TW462089B - Wafer clean equipment - Google Patents

Abstract

This invention provides a type of wafer cleaning equipment consisting of, at least, wafer carrier, brush head, robot arm, main fluid tube, first auxiliary fluid tube, second auxiliary fluid tube and cleaning fluid supply assembly. The wafer carrier is used to carry wafer for process. The brush head is used to brush clean wafers. The robot arm is employed to place the brush head onto the wafer surface and also control the brush head to clean the whole wafer surface through a specific route. The main fluid tube sprays clean fluid on the wafer surface brushed clean by the brush head. The first auxiliary fluid tube sprays the cleaning fluid on the wafer surface which is in front of the position brushed clean by the brush head. The second auxiliary fluid tube sprays the cleaning fluid on the wafer surface behind the position brushed clean by the brush head. The cleaning fluid supply assembly is used to provide the cleaning fluid. The main fluid tube, the first auxiliary fluid tube and the second auxiliary fluid tube are on the robot arm.

Description

462089 V. Description of the invention (1) 5-1 Field of the invention: The present invention relates to a cleaning device, and more particularly to a device for rinsing a wafer in a semiconductor process. 5-2 Background of the Invention: In the semiconductor manufacturing process, the appearance of dust particles cannot be completely ruled out, whether it is an environment without vacuum during transportation, or inevitable residual reactants or by-products in the chamber. (By-products), etc., may cause dust particles to adhere to the wafer. The presence of dust particles represents the source of contamination. Therefore, in the semiconductor manufacturing process, the steps of cleaning wafers are indispensable, and how to optimize the cleaning effect is an important key to improve product yield. A common way to clean the wafer is to rinse the surface of the wafer with water, and assisted by the brush head to remove the dust particles attached to the wafer. The basic structure of the corresponding cleaning equipment is shown in the first figure. There is a liquid pipe 11 for spraying the cleaning liquid somewhere on the wafer 10 near the wafer 10, and on the wafer 1 There is a brush head 12 for cleaning the wafer 10 on the 0, and a robot arm 13 is used to control the brush head 12 so that the brush head 12 can be rotated on the wafer 1 0 in addition to rotating around the axis 14 Move up. The purpose of this design is to make all the dust particles attached to the entire surface of the wafer 10 be pryed by the brush head 12 first.

Page 4 462089 V. Description of the invention (2) The wafer is taken away from the wafer 10 by the cleaning liquid flowing on the surface of the wafer 10. Obviously, this cleaning equipment cannot avoid the following two defects: first, as shown in the second figure, because the liquid pipe 11 is fixedly sprayed with cleaning liquid 15 somewhere on the wafer 10 (in the first The second figure is the center of the wafer 10), so the amount of the cleaning liquid 15 on the surface of the wafer 10 is not evenly distributed, so that the brush head 12 is pried up in the area where the amount of the cleaning liquid 15 is small. The dust particles cannot be effectively taken away from the wafer 10; second, because the cleaning liquid 15 is only used to take away the dust particles that have been pried up, so only the brush head 12 is used to pry up the dust particles. When the dust particles are firmly attached to the wafer 10 or the size and weight of the dust particles are large, the dust particles often cannot be removed or it takes more time to remove the dust particles. From the previous discussion, it can be seen that due to the limited effectiveness of conventional cleaning equipment in removing dust particles attached to the wafer, it is necessary to improve its structure to improve the efficiency of the cleaning process. 5-3 Purpose and Summary of the Invention: The main object of the present invention is to provide a cleaning device for effectively removing dust particles on the surface of a wafer. Another object of the present invention is to provide a cleaning device which can overcome the drawbacks mentioned in the background of the invention.

4 6 2 Ο B 9 V. Description of the invention (3) According to the above objects and other possible objects, the present invention provides a wafer cleaning device. This wafer cleaning equipment includes at least: wafer carrier, brush head, robot arm and cleaning fluid supply assembly and other components which are the same as conventional cleaning equipment: wafer carrier is used to carry the wafer to be processed; brush head is used The wafer is scrubbed; the robot arm is used to place the brush head on the wafer surface; the cleaning fluid supply assembly is used to supply the cleaning fluid, and the brush head is moved along a path to scrub the entire surface of the wafer. This wafer cleaning equipment also includes at least the main fluid tube, the first auxiliary fluid tube and the second auxiliary fluid tube, which are different from the conventional cleaning equipment: the main fluid tube sprays cleaning fluid on the wafer. In part, the first auxiliary fluid pipe sprays cleaning fluid in front of the position of the brush head in this path, and the second auxiliary fluid pipe sprays cleaning fluid behind the position of the brush head in the path. Obviously, one of the main features of this cleaning equipment is the way the cleaning liquid is sprayed onto the wafer. In addition, the main fluid pipe, the first auxiliary fluid pipe and the second auxiliary fluid pipe are usually located on the robot arm to ensure that the cleaning liquid required for the operation of the brush head can be continuously and adequately supplied. 5-4 Detailed description of the invention: To address the two common drawbacks of conventional techniques: the fluid tube does not allow the cleaning fluid to be evenly distributed on the wafer, and only the brush head is used to pry up the dust particles. Two entry points to solve the problem: the first

Page 6 Δ ο nqq V. Description of the invention (4) Let the cleaning fluid be directly supplied to the part being processed by the brush head, so as to ensure that all the dust particles that are pried up will be taken away by the cleaning fluid: Second, raise the brush The rate at which the head is processing part of the cleaning fluid, so that the dust particles are simultaneously pried by the brush head and the cleaning fluid. According to the above-mentioned entry point, the inventor of the present invention proposes a wafer cleaning equipment, as shown in the third figure, including at least the following units: wafer carrier 3, brush head 32, robot arm 33, main fluid pipe 34, and first auxiliary The fluid pipe 35, the second auxiliary fluid pipe 36, and the cleaning fluid supply assembly 37 (not shown in the third figure). Among them, the main fluid pipe 34, the first auxiliary fluid pipe 35, and the second auxiliary fluid pipe 36 are one of the main features of the present invention. In this wafer cleaning equipment, the wafer carrier 31 is used to carry the wafer 30 to be cleaned, and the brush head 32 is used to clean the wafer 30, and the robot arm 3 3 is used to remove The brush head 32 is placed on the surface of the wafer 30, and can also be used to drive the brush head 32 to move along a path so that the entire surface of the wafer 30 will be scrubbed by the brush head 32. Incidentally, in order to improve the ability of the wafer cleaning device to remove dust particles on the wafer 30, the device further includes rotating the wafer 30 with the wafer carrier 31, so that the wafer 30 is wound perpendicular to the wafer 30. Axis of its surface. Of course, the shooting device further includes rotating the brush head 32 with a robot arm 3 3 so that the brush head 32 rotates around an axis perpendicular to the surface of the wafer 30.

Page 7 4 620 8 9 V. Description of the invention (5) —------- The main fluid pipe 34 is used for spraying the cleaning fluid 38 on the part where the wafer head 32 is being brushed. The first-assisted fluid tube 35 is used to spray the Ϊ: body 38 in front of the position of the brush head 32 in this path, and the auxiliary fluid tube 36 is used to spray the cleaning fluid 38 on the path. The part behind the position of the brush head 32. The cleaning fluid supply assembly ^ is used to supply the required cleaning fluid 38. The cleaning fluid 38 is usually water, but may be a fluid such as a cleaning liquid. In addition, although the example depicted in the third figure is that the main fluid pipe 34 is located on the robot arm 33, the first auxiliary fluid pipe 35 is also located on the robot arm 33, and the second auxiliary fluid pipe 36 is also located on the robot arm 3 3 On the situation. However, the present invention f is not limited to this, because the focus is on injecting the cleaning fluid 38 on the wafers 30, 35/36, and the portion where the brush head 32 is being scrubbed, as well as the front and back, the three fluid pipes 34 / 35/36 may not be located on the robot arm 33. Of course, it is more convenient for these three fluid pipes 34/35/36 to be located on the robot arm 33. However, the configuration of the actual wafer cleaning equipment can be adjusted according to the situation. Furthermore, when the brush head 32 will be perpendicular to the crystal When the axis of the surface of the circle 30 rotates, in order to prevent the force of the dust particles on the surface of the wafer 3 from both the brush head 3 2 and the cleaning fluid 3 8, the main fluid pipe 3 4 of the cleaning device is The cleaning liquid 38 is sprayed with the cleaning fluid 38 on the wafer 30 in the direction in which the brush head 32 rotates. The brush head 32 is being washed, as shown in the fourth diagram of the top view (arrow indicates the rotation direction of the brush head 32). .

462089 V. Description of the invention (6) Further, because the flow rate in the fluid pipeline is kept constant, the flow rate will increase when the cross-sectional area becomes smaller, so in order to enhance the injection from the three fluid pipes 3 4/3 5/3 6 The ability of the cleaning fluid 38 on the wafer 30 to pick up dust particles, as shown in the partial schematic diagram of the fifth figure, the cleaning device may further include at least one of the following conditions according to actual needs: the main fluid pipe 34 is near The cross-sectional area at the wafer 30 is smaller than the cross-sectional area of the main fluid tube 34 at a distance from the wafer 30, and the cross-sectional area of the first auxiliary fluid tube 35 near the wafer 30 is smaller than the first auxiliary fluid tube 35 at a distance from the crystal. The cross-sectional area at the circle 30 and the cross-sectional area of the second auxiliary fluid tube 36 near the wafer 30 are smaller than the cross-sectional area of the second auxiliary fluid tube 36 near the wafer 30. In addition, because the three fluid pipes 3 4/3 5/36 are all betting cleaning fluid 3 8 on the wafer 30 and the position of the brush head 3 2 and the vicinity, it is not 100% guaranteed that the other on the wafer 30 Some of the dust particles that have been pried can be taken off the wafer 30. Therefore, the cleaning device may further include an external fluid pipe 39 for spraying the cleaning fluid 38 on the wafer 30 to remove the dust particles. The external fluid pipe 30 is not located on the robot arm 3 3. Since the external fluid pipe 39 is used to ensure that the dust particles that have been pried up on the wafer 30 are taken away, the flow of the external fluid pipe 39 is the main fluid pipe 3 4 and the first auxiliary fluid pipe 3 5 The flow rate with any of the second fluid pipes 36 is large. In any case, although the main fluid pipe 3 4, the first auxiliary fluid pipe 35, and the second auxiliary fluid pipe 36 are used in this cleaning device, since the present invention

Page 9 4 6 208 9 Fifth invention description (7) The main focus is to directly place the cleaning fluid 3 8 on and around the brush head 3 2 being processed, and to use the cleaning fluid 3 8 to assist in prying up Dust particles, not cleaning fluids with those fluid pipes 38. Therefore, the inventor of the present invention has also proposed another wafer cleaning device, which at least includes a brush head for cleaning the wafer, for placing the brush head on the wafer and moving the brush head along a path to scrub the wafer. The entire surface of the robotic arm is located on the robotic arm and is used to spray cleaning fluid onto the wafer at the brush head position and surrounding cleaning assemblies, and a cleaning fluid supply assembly for supplying cleaning fluid. The actual configuration of the innocent assembly depends on the configuration of the entire wafer cleaning equipment. Obviously, since the cleaning fluid is sprayed on the location and surrounding of the brush head, it can be ensured that no matter where the brush head is located on the wafer, the brush head has sufficient cleaning fluid available at all times. And because the cleaning fluid that has just been self-cleaned on the wafer has a certain amount of momentum, it can also assist the brush head to pry up dust particles. Of course 'this cleaning equipment can have the same details as the previous cleaning equipment, for example, the cleaning assembly is composed of the main fluid tube, the first auxiliary fluid tube and the second auxiliary fluid tube, but the possible changes of the cleaning equipment are not limited to this . In addition, the present invention can also be extended to cleaning any objects with dust particles on the surface; and when the dust particles are not urgently pried with a cleaning fluid, it can also be extended to the cleaning assembly to only place cleaning fluid on the objects without Be sure to bet on and around the brush head.

Page 4 620 8 9 V. Description of the invention (8) The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patent application for the present invention; all others do not depart from the spirit disclosed by the present invention Equivalent changes or modifications made below shall be included in the scope of patent application described below.

Page 462089 Brief description of the diagram The first diagram is a schematic diagram of the structure of a conventional wafer cleaning equipment; the second diagram is a schematic diagram of a common missing of the conventional wafer cleaning equipment; the third diagram is a description of a preferred embodiment of the present invention A schematic diagram of a wafer cleaning device; a fourth diagram is a schematic top view of the relationship between each fluid tube and a brush head in the foregoing preferred embodiment; and a fifth diagram is a partial schematic diagram of a configuration of this embodiment. Main symbols: 10 wafer 11 liquid tube 12 brush head 13 robot arm 14 axis 15 cleaning liquid 30 wafer 31 wafer carrier 32 brush head 33 robot arm 34 main fluid tube

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Claims (1)

4 6208 9 Case No. 89114295 Amendment VI. Application for amendments to patent scope and surface 1. A wafer cleaning device includes: a wafer carrier for carrying a wafer; a brush head for cleaning the A wafer; a robotic arm for placing the brush head on the surface of the wafer, for moving the brush head along a path to scrub the entire main fluid tube of the wafer, for spraying a cleaning fluid The part of the brush head that is being scrubbed on the wafer; a first auxiliary fluid tube for spraying the cleaning fluid in front of the path where the brush head is located; a second auxiliary fluid tube for Spraying the cleaning fluid behind the brush head on the path; and a cleaning fluid supply assembly for supplying the cleaning fluid. 2. The wafer cleaning equipment of item 1 of the patent application scope further includes rotating the wafer with a wafer carrier so that the wafer rotates about an axis perpendicular to one surface of the wafer. 3. The wafer cleaning equipment as claimed in item 1 of the patent application scope further comprises rotating the brush head with the robot arm, so that the brush head rotates about an axis perpendicular to a surface of the wafer. 4. The wafer cleaning equipment as claimed in item 1 of the patent scope, in which the main fluid pipe is located on the robot arm. Page 11 462089 _Case No. 89Π4295_Year Month Date_ Amendment VI. Scope of Patent Application 5. The wafer cleaning equipment of item 1 of the scope of patent application, wherein the first auxiliary fluid pipe system is located on the robot arm. The first description of the above is to clean it. The round-shaped crystal arm of the mechanical item machine 1 The second is in the range of the fan management special body Shen Liururu • _ 6 Fortunately, the main cleanliness of the first lieutenant general Its direction, Fang Bei. Set a round brush for cleaning the head of the rotating part to wash the crystal. The edge of the brush is at the head of the liquid body, and the liquid brush is cleaned. The fan should be used to apply the crystal tube to the body. In the upper body of the pipe, the master is required, and it is prepared at the item where the small washing system is used to clear the round surface. 1—_ The circle of the first product of the round product is close to the cut-off range. It is based on the special application of the Yuanshen tube crystal as the body. Cleanse and cleanse. The round cross-section of the round crystal is 1 of the first round. The near circle is surrounded by the crystal fan. The tube is far away from the body. The flow is such as the auxiliary tube. It's a cleansing facial cleanser. A round cross-section crystal of a round crystal is located at this location. 1 is near the circle, i is near the crystal, U is applied in the body, and α is flowing in the yoke tube. 10. The auxiliary body. 11. The wafer in the scope of patent application No. 1 The cleaning device further includes an external fluid tube, which is not located on the robot arm and is used to spray the cleaning fluid. Page 12 462089 ϋ_89114295 A_Month Amendment 6. The scope of the patent application is on the wafer 12. If the wafer cleaning equipment of the 11th scope of the patent application is applied, the flow rate of the external fluid pipe is higher than that of the main fluid pipe and the first The flow of any one of the auxiliary fluid ^ and the second fluid pipe is large. M s 1 3. According to the wafer cleaning equipment in the scope of the patent application, wherein the main cleaning fluid contains at least water. ^ β 1 4. A fluid cleaning device for cleaning an object, comprising: a robotic arm 'for placing a brush head on the object to scrub the ^ object; ... a main fluid tube' for cleaning a person The fluid is sprayed on the part of the wafer where the brush head is being scrubbed; a first auxiliary fluid tube is used to spray the cleaning fluid on the part in front of the position where the brush head is located; 1-the second auxiliary A fluid pipe for spraying the cleaning fluid behind the brush head on the path; and a cleaning fluid supply assembly for supplying the cleaning fluid. 1 5. The fluid cleaning device for cleaning an object according to item 4 of the patent application scope further comprises moving the brush head along a path with the robot arm to scrub the entire surface of the object. 苐 Page 13462089 _Case No. 89114295_Amended Month ____ VI. Scope of Patent Application 1 6. If the fluid cleaning equipment used to clean an object according to item 14 of the scope of patent application, it also includes rotating the brush with the mechanical arm The head, whereby the brush head is rotated about an axis perpendicular to a surface of the object. 17. The fluid cleaning device for cleaning an object as claimed in item 14 of the patent scope, wherein the main fluid pipe mentioned above sprays a cleaning fluid on the wafer in the direction in which the brush head rotates. The part of the brush head that is being scrubbed. 1 8. The fluid cleaning equipment for cleaning an object as claimed in item 14 of the scope of patent application, wherein the cross-sectional area of the main fluid tube near the wafer is smaller than that of the main fluid tube away from the wafer. Cross-sectional area. 19. The fluid cleaning device for cleaning an object as claimed in item 14 of the scope of patent application, wherein the cross-sectional area of the first auxiliary fluid tube near the wafer is smaller than the distance of the first auxiliary fluid tube away from the first auxiliary fluid tube. The cross-sectional area at the wafer. Page 14