46 3 428 A7 五、發明說明（1 ) [發明所屬之技術領域] 本發明係關於一種將雷射晶片之周圍氣密地封裝之容 器密封型之半導體雷射裝置。更詳言之’係關於尤其適合 於數位影碟（Digital Video Disc，以下簡稱為DVD)，雷射 束印表機（Laser Beam Printer ’ 以下簡稱為 lbP)，DVE>_ ROM等之拾訊用光源使用之廉價的半導體雷射裝置者。 [以往之技術] 以在之作為DVD之光源等而使用之半導體雷射裝置 係具有如第4圖所示之構造。這種雷射晶片，為了確保可 靠性而需要保護雷射晶片23不受空氣影響起見，用帽蓋 24覆蓋雷射晶片23之周圍並予以氣密封裝。[本文中之「柱 體」為stem，表示用以載置並支持半導體元件及其周邊之 相關零件之組件]。 第4圖中，（a)係平面圖，（1))係局部剖面之側視圖，（c) 係將帽蓋24焊接於柱體21時之剖面說明圖。21係晶枉體 (stem)，係以金屬之冷鍛加工等與台座21a__體成形，設 有兩處如第4圖（c)所示之貫穿孔21b，並將導線26，27 由低熔融點玻璃29等來絕緣而氣密封裝之。台座2U上有 藉矽基板等所成之輔助安裝座（subm〇unt)22而黏接雷射晶 片23,與導線26, 27之前端以金屬線連接。再者，柱體 之底面侧有共同導線28以焊接連接β該柱體21之上方以 焊接等方法固定帽蓋24於柱體21以便氣密地封閉雷射晶 片23之周圍》^蓋24之雷射光通過部分設有貫穿孔，用 低熔融點玻璃等材料黏接玻璃窗25。該以往之例係設 (請先閲讀背面之注意事項再填寫本頁) * 裝！1訂----- 5. 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210x297公楚了 1 311189 463428 A7 ----— _____B7 五、發明說明（2) f請先閱讀背面之注意事項再填寫本頁} 射二極體與監視雷射二極體之輸出用之光電二極體之雙方 的關係，連接於各一方之電極之導線26,27及各另一方之 電極共同連接之共同導線28之三條導線為導出於封裝之 外部。再且，在柱體21之中心部形成有凹部，而將未圖示 之光二極體設在該凹部内，或直接形成在輔助安裝座22。 如第4圖（c)所示，前述之帽蓋24與柱體2ι之谭接係 由权在帽蓋24底部之突緣部24a之底面侧之突起24b來集 中電流之狀態下用電極31’ 32從上下夾緊來焊接之。然 後’將柱體21之外周表面a成為定位用之基準面。又， 21c係決定旋轉方向之定位用之切口部。 [發明所欲解決之問題] 經濟部智慧財產局員工消費合作社印製 第4圖所示之以往習知構造之半導體雷射裝置之柱體 係如前述用較厚之金屬板予以冷煆造，與台座一起實行柱 體之成型加工而形成之。與該柱體一體形成之台座之對柱 體底面之垂直度之誤差必需要在1度程度之範圍内之同 時，柱體之外徑尺寸精度要求為〇.〇3mm左右以下之公差， 要用冷鍛製造時，必需要精度非常高之金屬模具。因此， 金屬模具之維修費用增加，有金屬柱體之單價上昇之問 題。 再者’在成型加工金屬柱體之際，需要對柱體開孔之 後’用玻璃密封導線。因此’要密封直徑〇.45mm左右之 導線時也得要將開設於柱體之孔徑作成直徑lmm左右，在 包含帽蓋之焊接部分及成為基準面之部分之柱體之最外徑 作成為5 _6mm左右，如此之小柱體，配置導線空間之自由 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 2 311189 經濟部智慧財產局員工消費合作社印製 6 3 428 A7 ____B7_ 五、發明說明（3 ) 度受到限制之同時’需要另外用玻璃密封導線，更增加製 造步驟數而成為增加成本之原因。 本發明之目的在於提供一種可以解決上述問題之半導 體裝置，此半導體裝置之設計自由度大，且可簡單地製造 之同時’可得到與以往之密封外殼封裝型半導體雷射裝置 同樣程度之尺寸精度及安裝基準面之小型而廉價之半導體 雷射裝置者》 [用以解決問題之手段] 根據本發明之半導體雷射裝置為包括：由樹脂一體成 形而使由導電材所成之複數條導線露出上下之狀態之樹脂 柱體’與該複數條之導線中之一條電性連接而設之台座， 固定於該台座之雷射晶片’及覆蓋該雷射晶片之周圍之同 時其頂部具有光之透過窗而固定於前述柱體之帽蓋而構 成。 由於採用上述構造’只要用金屬模具固定導線之後灌 入樹脂就可以簡單地形成樹脂製柱體，可減少很多的製造 步驟數而可廉價地製造該柱體。另一方面因以樹脂製成之 關係，較難以把外徑及高度之基準面等維持一定，然而利 用構成台座之金屬’及帽蓋等之金屬即可成設定必要之基 準面。 前述導線中之一條與前述台座係一體形成，且與該台 座一體形成之同時，露出於前述柱體上面，另外設有該沿 著柱體之周圍延伸之突出部’將前述帽蓋之底部固定於該 突出部上，結果可把安裝於台座之雷射晶片所產生之熱經 _ίιι·!!^-ν— 裝 i ! <請先閱讀背面之注意事項再填寫本頁)46 3 428 A7 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a container-sealed semiconductor laser device that hermetically encapsulates the periphery of a laser wafer. In more detail, it refers to light sources suitable for digital video discs (hereinafter referred to as DVD), laser beam printers (hereinafter referred to as lbP), and DVE &_; ROM. Low-cost semiconductor laser device. [Conventional Technology] A semiconductor laser device used as a light source of a DVD or the like has a structure as shown in FIG. In order to ensure the reliability of such a laser chip, it is necessary to protect the laser chip 23 from the influence of air, and the cap 24 is used to cover the periphery of the laser chip 23 and hermetically seal it. [The “pillar” in this article is stem, which means a component used to mount and support semiconductor components and related parts around it]. In FIG. 4, (a) is a plan view, (1)) is a side view of a partial cross section, and (c) is a cross-sectional explanatory view when the cap 24 is welded to the column 21. 21 series crystal body (stem), formed by cold forging of metal with the base 21a__ body, is provided with two through holes 21b as shown in Figure 4 (c), and the wires 26, 27 from low The melting point glass 29 is insulated and hermetically sealed. On the base 2U, a laser chip 23 is bonded to a submount 22 made of a silicon substrate or the like, and the front ends of the wires 26 and 27 are connected by a metal wire. Furthermore, a common wire 28 is provided on the bottom side of the pillar to be welded to the top of the pillar 21. The cap 24 is fixed to the pillar 21 by welding or other methods to hermetically close the periphery of the laser chip 23. The laser light passing portion is provided with a through hole, and the glass window 25 is bonded with a material such as low melting point glass. This past example is set (Please read the precautions on the back before filling this page) * Install! 1 order ----- 5. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, the paper size is applicable to the Chinese National Standard (CNS) A4 (210x297) 1 311189 463428 A7 -------- _____B7 V. Description of the invention (2) f Please read the precautions on the back before filling in this page} The relationship between the two diodes and the photodiodes used to monitor the output of the laser diodes, the leads 26 connected to each electrode, 27 and the common lead 28 connected to each other's electrodes are led out of the package. Furthermore, a recess is formed in the central portion of the column 21, and a light diode (not shown) is provided in the recess. Inside, or directly formed on the auxiliary mounting seat 22. As shown in FIG. 4 (c), the tanning of the cap 24 and the pillar 2m is based on the bottom surface side of the flange portion 24a at the bottom of the cap 24. The electrodes 24 are clamped from above and below with the protrusions 24b to concentrate the current. Then, the outer peripheral surface a of the cylinder 21 is used as a reference surface for positioning. 21c is a notch for positioning for determining the direction of rotation. [Problems to be Solved by the Invention] Intellectual Property of the Ministry of Economic Affairs The column system of the semiconductor laser device with the conventional structure shown in Figure 4 printed by the employee consumer cooperative is formed by cold-forming with a thicker metal plate as described above, and it is formed together with the base to carry out the molding process of the column. The error of the perpendicularity of the base formed by the pillar to the bottom of the pillar must be within 1 degree, and the accuracy of the outer diameter of the pillar must be within the range of about 0.03 mm or less. When forging, metal molds with very high precision must be used. Therefore, the maintenance cost of metal molds increases, and there is a problem that the unit price of metal pillars rises. Furthermore, when forming and processing metal pillars, it is necessary to open holes in the pillars After that, the wire is sealed with glass. Therefore, when sealing a wire with a diameter of about 0.45mm, it is necessary to make a hole diameter of about 1mm in the pillar, and the pillar including the welding part of the cap and the part that becomes the reference surface The outermost diameter is about 5 _6mm. Such a small cylinder, free to arrange the wire space. The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 2 3111 89 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 6 3 428 A7 ____B7_ V. Description of the invention (3) At the same time that the degree is restricted, it is necessary to use another glass to seal the wires, and the number of manufacturing steps is increased, which is the reason for the increase in cost. The purpose is to provide a semiconductor device that can solve the above problems. This semiconductor device has a large degree of design freedom and can be easily manufactured. At the same time, it can obtain the same degree of dimensional accuracy and installation as the conventional sealed-encapsulated semiconductor laser device "Small and cheap semiconductor laser device for reference plane" [Means for solving problems] The semiconductor laser device according to the present invention includes: integrally molding a resin to expose a plurality of wires made of a conductive material up and down. A state of the resin pillar 'a stand provided electrically connected to one of the plurality of wires, a laser chip fixed to the stand' and a light transmission window covering the top of the laser chip while covering the periphery of the laser chip, and The cap is fixed to the post body. Since the above structure is used, as long as the lead wire is fixed with a metal mold and resin is poured, the resin pillar can be simply formed, the number of manufacturing steps can be reduced, and the pillar can be manufactured inexpensively. On the other hand, because it is made of resin, it is difficult to maintain a constant reference surface such as the outer diameter and height. However, the necessary reference surface can be set by using the metal constituting the base and the metal such as the cap. One of the aforementioned wires is integrally formed with the aforementioned pedestal, and is integrally formed with the pedestal, and is exposed on the aforementioned pillar, and a protruding portion extending along the periphery of the pillar is provided to fix the bottom of the aforementioned cap On the protruding part, as a result, the thermal history generated by the laser chip mounted on the pedestal _ίι · !! ^-ν— installed i! ≪ Please read the precautions on the back before filling this page)
---訂I 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 3 311189 A7 兮6 3 4 2 8 五、發明說明（4) 台座，突起部及帽蓋而散熱，故較適宜。 在前述帽蓋之底部形成有覆蓋前述枉體之周圍上部及 侧部之附有高低差之外裙部，於是若樹脂製之柱體之直徑 之精密度不良，仍可藉帽蓋之外徑決定正確之安裝位置， 另外也可把外裙部之上面作為雷射晶片之定位（自雷射晶 片之距離）之基準面，故較適宜。 利用導熱率良好之黏接劑將前述帽蓋黏接於前述柱 體，於是，傳到台座之熱可從帽蓋有效地予以散熱。再且， 所謂導熱性良好之黏接劑係意味著例如銀膏（silver paste) 等有混入金屬填料等導熱率良好之材料之黏接劑。 [實施發明之形態] 兹參考圖式’將本發明之半導體雷射裝置說明如下。 本發明之半導體雷射裝置’如第1圖所示之將其一實 施形態之帽蓋予以剖開之側面說明圖及底面圖’包括以樹 脂構件14 一體成形之樹脂製柱體〖，具有由導電材料所製 成之複數條導線11至13從上下面露出，及有台座15為電 性連接於該複數之導線11至13之一條導線而形成。然後， 把雷射晶片2固定於台座15。該雷射晶片2係安裝於矽輔 助女裝座3上，而該碎辅助安裝座3則固定在台座is上。 在台座15上設有監視雷射晶片2之輸出用之受光元件 另有帽蓋5套在該雷射晶片2等之周圍，而用黏接劑6等 固定於柱體在帽蓋5之頂部形成有光之透過窗51。該 透過窗51有裝設玻璃片並予以氣密地封裝之情形。 柱體1係如在第2圖令有顯示其平視圖及侧視圖，在 Λ---------- I 裝·-- : <請先閱讀背面之注意事項再填寫本頁} 丨！ 訂-!丨！ - ^^5· 經濟部智慧財產局員工消費合作社印製 k紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公楚 4 311189 463428 A7 五、發明說明（5 ) (請先閱讀背面之注意事項再填寫本頁) 該例中用絕緣性之樹脂構件14固定3條導線11至13。其 中之-條導線11係與台座15 —體形成，該台座15係在樹 脂構件14之上面形成’其下面有共同導線u延伸出。在 樹脂構件14之上部，有突起部16以與台座15 一體之狀態 露出於樹脂構件i4之上部並沿著柱體i之外周延伸。該突 出部16係以稍為露出樹脂構件14之表面之一定尺寸而 設，而前述之帽蓋5係載置於該突出部6之上面而固定。 換言之，在雷射晶片2所產生之熱可經台座。及突起部 16而傳到帽蓋5，而從帽蓋5散熱，再者，樹脂構件14 之尺寸精度無法像金屬般那麼精確形戚，在柱體丨上不容 易設定雷射晶片2之定位基準面，然而該突起部16係與台 座15 —體形成的關係，能夠正碟地決定突起部對台座 15之位置，再者，把帽蓋5頂接於該突起部“而設之結 果，可把帽蓋5之外裙部52之平面部3作為雷射晶片2 之定位用之基準面。 經濟部智慧財產局員工消費合作社印製 如第2圖所示，突起部16係形成從台座15部分沿著 柱體1之周緣部延伸之狀態，例如其平面形狀呈u字形狀 者。該突起部16係並非限定於該形狀，從散熱及固定帽蓋 5之觀點而§，本來在柱體之周圍於帽蓋$之底部所頂接 之部分沿著圓周方向而設為宜。設在台座15之上部中央之 切口部15a係用以避開自雷射晶片2所出射之光者；第2 圖（a)之17係填充於導線12，13與台座15之間之導線固 定用樹脂；因為柱體1係樹脂製造的關係，在作金屬線連 接（wire bording)之際，其保持導線的力量會比使用低融點 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 5 311189 經濟部智慧財產局員工消費合作社印製 463428 A7 ________B7 五、發明說明（6) 玻璃來封裝導線時較低，因此用樹脂17以防止接合性之降 低者。 樹脂構件14於把完成之元件裝配於電路基板等時之 錫焊而溫度容易上昇時，應使用具有耐熱性的樹脂為宜， 例如，可使用液晶聚合物等。然而，也可使用通常之pps 等之樹脂。該樹脂構件14之厚度係可形成為0.8至lmm 左右，比以往之金屬製（1·1至l_3mm左右）者薄一些。又， 14a至14c係如同以往形成在柱體1之對旋轉之定位用之 切口部。該等切口部14a至14c僅在金屬模具形成突起則 可容易地形成為所希望之形狀。 欲製造該柱體1時’例如在有形成該樹脂構件14之形 狀之模穴（cavity)之金屬模具内，安裝事先用沖剪及折贊加 工等所形成之導線Π至13 ’注入樹脂而予以硬化，即可 形成把導線11至13固定在樹脂構件14内之柱體1。導線 11至13可如將複數組之導線逹結成導線框之方式，對一 個金屬模開設複數個模穴’則一次可同時製造數十個之柱 體1。 雷射晶片2係形成為可射出雷射光，其大小係250以 mx 250 //m左右而體型很小，為了容易處理起見，通常是 黏接於0.8x lmm左右之大小之矽基板等所成之輔助安裝 座3上。然後，將一方之電極直接連接於輔助安裝座3’ 以導電性黏接劑而連接於共同導線丨〗，另一方之電極則經 由辅助安裝座3之電性抬高之部分’藉金屬線連接而連接 於導線13。該有文裝雷射晶片2之輔助安裝座$係由吸住 ί請先閲讀背面之注意事項再填寫本頁} 裝 i — I II I I 訂 _ ---1 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 6 311189 163428 A7 B7 五、發明說明（7) 夹頭所搬運，以突起部16之上面為基準而^ 台座15上。以該突起部16之上面作為基準之結果女裝在 後述之帽蓋5固定在該突起部16上，對帽蓋’可把 52之基準面B’可將雷射晶片2以高精度地裝配於正：的 位置上。同樣地將用以監視雷射晶片2之發光輸 光元件4黏接於台座15上，其一 又 畀方之電極為經台座15而 連接於共同導線11，另一方之電極係未_ 电赃诉以禾圖不之金屬線連 接線而與導線12電性連接。又，該受光元件4係也可以直 接形成於輔助安裝座3。 將帽蓋5黏接於柱體！而設在雷射晶片2之周圍。帽 蓋5係以鋼等導熱性良好之材料製成為宜，但用鐵等金屬 製造亦可。另外，宜施以無光澤鍍銀以便防止光在内面紊 釓地反射。又，帽蓋5頂部之中心部設有使雷射光通過之 貫穿孔，並形成有窗部51。再者，在底部形成具有高低差 之外裙部52,將具有高低差之平面部作為定位用之基準面 B’而將外裙部52之覆蓋柱體1之部分作為外徑之基準。 該帽蓋5係以金屬製造’故可以良好之尺寸精度形成，不 論樹脂製柱體1之尺寸不均勻，仍可成為一定之尺寸基準 面及基準徑。該帽蓋5係以環氧系統之樹脂製成之黏接劑 而黏接於柱體’但為了要良好地逸散雷射晶片2所產生之 熱起見，以導熱性良好者為宜，如有混入銀等之金屬填料 者為宜。 根據本發明之半導體雷射裝置，柱體係由樹脂構件固 定導線而形成，相較於以往之將金屬板用冷鍛法形成之需 本紙張尺度適用中囤國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝，-------訂---- 經濟部智慧財產局員工消費合作社印製 311189 經濟部智慧財產局員工消費合作社印製 463428 B7 五、發明說明（8) 要複雜的成形製程，本發明之半導體雷射裝置可以非常廉 價地形成β而且，不必事後用玻璃來固定導線，可削減固 定導線之步驟數之同時，不因導線直徑大而需要較大的空 間，可在狹窄之範圍内固定導線，可提高配置導線等之自 由度。並且，將台座與導線一體形成而用樹脂成形時，其 直角度等也可比金屬模具更精密地成形，可製造彎曲度小 而高性能的半導體雷射裝置。另一方面，關於用樹脂製造 柱體之缺點為散熱性不好與尺寸精度不好。然而，關於散 熱性，本發明設有與安裝雷射晶片2之台座15 —體而從樹 脂構件14所露出之突起部16，而將帽蓋5之底部頂接於 該突起部16,可經由金屬構件之台座15與突起部16而對 帽蓋5導熱，可從帽蓋5實行散熱。因此，雖然樹脂構件 14之導熱性較低，但要使雷射晶月2所產生之熱逸散並無 任何障礙。 關於尺寸精度而言，樹脂構件14本身之收縮度不一 定’關於雷射晶片之光射出方向之尺寸設定用之定位，以 及設在安裝基板之孔内插入其柱體之外徑來定Xy方向之 位置時無法得到足夠的精度。然而，設在其外周之帽蓋係 金屬，可以很高之尺寸精度來形成帽蓋。在該尺寸精度良 好之帽蓋之底部設具有高低差之外裙部，而將該高低差部 之内面抵接於與前述之台座一體之突起部而固定，於是可 將雷射晶片之定位基準面設定在帽蓋之外祿部之高低差 部。並且’以覆蓋柱體外周之外裙部，可以良好的精度形 成其外徑的關係’xy方向之定位也可以充分良好之精度來 --,--------裝 i 1 (請先閱讀背面之注意事項再填寫本頁) t • n I n 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 8 311189 463428 A7 I-------- B7 五、發明說明（9) 形成。 {請先閱讀背面之注意事項再填寫本頁} 將前述之第1圖所示構造之半導體雷射裝置固定於厚 度3mm而30mm正方形之鋁金屬所成之散熱板時（本發明 以P1表示，以往構造以Q1表示），以及未固定於散熱板 時（本發明以P2表示，以往構造以q2表示）之雙方，把半 導體雷射裝置之動作條件，設定為順方向電流lF=3〇mA， 抽樣電流IM= 1.5mA ,柚樣時間TD= 1从s之條件下動 作’調査熱變電阻（Rth)之變化之結果與以往之半導體雷射 裝置對比而顯示於第3圖。從第3圖可明白，使用樹脂製 柱體所致之對散熱之影響幾乎無差別。另外，在第3圖中， 橫軸係顯示電流施加時間Tp(秒），縱軸係顯示熱變電阻 Rth(攝氏度/ W)。 [發明之效果] 經濟部智慧財產局員工消費合作社印製 如以上所說明，根據本發明，因為用樹脂構件形成柱 體’不必實行特殊加工而可簡單地製造柱體。並且，不必 用玻璃固定導線，故可減少組件數量之同時，也可免除其 步驟。因此，在不降低其電氣及光學特性之狀態丁可製造 非常廉償的半導體雷射裝置。再者’其外形完全與以往用 金屬柱體之半導體雷射裝置相同，故可以直接用來更換以 往之製品。 [圖式之簡單說明] 第1圖（a)至（b)係顯示本發明之半導體雷射裝置之一 實施形態之構造之說明圖。 第2圖（a)至（c)係顯示第1圖之柱體部分之平面及側面 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 9 311189 A7 463428 _B7 五、發明說明（iG) 之說明圖。 (請先閱讀背面之注意事項再填寫本頁) 第3圖係將第1圖之半導體雷射裝置之熱變電阻之特 性與以往之金屬製柱體之半導體雷射裝置之熱變電阻特性 予以對比而顯示之圖。 第4圖（a)至（c)係顯示以往之半導體雷射裝置之一例 之構造之說明圖。 [圖號之說明] 經濟部智慧財產局員工消費合作杜印製 1 樹脂製柱體 2 雷射晶片 3 矽輔助安裝座 4 受光元件 5 帽蓋 6 黏接劑 11 共同導線 12 導線 13 導線 14 樹脂構件 14a至 14c切口部 15 台座 16 突起部 17 導線固定用樹脂 21 柱體 21a 台座 21b 貫穿孔 21c 切口部 22 輔助安裝座 23 雷射晶片 24 帽蓋 24a 突緣部 24b 突起 26,27 導線 28 共同導線 29 低爆融點玻璃 31,32 電極 51 光之透過窗 52 外裙部 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 10 311189--- Order I This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 3 311189 A7 Xi 6 3 4 2 8 V. Description of the invention (4) The base, protrusions and caps dissipate heat, It is more appropriate. On the bottom of the cap is formed a skirt with a height difference outside the upper and lateral sides of the carcass. If the precision of the diameter of the resin column is poor, the outer diameter of the cap can still be used Determine the correct installation position. In addition, the top of the outer skirt can also be used as the reference plane for the positioning of the laser chip (the distance from the laser chip), so it is more suitable. The cap is adhered to the pillar with an adhesive with good thermal conductivity, so that the heat transmitted to the pedestal can be efficiently dissipated from the cap. The term “adhesive with good thermal conductivity” means, for example, an adhesive with a material with good thermal conductivity, such as a silver filler, mixed with a metal filler. [Mode for Carrying Out the Invention] The semiconductor laser device of the present invention will be described below with reference to the drawings'. The semiconductor laser device of the present invention, 'a side explanatory view and a bottom view, in which a cap of one embodiment is cut as shown in FIG. 1' includes a resin column integrally formed with a resin member 14, and has a A plurality of wires 11 to 13 made of a conductive material are exposed from above and below, and a pedestal 15 is formed by one wire electrically connected to the plurality of wires 11 to 13. Then, the laser wafer 2 is fixed to the pedestal 15. The laser chip 2 is mounted on the silicon auxiliary women's seat 3, and the broken auxiliary mounting seat 3 is fixed on the stage is. A light-receiving element for monitoring the output of the laser chip 2 is provided on the pedestal 15 and a cap 5 is set around the laser chip 2 and the like, and is fixed to the pillar with an adhesive 6 and the like on the top of the cap 5 A light transmission window 51 is formed. The transmission window 51 may be provided with a glass sheet and hermetically sealed. The column 1 is shown in the plan view and the side view in Figure 2. Install it in Λ ---------- I:-< Please read the precautions on the back before filling this page } 丨! Order-! 丨! -^^ 5. The paper size printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs is in accordance with the Chinese National Standard (CNS) A4 (210 X 297 Gongchu 4 311189 463428 A7) V. Description of the invention (5) (Please read the back (Please fill in this page again)) In this example, three wires 11 to 13 are fixed with an insulating resin member 14. One of the wires 11 is formed integrally with the pedestal 15, which is formed on the resin member 14. 'A common wire u extends below it. On the upper part of the resin member 14, a protrusion 16 is exposed on the upper part of the resin member i4 in a state of being integrated with the pedestal 15 and extends along the outer periphery of the pillar i. The protrusion 16 is It is provided with a certain size that slightly exposes the surface of the resin member 14, and the aforementioned cap 5 is fixed on the protruding portion 6. In other words, the heat generated by the laser chip 2 can pass through the pedestal. And the protrusion The portion 16 passes to the cap 5 and dissipates heat from the cap 5. Furthermore, the dimensional accuracy of the resin member 14 cannot be as precise as that of metal. It is not easy to set the positioning reference plane of the laser chip 2 on the cylinder 丨. , However, the protrusion 16 is related to The relationship between the base 15 and the body can determine the position of the protrusion on the base 15 in a straight dish. Furthermore, the cap 5 is abutted against the protrusion. As a result, the skirt 52 can be placed outside the cap 5. The plane part 3 is used as a reference plane for positioning the laser chip 2. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, as shown in Fig. 2, the protrusion 16 is formed from the pedestal 15 along the periphery of the column 1 In the extended state, for example, the planar shape is U-shaped. The protruding portion 16 is not limited to this shape. From the viewpoint of heat dissipation and fixing of the cap 5, it is originally located around the column at the bottom of the cap The top part is preferably arranged along the circumferential direction. The cutout part 15a provided in the center of the upper part of the pedestal 15 is used to avoid light emitted from the laser chip 2; 17 in FIG. 2 (a) is filled Resin for fixing the wires between the wires 12, 13 and the pedestal 15; because the column 1 is made of resin, its strength to maintain the wires during wire bording is lower than using a low melting point Paper size applies to China National Standard (CNS) A4 (210 X 297 male) (%) 5 311189 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 463428 A7 ________B7 V. Description of the invention (6) Glass is used to seal the wires, so resin 17 is used to prevent the decrease in bonding. The resin member 14 is finished When the components are mounted on a circuit board, etc., and the temperature tends to rise, it is advisable to use a resin with heat resistance. For example, liquid crystal polymers can be used. However, resins such as ordinary pps can also be used. The resin The thickness of the member 14 may be formed to be about 0.8 to 1 mm, which is thinner than that of a conventional metal (about 1.1 to 1-3 mm). In addition, 14a to 14c are cutout portions for positioning the pair of rotations formed in the column 1 as in the past. These cutout portions 14a to 14c can be easily formed into a desired shape by forming protrusions only in a mold. When manufacturing the pillar 1 'for example, in a metal mold having a cavity forming the shape of the resin member 14, a wire Π to 13 formed by punching and embossing in advance is installed, and the resin is injected thereinto When it is hardened, the pillar 1 in which the lead wires 11 to 13 are fixed in the resin member 14 is formed. The wires 11 to 13 can be formed into a wire frame by arranging the wires of a plurality of arrays, and by opening a plurality of cavities' to a metal mold, dozens of pillars 1 can be manufactured at one time. The laser chip 2 is formed to emit laser light. Its size is 250 mx 250 // m and the size is very small. For easy handling, it is usually bonded to a silicon substrate with a size of about 0.8x lmm. Into the auxiliary mounting base 3. Then, one electrode is directly connected to the auxiliary mounting base 3 'and connected to a common wire with a conductive adhesive, and the other electrode is connected through the electrically elevated portion of the auxiliary mounting base 3' by a metal wire. And connected to the lead 13. The auxiliary mounting base of the laser laser chip 2 with text is to be held. Please read the precautions on the back before filling in this page} Installation i — I II II Order _ --- 1 This paper size applies to Chinese national standards ( CNS) A4 size (210 X 297 mm) 6 311189 163428 A7 B7 V. Description of the invention (7) The chuck is carried on the base 15 with the upper part of the protrusion 16 as a reference. As a result of using the upper surface of the protruding portion 16 as a reference, the women's clothing is fixed to the protruding portion 16 by a cap 5 described later, and the laser chip 2 can be assembled with high accuracy to the cap 'the reference surface B of 52 Yu Zheng: position. Similarly, the light-emitting light-transmitting element 4 for monitoring the laser chip 2 is adhered to the pedestal 15, and the square electrodes are connected to the common wire 11 through the pedestal 15, and the other electrode is not The electric wire 12 is electrically connected with a metal wire connecting wire. The light receiving element 4 may be directly formed on the auxiliary mount 3. Attach the cap 5 to the post! It is provided around the laser chip 2. The cap 5 is preferably made of a material having good thermal conductivity such as steel, but it may be made of metal such as iron. In addition, matte silver plating should be applied to prevent the light from reflecting turbulently on the inside. In addition, a center portion of the top of the cap 5 is provided with a through hole through which laser light passes, and a window portion 51 is formed. Further, an outer skirt portion 52 having a step difference is formed at the bottom, a flat portion having a step difference is used as a reference plane B 'for positioning, and a portion of the outer skirt portion 52 covering the cylinder 1 is used as a reference for the outer diameter. The cap 5 is made of metal, so it can be formed with good dimensional accuracy. Regardless of the non-uniform size of the resin column 1, it can still become a certain size reference surface and reference diameter. The cap 5 is adhered to the pillar with an adhesive made of a resin of an epoxy system. It is advisable to mix metallic fillers such as silver. According to the semiconductor laser device of the present invention, the pillar system is formed by fixing a conductive wire with a resin member. Compared with the conventional method of forming a metal plate by cold forging, this paper is applicable to the national standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling out this page) Pack, --------- Order ---- Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economics 311189 Employees’ Cooperatives of the Intellectual Property Bureau of the Ministry of Economics Printed 463428 B7 V. Description of the invention (8) For complicated forming processes, the semiconductor laser device of the present invention can form β very cheaply. Moreover, it is not necessary to fix the wires with glass afterwards, and the number of steps for fixing the wires can be reduced. It does not require a large space due to the large diameter of the wire, it can fix the wire in a narrow range, and it can increase the freedom of the wire. In addition, when the pedestal and the lead are integrally formed and resin-molded, the right angle and the like can be formed more precisely than a metal mold, and a semiconductor laser device with a small curvature and high performance can be manufactured. On the other hand, the disadvantages of the resin-made pillars are poor heat dissipation and poor dimensional accuracy. However, regarding the heat dissipation property, the present invention is provided with a protrusion 16 that is exposed from the resin member 14 integrally with the pedestal 15 on which the laser chip 2 is mounted, and the bottom of the cap 5 is abutted against the protrusion 16 and can be passed through The base 15 and the protrusion 16 of the metal member conduct heat to the cap 5, and can dissipate heat from the cap 5. Therefore, although the thermal conductivity of the resin member 14 is low, there is no obstacle to the heat dissipation from the laser crystal moon 2. With regard to dimensional accuracy, the shrinkage of the resin member 14 itself is not necessarily "the positioning for setting the size of the light emitting direction of the laser chip, and the outer diameter of the cylinder inserted in the hole of the mounting substrate to determine the Xy direction The position cannot be obtained with sufficient accuracy. However, the cap provided on the outer periphery is made of metal, and the cap can be formed with high dimensional accuracy. A skirt portion with a height difference is provided at the bottom of the cap with good dimensional accuracy, and the inner surface of the height difference portion is abutted against a protrusion integral with the aforementioned base to be fixed, so the positioning reference of the laser chip can be The surface is set at the height difference portion of the outer portion of the cap. And 'the skirt portion covering the outer periphery of the column can be formed with a good accuracy of its outer diameter relationship' positioning in the xy direction can also be performed with sufficient accuracy-, -------- install i 1 (please Read the notes on the back before filling in this page) t • n I n This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 8 311189 463428 A7 I -------- B7 5 2. Description of the invention (9). {Please read the precautions on the back before filling this page} When the semiconductor laser device with the structure shown in Figure 1 above is fixed to a heat sink made of aluminum metal with a thickness of 3mm and a square of 30mm (this invention is represented by P1, The conventional structure is represented by Q1) and when it is not fixed to the heat sink (the invention is represented by P2, and the conventional structure is represented by q2), the operating conditions of the semiconductor laser device are set to a forward current lF = 30 mA Sampling current IM = 1.5mA, pomelo-like time TD = 1 Operation from the condition of 's' The result of investigating the change of the thermal resistance (Rth) is shown in Fig. 3 compared with the conventional semiconductor laser device. As can be seen from Fig. 3, there is almost no difference in the influence on heat dissipation caused by the use of the resin column. In Fig. 3, the horizontal axis shows the current application time Tp (seconds), and the vertical axis shows the thermal resistance Rth (Celsius / W). [Effects of Invention] Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs As described above, according to the present invention, since the column is formed of a resin member ', the column can be simply manufactured without performing special processing. Also, it is not necessary to fix the wires with glass, so that the number of components can be reduced and the steps can be eliminated. Therefore, it is possible to manufacture a very inexpensive semiconductor laser device without degrading its electrical and optical characteristics. Moreover, its shape is completely the same as the conventional semiconductor laser device using a metal cylinder, so it can be directly used to replace the previous products. [Brief description of the drawings] Figures 1 (a) to (b) are explanatory diagrams showing the structure of one embodiment of the semiconductor laser device of the present invention. Figures 2 (a) to (c) show the plane and side of the cylinder part of Figure 1. The paper dimensions are applicable to China National Standard (CNS) A4 (210 X 297 mm) 9 311189 A7 463428 _B7 V. Invention Explanation (iG) illustration. (Please read the precautions on the back before filling out this page.) Figure 3 shows the characteristics of the thermal resistance of the semiconductor laser device shown in Figure 1 and the thermal resistance of the conventional semiconductor laser device made of metal cylinders. Contrast and display. Figures 4 (a) to (c) are explanatory diagrams showing the structure of an example of a conventional semiconductor laser device. [Explanation of the drawing number] Consumption cooperation by employees of the Intellectual Property Bureau of the Ministry of Economic Affairs Du printed 1 Resin cylinder 2 Laser chip 3 Silicon auxiliary mount 4 Light receiving element 5 Cap 6 Adhesive 11 Common wire 12 Wire 13 Wire 14 Resin Components 14a to 14c Notch 15 Base 16 Projection 17 Resin for fixing wires 21 Post 21a Pedestal 21b Penetration hole 21c Notch 22 Auxiliary mount 23 Laser chip 24 Cap 24a Flange 24b Protrusion 26, 27 Lead 28 Common Lead wire 29 Low-explosive melting point glass 31, 32 Electrode 51 Light transmission window 52 Outer skirt This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 10 311189