TW425335B - Polishing pad cleaning apparatus - Google Patents

Abstract

The present invention discloses a polishing pad cleaning apparatus used in a chemical mechanical polishing equipment, which comprises a polishing platen, a slurry delivery arm and a synchronous cleaning brush located under the slurry delivery arm. As a wafer is polished on the polishing pad, the polishing pad is carried to rotate by the polishing platen and the synchronous cleaning brush under the slurry delivery arm can remove the process particles from the surface of the polishing pad desirably. In addition, the polishing platen further comprises a condition head with a non-synchronous cleaning brush lying thereon the bottom surface. When the polishing pad is idle, the condition head can move back and forth on the surface of the polishing pad and the process residual particles can be further cleaned through the non-synchronous cleaning brush. The non-synchronous cleaning brush and the synchronous cleaning brush could be selectively collocated for acquiring a best cleaning effect.

Description

A7 425335 B7 _ 5. Description of the invention (5-1) Field of the invention: The present invention relates to a polishing pad cleaning device used in chemical mechanical research equipment of semiconductor manufacturing processes, and in particular, to a chemical mechanical polishing process order , Choose synchronous " or non-synchronous cleaning pad polishing pad cleaning device. 5-2 Background of the Invention: As the design of semiconductor devices becomes more complex and the number of stacked structures is increasing, chemical mechanical polishing has become an indispensable unit process in the semiconductor field. When performing a chemical mechanical polishing process, the polishing device first uses a polishing head to adsorb the wafer. Then, the wafer is moved to a polishing table with a polishing pad by using the movement of the polishing head, and a slurry is sprayed on the surface of the polishing pad at the same time. Then, the wafer is pressed against the polishing pad with a polishing head, and then the wafer is rotated by a motor device to flatten the surface. In general, the components of the research and development are mainly composed of some colloidal particles and appropriate chemical agents (Reagent). When the wafer restrained by the polishing head is rotated relative to the polishing pad, the surface of the wafer will be At the same time, the effect of flattening is achieved by a combination of chemical reaction and mechanical polishing. Please refer to FIG. 1, which shows a schematic diagram of a conventional planarization process using a chemical mechanical polishing apparatus. When grinding, the grinding head will be in accordance with China National Standard (CNS) A4 specifications (210 X 297 male f) I., I. Please read the precautions on the back before filling this page) Order ---- ----- Consumption cooperation between employees of the Intellectual Property Bureau of the Ministry of Economic Affairs and Du Duan A7 425335 clearly states that Fawu will attach the wafer to its lower surface (not shown in the figure) and exert downward force on the wafer. It is closely attached to the surface of the polishing pad 102, and at the same time sprays the slurry on the surface of the polishing pad 102 through a Slurry Delivery Arm 106. Generally speaking, the 'polishing pad 102 is a plane formed by polymerizing a polymer material', and its surface has a microscopic fluff structure in microscopic view, so it can rub against the wafer to produce a polishing effect. In addition, in order to allow the slurry to flow sufficiently, there are usually several fine grooves (Groove) on the surface of the polishing pad 102, so that the slurry can flow in it, which is better than the wafer and polishing. Interface between pads. At the same time, both the polishing pad 102 and the grinding head 104 rotate in a certain direction, so that the wafer can achieve a flattening effect by using both the chemical reaction and mechanical polishing under the action of the grinding slurry and the grinding pad 102. Please continue to refer to FIG. 1. After the polishing pad 102 continuously grinds a few wafers, many byproducts of the chemical mechanical polishing process will adhere to the surface of the polishing pad 102, and even embed fluff and trenches on the surface. In the process, the use performance will be greatly reduced. In serious cases, the surface may even be damaged. To overcome this problem, the polishing pad 102 is conventionally subjected to an initialization process after it has been used for a period of time. When the initializing treatment is performed, the grinding head 104 is removed from the surface of the polishing pad 102 and the grinding slurry is stopped from being sprinkled. Afterwards, a set of cleaning heads (Condition Head) 107 are used to move back and forth on the surface of the polishing pad. At the same time, the rotation of the polishing pad and the cleaning brush head 107 is used to clean the surface of the polishing pad attached to the chemical mechanical polishing process. Process residues. This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 (please read the unintentional matter on the back before filling out this page) '* Packing ----- Order --- I!-Ministry of Economic Affairs Intellectual Property Printed by the Consumer Cooperatives of the Bureau) A7 425335 _____B7___ 5. Description of the invention () -------------- Shang --- I (Please read the Jiang Yi matters on the back before filling this page ) Please refer to Figure 2 for a front view of the chemical mechanical polishing booth described above. As shown in FIG. T, the polishing pad 102 is disposed on a polishing table 202 (Polish Piaten) 202 and is rotated by the driving of the polishing table 202. When polishing, the 'polishing head 104 will attract the wafer 204 and attach it to the surface of the polishing pad 102 for polishing. When the initialization process of the polishing pad 10 is performed, the wafer 204 and the polishing head 104 are first removed from the surface of the polishing pad, and then the cleaning brush head 10 7 is used to scrape off the surface of the polishing pad 1 02 the remains. Since the lower surface of the cleaning brush head 107 has a friction plate 206 that is in contact with the grinding pad 102, when it is driven by the robot arm 208, it can move along the surface of the polishing pad 102 and use friction The method further removes the residue of the grinding process. In addition, when the polishing pad 102 is initialized, the 'cleaning brush head 107 and the polishing pad 102 will each rotate around a certain direction, so that the friction disk 206 will be effective for the entire polishing pad area. Removal of process residues attached to it. -Line Printed by the Industrial and Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Traditionally, cleaning and polishing pads have to be separated from the chemical mechanical polishing process. Therefore, the polishing process must often be suspended for the initial processing of the polishing pads. In addition, when the polishing pad is used for a period of time, many particles generated during the polishing process will be trapped in the grooves on the surface of the polishing pad | and these particles often cannot be effectively obtained by cleaning the friction disk of the brush head. exclude. This will reduce the operating efficiency of the polishing pad and may even scratch the surface of the wafer. In summary, in order to effectively prevent the risk of potential damage to the wafer caused by the micro-adhesion of the polishing pad to the surface of the polishing pad and reduce the frequency of the initializing operation, the present invention proposes an option to synchronize with the polishing process or not. This paper scale is applicable to Chinese National Standard (CNS) A4 specification mo X 297 meal) A7 4 2 5 3 3 5 B7 V. Description of the invention () Simultaneous polishing pad cleaning device to overcome the above-mentioned conventional skills The problem. (Please read the notes on the back before filling in this page) 5-3 Purpose and summary of the invention: The purpose of the present invention is to provide a polishing pad cleaning device that can be applied to chemical mechanical polishing equipment. Another object of the present invention is to provide a polishing pad cleaning device which can be performed synchronously with a chemical mechanical polishing process. Another object of the present invention is to provide a polishing pad cleaning device that can be performed in a non-synchronous manner with a chemical mechanical polishing process. Another object of the present invention is to provide a polishing pad cleaning device that can be performed simultaneously or asynchronously with a chemical mechanical polishing process. Seal of the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The present invention discloses a polishing pad cleaning device used in chemical mechanical polishing equipment. When performing the chemical mechanical polishing process, the polishing table will drive the polishing pad to rotate, and the slurry nozzle sprays the slurry on the surface of the polishing pad, and the polishing head will press the wafer on the polishing pad to perform the grinding process. At this time, the synchronous cleaning bristles located below the mortar nozzle will synchronize with the polishing process and clean the process particles attached to the surface of the polishing pad. In addition, the polishing pad cleaning device of the present invention can also be used with a cleaning brush head to further remove process particles attached to the surface of the polishing pad. The paper size of this paper applies Chinese National Standard (CNS) A4 specification C? 10 X 297 mm) 4 253 3 5 A7

V. Explanation of the invention () The cleaning brush head is fixed on the grinding table in a rotatable manner through a set of mechanical arms, and is placed on the outside of the grinding pad. When you want to clean the polishing pad with the polishing pad brush head, 'the process of polishing the wafer will be stopped first, and then the cleaning brush head will be moved back and forth on the surface of the polishing pad by a robotic arm', and the asynchronous cleaning bristles on the lower surface will be used to Further remove process particles attached to the surface of the polishing pad. 5 ~ 4 solid type simple explanation ··· Figure 1 is a schematic diagram of the traditional planarization process using chemical mechanical polishing equipment. Figure 2 is a front view of a conventional chemical mechanical grinding equipment. Fig. 3 is a graph showing the relationship between the particle adhesion rate on the polishing pad surface and the polishing pad use time in the present invention. Fig. 4 is a schematic view of a chemical mechanical polishing device having a polishing pad cleaning device of the present invention, and Fig. 5 is a bottom view and a test test of a cleaning brush head in the polishing pad cleaning device of the present invention. 1 ί Binding --------- line '. F Please read the vji notice on the back before filling in this page) Explain in detail the details issued by the Intellectual Property Bureau Employee Consumer Cooperatives of the Ministry of Economic Affairs The table grinding step mats are prepared in the same mill in China or set first. Learn the materialization, leave it in the process, and use the process. You should grind the I-type surface of the research. Match the table and pad. Grind the research and install. Clean and clean.

425335 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Ⅴ. The relationship between the particle attachment rate on the surface of the invention and the use time of the polishing pad, to illustrate the mechanism of particle attachment during the manufacturing process (Scheme). Next, the spirit of the present invention will be described with reference to a specific embodiment. Please refer to "3 circles", which shows the relationship between the particle adhesion rate on the surface of the polishing pad and the use time of the polishing pad. First, the particle adhesion rate is defined as the number of times more than 100 particles are found on the surface of the polishing pad during every 100 polishing processes. Therefore, it can be found from the figure that within 10 hours of the use of the polishing pad, the particle adhesion is roughly stable, and after more than 10 hours, the particle adhesion significantly increases, and the particle adhesion rate of the polishing pad is high. 'That means too many particles remain on the surface of the polishing pad and its trenches'. Therefore, a procedure for cleaning and attaching particles to the polishing pad is required. Please refer to the fourth circle, which shows a three-dimensional schematic diagram of a part of the chemical mechanical polishing equipment of the first embodiment of the present invention. "As shown in the figure, the polishing pad 404 has a polishing pad 404 above it, and it is located on the polishing pad Above the 404, a grinding head (not shown in the figure) is used to adsorb the wafer and press it onto the surface of the grinding figure 404 to perform the grinding process. When chemical mechanical polishing is performed, the Slurry Delivery Arm (406) sprays the slurry on the surface of the polishing pad 404. At the same time, the polishing head and polishing pad will rotate relatively to produce the effect of chemical mechanical polishing. The polishing pad cleaning device in this embodiment is mainly composed of the synchronous cleaning bristles 408 located under the grinding nozzle 406. The synchronous cleaning bristles 408 are in contact with the surface of the polishing pad 404. Therefore, during the polishing process, The polishing pad 404 will rotate and friction with the synchronous cleaning bristles 408, and then the process (In-Situ) to remove the remaining micro-paper on the surface of the polishing pad 404 will be in accordance with Chinese national standards (CNSM4 specification (210 X 297 mm)! ^ -------- ^-I ------ *-(Please read the precautions on the back before filling in the winter page) A7 425335 ____ B7 ___-_ 5. Description of the invention () Affecting the spraying process of the slurry, the synchronous cleaning bristles 4 0 8 can be placed in the other direction of the slurry spraying tube 406 to spray the slurry. In this way, the synchronous cleaning bristles 406 with a single row design will not affect chemical mechanical polishing. In addition, because the pH value of the slurry is usually low, it is better to choose a material that can resist acid and alkali in the selection of the synchronous cleaning bristles 408. The material used in this embodiment is Nylon (Ny 1 on) Please refer to FIG. 4. In addition to the synchronous cleaning bristles 408 located below the grouting nozzle 406, the conventional cleaning brush head 4 1 2 can also clean the surface of the polishing pad 404 when the polishing process is not performed. As shown, the cleaning brush head 41 2 is connected to the polishing table 402 through a robot arm 410. When the polishing pad 404 is subjected to a chemical mechanical polishing process, the cleaning brush head 412 is disposed outside the polishing pad 404. When a cleaning brush head is to be used When cleaning the surface of the polishing pad 404 with 412, the spray slurry is first stopped and the wafer is removed from the surface of the polishing pad 404. It is worth mentioning that although the chemical mechanical polishing process has stopped at this time, the polishing pad 404 Still keep running to facilitate cleaning of the brush head 41 2 Procedure for cleaning >> When cleaning the polishing pad 404 with the cleaning brush head 4 1 2, the cleaning brush head 412 is driven by the robotic arm 410 and will move back and forth on the surface of the polishing pad ' The cleaning brush head 412 also sweeps the surface of the polishing pad in a rotating manner. Since the lower surface of the cleaning brush head 412 has a friction disk 414 in contact with the polishing pad 404 and asynchronous cleaning bristles 416, The friction between the disc 414 and the non-synchronized cleaning bristles 416 and the polishing pad 404 can further remove the remaining process particles in a non-synchronous manner with the polishing process. This paper is based on CNS A4 specification ⑵0 X 297 ^ « (Please read the notes on the back before filling this page) I i ^ -------- ^ --- IIII ί. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 425335 ___B7________ 5. Description of the invention () Please refer to FIG. 5, which shows a bottom view and a front view of the cleaning brush head in the polishing pad cleaning device of the present invention. As shown in the figure, the lower surface of the cleaning brush head 4 1 2 includes the friction disk 4 1 4 and the asynchronous cleaning bristles 4 1 6 " wherein the friction disk 4 1 4 has a rough surface, and when the cleaning brush head 4 1 2 is cleaned, During grinding, the rough surface of the friction plate 412 can remove the process particles remaining on the surface of the grinding plate and activate the fluff on the surface. The non-synchronized cleaning bristles 4 1 6 are arranged around the friction disk 414 in a ring configuration, and are driven by the robotic arm and the cleaning brush head 41 2 rotates itself to remove the grooves trapped on the surface of the polishing pad. Process particles. In this embodiment, the friction disc 4 1 4 is a disc composed of a plurality of broken diamonds, and the non-synchronous cleaning bristles 4 1 6 are made of a nylon material that is resistant to acid and alkali solutions. The synchronous and non-synchronous cleaning bristles provided in the present invention have different use characteristics. For example, 'synchronous cleaning bristles are tied in the chemical mechanical polishing process, and the surface of the polishing pad is continuously and continuously synchronized to obtain a good cleaning effect.' However, it causes the problem that the bristles are easily worn. Therefore, for the application of synchronous cleaning bristles and non-synchronous cleaning bristles, it can be combined and combined according to the actual application needs to obtain the best use effect. The present invention is described above with a preferred embodiment, and is only used to help understand the implementation of the present invention 'not to limit the spirit of the present invention, and those skilled in the art will understand the spirit of the present invention' without departing from the present invention. "Spiritual Garden" should be modified and replaced with equivalent changes, and the scope of patent protection shall depend on the scope of the attached patent application and its equivalent fields. This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 male cage)! Packing -------- Order * ---- Line-* (Please read the back first; fill in the 1 items before filling in (This page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs

Claims (1)

425335 —8444 ^ 3- ^ VI. Patent application Fanyuan ABCD L. A grinding and cleaning device that is synchronized with the chemical mechanical grinding process. The device at least includes: The grinding table is located below the ground where the grinding takes too much. For carrying and rotating the polishing pad to perform a chemical mechanical polishing process on a wafer located on the surface of the polishing pad θ m & The upper part is used to spray the slurry on the surface of the polishing pad to assist in polishing the wafer; and synchronously cleaning the bristles, which is located under the polishing nozzle tube and is in contact with the surface of the polishing pad. When the grinding table is driven and rotated, the frictional effect caused by the relative movement between the cleaning bristles and the grinding pad is then removed, and the residues attached to the grinding process are immediately removed. 2. For example, the research money cleaning device in the scope of the patent application, further includes a cleaning brush head. When the grinding mill is not subjected to a chemical mechanical polishing process, the cleaning brush head can be rotated to clean the polished table back and forth ... removed The process remains. (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 3. If the polishing pad cleaning device of the patent application No. 2 is used, the cleaning brush head Yin Shuzhi is connected to the robot arm, and The two ends of the robot arm are fixed on the grinding table in a rotatable manner. When grinding is performed, the cleaning brush head is placed outside the grinding pad. When the grinding process is stopped and the cleaning process is performed, the cleaning is performed. The brush head is moved to the surface of the polishing pad through the belt of the robot arm to clean the paper attached to the surface of the polishing pad. The national standard (CNS) A4 specification (210X297 mm) is applicable. 425335 ABCD Fan Guocheng residue. -...... 4. If you apply for a patent, the position is 0s. +. ”The polishing pad cleaning device of item 2 above, in which the above;" under the cleaning brush head and aa-.. the surface contains A friction disc. The surface of the friction disc in contact with the grinding pad has a fine outline of the rough seam. When the cleaning brush head cleans the surface of the grinding pad, the thing _An — the thick inspection disc can remove the adhesion. On the surface of the polishing pad, the polishing pad cleaning device of .5_ as described in item 4 of the patent application range, wherein the friction disk is composed of multiple broken diamonds. The supernatant is the same as in the table, pad. For non-surrounding objects, set the Zhou Yan to keep it, the clean bristles, sweep the brushes, wipe the pads, clean the pads, rub the brushes, and grind the brushes. When you set the square-hair surface of the brush on the surface of the brush, it should be matched with the special profile of the face. Please use the headband watch as the brush. When the brush is researched, it is described that the dragon on the surface is _ Niqi is a 1-series material with a clean hair pad, the brush is cleaned, and the steps are the same as 6 fcr. 7. Same. Materials and materials (Please read the precautions on the back before filling out this page) OijJ 、? Ί I—Industrial Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Its depilation 'pressure brush set Gao Jie Dun J-χ cleaning can clean the hair with the whole brush non-abrasive, the research with the hair item with the same brush δ non-cleaning the cleanliness and step with the same hair with the special brush Please ask Jie Jie to apply the same steps. 8. Use the same paper as the standard for washing the paper and use the Chinese national standard (CNS > A4 size UlOX297 mm) 42533 5 αβΙ C8 D8 6. Apply for a patent scope 9, such as The polishing pad cleaning device according to the scope of patent application No. 1 ... The above-mentioned synchronous cleaning bristles are located on the other side of the grinding nozzle spraying direction. ίο · —A kind of grinding / cleaning device that is performed asynchronously with the chemical mechanical polishing process, the device at least includes: a grinding table 'located below the grinding ring' for carrying and rotating the polishing pad to align the surface of the polishing pad The wafer is subjected to a chemical mechanical polishing process; a grinding nozzle is located above the grinding pad and is used to spray the slurry on the surface of the polishing pad to assist in grinding the wafer; the brush head is cleaned and a mechanical arm is used to It is fixed on the polishing table in a rotating manner. When the polishing pad is not subjected to a chemical mechanical polishing process, the cleaning brush head can be driven by the robot arm to clean the surface of the polishing pad by its own rotation; and non-synchronous bristles; Is located on the lower surface of the cleaning brush head, and is brought into contact with the polishing pad to remove process residues on the surface of the polishing pad when the cleaning brush head cleans the polishing pad. Printed by the Consumers ’Cooperative of the Intellectual Property A Bureau of the Ministry of Economic Affairs IIII» n I Pack 1 n ~~ Order (please read the precautions on the back before filling this page) 11. If you want to apply for the polishing pad cleaning device of item 10 in the patent scope, The lower surface of the above-mentioned grouting nozzle further includes synchronous cleaning bristles, which are in contact with the surface of the less cleaning bristles attached to the polishing pad, so as to simultaneously remove the process residues attached to the surface of the polishing pad during the chemical mechanical polishing process. Thing. ^ --- In the use of this paper standard «National Bank (CNS > A4 size < 210X297 mm) Printed by A8 B8 C8 D8 of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 6. Scope of patent application I 2. If applied The polishing pad cleaning device of the scope of patent No. 1 I, wherein the above-mentioned synchronous cleaning bristles are located on the other side of the mortar spraying pipe to spray the slurry. 13. For the polishing pad cleaning device in the U of the scope of patent application, wherein the material of the synchronous cleaning bristles and the asynchronous cleaning bristles are nylon materials. 14. The polishing pad cleaning device according to item 11 of the application, wherein the synchronous cleaning bristles and the asynchronous cleaning bristles can be rinsed with high-pressure deionized water to clean the synchronous cleaning bristles and the asynchronous cleaning bristles. 15. For the polishing pad cleaning device according to item 10 of the patent application scope, wherein the lower surface of the cleaning brush head includes a friction disk, and the surface of the friction disk in contact with the polishing pad has a rough outline. When the head cleans the surface of the polishing pad, the friction disc can remove process residues attached to the surface of the polishing pad. 16. The polishing pad cleaning device according to item 15 of the scope of patent application, wherein the friction disk is composed of multiple broken diamonds. 17 · —A polishing pad cleaning device for a chemical mechanical polishing device. The device includes at least 42533 5-I In-— I ----. ^ N-I 1 ^ 1,--^ 1 i 1- -*-* (Please read the notes on the back before filling out this page) This paper size is based on China's National Standard (CNS) A4 size (2 丨 0X297 mm) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 42533 5 5J C8 _________ D8 VI. Patent application scope The polishing table is located under the polishing pad and is used to carry and rotate the polishing pad to perform a chemical mechanical polishing process on the wafer on the surface of the polishing pad; Above the polishing pad is used to spray the slurry on the surface of the polishing pad to assist in polishing the wafer; the synchronous cleaning brush I is located below the slurry spray tube and is in contact with the surface of the polishing pad. When the polishing pad is driven by the polishing table to rotate, the process residues attached to the surface of the polishing pad are immediately removed through the friction effect caused by the relative movement between the synchronous cleaning bristles and the polishing pad; Through A robot arm is rotatably fixed on the polishing table, and when the polishing pad is not subjected to a chemical mechanical polishing process, the cleaning brush head can be driven by the robot arm, and the surface of the polishing pad can be cleaned by its own rotation; and Non-synchronous bristles, located on the lower surface of the cleaning brush head, and in contact with the polishing pad, are used to remove process residues on the surface of the honing pad when the cleaning brush head cleans the polishing pad. The polishing pad cleaning device of the scope item 17 makes the above-mentioned synchronous cleaning bristles be located on the other side of the slurry spraying nozzle. 19. The polishing pad cleaning device according to item 17 of the scope of patent application, wherein the synchronous cleaning bristles and the material of the asynchronous cleaning bristles are in accordance with the standard of paper waves, using the national standard of China (CNS) A4 (210X297 mm) ) (Please read the notes on the back before filling out this page) ---------- install -------- order --------- \ --------- -Γ * * mi ^^^ 1 ^^^ 1 ^^^ 1 m 4 2 5 3 3 5 ll D8 6. Application for patent scope Dragon materials. In the middle. Its hair removal, pressure brush set high floc '' / Installed for cleaning can be cleaned with a step of brushing non-abrasive cleaning with the same step with the hair item 丨 non-clean cleaning and step with the same special clean Please apply cleanly and step by step '. Wash with the water of the 20th (please read the precautions on the back before filling out this page) Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5 This paper uses the Chinese standard (CNS) A4 specification (210X297 mm)