TW469529B - Method and apparatus for removing organic substance on substrate, method for producing semiconductor device, and method and apparatus for producing display device - Google Patents

Abstract

A method of producing a display device in accordance with the present invention includes a step of producing a substrate by forming a predetermined element pattern on the substrate, and a step of producing a cell by securely attaching another substrate to the substrate to from a pair of substrates. At least one of the step of producing a substrate or the step of producing a cell includes a step of removing an organic substance existing on the substrate with the use of a supercritical fluid or a subcritical fluid. This makes it possible to completely oxidize and remove the organic substance at relatively low temperature without degrading device characteristics and to eliminate device contamination factors.

Description

469529 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the Invention (1) Technical Field The present invention relates to a method for removing organic sterilizer and its manufacturing device by using supercritical fluid or subcritical fluid. Further, the present invention relates to a method for manufacturing a semiconductor device and a method for manufacturing a display device by using a method of removing after-effects with a supercritical fluid or a subcritical fluid. Technical background While it is necessary to ensure the stability of various performances of display devices such as semiconductor devices or flat panel displays (hereinafter referred to as Ding Display), and to improve their horse quality, etc., it is urgent to maintain the surface of the substrate while manufacturing. A good state is a very important thing. For example, 'in the semiconductor device or liquid crystal display device J (in the manufacturing process', the formation of the surrounding image of the element depends on the lithography imaging step, and this lithography imaging step is no exception.) Tongda must be subjected to a Ua · removal step. Specifically, it is oxidized by fuming nitric acid, or after the phenol is decomposed to remove the photoresist. However, Uzhu stripping solution is used to decompose and remove the first resist. Method, the removal step itself is unstable, and the manufactured component will remain unremoved due to some photoresist residues, or impure substances contained in the photoresist stripper, which will cause the component characteristics to become unstable. In addition, in order to hold the surface of the substrate in a straightforward selection state, in the past, it was cleaned many times during the manufacturing process in an effort to maintain the dullness of the product. In these washing and diffusion treatments, pure water is used as a pre-check agent. Pure water is a non-blunt substance containing plant liquid, which is not dangerous and excellent in usability. This paper scale is applicable to China Standard (CNS > A4 specification (210 X 297 mm) ---- -I, 1 --- S ---- f equipment ---- (Please read the note on the back before filling in this S > Order ----- -4- Λ / Λ / Ministry of Economic Affairs_ Wisdom Wealth-Printed by the Consumer Bureau of Industry Bureau B7 V. Description of Invention (2) However, it is necessary to use pure water and so on; t clean the application, while maintaining the surface of the net (ie, the substrate) when manufacturing the ping display In a good state, 'it has its difficulties. For example, in one embodiment of the FP display, that is, in the manufacturing process of the liquid crystal display (LCD), before the alignment film is formed, after the alignment processing is ground, and when After the cell enters the liquid crystal, etc., it is necessary to repeatedly carry out a wave of S. However, in a series of processes of manufacturing LQD, even if the port is cleaned, it is sometimes unavoidable for various reasons. For example, implementation difficulties. After laminating a pair of substrates to form an empty cell, it is reasonable to perform a cleaning process. The reason for the cleaning treatment after bonding the substrates is that when bonding is to be performed, 'pre-coating is required. Heat treatment of the sealant on any of the substrates to harden it. That is, once the heat treatment is performed, The volatilized components of the sealant will adhere to the surface of the base handle, etc., and contaminate the empty cells, thereby deteriorating the display characteristics of the display. Also, if the empty cells are washed, they will be dried sufficiently after washing. In this step, the cleaning agent inside the empty cell cannot be completely removed, leaving the detergent behind. As a result, the display daytime surface becomes white and cloudy, and the display characteristics are degraded. Therefore, after forming the empty cell, No matter whether the substrate surface is contaminated or not, there is still a problem that pollutants cannot be removed. It is also another embodiment of the FP display, that is, when a light emitting display (ELD) is used, a carrier transport layer and / or a light emitting layer are formed. Washed with pure water before. However, 'Even if the drying step is performed after washing, there will still be adsorbed water on the basic surface' as a cause of black spots on the display screen. Therefore, in ELD, there are also manufacturing At the same time it is difficult to keep the surface of the substrate in good condition. This paper size applies to Chinese National Standards < CNS) A4 (210 X 297 mm) — II —II-— II III l · I 1 I ^-— ml — — — < Please read the notes on the back before Fill in this S) 46 9 b 2 9 Consumption cooperation by employees of the Intellectual Property Bureau of the Ministry of Economic Affairs, printed A7 B7 V. Description of the invention (3) Also, the so-called carrier rotation layer refers to the electrical: weekly or electronic transport layer . Secondly, 'Because of the film-forming material used in the carrier rotation layer, when the carrier rotation layer becomes the electron transport layer, the light-emitting layer will be the hole transport layer on the anode side; that is,' each layer_sample benefit will be: substrate / anode / Light-emitting layer / Thunder-conveyor layer / Negative selection 15 芨, if the carrier wheel transport layer is used for hole transport j, the light-emitting layer will be the electron transport layer on the cathode side; the structure of each layer will be: substrate / anode / Hole transport layer / light emitting layer / cathode. In addition, recently, there is a proposal of a three-story ELD. The eld of this three-story structure is to form an independent light-emitting layer without the function of a carrier transport layer after the tritium transport. It becomes: substrate / anode / hole transport layer / light-emitting layer / electron transport layer / cathode. In addition, the foregoing layers are generally formed by a vacuum evaporation method. The process of vacuum evaporation during film formation by the vacuum evaporation method has a low degree of pollution. However, steps other than the vacuum evaporation method are susceptible to contamination. However, as far as I know _, the cleanliness of the outer side of each layer is very important because of the interface for the injection of thunder or holes. 'In the car guide device or display device, the formation of the component circle image depends on the lithography imaging step, but when the photoresist is removed, photoresist residues or impure water contained in the photoresist stripping solution will remain. However, the problem of reliability of component characteristics. The problem of repair is reduced. Also, the pure water used in the cleaning process needs to be heated to perform the drying step. As long as a little pure water remains, it will damage the display user. Yes. A Therefore, I " expect to develop a cleaning technology that uses high cleaning power and no residual cleaning materials. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) — I — IIIIIL * I 1. — 1 i III such as * J1! 111111 I (锖 Please read the precautions on the back before filling this page) A7 B7 Ministry of Economic Affairs-Wisdom Wealth-Printed by Bureau A Consumer Consumption Cooperative V. Invention Description (4 Inventions The disclosure is recorded in the above problem. The first object of the present invention is to provide a method for removing organic matter. By this method, the safety of operation can be confirmed and the waste liquid can be easily removed. Furthermore, this method is used. Provide a manufacturing method of semiconducting bamboo shoots and display devices. 'This method can eliminate the causes of pollution on the manufacturing elements, and completely oxidize and remove the organic substances present on the substrate at a relatively low temperature without harming it. Contributing to this soap guide and display device under the characteristics of the element. Also, 'the second object of the present invention is to provide a manufacturing method of a display device and a device for manufacturing the same.' The cleaning process is performed without damaging the state of the surface of the object to be cleaned, and the cleaning substance can be left without being washed, and it can be made into a display device with higher performance than the conventional one. (1) Long removal of organic matter on the substrate, method In order to solve the foregoing problem, the present invention relates to a method for removing dancing objects on a substrate, which is characterized in that it removes organic substances existing on an inorganic substrate by supercritical water gas subcritical water oxidation. Here, the so-called "existence "On an inorganic substrate" does not just mean that the case where organic substances are present on the surface of the inorganic substrate 'also includes the formation of single-layer or multi-layer thin films on the substrate, and in the case where organic substances are present on these films. The organic substance may be an organic film formed of a photosensitive resin that is imaged to have a predetermined shape. Also, in the aforementioned method, the supercritical water or subcritical water should be ultra pure water with a resistivity of 10 million ohms or more and a supercritical state above 375 ° C and above 220 atmospheric pressure. National Standard (CNS) A4 specification (210 X 297 mm) ---- I -------- installation ----- S-II1 order ---- II! Line (Note f, please fill out this page) 469529 Α7 Β7

Printed by the Shelley Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (5) In the foregoing method, the inorganic substrate is made of silicon or glass. In the aforementioned method, water in a supercritical state or a subcritical state is used to remove organic substances existing on an inorganic substrate. 'According to the aforementioned method, since the water used in the supercritical state or the subcritical state removes organic matter on the inorganic substrate. Therefore, it is possible to ensure the safety of the organic matter removal operation compared with those who used only the safe # and dangerous organic solvents in the past. In addition, the waste liquid after organic removal can also be easily processed because it does not contain substances harmful to the human body. In addition, it is known that the organic solvent contains impurities, and even if the organic matter is removed, the winter pure substance may adhere to the substrate, and the surface of the inorganic substrate may be contaminated. However, according to the aforementioned method, 'Using ultra) pure water with a resistivity of 10 million ohms or more, since the removal of organic matter is carried out with supercritical water or subcritical water containing almost no impurities, it is also not removed after removal. The problem of contamination of the inorganic substrate due to the presence of residues on the substrate. (2) The manufacturing method of the semiconductor device is to 'in order to solve the aforementioned problems, the manufacturing method of the semiconductor device of the present invention is to form an image by borrowing the lithography imaging property.' The lithography imaging method includes Those who have the following steps are: a step of forming an imaged target, which is used to form a film of an imaged target on a semiconductor substrate; and a coating step, which is used to form a pancreas of the icon. Coating the first resister;-the light exposure step is a dragon mask with a predetermined mask surrounding the image, the first resister is exposed to form a mask image on the photoresist; an imager step , Is used to develop the photoresist after exposure to form a photocathode and an imager; a paper size of this paper applies the Chinese National Standard (CNS) A4 specification < 210 X 297 public love > — — — — —, 114 ^ i ------------- < Please read the item on the back > i and then fill in this page) -8- Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs A7,-B7_ V. Description of the invention (6) The step is to engraving the film house of the aforementioned circle image; and a light a removal step is based on the super-pro Water or subcritical water oxidation by removing the resist image. In the foregoing method, a true exposure step can be performed to obtain the mask exposure step, and the direct exposure step is to directly draw an arbitrary circle image on the photoresist with an electron beam. In the described method, the super: critical_water salty. Subcritical water is suitable for ultra-pure water with a resistivity of 10 million ohms or more and a supercritical state of 375t or more and 220 atmospheric pressure or more. According to the aforementioned method, since the supercritical water or subcritical water (hereinafter referred to as supercritical water, etc.) is the super-deer water oxidation reaction or the sub-critical water oxidation reaction, the organic substances on the semi- and deuterium substrates are completely oxidized and decomposed, and The remover, therefore, no accumulation of organic matter remains. As a result, it is possible to prevent the instability of the device from being caused by the residue of organic matter. In addition, organic solvents used in the past are female-friendly and dangerous. However, if supercritical water is used instead, safety can be ensured. In addition, the waste liquid after use can be easily processed because it does not contain substances harmful to the human body. In addition, because of the known organic solvents, which also contain impurities, it is possible that even after the photoresist is removed, there may be impurities on the semiconductor substrate, causing the semiconductor substrate surface to be contaminated. * However, as described above Method, using ultrapure water with a resistivity of 10 million ohms or more, because organic matter is removed with supercritical water or subcritical water containing almost no impurities, so no impurities remain on the removed substrate and cause pollution. problem. (3) The manufacturing method of the fluorine display device is also to understand the aforementioned problems. The manufacturer of the display device of the present invention applies the Chinese paper standard (CNS) A4 specification (210 X 297 mm). ---- 'I —Order ------- line < Please read the note on the back before filling in this I) -9- A7 B7 V. Description of the invention (7) (Please read the note on the back first Please fill in this page again) The method includes the following steps, namely: a basic ^ competition system step, which is used to form a predetermined image of the mouth on the substrate; and an Austrian yuan production step, which is used to The substrate is bonded to another substrate paired with it to make a cell; and at least one of the substrate manufacturing step and the cell manufacturing step includes a removal step, and the old division step is called super- Critical fluids or subcritical fluids remove organic matter present on the substrate. In the aforementioned method, the step of removing organic matter in the step of making the board may be one in which supercritical water or subcritical water is used to remove organic matter, especially by oxidative removal. Also in the aforementioned method, the step of removing organic matter in the cell production step may be a cleaning step of dissolving and removing organic matter with a supercritical flow or a subcritical fluid. The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints out the supercritical fluid or subcritical fluid (hereinafter also referred to as supercritical flow, etc.) to air such as the air according to the aforementioned method. In a lower-pressure environment, a phase change such as an immediate sacrifice of air from the surface of the substrate occurs, so it does not stay on the substrate at night. Therefore, in the case of removing organic matter by using an organic solvent, the drying steps and the like are required, which is not necessary for winter production, and the number of steps 1 and 5 is reduced. Moreover, the deduction result can reduce the manufacturing cost when manufacturing the display device, and It is very productive. In addition, when supercritical skin or subcritical water is used, it is possible to completely oxidize and decompose and remove organic matter, so that there is a problem that organic matter that cannot be removed remains on the substrate. Therefore, Θ is capable of producing excellent display devices such as display characteristics. Also, the aforementioned "display device" means a light receiving type display such as a liquid crystal display, and an electroluminescent display (ELD), etc. Since this paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 meters) ) • 10- Ministry of Economic Affairs-Wisdom Wealth-Printing of A7 B7 by Industry Bureau Consumer Cooperatives V. Description of Invention (8) Light-emitting display. In addition, in order to solve the foregoing problems, further, the method for manufacturing a display device of the present invention is used to manufacture a display device having a liquid crystal layer formed between an array substrate and an opposite substrate, and the manufacturing method includes the following steps. That is, a substrate manufacturing step is used to fabricate the array substrate and the opposite substrate; and a liquid crystal cell manufacturing step is used to fabricate the liquid crystal cell using the array substrate and the opposite substrate; and, It has a lithography to form a film with a predetermined shape after being imaged ', and the lithography includes the following steps: a film formation step of an image target is used to form on a substrate Photographic target film: a coating step is used to apply a photoresist solution to the film of the graphic target; a photomask exposure step is performed through a photomask with a predetermined photomask. The photoresist is exposed so as to form a latent image of the mask image on the photoresist; a development step is used to develop the photoresist after exposure to form a photoresist image;-etching step Etching the imaging system used by the underlying film; and a resist removal step, based supercritical water or subcritical water oxidation by removing the resist image. In addition, in order to solve the foregoing problems, a method of manufacturing the display device of the present invention is to manufacture a substrate having electrodes formed between the substrate and the electrodes.

* A device with an electrically excited photocell for the carrier transport layer and the light-emitting layer, and the manufacturing method includes the following steps, namely:-the manufacturing steps of the substrates with the electrodes are used to make the electrodes A substrate; and an electric quaternary light-emitting cell preparatory step 'is used to make the electro-excited photocell using the electrode-equipped k-plate; and' the electrode-produced substrate has a lithography imaging method In order to form a film with a predetermined shape after being imaged, the paper size of the braided paper is in accordance with the Chinese national standard (CNS> A4 specification < 210 X 297 public love>) ------------ --___ (Please read the precautions on the back before filling this page) Fantasy · • Line--11- 46 95 2 9

V. Description of the invention (9) Imaging technique printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs includes the following steps: The film formation step of the image is used to form the film of the image target on the substrate; The step of jin is used to apply a photoresist liquid on the diaphragm of the sleepy target; a photomask exposure step is to expose the photoresist through a photomask with a predetermined round image of a photomask to form a photoresist on the photoresist. A latent image of a mask image; a development step is used to develop the photoresist after exposure to form a photoresist image; an etching step is used to etch the film of the aforementioned image target And a photoresist removal step, wherein the photoresist image is removed by oxidation with supercritical water or subcritical water. In order to solve the aforementioned problems, furthermore, the method for manufacturing the display device of this Primer is for manufacturing a display device having a liquid crystal layer provided between a column substrate and an opposite substrate to constitute a liquid crystal cell, and the manufacturing method includes The following steps are: a substrate fabrication step for fabricating the array substrate and the opposite substrate; and a liquid crystal cell fabrication step for fabricating the liquid crystal cell using the array substrate and the opposite substrate: and the liquid crystal cell fabrication The step of cleaning includes a step of cleaning the array substrate and / or the opposite substrate with a supercritical fluid or a subcritical fluid. In the aforementioned method, the liquid crystal cell manufacturing step has a cleaning step of cleaning the substrate with a V Γ supercritical fluid or a subcritical fluid. Therefore, the drying step and the like required in the liquid crystal cell manufacturing step become No, reducing the number of manufacturing steps. And 'this result can reduce the manufacturing cost when manufacturing the display device, and can also improve its productivity. In addition, since it is washed with a supercritical fluid or the like, no washing material remains, and it is possible to prevent white turbidity such as lightening of the black portion on the display screen. Also, the so-called array substrate means that there are electrodes and wiring on the substrate, and this paper size applies the Chinese National Standard (CNS) A4 specification < 210 X 297 public love > -------- l · --- j · '^ i — ll · --- order.Ίί ^ ----- line one (please «read the precautions on the back before filling out this page) -12- Economic and Intellectual Property Bureau employee printing cooperative printed A7 _B7________ 5. Description of the invention (10) Or, if necessary, and have a thin film transistor. Also, the term "opposing substrate" refers to those having electrodes or the like or necessary color filters on the substrate. Therefore, the aforementioned liquid crystal cell manufacturing step means a series of steps from the formation of electrodes and wiring on the substrate to the substrate manufacturing step until the completion of the liquid crystal cell. In addition, a step of adding a module step, that is, setting a driving circuit in the liquid crystal cell, is not included in the liquid crystal cell manufacturing step. In the foregoing method, the liquid crystal cell manufacturing step may include an alignment film forming step to form an alignment film on the array substrate and / or the opposite substrate; and the cleaning step may be used in the alignment film forming step. Before or after. According to the aforementioned method, a cleaning step with a supercritical fluid or the like before the step of forming the alignment film not only removes the dust on the substrate, but also does not cause the problem of residual detergent in the cleaning process as in the past. Therefore, a good alignment film can be manufactured. In addition, even if the cleaning step is performed after the alignment film is formed, the supercritical fluid does not cause any adverse effects such as deterioration of the alignment film. Therefore, the cleaning can be performed without considering the stability of the alignment film to the detergent. Processing to obtain an alignment film with good film surface cleanness. That is, if the alignment film is cleaned by the conventional liquid system cleaning treatment method, depending on the type of the detergent, the alignment film will be deteriorated due to chemical action, causing problems such as adverse effects. In the aforementioned washing step, not only the alignment film is not deteriorated, but the alignment energy is not reduced. In addition, since no cleaning material remains, it can suppress the phenomenon of tilting (disclination) or alignment flow, so not only can produce a liquid crystal display with good display characteristics, but also reduce the number of manufacturing steps. Applicable to China National Standard (CNS) A4 specification (210 X 297 mm) ------------ installation ---- i --- 丨 --order ------- I-line ( Please read the notes on the back before filling out this page) -13- 469529 Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (11) Reduce the manufacturing cost and improve its productivity. _ In the foregoing method, the liquid crystal cell manufacturing step may have the following steps: an alignment film forming step for forming an alignment film on the aforementioned array substrate and / or an opposite substrate; and an alignment processing step for the The alignment film is applied to an alignment processor; the washing step may be performed before and / or after at least one of the alignment film formation step or the alignment processing step. According to the foregoing method, in addition to the function and effect of the third invention in the scope of patent application, even if the washing step is performed after the alignment processing step, the alignment of the alignment film can be suppressed from being reduced, and the drying step can be omitted. . In the aforementioned method, the liquid crystal cell manufacturing step may have the following steps: a bonding step for bonding the aforementioned array substrate and the opposite substrate to form an empty cell; and a liquid crystal injection step, The liquid crystal is injected into the interior of the empty cell; the aforementioned washing step may be performed before and / or after at least one of the bonding step or the liquid crystal injection step, and because the substance in a supercritical fluid state is not only Low viscosity and highly diffusive, so even the part that the liquid system detergent cannot enter 'can easily penetrate. Therefore, if the washing step is performed after the bonding step according to the aforementioned method, the supercritical fluid or subcritical fluid can also enter the inside of the empty cells. Therefore, it is difficult to wash the empty cells by the previous cleaning method. internal. In addition, supercritical fluids and the like immediately change to a gas phase state under atmospheric pressure, and therefore, they do not remain inside the empty cells. Therefore, according to the aforementioned method, a display device having better display quality and the like can be manufactured. Further, in the conventional liquid system cleaning method, since a sealant deteriorates the sealant ', liquid crystal contamination and the like attached during the liquid crystal injection cannot be sufficiently cleaned. However, the size of this paper applies to the Chinese National Standard (CNS) A4 (210 X 297 mm) ------ ---- 1—ιλ '^ _ ι! _ (Jing first read the precautions on the back before filling this page ) Order: --- 7 ---- line -14 A7 A7

V. Description of the invention (U) In addition, as in the present invention, using a supercritical fluid, etc., for the washing step, not only does the sealant not be deteriorated, but it can be fully removed and attached to the surface of the &cell; LCD pollution. A feature of the aforementioned method is that a resin substrate is used for the array substrate and the counter substrate. In addition, in the conventional liquid system cleaning treatment, a drying step or the like was required to remove the detergent. Specifically, this drying step is performed by heat treatment or the like. Therefore, it is necessary to use a substrate having a higher heat resistance than a resin substrate, such as a glass substrate (financial heat temperature 600 ° C). In addition, because the resin substrate may be deteriorated due to the chemical action of the detergent, the range of detergents that can be used is more limited. However, according to the aforementioned method, since a supercritical fluid or a subcritical fluid will immediately vaporize at normal temperature and pressure, there is no need to perform a drying step. Therefore, a display device having excellent display characteristics and the like can be manufactured. In addition, the supercritical flow or subcritical fluid does not deteriorate the surface of the resin substrate, so that a display device with excellent display characteristics and lighter weight can be manufactured. Also, in order to solve the aforementioned problems, the display device of the present invention is manufactured. The method is used to manufacture a display device having an electrically excited photocell provided with a carrier transport layer and a light emitting layer between a substrate with an electrode and an electrode, and the manufacturing method includes the following steps: an electrode is attached The manufacturing steps of the substrate are used to make the substrate with an electrode; and the manufacturing step of the electrically excited photo cell is to use the substrate with the electrode to make the electrically excited photo cell; and the electrically excited photo cell The manufacturing step includes a cleaning step of cleaning the aforementioned substrate with electrodes with a supercritical fluid or a subcritical fluid. / According to the aforementioned method, the display characteristics can be produced without black spots on the screen. The paper size applies the Chinese National Standard (CNS) A4 specification (210 * 297 mm) -Ill ------- I-- ---- ---------- I — < Please read the notes on the back before filling out this page) Economy t Wisdom W. Printed by members of the Production Bureau Η Consumer Cooperatives Printed by the Ministry of Hydrocarbons Intellectual Property Bureau Employees Printed by Consumer Cooperatives 469529 A7 Γ ------------ B? __ 5. Description of the Invention (I3) A good EL display, that is, a kind of display device. The black dots that can be seen on the display screen are due to the cleaning agent remaining after the cleaning process in the past. Secondly, when a cleaning agent remains on the surface of the substrate, even if it is washed with pure water and then dried at a predetermined temperature of the lamp, a certain degree of adsorbed water remains on the substrate surface and cannot be completely removed. However, according to the aforementioned method, & the supercritical vessel will immediately vaporize at atmospheric pressure, so the substrate surface will not remain cleaned after cleaning. Therefore, it is possible to prevent the decrease in luminescence due to the residue of the detergent. X, since the drying step of removing the cleaning material from the substrate surface is not required, the manufacturing cost can be reduced. Therefore, it is possible to manufacture a device with excellent luminescence and good heartfelt, & can reduce the manufacturing cost and at the same time improve its productivity. In the foregoing method, the step of preparing the electrically excited photocell may include the following steps. A carrier transporting layer forming step is used to form the carrier transporting layer on the substrate with the electrode; and a light emitting layer. The forming step is used to form a light emitting layer on the carrier transporting layer; the aforementioned washing step may be performed before and / or after at least one of the carrier transporting layer forming step or the light emitting layer forming step. Also, in the foregoing method, the step of preparing the electrically excited photocell may include the following steps, that is, a light-emitting layer forming step for forming the light-emitting layer on the substrate with an electrode; and a carrier transport The layer forming step is used to form a carrier transporting layer on the light-emitting layer. In addition, the aforementioned washing step may be performed in at least one of the carrier transporting layer-forming step or the light-emitting layer forming step and after A or . This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -16- < Please read the notes on the back before filling this page) -1 ----- It! — —! — · B7 B7 Consumption cooperation by employees of the Intellectual Property Bureau of the Ministry of Economic Affairs. Du V. Description of the invention (l4) According to the method described above, when the carrier wheel or light emitting layer is formed, supercritical fluid is used before and / or after the formation step. Such a cleaning step can greatly improve the cleanliness of the interface between the substrate with the electrode or the electrode and the carrier transport layer or the light-emitting layer, thereby reducing the carrier (electron or hole) injection by the electrode. The barrier of time, and EL display with good luminous intensity is manufactured. In the aforementioned method, the electro-excited photocell manufacturing step has a bonding step 'to bond the substrate with the electrode and the opposite substrate paired therewith; and' the washing step may be performed in the step Performed before and / or after the bonding step. In the foregoing method, the carrier transporting layer may be configured as a hole transporting layer or an electron transporting layer. In the aforementioned method, a resin substrate may be used as the electrode-attached substrate and the opposite substrate. The manufacturing method of the FP display in the present invention does not require a drying step at high temperature because the cleaning process is performed with a supercritical fluid or the like, and the surface of the resin substrate is not deteriorated. Therefore, a resin substrate β can be used for the aforementioned substrate with electrodes and the opposite substrate, thereby making it possible to produce a display device with excellent display characteristics and lighter weight. Also in the aforementioned method, the supercritical flow bi- or subcritical fluid can be used for carbon dioxide in a supercritical state. The critical temperature of carbon dioxide exists near normal temperature 'and has a moderate critical temperature and critical pressure when it is in a supercritical state. Also, the two carbons are non-toxic or corrosive to the human body and non-combustible. Therefore, since the aforementioned halogenated carbon has excellent usability, it is expected to improve its workability and the like. This paper is scaled with paper towels (cNs) A ^ ig 297 mm) Packing -------- Order --------- Line (Please read the precautions on the back before filling this page ) -17- 469529 A7 B7 _ V. Description of the invention (l5) In the foregoing method, the washing step may be performed by supercritical fluid or subcritical fluid for the next washing. In addition, under the same amount of cleaning material, the multi-stage washing method using multiple washings with supercritical fluids is more effective than washing when the supercritical fluids are stored one time at a time. Increasing its cleaning efficiency, and being able to remove surface contamination of the substrate. (4) Organic matter removing device In order to solve the aforementioned problems, the organic matter removing device on the substrate of the present invention is a device for removing organic matter existing on the substrate, which includes: a reaction tank for containing The substrate is removed by supercritical water or subcritical water gasification; a supply member is used to supply water to the reaction tank; a pressure control member is used to pressurize the inside of the reaction tank to the water A temperature above the critical pressure; and a temperature control member for heating the inside of the reaction tank to a temperature above the critical degree of the water. The removal device 'with the aforementioned structure can remove organic matter existing on the substrate by supercritical water or subcritical water oxidation. In addition, because no harmful substances are used, and the safety of the operation can be ensured when removing organic matter, and because no hazardous substances are contained in the waste liquid, simple waste liquid treatment can be performed without adversely affecting the environment. In the aforementioned structure, the reaction tank may be configured as an airtight container having a pressure resistance of at least 220 atmospheres and a heat resistance of 375 ° C or more. Also, in the aforementioned structure, the reaction tank can simultaneously hold the substrate inside it for several months *, thereby removing organic matter from multiple substrates at the same time to improve production efficiency. (5) Manufacturing device for display device The paper size is generally Chinese National Standard (CNS) A4 specification (210 X 297 mm> < Please read the precautions on the back before filling this page) Installation -------- Order ·, 1 — * '--- • Line ί Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -18-Printed by the Consumers' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of Invention (16) Also, in order to solve the aforementioned Question 'The manufacturing device of the display device of the present invention has a cleaning device for cleaning a substrate, and the cleaning device includes: a holding member' for holding the substrate; a cleaning tank, For enclosing the substrate held by the holding member and cleaning the substrate with a supercritical fluid or a subcritical fluid; and a supply member for supplying the supercritical fluid or the subcritical fluid to the cleaning Slots. With the aforementioned structure, the main net device is manufactured. Because supercritical fluid is equal to atmospheric pressure, phase changes such as immediate vaporization of the surface of the substrate will occur, so 'the substrate can be cleaned and no cleaning material remains on the substrate. That is to say, the manufacturing device of the display device with the foregoing structure has a washing device that does not require a washing treatment or a drying treatment after washing, and can prevent the residue of washing substances during washing, thereby reducing the manufacturing cost. , And at the same time can produce a house with excellent display nickel exhibition. In the aforementioned structure, one of the features of the supply member is a storage component for storing the supercritical fluid or subcritical fluid. In the aforementioned structure, the storage module is provided independently. If it is a structure communicating with the cleaning tank ', the cleaning tank can be supplied in a timely manner in a critical state close to that in the storage module. Brief Description of Others The other objects, features and advantages of the present invention will be fully understood by the following description. It is believed that the advantages of the present invention will be understood after successively explained with reference to the drawings. FIG. 1 is a manufacturing flow chart illustrating the manufacturing steps of the second semiconductor device of the present invention. The size of this paper is applicable to the national standard (CNS) A4 specification (2) 0X 297 mm. -19 · I —----— —ill — — ---------- IIIII i III {Please read first Note on the back, please fill out this page again) 46 95 2 9 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (Π) Figure 2 illustrates the manufacturing steps of the display device according to the second embodiment of the present invention Manufacturing flow chart. Fig. 3 is a manufacturing flowchart illustrating the steps of manufacturing the array substrate in the manufacturing steps of the liquid crystal display device of the second embodiment. FIG. 4 is a manufacturing flowchart illustrating the manufacturing steps of the liquid crystal cell in the manufacturing steps of the liquid crystal display device. Fig. 5 is a manufacturing flowchart illustrating the manufacturing steps of the substrate with electrodes in the manufacturing steps of the electroluminescent display device of the second embodiment. Fig. 6 is a manufacturing flowchart illustrating the manufacturing steps of the EL cell in the manufacturing steps of the electroluminescent display device. Fig. 7 is a schematic description of a photoresist removal device according to a first embodiment of the present invention. The eighth embodiment is a schematic sectional view showing a state where gate electrode and gate metal film images for gate wiring are formed on the glass substrate t in the first embodiment. Fig. 9 is a sectional view showing a state in which a gate electrode and a gate metal film ring image for gate wiring are formed on a glass plate in the first embodiment. Fig. 10 is a cross-sectional pattern circle illustrating the second lithography. Imaging step in the first embodiment. The eleventh circle is a sectional pattern 囷 in which TF / Γ is formed in the first embodiment. FIG. 12 is a cross-sectional view illustrating the third lithography imaging step in the first embodiment. ， -------- line ί (Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 χ 297 mm) -20 · Description of the invention (18 FIG. 13 is a cross-sectional view of a state where a transparent electrode (image group and protective film is formed on a TFT) is formed in the first embodiment. Fig. 14 is a schematic sectional view showing a liquid crystal display device according to a second embodiment of the present invention. Fig. 15 (a) is a fluid circuit in a cleaning device according to a third embodiment of the present invention, and Fig. 15 (b) is a diagram of a fluid circuit in another cleaning device according to the third embodiment of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION [First Embodiment] An embodiment of a method for manufacturing a semiconductor device according to the present invention will be described in the first paragraph. The method for manufacturing a semiconductor device according to the first embodiment is characterized in that the photoresist removal step in the lithography imaging step is a gasification removal of photoresist by supercritical water or subcritical water to replace the past photoresist peeling Liquid for photoresist peeling. Thereby, a semiconductor device can be manufactured by removing unnecessary photoresist at a low temperature without compromising the characteristics of the device and removing pollutants. The "lithographic imaging step" means a microfabricator who transfers an image of an LSI to a semiconductor substrate. More specifically, it refers to a series of processes including a film formation step of a circular image target, a coating step green, an exposure step, an image step, a lasting step, and a photoresist removal step. In addition, this step can be performed by means of photolithography, X-ray lithography, electron beam lithography, and ion beam lithography, depending on the material of the photoresist or the radiation source used for exposure. In addition, the paper formed on the substrate of the kitchen image North-standard ^ 's service body is suitable for Chinese national standard specifications (2〗 0 X 297 mm) ------------- -Packing— (Please read the precautions on the back before filling in the clothing page) -JST · LINE_Printed by the Employee Consumption Cooperative of the Intellectual Property Bureau of the Ministry of Economy-21- Printed by the Employee Consumption Cooperative of the Intellectual Property Bureau of the Ministry of Economy: i 6 9 5 2 9 A7--B7 _ V. Description of the invention (19) Those who will be micro-machined into a predetermined shape. The method for forming the film in this step can be performed by various methods known in the past, and is not particularly limited. This coating step is used to coat a photoresist on a semiconductor substrate. This step can use various coating methods known in the past, specifically, for example, a rotation method or a rolling method. The photoresist is not particularly limited as long as it uses a photosensitive resin that is sensitive to light (visible light, ultraviolet rays), x-rays, electron beams, and ion beams. The photoresist can be a negative photoresist that becomes insoluble due to bonding at the light, or a positive photoresist that becomes soluble by light reaction. Also, for the H photo step, a mask exposure method such as The photomask exposure method is a person who exposes a photoresist formed by coating by using a photomask that has a predetermined shape after being imaged. Also, if a photomask is not used as an intermediary, a direct exposure method can also be adopted, and the -based connection method directly irradiates the electron beam on the photoresist to depict the person. The development step is a method of forming a latent image generated by photoresist by exposure to image the photoresist to form a predetermined shape. In addition, the developing method in this step can be a masking method known in the past. In addition, the etching step is used to form a circle image on the surface of a semiconductor substrate or a thin film surface provided on a semiconductor substrate, and The area where the photoresist used as the mask (Ma & kl) is not formed is applied to a chemical or physical toucher. Also, the etching method in this step can be a conventional method such as dry etching or wet etching The photoresist removal step is the main part of it, and I am surprised to see that the super Xuejie water is oxidized. This step is the final step in this step. The purpose is to remove the photoresist. (210 X 297 public meals) --------- I--ΐ ----- HI --- 1 ----- ^ ^ (Please read the Jiang Yi matters on the back before filling in this page > -22 · B 'B' Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (20) Because supercritical water can completely oxidize and decompose organic matter by its oxidation effect, there will be no light. Residual fisheries occur. In the past, when the photoresist was peeled off with a photoresist stripping solution, After the photoresist is peeled off, the object will still remain and constitute a source of pollution. Conversely, the method of removing with supercritical water 'if the semiconductor substrate is taken out to atmospheric pressure, the supercritical water will be immediately removed from the surface of the semiconductor substrate. It will not cause residue. As a result, the characteristics of the transistor can be more stable. In addition, supercritical water also has the solubility to dissolve out substances, so it can play a role in cleaning semiconductor substrates. Therefore, 'not only can remove contaminated substances And it is possible to manufacture semiconductor devices with more excellent safety. ”Here, the so-called supercritical water means those in the supercritical state, specifically, the critical temperature is above 375 ° C, and the critical pressure is 220 atmospheres. Water in an environment above the force. Also, the so-called subcritical water means water in a state before reaching a supercritical state (that is, a subcritical state). Specifically, the water is at a critical temperature of 365 ° C ~ 375 ° C. And the water at the critical pressure of 215 atmosphere pressure to 220 atmosphere pressure. In addition, supercritical water should use ultra pure water with a resistivity of more than 10 million ohms to make it ultra-thin. Critical state or subcritical state. In addition, there are very few impurities contained when the resistivity is 10 million ohms or more. As a result, the impurities remaining after removing the photoresist can be sufficiently suppressed. Also, in the photoresist removal step, An oxidant can be added. This can promote the oxidization of organic matter and save a dose-it can be used in the past, and is not particularly limited, such as oxygen. Chemical damage, damage to the substrate, so this paper size applies to China National Standard (CNS) A4 (210x297 mm) -23- ------------ installation ----- ---. Order --------- line (please read the notes on the back before filling this page) The Ministry of Economy knows "Printed by the Consumer Property Cooperative of the Intellectual Property Bureau 469529 A7 V. Description of Invention (21) Appropriate It is necessary to set the type of the oxidant or the conditions for its addition. When the supercritical water system is generated in stages and contains oxygen in the atmosphere, it is not necessary to consider the addition of the oxidant. [Second Embodiment] An embodiment of the display device of the present invention will be described with reference to the second circle to the sixth circle. The manufacturing steps of a display device basically include a substrate manufacturing step, which is used to form electrodes and the like to make a pair of substrates; a cell manufacturing step is used to make the pair. The substrates are adhered to form a cell; and a module manufacturing step, which is used to set a medium moving circuit for driving the cell. In addition, the manufacturing method of the display device according to the second embodiment is characterized in that: when a predetermined element image is formed by a micro-imaging method in the substrate manufacturing step, oxidation is performed with supercritical water or subcritical water to Remove the photoresist, and replace those who used the photoresist stripping solution to remove the photoresist in the past, so that the unnecessary photoresist can be removed at low temperature without compromising the characteristics of the device, and the pollutants can be removed to make the display . The supercritical water and subcritical water are omitted in the detailed description because they are prepared in the first embodiment. The manufacturing method of the display device according to the second embodiment is further characterized in that in the cell manufacturing step, the substrate is cleaned with a supercritical fluid or a subcritical fluid to replace the previous pure water cleaning. This can not only reduce the number of manufacturing steps and reduce the manufacturing cost, but also will not cause the surface of the object to be cleaned (ie, the substrate) to be deteriorated, and it can prevent the residue of the cleaning material during cleaning. This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 cm) ------------ {板 -------- Order --- ^ ---! Line ^ (Please read the notes on the back before filling this page) -24- Economic Bank Wisdom ^-Printed by the Consumer Bureau of Industry Bureau A7 __ ____B7_ _ V. Description of the Invention (22) and 'The cell production steps Cleaning of substrates using supercritical fluids, where the so-called supercritical flow system means cleaning substances in a supermarine state, more specifically, it means' a state where the gas phase and the liquid phase coexist, The temperature and pressure are increased beyond the critical temperature Tc and the critical pressure pc, so that the gas-liquid interface disappears, and a single-phase fluid with rich fluidity is formed. In addition, the supercritical fluid has an approximate liquid density and a gas-like large diffusion constant. This is the main reason why the supercritical fluid has a strong dissolving power. In short, when using one medium to dissolve other substances, the two main reasons for the large dissolving power are the large number of molecules in the medium and the large penetrating power of one molecule. The aforementioned subcritical flow system means a cleaning substance in a subcritical state, and more specifically, it means a fluid in a state before reaching a supercritical state. Also, the aforementioned cleaning materials can be materials known in the past, and there are no particular restrictions. For ships, carbon dioxide (Tc = 3l «C, pc = 75 3x〗 5pa), Bingxuan (Tc = 96.7 ° C) , Pc = 43'4xl05Pa), ethylene (Tc = 9.9 ° C, Pc = 52.2M05Pa) and the like are taken as examples. Herein, in the present invention, co2 + e can be selected as a cleaning substance. Because the critical temperature of CO2 is lower than that of other materials that can be used as cleaning materials, and it has a moderate critical temperature and critical pressure in a supercritical state. In addition, because CO2 is non-toxic to human Zhao and non-combustible, it has excellent usability. In addition, the substrate can be made of various conventionally known objects, and is not particularly limited. In particular, when a resin substrate is used, there have been inconveniences such as deterioration of the surface of the substrate when the substrate was cleaned with a detergent. However, such a problem is not caused by using a supercritical fluid today. Therefore, even a resin substrate is suitable for cleaning processing. In addition, the resin substrate is not particularly limited. Even if a thin film made of a polymer or the like is formed on the surface, as mentioned above, the national paper standard (CNS) A4 (210x297) is applied because of the paper size of supercritical fluid. ) ------------- Installation -------- Order --------- Line (Please read the precautions on the back before filling this page) • 25. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 469529 A7 ______B7_ V. Invention Description (23) The film will not deteriorate, so it is still suitable for cleaning. In addition, in the past cleaning methods, since a heat treatment or the like is required to remove the remaining cleaning agent, the substrate used must have a certain degree of heat resistance. However, when carbon dioxide having a critical temperature close to normal temperature is used as the cleaning material, It is suitable for use even on substrates with low heat resistance. In addition, the aforementioned washing step may be one in which washing is performed multiple times with a fluid such as ^ 6 ^. At this time, even if an equal amount of supercritical fluid is used, the method of washing in multiple times can increase the washing efficiency more than the method of storing for a predetermined time at a time during washing. Thereby, the surface contamination of the substrate can be more removed. In addition, the invention of the second embodiment can be used to remove photoresist by oxidation with supercritical water and the like, and the substrate can be cleaned by supercritical fluid or other methods. Either. Hereinafter, specific examples of the display device, that is, the manufacturing method of the LCD and the ELD will be described. [Liquid Crystal Display] FIG. 3 is a manufacturing flowchart illustrating the manufacturing steps of the array substrate. In the LCD manufacturing method, the substrate manufacturing step can be divided into an array substrate manufacturing step and an opposite substrate manufacturing step. An array substrate manufacturing step means a series of processes such as forming an oxide on a substrate; pixel electrodes such as Indium Tin Oxide) or TFTs. In the array substrate manufacturing step, the lithography imaging step is usually performed when a TFT or a pixel electrode is to be formed. The lithography imaging step is performed repeatedly after forming a thin film on a substrate (thin film forming step) when the thin film is to be imaged to have a predetermined shape. Therefore, the main full element of the present invention is to take the Lin_Jie Shuijin --------; --- h --- ^ equipment ------- order ------------ -线 # (Please read the precautions on the back before filling in this page> This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 26-

Employees of the Smart Forest Products Bureau of the Ministry of Economic Affairs " Printed by Cooperatives V. Invention Description (24) The photoresist removal step can be performed at least one or all of the lithography imaging steps in each stage of the array substrate manufacturing step. Do it. In this way, the photoresist removal step can be performed using supercritical water in the array substrate manufacturing step, and the photoresist can be oxidized and removed at low temperature, so it can avoid damaging the TFT characteristics. It can be at a lower processing temperature than 400t and will not damage the TFTf. 5 In the past, when the photoresist was peeled off with a photoresist stripping solution, impurities contained in the stripping solution would remain after the photoresist stripping. It constitutes a source of pollution. The contamination of the impurities will cause the characteristics of the sum and the like to appear unstable, which will lead to a decline in display quality. On the contrary, if the method of removing with supercritical water is used ', if the substrate is taken out to atmospheric pressure, the supercritical water will be immediately vaporized from the surface of the substrate, so no residual β will be caused. This results in more stable TFT characteristics. Since 'supercritical water' has solubility to dissolve substances, it can exert a cleaning effect on the substrate. Therefore, not only the pollutants can be removed, but also a display device having more excellent stability can be manufactured. It is to be noted that the above-mentioned cell manufacturing step is equivalent to the liquid crystal cell manufacturing step. This step more specifically means that an array substrate with pixel electrodes or TFTs, such as IT0, and an opposite substrate with opposite electrodes or color filters, etc. are used as starting materials, and a subsequent series of place dragging is performed. By. Specifically, as shown in the fourth circle, first, an array substrate prepared by the array substrate manufacturing step is prepared, and then the array substrate is coated with an alignment film material, and then dried and fired to form a predetermined film thickness. Alignment film (alignment film formation step). In addition, using the same method described by Ao Yu, an alignment pattern is formed on the opposite substrate produced in the opposite substrate production step. This paper size applies to China National Standard (CNS) A4 specifications (2〗 0 X 297 mm) I— II — --- I --- I ^ II! IJII {Please read the precautions on the back before filling this page) -27- A7 469529 _____B7 _ V. Description of the invention (25) Secondly, the alignment film formed on the array substrate and the opposite substrate is subjected to an alignment treatment by a method such as a polishing treatment (after the alignment processing step, the array substrate or the opposite substrate is subjected to any After one side is printed with a thermosetting sealant, the spacer material is spread. Then, the sealant is applied in the shape of a frame-shaped circle without a liquid crystal injection port. Then, the alignment films are opposed to each other and the two substrates are bonded together. 'The sealant is heated to harden it to form an empty cell (combination step). Then,' the liquid crystal injection port is sealed after the liquid crystal material is injected into the empty cell by a vacuum injection method, etc. 'to make a liquid crystal cell (Liquid crystal injection step). Then, a driving circuit and the like (module step) are installed in the liquid crystal cell to make the LCD of this embodiment. Here, the cleaning steps constituting the main part of the present invention can be performed as described above. It is carried out before the film formation step. At this time, the purpose of the cleaning step is to dissolve and remove dust, organic substances, and the like attached to the substrate of the queue. In the past, the liquid system cleaning method must be sequentially washed after the cleaning process. Steps and drying steps, for example, when cleaning with pure water, a drying step or a water removal step must be performed to remove the pure water remaining on the substrate. However, the supercritical fluid cleaning method requires the substrate to be removed from the cleaning tank to At atmospheric pressure, supercritical fluids and the like are immediately vaporized from the surface of the substrate, so no cleaning material remains. Therefore, it is possible to form improved alignment films such as film-forming and adhesion on the surface of the substrate. It will degrade the ITO, TFT, etc. formed on the substrate, so it will not reduce the display quality. Also, the aforementioned cleaning step can also be performed after the alignment film formation step. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm)

If-- | — — I— ^ --- ml II (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economics -28 A7 _________B7___ V. Description of the invention (26) As mentioned above, cleaning with supercritical fluid etc. does not deteriorate or degrade the alignment film, and does not leave any cleaning material, so it can prevent the alignment of the alignment film from decreasing and dissolving. Remove pollutants. As a result, it is possible to suppress the occurrence of white turbidity such as the display of the black part becoming lighter or to align the flow phenomenon, and to produce a liquid crystal display with excellent display characteristics. Also, since a dry welding step after washing is not required, the number of manufacturing steps can be reduced. At the same time, it can also reduce manufacturing costs. Furthermore, the aforementioned washing-direction treatment step is performed. This can sufficiently remove dust (such as swarf of an alignment film, etc.) generated during a grinding process (that is, an alignment process) without deteriorating the alignment plutonium. Therefore, 'the alignment film can be prevented from being deteriorated even if it is cleaned after the alignment treatment, (oblique dislocation; there are very few images, and it is possible to suppress the occurrence of white turbidity such as lightening of black parts or alignment flow.' The drying steps required in the liquid system washing method can not only reduce the number of manufacturing steps, but also reduce the manufacturing cost. Also, the aforementioned washing step can also be performed after the bonding step to clean the air cells. As can be seen from the foregoing, heat treatment is required in the bonding step to thermally harden the sealant, and during heat treatment, the volatile components of the thermosetting sealant will adhere to the substrate and cause pollution, and during bonding, dust, etc. It will also invade into the empty cell. Also, the inside of the empty cell is used to remove pollutants or dust, and even if it is washed into the empty cell, there is a high possibility that the detergent will remain in the empty cell. Inside the cell, there is a problem of deterioration of display performance such as white turbidity of the display screen. Due to the above-mentioned prime minister's reason, the previous cleaning treatment could not be performed in the empty cell. However, Yu Chao In the international fluid cleaning method, because the paper is in a supercritical state, the Chinese National Standard (CNS) A4 specification C297 is applicable. 111 II-IIII 1 II ^ III-I — II (Please read the precautions on the back before filling (This page) -29- 4 6 9 5 2 9 A7 ___ B7 V. Description of the invention (27) The cleaning substance in the state (27) is not only low in viscosity, but also highly diffusive, even for the parts that cannot be used for liquid system detergents. Can also easily penetrate. Therefore, the washing substances existing inside the empty cells can be easily removed. In addition, since the supercritical fluid will immediately vaporize under normal pressure, it will not remain inside the empty cell, and a display device with better display performance can be manufactured. Also, the 'empty cell' is a structure that is made under the precise design and control of cell gaps and does not allow free deformation. In addition, when the present invention uses, for example, C02 as a cleaning substance, as described above, 31 ° C 'is near normal temperature, so that the space cell does not generate excessive thermal stress during cleaning and deformation due to thermal stress does not occur. The reason is that it does not cause uneven cell gaps in the plane of the empty cell substrate, and produces a liquid crystal display with good display characteristics. The cleaning step may be performed after the liquid crystal injection step. This can remove liquid crystal contamination attached to the surface of the flat panel or the liquid crystal injection port when liquid crystal is injected. [Electro-excited light display_device_] Although the stacked structure of pong LD has many different aspects, but basically its structure is to stack the anode, carrier transport layer (hole hole transport layer or electron transport layer) on the substrate, Light emitting layer and cathode. Secondly, in the method, the step of making a substrate with an electrode means that one of the anodes formed by 丄 on the substrate is driven away from the vehicle. In addition, in addition to the foregoing layers, a single layer or a plurality of other layers, such as an electron transport layer, may be included as necessary. In addition, in addition to the aforementioned necessary structures, all the techniques of ^ paper-dividing H-type elements can be used. . This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 Public Love) (Please read the precautions on the back before filling this page) Packing! ----Order-! | Line ί Intellectual Property of the Ministry of Economic Affairs Printed by the Bureau ’s Consumer Cooperatives • 30- V. Invention Description (28) ί I ----------- Install i I (Please read the precautions on the back before filling this page) Also, attached In order to image the substrate such as the anode in the manufacturing step of the electrode so as to have a desired shape, a lithography imaging step (refer to Section 5) must be performed. Secondly, critical water is supplied in this microdisk imaging step. The photoresist removal step can prevent the contamination remaining from the impure substances contained in the stripping solution after the photoresist is peeled off with the photoresist stripping solution in the past. Therefore, 'it will not be visible to the naked eye on the display screen. Black dots, etc., can produce ELD with excellent display characteristics. Also, 'the cell production step means that the substrate with an anode and other electrodes is used as the starting material to perform a subsequent series of processors' will be described in detail below. Figure 6 illustrates the manufacturing steps of ELD First, the substrate-attached electrode with an electrode such as ITO is formed on the substrate with the steps of making the substrate with the electrode n. The film of the hole transporting layer (ie, the carrier transporting layer) is formed on the substrate with the electrode (the carrier transporting layer forming step). It is printed by the consumer cooperative of the Smart Forestry Product Bureau of the Ministry of Economic Affairs and then 'formed on the hole transporting layer. A light-emitting layer (light-emitting layer forming step) having a light-emitting function. The method for forming the light-emitting layer can be a method known in the past, such as a vapor deposition method, a spin coating method, a casting method, and a LB method. The light emitting layer is formed. Next, a cathode (electrode) formed of, for example, aluminum is formed on the light emitting layer by a method known in the past to make EL cells. Alternatively, after forming the cathode, The substrates with electrodes are paired with the opposite substrates attached to the cathode side * to become the most efficient EL cell to save electricity, electricity, roads, agricultural branches, and equipment. Installed on the EL cell (module step). Paper size applicable to China Standard (CNS) A4 (2J〇X 297 mm) A7 6 95 2 9 ^ ------ B7____ V. Description of the invention (29) Production of the ELD of this embodiment »Here, the aforementioned washing steps can be called It is performed before the formation of the hole transporting layer. At this time, the purpose of the cleaning step is to dissolve and remove dust, organic substances, etc. attached to the substrate. In addition, since the supercritical fluid is equal to atmospheric pressure, it will not be gasified, so it will not Residual cleaning material. Therefore, the cleanliness of the interface between the anode and the hole transport layer will be improved, and the barrier when the hole is injected by the anode can be reduced. As a result, the luminous intensity can be improved. Also, the aforementioned washing step is also "The purpose of this step is to remove adsorbed water existing on the surface" may be performed after the carrier transporting layer forming step. The aforementioned washing step may be performed after the light emitting layer forming step. Thereby, the cleanliness of the interface between the light emitting layer and the cathode can be improved ', and the barrier when electrons are injected from the cathode can be reduced. Therefore, 'can increase the luminous intensity. In addition, the aforementioned washing step may be performed after the laminating step in which an electrode-attached substrate and an opposite substrate are attached to form an EL cell. In this way, the supercritical fluid cleaning method in the production of EL cells will make the interface between the anode or cathode and the hole transporting layer or the light-emitting layer appear clean, thereby increasing the light emission intensity. In the past cleaning methods (pure water, etc.), water and the like remained on the surface of the substrate. However, in the present invention, since the supercritical fluid is vaporized immediately at normal temperature and pressure, no cleaning material remains. Therefore, no black spots visible to the naked eye are generated on the display screen, and _E1D with excellent display characteristics can be manufactured. Moreover, since no drying step is required, the number of manufacturing steps can be reduced 'and the manufacturing cost can be reduced. Also, "this embodiment 2", that is, the manufacturing method of the above-mentioned LCD or ELD, is also applicable to a manufacturing method including similar steps with some differences. For example, this paper size is applicable to China National Standard (CNS) A4 specification {210 X 297 public love) -------- U ---- ^ Installation -------- Order V --- One ----- 线 {ί /-\ (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs -32- Printed by the Ministry of Economic Affairs; A7 ____B7___ -------- 5. Description of the invention (30) In the ELD, when the electron transport layer is used as the carrier transport layer, after the light emitting layer forming step of forming the light emitting layer on the substrate on which the cathode is formed A carrier transporting layer forming step of forming an electron transporting layer on the light emitting layer is performed, and further, an anode is formed on the light emitting layer to make an EL cell. At this time, the aforementioned washing step may be performed before and / or after at least one of the light-emitting layer forming step and the carrier transporting layer forming step. In addition, according to the structure of each layer such as the carrier rotation layer and the light emitting layer, the aforementioned washing step may be performed before and / or after the at least one of the steps in a timely manner. In the following, any element such as + of the present invention will be described in detail as long as it does not exceed the gist of the present invention, and the application of the present invention is not limited to the following embodiments. (Example 1) First, 'a glass substrate 1 which has been cleaned in advance and has transparency is prepared, and then an undercoating film made of silicon dioxide (SiO2) is formed on the glass substrate 1 by a CVD method. 2'The lower jaw Buchan | 0.4 microns. Next, an amorphous silicon (i-type 3_51) film 3 to be a semiconductor film without impurities is formed on the lower coating film 2 by a plasma CVD method, and the film thickness of the amorphous silicon film 3 is 50 nm. Then, a closed-electrode insulating film 4 made of a SiNx film is formed on the amorphous silicon film 3 by a plasma CVD method. The thickness of the inter-electrode insulating film 4 is 150 nm. Next, a gate electrode (not shown) made of an Al-Zr (97: 3) alloy and a closed-gate wiring metal for gate wiring are formed on the gate insulating film 4 by sputtering in a vacuum state. The film image 5 has a film thickness of about 200 nm. Next, the photosensitive material with a thickness of 1.5 micrometers is rotated by rotation. {Product size of this paper applies the Chinese National Standard (CNS) A4 specification < 210 X 297 mm)

In! -------- I · ----— I — -jiT --- I ----- " 5 ^ (Please read the back of the page; i-notes before filling out this page)- 33- 469529 A7 ___ B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of invention (31). TFR-890 [Tokyo Chemical Industry (Shares)] or trade name: pFI37A [Sumitomo Chemical Industry (Shares) Manufacturing] 丨 coated on the glass substrate 1 to form a photoresist (coating step). After that, the photoresist film is pre-baked, and then exposed through a photomask (exposure step), and the exposure condition is an irradiation intensity of 100 mJ / cm2. Then, the developed photoresist film is developed with a special developing solution (development step). Thereby, the first photoresist image 6 shown in Fig. 8 can be formed. Next, using the i-th photoresist image 6 as a cover (), the gate electrode and the gate wiring metal film image 5 for the idler wiring are selectively etched. Then, the first photoresist image 6 formed on the glass substrate 1 is removed by a photoresist removal device 50 shown in item 7 (photoresist removal step). The specific steps are described below. In this embodiment, ultrapure water is used as a cleaning substance. First, the specific structure of the 7th gL ^ L ^ L ^ _ resistance removal formula will be described. The photoresist removing device 50 of this embodiment is configured to have: a reaction tank 51; a supply member 52 for supplying ultrapure water 53 to the reaction tank 51; a separation tank 56 for connecting to the Those in the reaction tank 51; a pressure control member 54 for controlling the pressure inside the reaction tank 51; and a temperature control member 55 for controlling the inside of the reaction tank 51. The reaction tank 51 can accommodate 5 glass substrates spaced at a distance of 10 mm, whereby multiple glass substrates 1 can be processed at the same time, thereby improving productivity. In addition, the reaction tank 51 has a pressure-resistant airtight structure capable of withstanding a pressure of 220 atmosphere pressure or more by the pressure control member 54. The reaction tank 51 is made of a heat-resistant material that can be heated to a temperature of 375 ° C or higher with the temperature control member 55 (please read the precautions on the back before filling this page). Standards are applicable to China National Standard (CNS) A4 specifications (2〗 0 X 297 mm). • 34- Printed by the Consumer Cooperatives of the Smart Bed Industry Bureau of the Ministry of Economic Affairs " A7 B7_ V. Description of the invention (32) The separation tank 56 is The pressure valve 57 is connected to the reaction tank 51. In addition, the separation tank 56 is provided with: a recovery vacuum pipe 58 for discharging pollutants; and a discharge pipe 59 for discharging from a supercritical state or a subcritical state to gas. Those in the phase state. With the photoresist removal device 50 having the above-mentioned structure, the first photoresist image 6 is removed as described below. That is, five glass substrates on which the first photoresist image 6 has been formed are firstly removed. 1 is placed inside the reaction tank 51. Next, the inside of the reaction tank 8 is filled with ultrapure water (resistance coefficient 12 million ohms or more) supplied by the supply member 52, and then the pressure control member 54 is pressurized to 250 atmospheric pressure and The temperature control member 55 is used to heat up to 400, so that the ultrapure water is in a super-pro State. Maintain this state for minutes to carry out > photoresist removal treatment. By doing this, Ua fg can be removed by oxidative decomposition of supercritical water; like 6. Then, 'the foregoing gate electrode and gate wiring are used for The gate wiring metal film image 5 is immersed in an electrolytic solution formed of ammonium borate (pH = NOA), and anodized, so that the gate wiring metal film image 5 is exposed to the outside (ie, upper and side) to form Al2O3 is an anodized insulating film 7 as a main component. The 'anodized insulating film 7 is used as a mask, and the gate insulating film 4' is etched to form a gate insulating film circular image 4 '( Referring to FIG. 9 here, the gate insulating film 4 may also be the first photoresist image 6 that is not removed as a mask for etching, but it is suitable to form the anodized insulating film 7 before etching the gate. Insulation film 4 'to prevent undercuts under gate anodized insulating film 7 of gate wiring metal film image 5 for gate electrode and gate wiring. This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm> --------- I I--install -------- II order------- line (please read first Note on the back, please fill in this page) • 35- 4 95 29 Printed by A7 B7, Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (33) The user's deposit is about 50nm by CVD method. A filled (n-type impurity) amorphous silicon (n + a-Si) film 8. A contact electrode metal film 9 made of Ti metal is formed by a sputtering method, and the thickness of the contact electrode metal film 9 is 100 nm. Next, a metal film made of Al-Zr on> with a film thickness of about 200 nm was formed by continuous vapor deposition. Next, a photoresist material is coated on the metal film, and then exposed through a photomask 'to form a second photoresist image II. In addition, an Al-Zr film, a contact electrode metal film 9, an n + a-Si film 8 and an i-type a-Si film 3 are sequentially etched using the second photoresist image 11 as a mask. Next, the second photoresist pattern is removed by 'oxidation' in the same manner as in the case of the first photoresist circular image 6. Thereby, the A1 · Zγ film can be imaged into a predetermined shape to form a metal film 10a for source wiring and a metal film 10b for drain wiring. That is, a bottom-gate TFT 12 (refer to FIG. 1) composed of an i-type a_Si film 3, an n + a-Si film 8, a contact electrode metal film 9, a source wiring metal film 10a, and a drain wiring metal film 10b can be formed (see (Figure 11). Next, a transparent electrode film 13 made of an indium tin oxide film (ιτο) is formed by evaporation on the undercoat _ flag_ 2 and the TFT 12 by a sputtering method, and the film thickness is 100 nm. Next, the transparent electrode film 13 is coated with a photoresist material, and then subjected to #light via a photo leather to form a third photoresist image 14. Next, the third photoresist image 14 is etched as a mask. The same photoresist image as in the first photoresist image 6 described above is oxidized and decomposed to remove the third photoresist image 14. Thereby, a transparent electrode film image group (pixel electrode) 13 'is formed (refer to Section 12). The removal of the photoresist is the same as the method of removing the photoresist for the first time. Next, a thermally decomposable silazane-based silica is used for the printing and firing method, so as to cover the TFT12 and the transparent electrode 1-2-oxide dream protection I L ---- ^ ^ i ----- ------ I-- {Please read the precautions on the back before filling this page) -36- • Printed by A7 B7, Employee Cooperative of the Intellectual Property Industry Bureau of the Ministry of Economic Affairs V. Invention Description (34) Film 15, The film thickness was 300 nm. Finally, using the silicon dioxide protective film image as a mask, the anode oxide film on the gate electrode metal connected to the external driving circuit is removed by etching. In this way, a TFT array substrate 16 (FIG. 13) which can be used in a transmissive liquid crystal display device is produced. In this way, by performing the above-mentioned series of steps, in this embodiment, a TFT array substrate can be fabricated with three photomasks. In addition, since a photoresist removal process capable of simultaneously placing a plurality of glass substrates in a reaction tank of a photoresist removal device is performed, a TFT array substrate with good mass productivity can be manufactured. In addition, in this embodiment, a lithography imaging step is performed using a glass substrate to explain various cases of removing photoresist, but the same method is used when a silicon substrate is used. Also, the method of this embodiment is not limited to the removal of photoresist, and can also be applied to remove organic contamination on an inorganic substrate. In addition, although the description in this embodiment is a step of exposing with a photomask ', the same result can be obtained even in the direct drawing method of directly drawing an arbitrary image shape with an electron beam without using a photomask. (Embodiment 2) The liquid crystal display element of this embodiment is manufactured by the following method. First, as shown in the fourteenth section, a TFT array substrate 19 is fabricated by the same method as in the previous embodiment 1. Its structure includes: a glass substrate 1; a first electrode group 17 'is formed by forming a matrix-shaped transparent electrode film. And a transistor group 18 for driving the transparent electrode film image group 17 respectively. Here, the 'TFT group 18 has a bottom-gate structure. In addition, 'formed on the glass substrate by conventional methods in accordance with R_G. This paper size applies the Chinese National Standard (CNS) A4 specification (210x 297 mm) -37- --- I -------- • equipment ---- I--Order --------- line (please read the precautions on the back before filling this page) 46952? A7 ------ B7___ 5. Description of the invention (35) B order The formed color filter group 20 and the aforementioned second electrode group are used to fabricate a counter substrate 22 »Then, a solution made of a polyimide resin is applied to the TFT array substrate 19 and a counter electrode by a conventionally known method. After that, the substrate 22 is fired to harden it, and then polished to form a liquid crystal alignment film 23 °. Then, the TFT array substrate is faced with the first electrode group Π and the second electrode group 21 facing each other. 19 is positioned and bonded to the opposite substrate 22 "At this time, a frame-shaped adhesive 24 and a spacer 25 are provided on the TFT array substrate 19 so that the cell gap is approximately 5 microns. Further, the alignment processing direction of the liquid crystal alignment film 23 provided on the TFT array substrate 19 and the alignment processing direction of the liquid crystal alignment film 23 provided on the opposite substrate 22 were intersected to be 90. Angle, and positioned in the state of the crossed Nicols (dark vision). Then, a liquid crystal material is injected between the TFT array substrate 19 and the counter substrate 22 'so as to have a thickness of 90'. The twisted TN aligns the liquid crystal layer 26 to form a liquid crystal cell. Further, in a state where the optical axis direction intersects with Nicols (has a dark field of view), polarizing plates 27 and 27 are respectively provided on the outer sides of the liquid crystal cells. By the above steps, the TN-type liquid crystal display element of Example 2 is completed. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Next, the liquid crystal display element is illuminated with backlight 29 'from the TFT array substrate 19 side, and then the TFT group 18 is driven by the image signal to display the image in the direction indicated by arrow A. Whether it is in a good display state. In this way, the characteristics of the TFT element can be prevented from being impaired, and the π-dye substance can be reduced. In addition, when forming the TFT group 18, it is necessary to form a protective film covering at least the TFT to prevent the TFT from being damaged when the liquid crystal alignment film 23 is formed. Thereby, -38---------- Γ- --j Pack ---- (Please read the precautions on the back of S before filling out this page) This paper size is applicable to China National Standard (CNS) A4 (2) 0 × 297 mm • Employees of the Ministry of Economic Affairs Printed by Consumer Cooperatives A7 B7 V. Description of Invention (36) Create a more reliable liquid crystal display element. In addition, the protective film may be a silicon dioxide film or a silicon oxide film, which is an inorganic substance, in order to improve the protection function and make a liquid crystal display device with higher reliability. In addition, when a metal electrode film having light reflectivity is formed instead of the transparent electrode film as the first electrode group 17, a reflective liquid crystal display element β can be produced (Example 3) The first 15th (a) is the present embodiment Example fluid circuit diagram of a cleaning device "First, prepare a liquid crystal array substrate (array substrate) and a color filter substrate (counter substrate) equipped with electrodes and wiring," and then wash it by a general method (purified water cleaning method) net. Then, the polymer (that is, the precursor of the alignment film) is coated with a printer and then fired to form an alignment film. Here, the polymer used as the precursor of the alignment film was Shang Anbo RN-7992 [transliteration of the trade name; it is a polyimide system and was manufactured by Yusan Chemical Industry Co., Ltd.]. Next, using the cleaning device 40 shown in FIG. 15 (a), a liquid crystal array substrate formed with alignment 臈 and the like and a substrate group composed of color filter substrates (hereinafter also referred to as a substrate group) are washed by a supercritical fluid cleaning method. 32 Wash. The specific step lock will be described below. In this embodiment, C02 is used as a cleaning substance. First, the specific structure of the cleaning device 40 shown in Fig. 15 (a) will be described. The structure of the cleaning device 40 ′ of this embodiment includes: a cleaning tank 31 (the content is 3 liters); a supply member 45 ′ is connected to the cleaning tank 31 via an injection pipe 41; and a separation The tank 37 is connected to the washing tank 31 via the first discharge pipe 42. The washing tank 31 has a pressure-resistant structure capable of accommodating objects to be washed. This paper is fully compliant with the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -------------- --------Order --- 1 --- (Please read the precautions on the back before filling out this page) -39- 469529 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 V. Description of the Invention (37) In addition, the supply member 45 contains: a carbon dioxide cylinder high pressure A gas container 33 is used to supply CO2; a high-pressure pump 34 is used to connect to the carbon dioxide cylindrical high-pressure gas container 33; a heat exchanger 35 is used to connect to the high-pressure pump 34 And an adjusting valve 38 for connecting to the heat exchanger 35. The high-pressure pump 34 has a function of pressurizing the carbon dioxide supplied from the carbon dioxide cylindrical high-pressure gas vessel 33. In addition, the heat exchanger 35 has a function of warming the CO 2 pressurized by the high-pressure pump 34. The regulating valve 38 has a function of controlling the supply of the supercritical state co2i. Further, the separation tube 37 is connected to the i-th discharge pipe 42 through a pressure reducing valve 36, and includes: a recovery vacuum pipe 39 for discharging pollutants; and a second discharge pipe 43 for discharging Co2 who changed from supercritical state or subcritical state to gas phase state. A gas separation membrane [trade name: Airdryer-UM-A5, manufactured by Ube Industries, Ltd.] is provided inside the separation tank 37. The gas separation membrane has a gas of 6xl0.5cc / cm2.sec.cmHg for C02. Transmission coefficient β Then, the washing device 40 having the above-mentioned structure was washed in the following manner. That is, firstly, the substrate group 32 which has been baked and made into an alignment film and assembled in a cassette (tool or holding member) 44 is set inside the cleaning tank 31. Second, the high-pressure pump 34 pressurizes the CO 2 supplied from the carbon dioxide cylindrical high-pressure gas container 33 to a calendar power (35 × 10 5 Pa) higher than the critical pressure of CO 2, and at the same time raises the temperature to a temperature higher than the critical temperature of CO 2 The temperature (40 ° C) to reach the supercritical state. Then, the valve of the regulating valve 38 is opened, and the supercritical flow MC0 2 is supplied into the cleaning tank 31 and allowed to stay for 3 minutes. In this way, pollutants can be precipitated into the supercritical fluid co2, and the size of the private paper used to clean the LCD array substrate is in accordance with China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling in this page)

b ---- ^ 装 -------- Order · --- ·! — First--line I -40- A7 A7

5. Description of the invention (38) and the surface of the ferrule substrate. Then, the supercritical fluid co2 mixed with the pollutants is discharged from the cleaning pipe 31 through the exhaust pipe 42, and the pressure is reduced by a pressure reducing valve, and then sent to the separation tank 37. In the separation tank 37, The supercritical fluid co2 is at a temperature of 9x: and a pressure of 9x105Pa, so a phase change occurs to become a gaseous state. As a result, dissolved pollutants can be precipitated, and co2 can be separated from the pollutants. In addition, if the contaminants in the separation tank 37 are separated, they are discharged out of the separation tank 37 by opening the space between the recovery vacuum tubes 39 '. Next, the alignment films in the cleaned liquid crystal array substrate and color filter substrate are further subjected to a polishing treatment. Then, the liquid crystal array substrate and the color filter substrate are bonded together, and the cell gap is made about 12 μm to make an empty cell. Then, a liquid crystal [trade name: ZLI-4792, manufactured by Merk] is injected into the empty cell through a liquid crystal injection port to produce the liquid crystal cell A of the present invention. Then, the evaluation of the liquid crystal alignment in the liquid crystal cell A of the present invention prepared by the above steps was started. That is, in a state of Nicol (presenting a dark field of vision), the paired polarizing plates are set on the outer side of the liquid crystal cell A of the present invention 'and observed with the naked eye. As a result, no discontinuous field was observed in the alignment of the liquid crystal, and tilting (disclination) was extremely rare. In addition, it shows black, and it is at the liquid crystal injection port; it is almost impossible to see the phenomenon of alignment flow. That is, it can be determined that a liquid crystal cell having very good alignment is obtained. In this way, it can be clearly understood that the alignment film after firing is cleaned with carbon dioxide in a supercritical state, and the display quality can be effectively improved. In addition, the cleaning tank 31 can also have a heating element to apply its internal control paper size to the National Standard (CNS) A4 specification (210 x 297 mm) --------- -I--Equipment --------- 1_ Order · --II--Line < Please read the notes on the back before filling in this page) • Intellectual Property Bureau, Ministry of Economic Affairs, Consumer Consumption Du-41- 469529 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Invention Description (39) Controlled at a predetermined temperature. Further, as shown in FIG. 15 (b), the supply member 45 may have a storage tank (storage module) 46 instead of the high-pressure pump 34 and the heat exchanger 35, and the supercritical fluid may be stored in the second pump. The one between the carbonized cylindrical high radon gas container 33 and the adjustment valve 38. In addition, the storage tank 46 has a pressure-resistant structure, and is provided with a pressure heating member (not shown) for pressurizing the cleaning substance to a pressure higher than the critical pressure of the cleaning substance. Pressure, and at the same time, warm to a temperature higher than the critical temperature of the cleaning substance, so that it is in a supercritical state. With the above structure ', a supercritical fluid can be supplied into the washing tank 31 at a proper time as needed. Also, 'the cassette (tool) 44 as the aforementioned holding member can also be used to hold an empty cell or a liquid crystal cell, whereby the cleaning device of this embodiment can constitute a type of cell that can clean an empty cell or a liquid crystal cell. structure. Comparative Example 1 In this Comparative Example 1, a cleaning process using a water-based substrate cleaning process was performed. By performing the same steps as in Example 3 above, a comparative liquid crystal cell a was prepared. Specifically, 'first' the substrate is set in the cleaning tank 3 1 used in Example 3 ', and then' warm water (ie, detergent) at about 50 ° C is poured 'for 10 minutes for cleaning. After that, the substrate was moved to a desiccator and fully dried at 70 t. A liquid crystal cell a for comparison was produced by performing a series of manufacturing processes including the above washing process. Next, the liquid crystal cell a for comparison was subjected to the same alignment evaluation as in Example 3 described above. As a result, it was found that the phenomenon of tilting (disclination) was serious, and the black part was also lighter. Therefore, it can be confirmed that the phenomenon of alignment flow occurs. That is, compared with the aforementioned liquid crystal cell A of the present invention, the alignment is significantly deteriorated, and the elemental quality of the element is also ^ ----- ^ ---- „---- ^ ^ ----- -I — — ------ (Please read the precautions on the back before filling out this page) -42- A7 A7 Printed by the Employees ’Cooperatives of the Intellectual Property and Smart Industry Bureau V. Invention Description (4〇) Not good. This is because in the drying treatment after washing treatment with water, the water is not completely removed so as to remain, and the alignment of the liquid crystal molecules of the alignment film can be adversely affected. (Compared to the system in Comparative Example 2) Alcohol was used as a cleaning agent instead of water, and the same steps as in Comparative Example 1 were performed to prepare a liquid crystal cell b for comparison. The liquid crystal cell b for comparison was performed in the same manner as in Example 3. Result of alignment evaluation. As a result, although the phenomenon of tilting (disclination) is slighter than that of the liquid crystal cell a used in the comparative example 1, it is more serious than the liquid crystal cell A of the present invention, and the black part is also more visible. It can be confirmed that the phenomenon of alignment flow also occurs. That is, compared with the aforementioned liquid crystal cell A of the present invention, the alignment There is obvious degradation 'and the display quality is also not good. As for why the tilting (displacement obliquely; disclination) phenomenon of the comparative liquid crystal cell b is slighter than the comparative liquid crystal cell a, it is because the boiling point ratio of alcohol The water is low, so the drying process after the washing process can remove more solutions than when the water is removed. In addition, compared with the liquid crystal cell A of the present invention, its alignment is deteriorated and its display performance is lowered because of the wine edge C fog board) The liquid crystal of this embodiment 4 is turned on. The negative electrode 阴 is cleaned before the grinding treatment and washed after the grinding treatment, and is manufactured in the same manner as in the previous embodiment 3. In addition, the liquid crystal cell of the present embodiment manufactured by the above method is hereinafter referred to as the liquid crystal cell 3 of the present invention. The liquid crystal cell B of the present invention is subjected to the same as the foregoing embodiment 3 < Sexual Evaluation ----------- I ---------- Order · ----- I! · ^ · (Please read the precautions on the back before filling this page)- 43- A7 469529 B7_ V. Description of the invention (41) (Jing first read the precautions on the back and then fill out this page> Estimating β results, and found the tilt ( There are very few disclination phenomena, and the black part is also deep, and the phenomenon of alignment flow is almost not seen near the liquid crystal injection port. That is, a liquid crystal cell with very good alignment is obtained. It can be seen that After polishing, washing with supercritical carbon dioxide can effectively improve the display quality. (Comparative Example 3) In this Comparative Example 3, a cleaning process using a water-based substrate cleaning process is performed. The same steps as in the foregoing Example 4 were performed to make a comparative liquid crystal cell c ». Specifically, first, the substrate was set in the cleaning tank 31 used in Example 4, and then, about 50 ° C Inject warm water (ie detergent) and wash for 10 minutes. After that, the substrate was moved to a desiccator and fully dried at 70 ° C. A liquid crystal cell c for comparison was produced by performing a series of manufacturing processes including the above washing process. In addition, the liquid crystal cell c for comparison was subjected to the same alignment evaluation as in the foregoing Example 4. As a result, it was found that the phenomenon of tilting (dislocation) was serious, and the black part was also lighter, which confirmed that the phenomenon of alignment flow occurred. That is, compared with the aforementioned liquid crystal cell B of the present invention, the alignment is significantly deteriorated, and the display quality is not good. Employee Consumption Cooperative Society of the Intellectual Property Bureau of the Ministry of Economic Affairs ## 农 (Comparative Example 4 1 In this Comparative Example 4, alcohol was used instead of warm water at about 50 ° C, and the same steps as in Comparative Example 3 were used to make Comparative liquid crystal cell d. The same alignment evaluation was performed on the comparative liquid crystal cell d as in the previous Example 4. As a result, although the phenomenon of tilting (disclination) was more severe than that of Comparative Example 3 Yiyuan De ^ ― '^ Li yet .... Bee-Ben's ^^ This cell paper is again applicable to China National Standard (CNS) A4 (210 X 297 mm) -44 · Employees of the Ministry of Economic Affairs and Forestry Bureau Printed by the consumer cooperative A7 _____B7________ 5. Description of the invention (42) Yuan B is serious, and the black part is also lighter. 'Alternatively, there is also a phenomenon of orientation flow. That is, compared with the aforementioned liquid crystal cell D of the present invention. The alignment is significantly degraded, and the display quality is not good. (Example 5) This example 5 is to make EL cells, which is different from the liquid crystal cells made in the previous examples and comparative examples. The details will be described below. First, prepare one formed with ITO The transparent substrate of the bright electrode (anode), and then the transparent substrate is cleaned by the supercritical fluid washing method using the aforementioned cleaning device 40. Next, a carrier transport layer is formed on the cleaned transparent substrate ITO. In a nitrogen atmosphere, polyvinyl carbazole and a gas-imitation solution (300 00/101111) were spin-coated (5000 imprints 11 ^ 10 seconds) on a transparent substrate, and then heat-treated at 80 ° C to make the gas imitation It volatilizes. Then, it is baked at 120 ° C for 30 minutes in a nitrogen atmosphere. Thereby, a hole transporting layer having a thickness and complete hardening can be formed. Then, a light-emitting layer is formed on the carrier transporting layer. That is, After being spin-coated (5000 rpm x 10 seconds) on the carrier transport layer, the lyophilized oxygen chelate complex and aeroform (400 mg / 10 ml) were subjected to heat treatment at 800 c to make the gas Imitation volatilization. Then 'bake at 120 for 30 minutes in a nitrogen atmosphere. By this, a fully hardened light-emitting layer can be formed. Then, A1 is vapor-deposited on the light-emitting layer by vacuum evaporation, and A film is formed on the back electrode (cathode) to make the EL cell of the present invention. The EL cells made in the above steps were evaluated for luminescence. That is, a DC pulse voltage (M junction-n I ί ΙIII-I · t IIIIII) was applied between the transparent electrode and the back electrode < read the note on the back first Emperor? Fill in this page again >

Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 6 9 5 2 9 A7 V. Description of the invention (43) If you get a beautiful green light, and almost no black spots are visible Carbon washing can effectively improve the display quality. (Comparative Example 5) This Comparative Example 5 was subjected to a cleaning treatment using alcohol as a transparent substrate formed with ITO, and the same treatment as in Example 5 was performed to prepare a comparative EL cell. The comparison EL cell was subjected to the same light emission evaluation as in Example 5. As a result, not only the brightness was weaker than that of the EL cell of Example 5 but also black spots were observed. That is, compared with the aforementioned cell of the present invention, the luminescence is significantly lower. The specific embodiment of the present invention described in the detailed description above is only for the purpose of clarifying the technical content of the present invention, and cannot be based on this specific example. The present invention is explained narrowly, that is, as long as it is within the spirit of the present invention and the scope of patent application described below, various necessary changes can be made. Industrial advantage _ ^ _ The method for removing organic matter on the substrate of the present invention, if implemented in the form described above, can achieve the following effects. That is, 'the method for removing organic matter on a substrate according to the present invention does not use a low-safe and dangerous organic solvent, but uses supercritical% or subcritical water', so that it can ensure safety in operation, and, After removing organics, simple waste liquid treatment can be performed. In addition, if ultrapure water in the critical state n subcritical state is used as supercritical water or subcritical water, because it contains almost no impurities, there will be no impurities left after removing organic matter. The semi-conducting device and the manufacturing method of the display device, because the super-conducting water can be used for the semi-conducting device .. The base has no photoresistance, and the order of the photoresistance is complete. (2 〖〇χ 297mm） < Please read the precautions on the back before filling out this page) --fn —1 ϋ I ϋ Line (-46- Economy 钋 Wisdom Leaf Production Bureau Employee Consumption Cooperative printed A7- -1 ---------- --- 5. Description of the invention (44) Oxidative decomposition and removal, so no photoresist will remain. Therefore, it can prevent the instability of element characteristics caused by m of photoresist. Χ, the photoresist stripping solution used in the past is low in safety and dangerous, but the use of supercritical water can ensure safety in operation. Also, the waste liquid after use does not contain harmful substances to people. It can perform simple waste liquid treatment, and because there are very few impurities in supercritical water, etc., After the photoresist is removed, there will be no contamination caused by impurities / pure substances remaining on the substrate. Moreover, the organic matter removal device on the substrate according to the present invention can exist in the substrate because supercritical water or subcritical water can exist on the substrate The organic substances on the surface are more efficiently oxidized and removed, so that the production efficiency can be improved. The display of Ben Manmin is set up to manufacture a display device that includes a cleaning step for cleaning the substrate. Supercritical flow or subcritical fluids are used for cleaning, so you can omit the husband. Drying steps necessary in the tank cleaning method. The result can not only reduce the number of manufacturing steps and reduce manufacturing costs, but also improve Its production is careful, because no cleaning material remains, so it can prevent the surface of the substrate from being slammed, and it can display good display characteristics. Also, the manufacturing device of the display device of the present invention has no cleaning when cleaning the substrate. The net substance remains on the substrate, so no washing or drying process after washing is needed, and the purpose of reducing manufacturing costs can be achieved. In addition, because no net substance remains, it can be combined and manufactured _ ^ 易 边 _ ^ Show special According to the above description, according to the above description, the structure of the present invention can completely achieve the ingenious problems of the invention. Therefore, the present invention is of great significance in the industry. This paper standard is applicable to Chinese National Standard (CNS) A4 Specifications (210 X 297 mm) 47- --I ---------- installation --------- order! ----- line (please read the precautions on the back before filling This page) 469529 B7 V. Description of the invention (45 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ^ Symbol description 1 ... Glass substrate 19 ... TFT array substrate 2 ... Lower coating film 2 ... Color filter group 3 ... amorphous silicon film (i-type a-Si) 21 ... second electrode group 4 ... gate insulating film 22 ... opposite substrate 4 '.., gate insulating film image 2 3 ... liquid crystal alignment film 5 … Gate wiring metal film image 2 4… adhesive 6 · .. first photoresist image 25… spacer material 7 ... anodized insulating film 26 ... TN alignment liquid crystal layer 8 ... phosphorus-containing amorphous silicon film (N + 27 ... polarizing plate a-Si) 29 ... backlight 9 ... contact electrode metal film 31 ... washing tank 10 a ... metal film for source wiring 3 2 ... substrate group 10b ... drain wiring With metal 33 ---- Carbon oxide tube 11 ... Second photoresist image container 12 ... Bottom gate TFT 34 ... High pressure pump 13 ... Transparent electrode film 35 ... Heat exchanger 13 '... Clear Electrode film image group 37 ... separation tank 14 ... third photoresist image 38 ..., adjustment valve 15 ... silicon dioxide protective film 3 9 ... recovery vacuum tube 16 ... TFT array substrate 40 ... cleaning device 17 … The first electrode group (transparent electrode film 41 ... injection tube image group) 42 ... the first discharge tube 18 .. · transistor (TFT) group 43 ... the second discharge tube The paper's inversion applies the Chinese national standard < CNS) A4 size (210x297 public love) I l · --- ^ Install -------- order ... 1.111! Line ((Please read the precautions on the back before filling this page), 48 · A7 B7 V. Description of the invention (46) 44 ... Cassette 54 ... Pressure control member 45 ... Supply member 55 ... Temperature control member 46 ... Storage tank 56 ... Separation tank 50 ... Light Resistance removal device 57 ... decompression chamber 51 ... reaction tank 58 ... recovery vacuum tube 52 ... supply member 59 ... discharge tube 5 3 ... ultra-pure water (please read the precautions on the back before filling in this page ) * Economic Village Printed Copy Zhang scale applicable Chinese National Standard (CNS) A4 size (210 X 297 mm)

Claims (1)

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 6 9 5 2 9 as B〇CS D8 VI. Application for patent scope 1. A method for removing organic matter on a substrate, characterized in that it is supercritical water or subcritical water Oxidation removes organic matter present on the inorganic substrate. 2. The method for removing organic matter on a substrate according to item 1 of the scope of patent application, wherein the organic matter is an organic coating formed by a photosensitive resin that is imaged to have a predetermined shape. 3. For the method of removing organic matter on the substrate as described in the first item of the patent application scope, wherein the supercritical water system uses a supercritical state with a resistivity of 10 million ohms or more and a temperature of 375 ° C or more and 22o atmospheric pressure or more Super bismuth water. 4. The method for removing organic matter on a substrate according to item 1 of the application, wherein the inorganic substrate is formed of silicon or glass. 5. —A method for manufacturing a semiconductor device, which is used to form a circle image of a device by performing lithography. The lithography includes the following steps: A step of forming a film of an imaging target is used to freeze a conductor Those who form a target film on a substrate; a coating step 'is used to apply a photoresist on the film of the target; a mask exposure step' is a photomask having a predetermined mask image, Exposing the photoresist to form a latent image of the mask image on the photoresist; and a developing step for developing the photoresist after exposure to form a photoresist image; A “money engraving step” is used to etch the film of the aforementioned image target; and a photoresist removal step is used to remove the photoresist image by supercritical water or subcritical water oxidation. This paper size is applicable to China Store Standard (CNS) A4 specification (210x 297 ϋ ------: ---: --- β-clothing -------- Order -------- ^- ---- Line · ((Please read the precautions on the back before filling in this page) -50- A8B8C8D8 Six Economy I Member of Intellectual Property Bureau X Consumption Cooperative Printing, Patent Application Scope. A method for manufacturing a semiconductor device is to perform a direct exposure step instead of the photomask exposure step, and the direct exposure -------------- install --- read the first back Note * Please fill in this page again> The light step is to directly draw any image on the photoresist with an electron beam. 7. If the method of manufacturing a semiconductor device according to item 5 of the patent application, the supercritical The water system uses ultrapure water with a resistivity of more than 10 million ohms, and a supercritical state above 375 ° C and above 220 atmospheric pressure. 8. —A method for manufacturing a display device, including the following steps: A substrate manufacturing step is used to form a predetermined element image on the substrate; and a cell manufacturing step is used to pair the substrate with another The substrates are attached to form a cell;-line, and at least one of the substrate production step and the cell production step includes a removal step, which removes the existence of the supercritical fluid or subcritical fluid Organic matter on the substrate. 9. The method for manufacturing a display device according to item S of the patent application scope, wherein the step of removing organic matter in the substrate manufacturing step is to remove supercritical water or subcritical water to oxidize and remove organic matter. 10 'The method for manufacturing a display device according to item 8 of the scope of patent application, wherein the step of removing organic matter in the cell manufacturing step is a washing process in which supercritical fluid or subcritical fluid is used to dissolve and remove organic matter. 11_ A method for manufacturing a display device is used to manufacture a display device having a liquid crystal layer formed between an array substrate and an opposite substrate to form a liquid crystal cell. The paper size is applicable to the Chinese National Standard CCNS) A4 specification (210 X 297 mm). } -51, 469529 A8 B8 C8 D8 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs The manufacturing method includes the following steps: a substrate manufacturing step for fabricating the array substrate and an opposite substrate; and-a liquid crystal cell manufacturing step for fabricating a liquid crystal cell using the array substrate and the opposite substrate; and In the step, there is a lithography imaging method to form a film with a predetermined shape after being imaged, and the lithography imaging method includes the following steps: A film forming step of imaging a target is used for A film forming a target film on a substrate; a coating step 'is used to apply a photoresist on the film of the target film; a photomask exposure step is a photomask having a predetermined photomask image A photoresist for exposing the photoresist to form a latent image of the photomask on the photoresist; a developing step for developing the photoresist after exposure to form a photoresist image; The etching step is used to etch the film of the aforementioned image object; and the photoresist removal step is to remove the photoresist image by oxidation with supercritical water or submarine boundary water. 12. For example, if the display device of the patent application No. 11 is installed, the direct exposure step is performed instead of the photomask, and the AJU4 # · washing step is directly described by the electronic car on the photoresist. Arbitrary circle like. 13. For the manufacturing method of display device No. 11 in the scope of patent application, the supercritical water system uses a resistivity of more than 10 million ohms', and the Chinese paper standard (CNS) A4 specification is used at H5 ° C. 210 X 297 public love) -52- — — — — —— — I — LII 1 《Yi--I -----Order, '1! ·'! — · Please read the precautions on the back before reading (Fill in this page) I OQ 00809 ABCD Economy I Member of Intellectual Property Bureau 1 Printed by Consumer Cooperatives 6. Ultra-pure water in supercritical state above patent application scope and above 220 atmospheric pressure. 14. The method for manufacturing a display device according to item u of the application, wherein the liquid crystal cell manufacturing step includes a cleaning step of cleaning the array substrate and / or the opposite substrate with a supercritical fluid or a subcritical fluid. 15. The method for manufacturing a display device according to item 14 of the patent application, wherein the liquid crystal cell manufacturing step further includes an alignment film forming step for forming an alignment film on the aforementioned array substrate and / or the opposite substrate; The washing step is performed before and / or after the alignment film forming step. 16. The method for manufacturing a display device according to item 15 of the scope of patent application, wherein the manufacturing process of the liquid crystal cell has the following steps: a bonding step for bonding the aforementioned array substrate and the opposite substrate to form an empty cell A liquid crystal injection step, which injects liquid crystal into the interior of the empty cell; and the 'washing step is performed before and / or after at least one of the bonding step or the liquid crystal injection step. . 17. The method for manufacturing a display device according to item 14 of the patent application scope, wherein the liquid crystal cell manufacturing step has the following steps: An alignment film forming step < is used to form an alignment film on the aforementioned array substrate and / or the opposite substrate And an alignment processing step, which is to apply the alignment treatment to the alignment film; and the 'washing step is performed before the alignment film formation step or the alignment processing step is at least one of the steps before and / or after get on. 18. The manufacturing method of the display device according to item 17 of the scope of patent application, wherein the paper rule 5 is used at home side standard x 297 —-— — — — — — I »III} ii I 一 aj — — — — — —— — — < Please read the precautions on the back before filling out this page) • 53- Printed by Employee Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs A8 95 2 9 cl —_____ D8 VI. Application scope for patent application The following steps: a bonding step for bonding the aforementioned array substrate and an opposite substrate to form an empty cell; and a liquid crystal injection step for injecting liquid crystal into the interior of the empty cell; and 'The aforementioned washing step is performed before and / or after the step of at least one of the bonding step or the liquid crystal injection step' 19 'If the method for manufacturing a display device according to the item η of the patent application scope, wherein the liquid crystal cell manufacturing step The system has the following steps: a bonding step for bonding the aforementioned array substrate and an opposite substrate to form an empty cell; and a liquid crystal injection step for injecting liquid crystal The element of internal ghosts persons; and, the cleaning step is based on liquid crystal or the bonding step at least for implantation step, and / or one of the prior steps. 20. —A manufacturing method of a display device is used for manufacturing a display device having an electrically excited photocell having a carrier transport layer and a light emitting layer formed between a substrate with an electrode and an electrode, and the manufacturing method includes the following steps : A manufacturing step of an electrode-attached substrate, which is used to make the electrode-attached substrate; and-an electrically excited photocell manufacturing step, which uses the electrode-attached substrate to make the electrically excited photocell; and, the In the manufacturing steps of the substrate with electrodes, _lithography imaging is used to form a film with a predetermined shape after being imaged, and this paper size applies the Chinese National Standard (CNS) A4 specification (210 x 297) ) ------------- One ^ --------— ^ ---- (Please read the notes on the back before filling out this page) -54 · A8B8C8D8 Ministry of Economy Wisdom Printed by the Consumer Cooperative of the Property Bureau. 6. Scope of patent application. The lithography imaging method includes the following steps: a film formation step of an imaging target, which is used to form a film of an imaging target on a substrate; a coating step For coating on the film of the image target Liquid-blocker: a mask exposure step, which exposes the photoresist with a predetermined mask circle image 4 mask, to form a latent image of the mask image on the photoresist; a development step, A photoresist for developing the photoresist after exposure to form a photoresist image; an etching step for etching the film of the aforementioned imaging target; and a photoresist removal step for supercritical water or Subcritical water oxidation removes the photoresist image. 21. If the method of manufacturing a display device according to item 20 of the patent application is to perform a direct exposure step instead of the mask exposure step, the direct exposure step is to directly draw an arbitrary circle on the photoresist with an electron beam. Like 22. The manufacturing method of the display device according to item 20 of the patent application, wherein the supercritical water is ultrapure water in a supercritical state with a resistivity of 10 million ohms or more and a temperature of 375 ° c or more and 220 atmospheric pressure or more . 23. The method for manufacturing a display device according to claim 20, wherein the manufacturing step of the electrically excited photocell includes a cleaning step of cleaning the substrate with the electrode with a supercritical fluid or a subcritical fluid. 24. The method for manufacturing a display device according to item 23 of the patent application, wherein the step of making the electrically excited photocell has the following steps: A carrier transport layer forming step is applied to the basic paper size with electrodes China National Standard (CNS) A4 Specification (2J0 > c 297 mm) -55- ------------- Installation -------- Order --------- --Line (please read the precautions on the back before filling this page) printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 β 9 5 2 9 Β8 • C8 __D8 _ VI. The carrier is formed on the board for patent application Layer; and a light-emitting layer forming step for forming a light-emitting layer on the carrier transporting layer; and the aforementioned washing step is at least one of the carrier transporting layer forming step or the light-emitting layer forming step. This step is performed before and / or after. 25. The method for manufacturing a display device according to item 24 of the patent application, wherein the manufacturing step of the electrically excited photocell includes a bonding step to bond the substrate with the electrode and the opposite substrate paired with the substrate. Or; the aforementioned washing step is performed before and / or after the bonding step. 26. The method for manufacturing a display device according to item 23 of the patent application, wherein the step of making the electrically excited photocell has the following steps: A light-emitting layer forming step is used to form the light-emitting layer on the substrate with electrodes. And a carrier transporting layer forming step for forming a carrier transporting layer on the light emitting layer; and the aforementioned washing step is at least one of the carrier transporting layer forming step or the light emitting layer forming step. The method of manufacturing a display device according to item 26 of the patent application scope is carried out before and / or after one of the steps, wherein the electro-excited photocell manufacturing step includes a bonding step to the electrode-attached substrate Those who are bonded to the opposite substrates that are paired with each other: the aforementioned washing step is performed before and / or after the bonding step. 28. —A manufacturing method for displaying a display device, which is used for manufacturing a liquid crystal cell & display device having a crystal layer formed between an array substrate and an opposite substrate. The manufacturing method includes the following steps: This paper scale is applicable to China National Standard (CNS) A4 Specification (210 X 297 Public Love) ----- ^ ---- r --- ί Come -------- Order · ---: ----- line < (Please read the notes on the back before filling in this page) • 56- Application for patent scope A8 B8 C8 D8 Economics Intellectual Property Bureau Employees Consumer Cooperatives printed a substrate production step, which is used to make the array substrate and relative Substrate: and a liquid crystal cell manufacturing step, which uses the array substrate and an opposite substrate to fabricate the liquid crystal cell; and the liquid crystal cell manufacturing step includes washing with a supercritical fluid or a subcritical fluid, the aforementioned array substrate and / Or the step of cleaning the opposite substrate. 29. The method for manufacturing a display device according to item 28 of the patent application, wherein the liquid crystal cell manufacturing step further includes an alignment film forming step on the aforementioned array substrate and / or the opposite substrate. Those forming an alignment film; The washing step is performed before and / or after the alignment film forming step. 30. For the manufacturing method of the display device according to item 29 of the patent application, the liquid crystal cell manufacturing step has the following steps: a bonding step, It is used to attach the aforementioned array substrate and the opposite substrate to form an empty cell; and a liquid crystal injection step is to inject liquid crystal into the interior of the empty cell; and the aforementioned washing step is applied to the At least one of the combining step or the liquid crystal injection step is performed before and / or after the step. 31. For example, the method for manufacturing a display device according to item 28 of the patent application, wherein the liquid crystal cell manufacturing step has the following steps: an alignment film is formed Steps are for forming an alignment film on the aforementioned array substrate and / or an opposite substrate: and an alignment processing step is for applying an alignment treatment to the alignment film; This paper size applies the Chinese National Standard (CNS) A4 specification ( 210 X 297 mm) (Please read the notes on the back before filling out this page) Binding · Thread · -57- 469529 Shellfish Consumption Cooperation of Intellectual Property Bureau of the Ministry of Economic Affairs Du Yin Manufacturing A8 B8 CS D8 6. The scope of the patent application is also that the aforementioned washing step is performed before and / or after at least one of the alignment film forming step or the alignment processing step. 32. If the scope of patent application is the 31st item A method for manufacturing a display device, wherein the liquid crystal cell manufacturing step has the following steps: a bonding step for bonding the aforementioned array substrate and an opposite substrate to form an empty cell; and a liquid crystal injection step, The liquid crystal is injected into the inside of the empty cell; and the 'if washing step is performed before and / or after at least one of the bonding step or the liquid crystal injection step. 33. The manufacturing method of the display device according to item 28 of the patent application scope, wherein the liquid crystal cell manufacturing step has the following steps: A bonding step is used for bonding the aforementioned array substrate to a pair of substrates to form An empty cell; and a liquid crystal injection step in which liquid crystal is injected into the empty cell; and the washing step is performed before at least one of the bonding step or the liquid crystal injection step and / or After that. 34. The method for manufacturing a display device according to item 28 of the application, wherein the array substrate and the opposite substrate are resin substrates. 35. The method for manufacturing a display device according to item 28 of the application, wherein the supercritical fluid or subcritical flow system uses carbon dioxide in a supercritical state or a subcritical state. 36. For the manufacturing method of the display device under the scope of application for patent No. 28, wherein the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 gong) ------------ ί ^ -------- Order—ϊ ----- line · &(; guess first read the notes on the back before filling out this page) -58- A8 B8 C8 D8 Sixth, the Intellectual Property Bureau of the Ministry of Economic Affairs, consumer cooperation The cleaning steps in the scope of Du's patent application are those in which the supercritical fluid or subcritical fluid is used for multiple washings. 37 'A manufacturing method of a display device' is used for manufacturing a display device having an electrically excited photocell having a carrier transport layer and a light emitting layer formed between a substrate with an electrode and an electrode. The manufacturing method includes the following steps: : A manufacturing step of an electrode-attached substrate, which is used to make the electrode-attached substrate; and an electrically-excited photocell manufacturing step, which uses the electrode-attached substrate to make the electrically-excited photocell; and The step of manufacturing the electrically excited photocell includes a cleaning step of cleaning the substrate with the electrode with a supercritical fluid or a subcritical fluid. 38. The method for manufacturing a display device according to item 37 of the application for patent, wherein the step of making the electrically excited photocell has the following steps: a carrier transport layer forming step for forming the electrode on the substrate with the electrode A carrier transporting layer; and a light emitting layer forming step for forming a light emitting layer on the carrier transporting layer; and the aforementioned washing step is a step of forming a carrier wheel or a light emitting layer. At least one of the steps is performed before and / or after. 39. The method for manufacturing a display device according to item 38 of the application, wherein the manufacturing step of the electrically excited photocell has a bonding step 'to stick the substrate with the electrode and the opposite base paired with it. Combination; and the aforementioned washing step is performed before and / or after the bonding step. This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) ------------- Installation -------- Order 1 ^ 1 ϋ it— n I (Please read the notes on the back before filling out this page) -59- Printed by the Intellectual Property Bureau Employee Consumer Cooperatives of the Ministry of Economic Affairs 469529 _ SI__ VI. Application for a patent scope 40_ If the display of the patent application group item 37 shows Pei Zhi In the manufacturing method, the electro-excited photocell system is provided with the following steps: a step of forming a light-emitting layer, which is used to form the light-emitting layer on the substrate with an electrode; and a step of forming a carrier transport layer Is used to form a carrier transport layer on the light-emitting layer; and the washing step is performed before and / or after at least one of the carrier transport layer formation step or the light-emitting layer formation step. 41. The method for manufacturing a display device according to item 40 of the application for a patent, wherein the manufacturing step of the electro-excited photocells has a bonding step to attach the electrode-attached substrate to a pair of opposite substrates. Combination; and the aforementioned washing-step is performed before and / or after the bonding step. 42. The method for manufacturing a display device according to item 37 of the application, wherein the carrier transporting layer is a hole transporting layer or an electron transporting layer. 43_ If the method for manufacturing a display device according to item 37 of the patent application, wherein the electrode-attached substrate and the opposite substrate are resin substrates β 44. If the method for manufacturing a display device according to item 37 of the patent application, the supercritical Fluid or subcritical flow systems are used in supercritical or subcritical carbon dioxide. 45. The method for manufacturing a display device according to item 37 of the application, wherein the washing step is performed by using a supercritical fluid or a subcritical fluid for multiple washings. 46. — A device for removing organic matter on a substrate, which is used to remove organic matter existing on the substrate. The removal device includes: This paper size is applicable to China National Standard (CNS) A4 (210 X 297) ) {, Take -------- order ------------ line. ^ (Jingxian «read the precautions on the back before filling this page) -60 · A8 BS C8 D8- 6. Scope of patent application: A reaction tank is used to receive the substrate and remove the substrate by supercritical water or subcritical water oxidation; a supply member is used to supply water to the reaction tank; a pressure control member is A device for pressurizing the inside of the reaction tank to a temperature above the critical pressure of the water; and a temperature control member for heating the inside of the reaction tank to a temperature above the critical temperature of the water "47. 46 The device for removing organic matter on the substrate according to the item, wherein the reaction tank is an airtight container having a pressure resistance of at least 220 atmospheric pressure and a heat resistance of 375 ° C or more. 48. For an organic matter removing device on a substrate, which is the private item in the scope of patent application, wherein the reaction tank is capable of simultaneously accommodating multiple pieces of the substrate in the substrate. 49'A manufacturing device for a display device, the manufacturing device having a cleaning device'for cleaning substrates or cells assembled by pairing substrates, the cleaning device includes: a holding member, It is used to hold the substrate or cell; the Ministry of Economic Affairs-Wisdom Wealth-Industry Bureau staff consumption fee η. The company printed a washing tank, which is used to accommodate the substrate or cell held by the holding member, The substrate or the cells are cleaned with a supercritical fluid or a subcritical fluid; and a supply member is used to supply the supercritical fluid or the subcritical fluid to the cleaning tank. 50. The manufacturing device of the display device according to item 49 of the scope of patent application, wherein the supply member is provided with a paper for storing the supercritical fluid or subcritical paper. The size of the paper is applicable to China National Standard (CNS) A4 (210 * 297) (Centi) -61- 4 〇S ο 2 9 Jaw C8 DS VI. Patent application scope fluid storage components ° (Please read the precautions on the back before filling this page) ^ -------- Order- --- ^ ----- 线 * {Printed on the paper by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, this paper applies Chinese National Standard (CNS) A4 (210 X 297 meals) -62-