and changes can be made there without violating the spirit of the present invention. This paper size applies to China National Standard (CNS) A4 (210 X297 mm) 44