4 6 63 1 3 A7 ------— B7 ______ 五、發明說明（1 ) 相關申請案 本案主張藉著參考結合於此-的2〇〇〇年1月26日 申請的美國專利臨時申請案第6 〇 /丄了 8，3 〇 4號的 優先權。 發明領域 本發明相關於閘閥的領域。更特別地，本發明相關於 被設計用於淸潔的環境中的閘閥的領域。 - 發明背景 '♦典型上’壓力容器的裝載口使用一外部門來密封裝載 口。一或多個機械緊固件將外部門固持於壓力容器，使得 外部門形成密封壓力容器的密封件。典型上，機械緊固件 是選擇自包含速釋夾，外部自我鎖緊環形夾，及螺栓的群 類。採用具有機械緊固件的外部門的壓力容器對於半導體 晶圓的製造而言至少有雨個問題β第一個問題是機械緊固 件產生比半導體晶圓的製造中可容許者多的顆粒物質。第 二個問題是緊固及放鬆機械緊固件使得密封壓力容器需要 過多的時間。過多的時間導致半導體晶圓的製造的自動化 無效率。 所需要的是不使用外部緊固件來密封壓力容器的裝載 口的方法》 所需要的是產生較少的顆粒物質的密封壓力容器的裝 載口的方法。 (請先閱讀背面之注意事項再填寫本頁) 策--------訂--------- 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A-1規格（210 x 297公釐） -4- 46 63 1 λ Λ7 經濟邨智慧財產局員工消費合作社印； Β7_五、發明說明（2 ) 所需要的是導致用來打開及關閉壓力容器的時間較少 的密封壓力容器的裝載口的方法 發明槪說 本發明相關於一閘閥。閘閥包含一板件，一密封件， 以及一殻體。殼體包含一通道及一密封表面。板件連接於 殼體。密封件連接於板件。在操作時，板件佔據可在一密 封位置與一退回位置之間選擇的一位置。在密封位置時， 密封件將板件密封抵靠密封表面。在退回位置時，板件不 佔據通道，此提供經由通道的自由進出。在密封位置與退 回位置之間移動時，板件平移但是不旋轉。 圖式簡要敘述 圖1顯不本發明的較佳鬧閥。 圖2顯示結合成爲半導體晶圓用的超臨界處理室的一 部份的本發明的較佳閘閥。 圖3 A及3 B顯示結合成爲半導體晶圓用的另—超臨 界處理室的一部份的本發明的另一閘閥》 元件對照表 10 閘閥 1 0 A 閘閥 1 2 殻體 1 2 A 殼體 · * * · -^1 k^i -^1 I n irm k I (請先閱讀背面之泛意事項再填寫本頁) I n i n 1 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公g ) -5- 經濟部智慧財產局員工消費合作社印制衣 4 6 63 1 3五、發明說明（3 ) 14 板件 1 4 A 板件 16 通道 18 板件軸 2 0 密封表面 2 2 0形環凹槽 2 2 A 密封表面 2 4 0形環 2 6 密封位置 2 8 退回位置 30 超臨界處理室 3 0 A 壓力室 3 2 壓力缸筒 34 氣體處理組態 3 6 晶圓處理空穴 36A 晶圓處理空穴 ----------I— -------- 訂 -------Ϊ I . {請先閱讀背面之注意事項再填寫本頁) 3 8 活 塞 3 9 第 —‘ 桿件 4 0 缸 AvV· 同 軸 4 2 回 動 彈簧 4 4 缸 同 底部 4 6 入 / 出口 4 8 第 — 閥 5 0 第 — 閥 本紙張尺度適用令國國家標準（CNS)A4規格（2_10 X 297公釐） -6-4 6 63 1 3 A7 -------- B7 ______ V. Description of the Invention (1) Related Applications This application claims a provisional U.S. patent application filed on January 26, 2000, incorporated herein by reference. Case No. 6 0 / has priority of No. 8,304. FIELD OF THE INVENTION The present invention relates to the field of gate valves. More particularly, the invention relates to the field of gate valves designed for use in clean environments. -BACKGROUND OF THE INVENTION "♦ Typically," the loading port of a pressure vessel uses an outer door to seal the loading port. One or more mechanical fasteners hold the outer door to the pressure vessel such that the outer door forms a seal that seals the pressure vessel. Typically, mechanical fasteners are a group of self-contained quick-release clips, external self-locking ring clips, and bolts. The use of an external pressure vessel with mechanical fasteners has at least one rain problem for the manufacture of semiconductor wafers. The first problem is that mechanical fasteners produce more particulate matter than semiconductor wafer manufacturing can tolerate. The second problem is that tightening and loosening mechanical fasteners makes sealing the pressure vessel too much time. Too much time results in inefficient automation of semiconductor wafer manufacturing. What is needed is a method of sealing the pressure vessel's loading port without the use of external fasteners. What is needed is a method of sealing the pressure vessel's loading port that produces less particulate matter. (Please read the precautions on the back before filling out this page) Policy -------- Order --------- The paper size printed by the Employee Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs applies the Chinese national standard ( CNS) A-1 specification (210 x 297 mm) -4- 46 63 1 λ Λ7 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Economic Village; Β7_Ⅴ. Description of the invention (2) What is needed is to cause it to open and close A method of sealing a pressure vessel's loading port with less time for a pressure vessel. The present invention relates to a gate valve. The gate valve includes a plate, a seal, and a housing. The housing includes a channel and a sealing surface. The plate is connected to the housing. The seal is connected to the plate. In operation, the plate occupies a position selectable between a sealed position and a retracted position. In the sealed position, the seal seals the plate against the sealing surface. In the retracted position, the plate does not occupy the channel, which provides free entry and exit through the channel. When moving between the sealed position and the retracted position, the plate translates but does not rotate. Brief Description of the Drawings Figure 1 shows a preferred alarm valve of the present invention. Figure 2 shows a preferred gate valve of the present invention incorporated as part of a supercritical processing chamber for semiconductor wafers. Figures 3 A and 3 B show another gate valve of the present invention which is part of another supercritical processing chamber for semiconductor wafers. "Component comparison table 10 Gate valve 1 0 A Gate valve 1 2 Housing 1 2 A Housing · * * ·-^ 1 k ^ i-^ 1 I n irm k I (Please read the general matters on the back before filling out this page) I nin 1 This paper size is applicable to China National Standard (CNS) A4 (210 X 297g) -5- Printed clothing by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 6 63 1 3 V. Description of the invention (3) 14 Plate 1 4 A Plate 16 Channel 18 Plate shaft 2 0 Sealing surface 2 2 0-ring groove 2 2 A sealing surface 2 4 0-ring 2 6 sealing position 2 8 retracted position 30 supercritical processing chamber 3 0 A pressure chamber 3 2 pressure cylinder 34 gas processing configuration 3 6 wafer processing cavity 36A wafer processing cavity ---------- I-- -------- Order ------- Ϊ I. {Please read the precautions on the back before filling this page) 3 8 Piston 3 9 Section— 'Rod 4 0 Cylinder AvV · Coaxial 4 2 Revolving Spring 4 4 Cylinder with Bottom 4 6 Inlet / Outlet 4 8 Section—Valve 5 0 Section—Valve This paper is applicable to national standards CNS) A4 size (2_10 X 297 mm) -6-
五、發明說明（4 ) 5 2 半導體晶圓 6 0 第二桿件 - 6 2 第三桿件 較佳實施例的詳細敘述 本發明爲被設計用於半導體處理環境中的閘閥，在該 環境中有需要將高壓密封成爲與低壓隔離，並且有需要維 持淸潔的環境。 - 本發明的較佳閘閥顯示在圖1中。較佳閘閥1 〇包含 殼體1 2及板件1 4。較佳地，殼體1 2包含通道1 6， 板件軸1 8，及密封表面2 0。板件1 4較佳地包含◦形 環2 4用的0形環凹槽2 2 °或者，〇形環凹槽2 2爲殻 體1 2的岔封表面2 0的一部份。或者，〇形環2 4另外 可用任何聚合物密封件或適合用於重複密封的其他密封件 來取代。 在密封位置2 6時，板件1 4靜置抵靠密封表面2 0 。在退回位置2 8時’板件1 4容許自由通過通道1 6。 在密封位置2 6與退回位置2 8之間移動時，板件1 4平 移但是不旋轉。因爲板件1 4不旋轉，所以粒子的產生減 至最少’此對於淸潔環境而言極爲有利，特別是半導體處 理環境。 本發明的較佳閘閥1 〇另外顯示在圖2中，其顯示結 合成爲超臨界處理室3 0的一部份的較佳閘閥1 〇。超臨 界處理室3 0包含殼體12 ’板件14，通道16，板件 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） (請先間讀背面之庄意事項再填寫本頁) 裝--------訂*--------線- 經濟部智慧財產局員工消費合作社印製 A7 〇3 1 3 D7___ 五、發明說明（5 ) 軸1 8 ’密封表面2 0 ’壓力缸筒3 2，氣體處理組態 3 4 ’以及晶圓處理空穴3 6。·壓力缸筒3 2較佳地包含 活塞38 ’缸筒軸40，以及回動彈簧42。活塞38在 其一外徑處連接於缸筒軸4 0，而該處有一活塞密封件（ 未顯示）將活塞3 8密封於缸筒軸4 0。活塞3 8也藉著 第一桿件3 9而連接於板件1 4。回動彈賛4 2連接於活 塞3 8及缸筒底部4 4。氣體處理組態3 4包含入/出口 4 6及第一及第二閥4 8及5 0。第一閥4 8將入/出口 4 6連接於壓力缸筒3 2。第二閥5 0將入/出口 4 6連 接於晶圓處理空穴3 6。 —開始’扳件1 4從退回位置2 8開始，並且第一及 第二閥4 8及5 0以關閉組態開始。在操作時，半導體晶 圓5 2由自動臂（未顯示）送入晶圓處理空穴3 6內。或 者’半導體晶圓5 2被手動送入晶圓處理空穴3 6內。其 次，第一閥4 8打開’使得板件1 4平移至密封位置2 6 。接著’第二閥5 0打開。此加壓晶圓處理空穴3 6 ，並 且使板件1 4密封抵靠密封表面2 0。然後，較佳地使用 超臨界二氧化碳來處理半導體晶圓5 2。在處理之後，晶 圓處理空穴3 6及缸筒3 2被減壓，使得板件1 4平移至 退回位置2 8。然後，半導體晶圓5 2從晶圓處理空穴 3 6被移去。 對於熟習此項技術者而言相當明顯，較佳閘閥1 〇也 適合用於超臨界條件以下的高壓處理。因此，較佳鬧闘 1 0適合用於將高壓與低壓分離的任何應用。另外，對於 本紙張尺度適用中國國家楳準（CNS)A4規格（210 X 297公釐） --------------------------^ . (請先閲讀背面之注意事項再填寫本頁) 經泫部智慧財產局員工消費合作社印製 -8- A7 B7 4 6 63 1 3 五、發明說明（6 ) 熟習此項技術者而言也相當明顯，壓力缸筒3 2可由另外 的致動裝置來取代，例如電馬達-或可電磁感應出—力的另 一裝置。 結合本發明的另一閘閥的另一壓力室顯示在圖3 A及 3 B中。此另一壓力室3 〇A包含另一閘閥1 〇A及另一 晶圓處理空穴3 6A。閘閥1 0A包含殼體1 2A，板件 1 4A *密封表面2 2A，以及第二及第三桿件6 〇及 6 2。在操作時，第二及第三桿件6 C|及6 2拉動板件-1 4A抵靠密封表面2 2A ’然後晶圓處理空穴3 6 A被 加壓。在處理之後，晶圓處理空穴3 6 A被減壓，並且板 件1 4 A被推動離開密封表面2 2 A。 對於熟習此項技術者而言相當明顯 > 在不離開由附隨 的申請專利範圍所界定的本發明的精神及範圍下，可對較 佳實施例進行其他不同的修正。 I Ά裝--------訂---------線A (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（2〗0 X 297公釐） -9-5. Description of the invention (4) 5 2 Semiconductor wafer 60 0 Second rod-6 2 Detailed description of the preferred embodiment of the third rod The present invention is a gate valve designed for use in a semiconductor processing environment in which There is a need to isolate high pressure from low pressure and to maintain a clean environment. -The preferred gate valve of the present invention is shown in FIG. The preferred gate valve 10 includes a housing 12 and a plate member 14. Preferably, the housing 12 includes a channel 16, a plate shaft 18, and a sealing surface 20. The plate member 14 preferably includes a 0-ring groove 2 2 for the o-ring 24, or the o-ring groove 22 is a part of the sealing surface 20 of the housing 12. Alternatively, the o-ring 2 4 may be replaced with any polymer seal or other seal suitable for repeated sealing. When in the sealing position 26, the plate 14 stands still against the sealing surface 20. In the retracted position 28, the 'plate 14 allows free passage through the channel 16. When moving between the sealed position 26 and the retracted position 28, the plate 14 is translated but not rotated. Since the plate member 14 does not rotate, the generation of particles is minimized. This is extremely advantageous for a clean environment, especially a semiconductor processing environment. The preferred gate valve 10 of the present invention is also shown in Fig. 2 which shows the preferred gate valve 10 which is combined into a part of the supercritical processing chamber 30. The supercritical processing chamber 30 contains the shell 12 'plate 14, channel 16, plate. The paper size is applicable to Chinese National Standard (CNS) A4 (210 x 297 mm) (please read the solemn matters on the back first) (Fill in this page) Packing -------- Order * -------- Line-Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 〇3 1 3 D7___ 5. Description of the invention (5) Axis 1 8 'sealing surface 2 0' pressure cylinder barrel 3 2, gas processing configuration 3 4 'and wafer processing cavity 36. The pressure cylinder 32 preferably includes a piston 38'cylinder shaft 40, and a return spring 42. The piston 38 is connected to the cylinder shaft 40 at one of its outer diameters, and there is a piston seal (not shown) there to seal the piston 38 to the cylinder shaft 40. The piston 38 is also connected to the plate member 14 through the first rod member 39. The revolving spring button 4 2 is connected to the piston 3 8 and the cylinder bottom 4 4. The gas processing configuration 3 4 includes an inlet / outlet 46 and first and second valves 48 and 50. The first valve 4 8 connects the inlet / outlet 4 6 to the pressure cylinder barrel 3 2. The second valve 50 connects the inlet / outlet 4 6 to the wafer processing cavity 36. —Start ’trigger 14 starts from the retracted position 28 and the first and second valves 48 and 50 start with the closed configuration. In operation, the semiconductor wafer 52 is fed into the wafer processing cavity 36 by a robotic arm (not shown). Alternatively, the semiconductor wafer 52 is manually fed into the wafer processing cavity 36. Secondly, the first valve 48 is opened 'so that the plate member 14 is translated to the sealing position 26. Then the 'second valve 50 is opened. This pressurized wafer processes the cavities 3 6 and seals the plate 14 against the sealing surface 20. Then, the semiconductor wafer 52 is preferably processed using supercritical carbon dioxide. After the treatment, the wafer processing cavity 36 and the cylinder barrel 32 are decompressed, so that the plate member 14 is translated to the retracted position 28. Then, the semiconductor wafer 52 is removed from the wafer processing hole 36. It is obvious to those skilled in the art that the better gate valve 10 is also suitable for high pressure treatment under supercritical conditions. Therefore, the preferred alarm 10 is suitable for any application that separates high pressure from low pressure. In addition, for this paper size, China National Standard (CNS) A4 (210 X 297 mm) applies -------------------------- ^ (Please read the notes on the back before filling out this page) Printed by the Consumers ’Cooperative of the Ministry of Intellectual Property, -8- A7 B7 4 6 63 1 3 V. Description of the invention (6) Those who are familiar with this technology It is quite obvious that the pressure cylinder 32 may be replaced by another actuating device, such as an electric motor—or another device that can electromagnetically induce—a force. Another pressure chamber incorporating another gate valve of the present invention is shown in Figs. 3A and 3B. This other pressure chamber 30A contains another gate valve 10A and another wafer processing cavity 36A. The gate valve 10A includes a housing 12A, a plate member 4A * a sealing surface 2 2A, and second and third rod members 60 and 62. In operation, the second and third rods 6 C | and 62 pull the plate-1 4A against the sealing surface 2 2A ′ and the wafer processing cavity 3 6 A is pressurized. After processing, the wafer processing cavity 3 6 A is decompressed, and the plate 1 4 A is pushed away from the sealing surface 2 2 A. It is quite obvious to those skilled in the art > other different modifications can be made to the preferred embodiment without departing from the spirit and scope of the invention as defined by the scope of the accompanying patent application. I Outfit -------- Order --------- Line A (Please read the precautions on the back before filling out this page) Printed on this paper. China National Standard (CNS) A4 Specification (2〗 0 X 297 mm) -9-