45 885 4 A7 B7 五、發明説明（） 5-1發明領域 (請先閲讀背面之注意事項再填寫本頁) 本發明係有關於一種化學機械硏磨之硏漿供給的裝置與方 法，特別是有關於一種利用一大型螺帽緊扣一包圍有晶圓淸洗刷 / 之夾鉗，以ί免晶圓淸洗刷鬆動的裝置與方法。 5-2發明背景 在製造半導體元件時，平坦度是一個很重要的問題，因此 在積體電路的製程中，用以獲得整個晶圓表面之全面平坦化是一 個極爲重要的步驟。在半導體製程中，平坦化的方法有很多，其 中當需要獲得全面平坦化的時候，經常是使用化學機械硏磨法 (chemical mechanical polishing: CMP)，以替代回飽刻（etch back)， 將半導體晶圓表面的半導體層平坦化。 - 經濟部智慧財產局員工消費合作社印製 在化學機械硏磨法的製程中’，在硏磨完成之後都會有一個 淸理晶圓的步驟。儘管部分提倡超音波的淸洗方法，可是一般來 說使用純水的刷洗法（brush cleaning method)依然是一種淸 洗效果最佳的方法，而且亦是最常見最普遍的晶圓淸洗方 法。在硏磨製程完成之後，使用機械手臂將晶圓自硏磨頭 中移出，再將該晶圓移動至兩個晶圓淸洗刷之間，而這兩 個晶圓淸洗刷就開始作用對晶圓的兩面淸洗（未以圖面表 示）。 每一個晶圓淸洗刷的兩端都由個別的兩個夾鉗所夾持固 2 本紙張尺度適用中國國家襟準（CNS ) A4規格（210X297公釐） 經濟部智慧財產局員工消費合作社印製 4 δ 83 5 4 Α7 Β7 五、發明説明（） 定，晶圓淸洗刷一端的夾鉗連結一轉動馬達，在淸洗過程中，轉 動馬達牽引驅動夾鉗，使得在夾持在夾鉗之中的晶圓淸洗刷亦沿 著其主軸轉動，而晶圓淸洗刷之多個毛刷端連續接觸並離開晶圓 表面，以此掃動的做法來移除晶圓表面之異物，期間由晶圓淸洗 刷中亦可以着純水噴出，以達到沖洗的效果。 傳統上一般將晶圓淸洗刷固定於夾鉗之裝置，請參考第— 圖，夾鉗可以由結構上被區分爲兩端：連接於轉動馬達軸12的 夾鉗後端14以及面對著晶圓淸洗刷16方向的夾鉗前端18。其 中夾鉗內部有~中空區2〇，且該中空區的大小形狀與晶圓淸 洗刷16端外形相符。 第二A圖以及第二B圖爲傳統固定裝置之夾鉗前端1S打開 時的結構槪略圖，如圖所述，夾鉗前端18可以被打開’在一般 的設計上係利用一軸22將夾鉗前端的上半部18a固定連接於夾 鉗後端14及夾鉗前端之下半部18b，夾鉗前端上半部iSa的部分 即可呈非固定狀態而移動，當夾鉗前端1S在開啓狀態時，夾鉗 內的中空區20已經暴露在外，所以晶圓淸洗刷16可以輕易的置 入該中空區20之內。 當夾鉗前端18打開時，將晶圓淸洗刷16的一端置入夾鉗 的中空區20之中，再將夾鉗前端18關閉，因爲中空區20的形 狀與晶圓淸洗刷16置入端的輪廓相同，在夾鉗前端18關閉之狀 態下，晶圓淸洗刷16的位置應可緊緊維持於中空區20內。爲了 保持晶圓淸洗刷位置的固定與夾鉗之前端保持關閉狀況，在一般 ----Γ,--^---14—----—^------>、 -> · (請先閱讀背面之注意事項再填寫本頁) 46 3054 A7 B7 五、發明说明（） (請先閲讀背面之注意事項再填寫本頁) 的設計中係利用一小型螺絲24 ’該小型螺絲24位置於轉軸22 的另一側，在關閉狀態時穿過前端18的上半部18a及下半部 18b，使得夾鉗結構中的可移動部分-前端上半部18a與不可移動 部分-前端下半部18^緊密連結，並將晶圓淸洗刷16緊密的保持 在中空區2〇/內的位置》 , 一般來說，晶圓淸洗刷在淸理一萬片晶圓之後即需要更 換，以保持晶圓淸洗刷的清潔效果，而且當實際操作中，只要晶 圓的淸潔未能達到預期的效果，亦會更換一支新的晶圓淸洗刷。 經濟部智慧財產局員工消费合作社印製 再者，在夾鉗暨晶圓淸洗刷轉動的過程中，因爲急速轉動， 例如50至300RPM，而產生強大的離心力可能使得在夾鉗中的 晶圓淸洗刷16微微的移動，在這種持續的移動之下可能就會使 螺絲24閉鎖的機構產生鬆動。在實際的操作上，儘管在一萬次 晶圓清理之後都會將螺絲重新鎖緊，可是依然經常有因爲螺絲鬆 動，前端上半部ISa開啓，使得在淸理中晶圓淸洗刷I6由夾鉗 中掉落。當晶圓清洗刷16掉落的情況發生時，不僅需要利用特 殊工具鎖緊螺絲24，且重新安裝晶圓淸洗刷16亦形成工作效率 的損失，同時晶圓淸洗刷的掉落亦可能會造成晶圓的損傷。故需 要一種固定晶圓淸洗刷之方法與裝置，以改良夾鉗的閉鎖機構， 且更方便於操作。 5-3發明目的及槪述 4 本紙乐又度適用中國國家標準（CNS ) A4規格（210XZ97公釐） A7 B7 五、發明説明（） 因爲傳統的晶圓淸洗刷固定裝置在使用一段時間之後，其 夾鉗前端的閉鎖裝置會發生鬆開的現象，本發明使用一種固定化 學機械硏磨之晶圓淸洗刷之方法及裝置，該裝置係用於化學機械 硏磨設備之中，用以避免在晶圓淸洗刷經過一段使用時間之後在 固定部位所^生的鬆動現象，並且無需要特殊工具即可以使該晶 圓淸洗刷在此固定裝置之中完成工作，以維持良好的作業便利 性。本發明之裝置主要包含一夾鉗及一螺帽。本發明的裝置所包 含的夾鉗內包圍該晶圓淸洗刷之一端使得夾鉗與晶圓淸洗刷緊 密結合；而螺帽位於該夾鉗之外緣，且用於固定該夾鉗內該晶圓 淸洗刷，當該螺帽位於該夾鉗側端時該晶圓淸洗刷可以移動，當 該螺帽移至中間位置時可以將該夾鉗連同該晶圓淸洗刷扣緊固 定。 使用本發明裝置之方法包含下列步驟：首先置入一晶圓淸 洗刷的一端於一夾鉗內的中空區，該中空區的大小形狀與該晶圓 淸洗刷輪廓相符；另一步驟是沿著圓筒狀夾鉗曲面移動外緣之螺 帽，將該螺帽移至該夾鉗之該中空區的部位，其目的係使得夾鉗 與晶圓淸洗刷緊緊相扣β 5-4圖示簡單說明 本發明的特徵可以經由下列的圖式及其伴隨的說明而得到 更加淸楚的了解，其中： 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） :1：：---”裝-- (請先閱讀背面之注意事項再揉寫本頁) 訂 ，鼻.. 經濟部智慧財產局員工消費合作社印製 5 88 5 4 A7 _B7_ 五、發明説明（） 第一圖 爲CMP機台內晶圓淸洗刷固定裝置的簡略構造； 第二A圖爲傳統晶圓淸洗刷固定裝置呈開啓狀態之側視圖； 第二B圖爲If統晶If淸洗刷固定裝置呈開啓狀態之前視圖； 第三ABC圖 爲本發明晶圓滴洗刷固定裝置之使用方 法；第三A圖A表示晶圓淸洗刷未置入前的情況；第三B圖表 示晶圓淸洗刷置入後但是夾鉗未閉鎖的狀況；第三C圖表'示晶 圓淸洗刷置入後且夾鉗閉鎖的情況。 (請先聞讀背面之注意事項再故寫本頁) -裝- 經濟部智慧財產局員工消費合作杜印製 圖號元伴對照表 12 轉動馬達軸 14 夾鉗後端 16 晶圓淸洗刷 18 夾餅前端 18a 夾鉗前端的上半部 18b 夾鉗前端之下半部 20 中空區 '22 轉軸 24 小型螺絲 30 夾鉗 32 夾鉗前端 32a 夾鉗前端的上半部 32b 夾鉗前端之下半部 34 夾鉗後端 35 中空區 38 螺紋 40 螺帽 50 晶圓淸洗刷 訂 6 本紙張尺度適用中國( CNS ) ( 210Χ297/>Ϊ7 經濟部智慧財產局員工消费合作社印製 W Μ 5 4 A7 B7 五、發明説明（） 5_5發明詳細說明 在晶圓淸理的過程中，由於離心力的作用，會造成傳統設計 之晶圓淸洗刷#其固定裝置的鬆動，其原因之一可以說是在該傳 統設計固定裝置之夾鉗只依靠一個小型的螺絲.維持其閉鎮之狀 態。該小型螺絲的閉鎮力量不足以抵抗長時間離心力的影響，而 令夾鉗前端的上下部分無法維持緊密的閉合〇在本發明中揚棄了 該小型螺絲閉鎖的設計，而改由使用一套附於夾鉗外緣的螺帽， 提供更強大的閉鎖力量以保持夾鉗前端的上下部分的緊密_ 合’以避免晶圓淸洗刷的脫出掉落。 本發明晶圓淸洗刷固定裝置請參考圖三A，主要爲〜《夾錐 3〇以及一螺帽40所組成，該夾鉗30之內部構造與傳統上的夾 鉗並無明顯的差異，亦擁有一個中空區35用於置放晶圓淸洗刷 5〇之一端，該中空區35的形狀與晶圓淸洗刷端5〇之輪廓相同。 在本發明之最佳實施例中，該夾鉗3〇亦可以被區分爲前端32及 後端34，而且在夾鉗30靠近晶圖清洗刷50的前端32上下部分 亦爲可分離式，例如前端之下部分32b爲固定式，且與夾餅後端 34相連接；而前端的上部分32a爲可移動式，以一轉軸與下部 分及後端相連（未以圖式表示），在靠近晶圓淸洗刷5〇之前端32 呈開啓狀態時，晶圓淸洗刷5〇的置入與取出較爲方便，此外， 在本發明之實施例中，夾鉗30基本上爲一圓筒型的設計，其直 徑約爲10至70mm，長度約爲100至300mm，且其外緣上擁有 7 本紙張尺度適用中國國家梯準（CNS ) A4規格（210X297公釐） (請先聞讀背面之注意事項再.^本頁) —裂 .訂 4§eSi4 A7 B7 五、發明説明（） (請先閲讀背面之注意事項异<寫本頁) 螺紋38，該螺紋部位在夾鉗30之前端後端外緣均存在’另有一 個大型之螺帽4〇套附於該夾鉗30之螺紋38部分，該螺帽4〇可 以完全的旋置到夾鉗的後端34，以方便於夾鉗前端32的開啓； 此外該螺帽$亦可仗完全或者部分的旋置到夾鉗的前端32以達 _成夾鉗前端32的閉鎖狀態* 有關於本發明的使用方法請參考圖三A，轉動馬達軸12與 夾鉗30之間爲可分離式，如此可以置入螺帽40，在本發明之具 體實施例中，當螺帽40位於夾鉗後端34時，夾鉗前端32可以 被開啓，此時可以準備將晶圓淸洗刷50的一端置入夾鉗內的中 空區35。 接下來請參考圖三B，當夾鉗前端32呈現開啓時，可以輕 易地將晶圓淸洗刷50的一端置入夾鉗內的中空區35之中，置入 後將夾鉗30關閉 > 以固定晶圓淸洗刷50的位置。 再來請參考圖三C，將螺帽40旋移至夾鉗前端32，以緊密 壓迫可移動的夾鉗前端上半部32a與下半部32b，使其將內部中 空區35裡的晶圓淸洗刷50被該夾鉗30固定》 經濟部智慧財產局員工消費合作社印製 當使用本發明以達成晶圓淸洗刷固定裝置之閉鎖時，本發 明乃利用大型的螺帽4〇對於夾鉗3〇施予一個緊箍的力量，該力 量對夾鉗30受力的面積在本發明之具體實施例中，約等於3至 _10cm2,即爲螺帽內環的面積，而傳統上使用一小型螺絲的設計， 對夾鉗施力的面積只有約等於0.2至0.7cm2，即爲該小型螺絲與 夾鉗的接觸面。由此可知本發明提供更佳的閉鎖力量於夾鉗之 本紙張尺度適用中國國家揉準（CNS > A4規格U10X297公釐） Α7 Β7 五、發明説明（） 上。 在本發明之實施例中，將夾鉗外緣之螺紋由後端延伸至中 空區之外緣的部位，所以當螺帽旋移至此部位時可以達成較佳的 閉鎖效果；（5時μ蟪紋應使用較粗之螺紋牙距（視夾鉗大小而 / 定）’以利於螺帽之前進及後退》此外，在夾鉗的後端可以連結 一個旋轉馬達轉軸，該旋轉馬達轉軸帶動圓柱型夾鉗及該夾鉗內 部的晶圓淸洗刷使其轉動，晶圓淸洗刷的末端不斷的接觸及離開 晶圓以達成淸理的功效。 其次，在CMP的實際應用中，晶圓淸洗刷的兩端各有一個 晶圓淸洗刷固定裝置。 再者，螺紋之方向應該與晶圓淸潔刷自運作轉動之方向相 反，故晶圓淸洗刷的兩端之晶圓淸洗刷固定裝置螺紋可以爲相反 方向，以確保晶圓清洗刷在轉動時的固定》 · 再者，使用本發明並不需要另外一種特殊工具以達成閉 鎮，只需要使用手指旋轉螺帽至適當位置即可。在一般的機台設 計上，操作人員或維修人員由CMP機台的上方更換或安裝晶圓 淸洗刷至固定裝置中，在一般的情況下人員手臂的長度是足以輕 易的旋轉本發明裝置之螺帽。 以上所述僅爲本發明之較佳實施例而已，並非用以限定本 發明之申請専利範圍：凡其它未脫離本發明所揭示之精神下所完 成之等效改變或修飾，即應包含在本發明的精神與範圔之內，故 應包含在下述之申請專利範圍內。 9 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） (請先閱讀背面之注意事項WV4寫本頁) 裝· 訂 經濟部智慧財產局員工消費合作社印製45 885 4 A7 B7 V. Description of the invention () 5-1 Field of invention (please read the notes on the back before filling out this page) The present invention relates to a device and method for the supply of mortar for chemical mechanical honing, especially The invention relates to a device and method for using a large nut to fasten a clamp that surrounds wafer cleaning / washing to prevent the wafer cleaning and cleaning from loosening. 5-2 Background of the Invention When manufacturing semiconductor devices, flatness is a very important issue. Therefore, in the process of integrated circuit, it is an extremely important step to obtain a complete planarization of the entire wafer surface. In the semiconductor manufacturing process, there are many methods for planarization. When comprehensive planarization is required, chemical mechanical polishing (CMP) is often used instead of etch back to etch back the semiconductor. The semiconductor layer on the wafer surface is planarized. -Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In the process of the chemical mechanical honing method, there will be a wafer processing step after the honing is completed. Although some ultrasonic cleaning methods are advocated, in general, the brush cleaning method using pure water is still the best cleaning method, and it is also the most common and common wafer cleaning method. After the honing process is completed, the robot is used to remove the wafer from the honing head, and then the wafer is moved between the two wafer honing scrubs, and these two wafer honing scrubs begin to act on the wafer. Wash both sides (not shown). The two ends of each wafer are scrubbed and held by two separate clamps. 2 This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm). Printed by the Employees ’Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs. 4 δ 83 5 4 Α7 Β7 V. Description of the invention () It is determined that the clamp at one end of the wafer scrubbing is connected with a rotary motor. During the cleaning process, the rotation motor drives the clamp to pull it into the clamp. The wafer 淸 scrubbing also rotates along its main axis, and the multiple brush ends of the wafer 淸 scrubbing continuously contact and leave the wafer surface. This sweeping method is used to remove foreign objects on the wafer surface.淸 You can also spray pure water during scrubbing to achieve the effect of rinsing. Traditionally, a device for cleaning and fixing wafers to clamps is shown in the figure. The clamps can be structurally divided into two ends: the rear end 14 of the clamp connected to the rotating motor shaft 12 and the wafer facing the crystal. The front end of the clamp 18 in the direction of the circular scrubber 16 is scrubbed. Among them, there is ~ hollow area 20 inside the clamp, and the size and shape of the hollow area are consistent with the shape of the 16 ends of the wafer 淸 scrub. Figures 2A and 2B are schematic diagrams of the structure of the clamp front end 1S of the conventional fixing device when it is opened. As shown in the figure, the clamp front end 18 can be opened. In a general design, a shaft 22 is used to clamp the clamp The upper half 18a of the front end is fixedly connected to the rear end 14 of the clamp and the lower half 18b of the front end of the clamp. The iSa part of the upper half of the front end of the clamp can be moved in an unfixed state. When the front end 1S of the clamp is in the open state At this time, the hollow area 20 in the clamp has been exposed to the outside, so the wafer scouring scrubber 16 can be easily placed inside the hollow area 20. When the front end of the clamp 18 is open, place one end of the wafer grate scrubber 16 into the hollow area 20 of the clamp, and then close the front end of the clamp 18 because the shape of the hollow area 20 and the The contour is the same. When the front end of the clamp 18 is closed, the position of the wafer scouring scrubber 16 should be tightly maintained in the hollow area 20. In order to keep the wafer 淸 scrubbing position fixed and the front end of the clamp to remain closed, in general ---- Γ,-^ --- 14 -------- ^ ------ >,-- > (Please read the notes on the back before filling this page) 46 3054 A7 B7 V. Description of the invention () (Please read the notes on the back before filling this page) The design uses a small screw 24 The small screw 24 is located on the other side of the rotating shaft 22 and passes through the upper half 18a and the lower half 18b of the front end 18 in the closed state, so that the movable part in the clamp structure-the front upper part 18a and the non-movable part -The lower half of the front end is tightly connected, and the wafer scouring scrubber 16 is tightly maintained at a position of 20 / in the hollow area. Generally speaking, wafer scouring scrubbing is required after processing 10,000 wafers. Replace to maintain the cleaning effect of wafer cleaning. In actual operation, as long as the cleaning of the wafer fails to achieve the desired effect, a new wafer cleaning will be replaced. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In the process of cleaning and rotating of the clamp and wafer, due to rapid rotation, such as 50 to 300 RPM, the strong centrifugal force may make the wafer in the clamp The slight movement of the scrubber 16 may loosen the locking mechanism of the screw 24 under this continuous movement. In actual operation, although the screws will be re-tightened after 10,000 wafer cleanings, but often because the screws are loose, the upper half of the front end ISa is turned on, so that the wafer scrubbing I6 is processed by the clamp in the process. Medium drops. When the wafer cleaning brush 16 is dropped, it is not only necessary to use a special tool to tighten the screws 24, but also reinstalling the wafer 淸 scrub 16 also results in a loss of work efficiency. At the same time, the wafer 淸 scrub may fall. Damage to the wafer. Therefore, a method and a device for fixing the wafer and scrubbing are needed to improve the locking mechanism of the clamp and be more convenient to operate. 5-3 Purpose of the invention and description 4 This paper music is again applicable to the Chinese National Standard (CNS) A4 specification (210XZ97 mm) A7 B7 5. Description of the invention () Because the traditional wafer cleaning and fixing device is used for a period of time, The locking device at the front end of the clamp will loosen. The present invention uses a method and device for fixing wafers for chemical mechanical honing and cleaning. The device is used in chemical mechanical honing equipment to avoid The phenomenon of loosening at the fixed part after a period of use of the wafer scouring and scrubbing, and without the need for special tools, the wafer scouring and scrubbing can be completed in this fixture to maintain good operation convenience. The device of the present invention mainly includes a clamp and a nut. The clamp included in the device of the present invention surrounds one end of the wafer 淸 scrubbing so that the clamp is tightly combined with the wafer 刷 scrubbing; and the nut is located on the outer edge of the clamp and is used to fix the crystal in the clamp. For round cymbal scrubbing, the wafer cymbal scrubbing can be moved when the nut is located at the side end of the clamp, and when the nut is moved to an intermediate position, the clamp can be fastened together with the wafer cymbal scrubbing and fixing. The method of using the device of the present invention includes the following steps: firstly placing one end of a wafer grate scrub in a hollow region in a clamp, the size and shape of the hollow region conforming to the wafer gluing scrub profile; another step is to Cylindrical clamp curved surface moves the outer edge of the nut, and moves the nut to the hollow area of the clamp. The purpose is to make the clamp and wafer clean and tightly interlock. Β 5-4 A brief explanation of the features of the present invention can be obtained through the following drawings and accompanying descriptions, in which: This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm): 1 ::- -"Pack-(Please read the notes on the back before rubbing this page) Order, Nose: Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5 88 5 4 A7 _B7_ V. Description of the invention () The first picture is The simple structure of the wafer 淸 scrubbing fixture in the CMP machine; Figure A is a side view of the traditional wafer 淸 scrubbing fixture in the open state; Figure B is the If before the If 淸 scrubbing fixture is in the open state View; the third ABC diagram is the present invention The use method of the circular drop scrubbing fixture; the third A picture A shows the situation before the wafer 淸 scrub is not placed; the third B picture shows the wafer 淸 scrub is placed but the clamp is not locked; the third C chart 'Indicate the situation after the wafer is washed and the clamp is locked. (Please read the precautions on the back before writing this page) Table 12 Rotating motor shaft 14 Clamp rear end 16 Wafer cleaning 18 Clamp front 18a Clamp upper half 18b Clamp lower half 20 Hollow area '22 Rotary shaft 24 Mini screw 30 Clamp 32 Clamp Front end 32a Upper half of the front end of the clamp 32b Lower half of the front end of the clamp 34 Rear end of the clamp 35 Hollow area 38 Thread 40 Nuts 50 Wafer cleaning and ordering 6 This paper is applicable to China (CNS) (210 × 297 / > Ϊ7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs W Μ 5 4 A7 B7 V. Invention Description (5) The invention details 5_5 In the process of wafer processing, due to the centrifugal force, traditionally designed wafer cleaning will occur # 其 Fixture of loose One of the reasons can be said that the clamp of the traditional design fixing device only relies on a small screw to maintain its closed state. The closing force of the small screw is not enough to resist the effect of long-term centrifugal force, so that The upper and lower parts of the front end of the clamp cannot maintain a tight close. In the present invention, the design of the small screw lock is abandoned, and a set of nuts attached to the outer edge of the clamp is used instead to provide a stronger locking force to maintain the clamp. The upper and lower parts of the front end of the tongs are tightly closed to prevent the wafer 淸 scrubbing from coming out. Please refer to FIG. 3A for the wafer 淸 scrubbing fixture of the present invention. Composition, the internal structure of the clamp 30 is not significantly different from the traditional clamp, and also has a hollow area 35 for placing one end of the wafer 淸 scrub 50, the shape of the hollow area 35 and the wafer 淸The contour of the scrub end 50 is the same. In the preferred embodiment of the present invention, the clamp 30 can also be divided into a front end 32 and a rear end 34, and the upper and lower parts of the front end 32 of the clamp 30 near the crystal cleaning brush 50 are also separable, for example, The lower part 32b of the front end is fixed and connected to the cake back end 34; the upper part 32a of the front end is movable and is connected to the lower part and the rear end by a rotating shaft (not shown in the figure). When the front end 32 of the wafer grate scrubber 50 is in the open state, it is convenient to insert and remove the wafer grit scrubber 50. In addition, in the embodiment of the present invention, the clamp 30 is basically a cylindrical design. , Its diameter is about 10 to 70mm, its length is about 100 to 300mm, and its outer edge has 7 paper sizes applicable to China National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back first ^ This page)-Crack. Order 4§ eSi4 A7 B7 V. Description of the invention () (Please read the precautions on the back first <write this page) Thread 38, which is located at the front and rear of the clamp 30 There is a large nut 40 on the outer edge. 38 sets of 38 threads attached to the clamp 30 The nut 40 can be fully rotated to the rear end 34 of the clamp to facilitate the opening of the front end 32 of the clamp. In addition, the nut 40 can also be fully or partially rotated to the front end 32 of the clamp to Reaching the locked state of the front end 32 of the clamp * For the method of use of the present invention, please refer to FIG. 3A. The rotating motor shaft 12 and the clamp 30 are separable, so that the nut 40 can be placed in the present invention. In a specific embodiment, when the nut 40 is located at the rear end 34 of the clamp, the front end 32 of the clamp can be opened. At this time, one end of the wafer scouring scrubber 50 can be prepared to be placed in the hollow region 35 in the clamp. Next, please refer to FIG. 3B. When the front end 32 of the clamp is turned on, one end of the wafer scouring scrubber 50 can be easily placed into the hollow area 35 in the clamp, and the clamp 30 is closed after being placed> The position of the wafer scrubbing 50 is fixed. Please refer to FIG. 3C again, the nut 40 is rotated to the front end 32 of the clamp to tightly press the upper half 32a and the lower half 32b of the front end of the movable clamp to make the wafer in the inner hollow area 35 The scrubbing 50 is fixed by the clamp 30. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. When the present invention is used to achieve the locking of the wafer scrubbing fixture, the present invention uses a large nut 40. For the clamp 3 〇The force applied to a clamp, the area of the force on the clamp 30 in the specific embodiment of the present invention, is approximately equal to 3 to -10cm2, which is the area of the inner ring of the nut, and traditionally a small The design of the screw only has an area of about 0.2 to 0.7 cm2, which is the contact surface between the small screw and the clamp. It can be seen that the present invention provides better locking power for the clamp. The paper size is applicable to the Chinese national standard (CNS > A4 specification U10X297 mm) Α7 Β7 V. Description of the invention (). In the embodiment of the present invention, the thread of the outer edge of the clamp is extended from the rear end to the position of the outer edge of the hollow area, so when the nut is rotated to this position, a better locking effect can be achieved; (5 o'clock μ 蟪The pattern should use a thicker thread pitch (depending on the size of the clamp) to facilitate the nut to advance and retreat. In addition, a rotary motor shaft can be connected to the rear end of the clamp, which rotates the cylindrical type. The clamp and the wafer 淸 scrub inside the clamp make it rotate, and the ends of the wafer 淸 scrub are constantly contacting and leaving the wafer to achieve the effect of logic. Second, in the practical application of CMP, the wafer 淸 scrub There is a wafer 刷 scrubbing fixture at each end. In addition, the direction of the thread should be opposite to the direction of the wafer 淸 scrubbing brush's self-operation rotation, so the wafer 淸 scrubbing fixture thread at both ends of the wafer 淸 scrubbing can be In the opposite direction, to ensure the wafer cleaning brush is fixed during rotation. "Furthermore, the use of the present invention does not require another special tool to achieve closed, only need to use your fingers to rotate the nut to an appropriate position. In the general machine design, the operator or maintenance staff replaces or installs the wafers from the top of the CMP machine or scrubs them into the fixing device. Under normal circumstances, the length of the human arm is sufficient to easily rotate the nut of the device of the present invention. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the application of the present invention: any equivalent changes or modifications made without departing from the spirit disclosed by the present invention shall be included in The spirit and scope of the present invention are within the scope of the following patent applications. 9 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 × 297 mm) (Please read the note on the back first WV4 copy Page) Binding and printing Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs