TW463270B - Electronic device without the requirement of bonding - Google Patents

Abstract

The present invention relates to a kind of electronic device without the requirement of bonding. The invention mainly uses an opaque circuit substrate or chip to conduct the direct bonding package between the electrode surface and the printed circuit board. For the facedown package chips, the key positioning pattern on the back surface of chips is formed through the comparison of chips or the internal position of device. Therefore, the chips can be correctly mounted at the appointed position on the substrate so as to assure the correct package of chips.

Description

463270 V. Description of the invention (1) "Background of the invention" Please refer to the first diagram (a) and (b) of the first diagram, which are schematic diagrams of the structure of a multi-die module package device. The package (P ackage) category can be called " SIP 〃 (SIN GLE IN LINE PACKAGE), which is a single-row in-line package, which is a package of multiple terminals that are flush-connected to each other by terminal terminals that are electrically connected; The occupied area of the packaging substrate is very large. In addition, a general insulating substrate must be assembled to the packaging substrate by using a lead frame. Therefore, the cost of production is high, the time is long, and it is not economical. ; Also, at the beginning of the development of electronic engineering, all manufacturing processes must be done by human hands. However, some electronic components with precise internal structures are often burned because of the long welding time, which causes the entire part to be burned at the beginning. Therefore, Fang You's predecessors successfully developed an automatic welding device. The automatic welding device includes the package for each device without pressure welding, plastic molding, and lead frame. Points, coupled with the simultaneous formation of each electrode, not only facilitates miniaturization, but also reduces product weight, improves efficiency, and reduces production costs. Because this automatic welding device has the above-mentioned advantages, it is used by various high-tech stocks. Product manufacturing; however, to manufacture substrates with an automatic soldering device, you must complete the positioning of the parts on the substrate before packaging. If you want to complete this action, you must use a substrate that can see through, or use infrared, microscope Optical equipment such as

4 6 3 2 7 〇 V. Description of the invention 2) The alignment of optical equipment, the cost of the alignment technology is too high, making it practically impossible; therefore, how to provide a solution that can solve the above problems The electronic device to be wired is to motivate the inventor of the present invention. "Objective of the Invention" In view of this, the inventor of this case uses his own technology, experience, and professional qualities to make and improve the invention through several trials and improvements. The purpose of this invention is to provide an Electronic devices are mainly designed to simplify the pins of electronic components or devices, and at the same time design the marking lines so that when the electrodes are directly packaged with the printed circuit board, they can be accurately installed at the specified position on the substrate. In addition, the present invention does not use high-priced special equipment such as infrared rays and microscopes at all. In addition, the realization of the present invention can completely adapt to the conventional parts manufacturing process, and the added cost is negligible, which is almost negligible; therefore, the present invention can Used for playing various electronic products such as big brother, camera, video player, computer, etc. "Technical Content, Features and Effects" To make it easy for your reviewers to understand the content of this creation, and the effects that can be achieved, a specific embodiment is listed in conjunction with the drawings. The detailed description is as follows:

Page 5 463270 V. Description of the invention (3) 1 • Die 2 • • Electrode 3 • • Glass mask 4 * * Die for production 5 • • Dividing line 6 • • Printed circuit board rj • • Wiring Column 8 • * Positioning point 1 ~ I CM a—i CO XX γ γ line line line line mark labeling indication icon picture one picture figure diagram surface plane structure assembly device packing group mold grain crystal multiple system The figure shows the structure of the packaging device of the top-down structure. The figure of the grain crystals is N) / b / (\-The figure shows the face of the hair crystals. \ ly and ^ V ab / (\ Γ \

_— <Cangyi S means C shows 〃 p \ lry ο 1 "^ Figure s G means 4 A shows surface K view side C down single A grain P crystal grains E Ming N N pole I L 系 的} 明 ”C issued IC books E diagram L two three G number N

Page 6 4 6 327 0 V. Description of the invention (4) The fourth diagram is a schematic diagram of the manufacturing method of the present invention. The fifth figure is a positioning state diagram of the present invention. The sixth diagram is an embodiment of the present invention. The seventh diagram is another embodiment of the present invention. The pull of the crystal and the rise of the crystal are shown in the figure. 2 The pole is the electric power. The grain is shown in the figure. The crystal shows the 3 series of the light in the picture. The second is the first in the picture.

Tt- the crystal, oh 41 ° knows that there are 2 photoelectrodes on the surface of the C table (a grain diagram of the second crystal and the second line of the first and the table) line b virtual C of the second and the second from the figure, two Gao Dizhong ~ Its, __ 一 '示 indicates the line labeled Λί /' C 2 (X 之 ~ One animal, one Ί × 二 X line, the second line of the editorial parameters and then ask the party, on top of the 1 grain The line facing away from the 1 grain and the X line marks the 1 and the grain line cuts the 2 positive poles 2 which are positively positioned to form the shape? The surface T—Ί table 1 shows the mitochondrial mark. Crystal, set the CX1 position to X 2 2, pole Υ 1 electric IX grain Ε crystal N at &gt;-2 L pole electric Ν I Mingfa EI This L is G series N and I, S shows C Please refer to the reference surface of the three-dimensional and three-dimensional reference points. Please use η6-'s line 2 to damage X points, and to use the '—t 2 X polar line electrical standard. For internal questions, ask the table to know how to do this. The production intention is indicated by the meeting, but not both) Y 2 Ε ~ YG 1, A Υ 1 K, YC 1 line AX marked P is, after the crystal is finished, the dual-use feet use the production engraving to make the light generation. It is also light-shaped, and the external standard film of the 3-wire wire board should be covered by Zhongli with its glass, May be shown by determining its registration, FIG four pairs of bits cloth reading light with respect to the cross-like \ and make surface 4 with two-phase full grain

Page 7 4 6 327 0 V. Description of the invention (5) Use the two facing positions between the electric film plate 3 of the crystal grain 4 for production, and make the electrode on the glass mask grain 4 Correctly position the exposure, and then turn the dividing line 5 through development, bake, and engraving the positioning pattern above the grain. Refer to the sixth diagram, a schematic diagram of the grain part, of which 7, the rectangle is the positioning point 8. For mutual alignment with (Please refer to the fifth figure), to ensure that the designated position of the circuit board 6 is brushed. The pole is facing up, and the two glass masks are placed to adjust the production. The grains 4 used on the plate 3 and the production line, and then the ultraviolet ray from the upper and lower sides at the same time to the grains 4 for production, and finally (J as shown in the fifth figure), the formation is stable and further The present invention has been completed. It is used to connect a number of black dots in the printed circuit board 6 to connect the terminals connected to the crystal grains to form a key positioning pattern. Its function is shown.) The dividing line 5 formed on the crystal grain 1 can be correct. The ground is mounted on the printed board, as shown in the seventh figure, which is a combination of various possible alignment patterns. According to these graphs, it can be seen that there are more than one alignment patterns. As a result of wiring confusion, the alignment pattern can be arbitrarily changed and combined; that is, in the case of manufacturing a multi-die module package device with different functions using the same die, the wiring on the substrate has various corresponding changes. However, according to the present invention, as long as the position of the key alignment pattern on the substrate is simply adjusted, the connection between the die and the substrate can be correctly formed.

Page 8 4 6 327 0 V. Description of the invention (6) In order to make the present invention show its progress and practicability, the advantages are listed as follows: 1. The insulating substrate can be directly assembled to the package without using a lead frame. On the substrate, the cost is greatly reduced, and the weight is reduced. 2. The pattern wiring on the connected substrate has great adaptability. 3, the effect of reducing volume. 4. High practical value. 5. Reduce manufacturing costs. 6. Make the invention easy for mass production and shorten the production cycle. 7. Industrial use value. The above descriptions are merely preferred embodiments of the present invention. For example, any changes made by using the above-mentioned technology and method of the present invention should be included in the scope of rights of the invention. To sum up, the present invention has already met the application requirements of the invention patent. 爰 Submit an application in accordance with the law, and ask the Commissioner of the Bureau of Examinations for a clear reference and give this creation

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Claims (1)

No. 6327 No. 89103996 9Η1Λ correction factory six; please patent scope 1, an electronic device that does not need to be wired, which is a packaging method where the surface electrode is directly connected to the substrate forming the electronic circuit. Its characteristics are as follows: For the face-down The wafer electrode 'in order to be correctly installed at the designated position on the substrate' passes through the position of the electrode below the die to form a marking line on the surface of the crystal moon directly above the electrode, and then forms a key positioning map. The wafer is mounted on the substrate. . 2. An electronic device that does not need to be wired according to item 1 of the scope of the patent application, where the marking is formed by using two identical glass mask plates that are exactly the same and accurately aligned with each other, and then use the crystal for production. The electrode with the grain facing upward is inserted between the two glass mask plates, and the two-position device is used to adjust the position of the grains for production, so that the dividing line of the glass mask plate and the production The electrodes on the used crystal grains are correctly aligned, and then UV exposure is performed from the upper and lower sides at the same time. The dividing line is transferred to the production crystal grains, and finally developed, baked and etched to form a stable crystal. Key positioning pattern above the die. 3. An electronic device that does not require wiring according to item i of the scope of the patent application, wherein the key positioning pattern includes a pattern in the device structure. Electric film. The line of the crystal is played in this group. The required line is not connected to the square seed column Y. The line is connected to X. The multi-line is used for the standard item. The figure is in the shape of a bar. The cut application is divided into four parts according to its heart. Page 10 463270 Case No. 89103996 Amendment VI. Patent application scope 5. An electronic device that does not require wiring according to item 1 of the patent application scope. When the electrode pins under the chip have a two-row structure, then Take the center line of the electrode, and add two more locating points in the X and Y directions, or set a single structure pattern with a total of three locating points in either direction.