TW457843B - Manufacturing method of elastic plate for preventing electromagnetic interference and its products - Google Patents

Manufacturing method of elastic plate for preventing electromagnetic interference and its products Download PDF

Info

Publication number
TW457843B
TW457843B TW88121226A TW88121226A TW457843B TW 457843 B TW457843 B TW 457843B TW 88121226 A TW88121226 A TW 88121226A TW 88121226 A TW88121226 A TW 88121226A TW 457843 B TW457843 B TW 457843B
Authority
TW
Taiwan
Prior art keywords
electromagnetic interference
scope
shrapnel
item
sheet
Prior art date
Application number
TW88121226A
Other languages
Chinese (zh)
Inventor
Jin-Fu Hung
Original Assignee
Hung Jin Fu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hung Jin Fu filed Critical Hung Jin Fu
Priority to TW88121226A priority Critical patent/TW457843B/en
Application granted granted Critical
Publication of TW457843B publication Critical patent/TW457843B/en

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The present invention relates to a kind of manufacturing method of elastic piece for preventing electromagnetic interference and its products. For the manufacturing process of this invention, a thermally processed beryllium copper is used as the material that is undergone with an electroplating process. After that, a stamping process is then performed onto this beryllium copper to form each kind of elastic conductive plate products. Because each kind of elastic conductive piece has so many functions such as good conductivity, good elasticity (strong toughness), low impedance and non-oxidization, the additional value of products can be increased.

Description

457843 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(/ ) 本發明係一種防止電磁千擾之彈片袈逭方法及其製 品,尤指一種能遮蔽電腦主機板之微處理器及記憶體所 溢放出之電磁波之彈片製遒方法及其製品。 按,習有用於電腦主機板防止電磁千擾方(EMI)之 式Μ系於微處理及記憶鱧周緣之栢鄰部位上,透過導電 猗綿以與一內呈中空之罩蓋黏附,達到防止電磁千授之 效果。 惟,該缉電海綿之成本高,且夢藉由人工方式作某 ,導致工賢貴,且不具便利性。 綠是,本發明人乃特潛心的硏究並配含學理之運用 ,以設計出一可採彈性導電片取代茑電海綿之構件,以 達到防止電磁千稷之效果。 本發明之一目的,在於提供一種彈性導電片之製程 ,其係禆用經熱慮理之鈹銅為衬質t然桟,將該鈹銅電 _加工,之筏,再輕衝壓處理,如此,即可形成各彈性 導電片製品。 本發明之呙一目的,在於提供一具防止電磁千授之 彈片製品,由於各彈性導電片於製程上係採自動化,故 ,速度快,且能降低成本。 為了使貴審查委員能更進一歩了解本發明之特徽 及挠術內苕,請參閲以下有闞本發明之詳細說明與附圖 ,然而所附圖示僅供#考與說明用,並非用來對本發明 加以隈制者。有關該筲施例之附圈為: 圈示簡單說明: 2 (請先聞讀背面之注意事項再填寫本頁) 訂 線一一 本紙張尺度適用中國國家橾準(CNS > A4規格(210X297公釐) A7 B7 五、發明说明(/ ) 第一圖係本發明於製程上之流程圔。 第二圖係本發明單一殫性導電片之外顴圈。 (請先閱讀背面之注意事項再填寫本頁) 第三圖係本發明單一彈性蓽電片之側視圔。 第四圈係本發明之彈性導電片赝用於電腦主璣板之 背施例圍。 圖號與名稱說明: 彈性導電片 11 接觸面部 RI 第一 ί到角 12 片狀板部 K2 第二倒角 13 焊赉面部 14 槽孔 15 側板部 2 覃蓋 3 電腦主機板 經濟部智慧財產局員工消費合作社印製 請參間第一圖所示,本發明係一種「防止電磁千授 之彈片製造方诖及其製品」,其於製造方法上包含下列 步驟: (1).選取材料(鈹銅該鈹銅保經熱處璉,故其硬: 度栢當高。 C 2 ).電镀加工,以金或錫鉛合金為隹。 < 3 ).衝壓處理t如此,即形成各彈性違電片製品。 (4).包裝。 本紙張尺度適用中國國家標準(CNS ) A4規格(2I〇X297公釐) 4 5 7 843 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明o ) 由於各彈性導電片皆具萆電性隹、彈性好ί韌性強J 、低阻抗及不氧化萆諸多功能,故可增加産品的附加價 值。 請參閲第二及第三圍所示,保本發明單一彈性導電 Η之外顴圖及其側視圖,該彈佐導電Hi中設有一片狀 搜觸面部11,供軍蓋2底綠柢接,接觸面部之一外側 綠向下延伸折營形成一片狀板部12,且於其間形成一第 一倒角R1 ,該第一倒角Hi之中央部位上沖設有一槽孔I4 ,與第一倒角B1相鄰之兩惻緣,分別向下折骛延伸形成 —鉛直狀之側板部15,片狀板部12之自由端綠向下延伸 折绔形成一片狀:焊接面部13 r且於其間形成一第二倒角 B2 ,該第二ί到角B2之内面係與第一倒角BJL之内面呈栢對 方向。 由於各彈性違電片1皆具導電性佳、彈性好(韌性 強 >、低阻抗及不氧化等諸多功能f故可增加産品的附 加價值。 復參閲第西圖所示7係彈性導電片應用於電腦主機 板之宵施例圖。其係在電腦主機板3之微處理器及記憶 鳢闺綠之栢鄰部位上,佈設多數画彈性導電片i,各彈 性導電片1之排列鉅離係視微處理器功能而定,一般功 能較低之微處理器,其兩彈性違電片1之間距係2公分 ;而較強之微處理器,其闲彈性導電片i之間距係 公分;宵陴上的間鉅則以通過EMI .為基準,而在备彈性 導電片1之接觸面部11上則接有一軍蓋2,藉此;►俾遮 4 (請先聞讀背面之注意事項再填寫本頁) \1/· -c 訂 線 本纸張尺度適用中國國家標準(CNS > A4規格(210 X297公釐) 45784 3 A7 B7 五、發明説明(邙) 蔽微處理器及記憶鱧所溢放出之電磁谀。 綜上m述,透過本發明之特殊設計,能用彈性導電 片取代導電海綿^ μ達到防止電磁千擾之效果,而於製 程上則能提高生産速度,降低成本,完全符合專利申請 蒉件,故爰依專利法提出申請,請詳查並准予本案,以 保障發明者之權益,若鈞局之貴審查委員有任何稽疑 ,請不吝來函指示。 按,以上所述,僅為本發明的最隹之一具鳢宵施例 ,惟本發明之構遠特徽並不侷限於此,任何熟悉該頂技 藝番在本發明之領域內,可輕易思及之變化或修飾(如 接觸面部於電镀時之材質可採用金,焊接面部採用錫|R 合金;或接觸面部與輝接面部背採用錫雜合金)背可涵 蓋在以下本案之專利範圍。 (請先閣讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 5 本紙張尺度適财Dgj家操準(CNS ) ( 2ιαχ29<7公麥)457843 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (/) The invention is a method and a product thereof for preventing electromagnetic interference, especially a microprocessor and a microprocessor capable of shielding a computer motherboard. Method and product for making shrapnel of electromagnetic waves emitted from memory. Press, the formula M used to prevent electromagnetic interference (EMI) of computer motherboards is located on the adjacent part of the periphery of the micro-processing and memory card. It is adhered to a hollow cover by a conductive pad to prevent it. The effect of electromagnetic induction. However, the cost of the electric sponge is high, and the dream is to make something artificially, which results in expensive workers and is not convenient. Green is, the present inventor is dedicated to research and equipped with scientific applications, to design a flexible conductive sheet can be used to replace the components of the electric sponge, in order to achieve the effect of preventing the electromagnetic thousands. An object of the present invention is to provide a manufacturing process of an elastic conductive sheet. The beryllium copper is thermally treated as a substrate. The beryllium copper is electro-processed, and the raft is then lightly stamped. To form each elastic conductive sheet product. Another object of the present invention is to provide an elastic sheet product that prevents electromagnetic interference. Since each elastic conductive sheet is automated in the manufacturing process, the speed is fast and the cost can be reduced. In order to allow your review committee to better understand the special emblem and internal flexure of the present invention, please refer to the following detailed description and drawings of the present invention. Used to control the invention. The attached circle about this example is: Brief description of the circle: 2 (Please read the notes on the back before filling out this page) Alignment One-by-one paper size applies to China National Standard (CNS > A4 size (210X297 (Mm) A7 B7 V. Description of the invention (/) The first picture is the process flow of the present invention. The second picture is the outer ring of the single conductive sheet of the present invention. (Please read the precautions on the back before reading) (Fill in this page) The third picture is a side view of a single elastic sheet of the present invention. The fourth circle is an example of the elastic conductive sheet of the present invention used for the back of a computer main board. Drawing number and name description: Elastic Conductive sheet 11 Contact face RI First to corner 12 Sheet plate part K2 Second chamfer 13 Welding face 14 Slot 15 Side plate part 2 Qin cover 3 Computer motherboard Printed by Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Consumption Cooperative As shown in the first figure, the present invention is a "manufacturer of anti-electromagnetic thousand-sheet shrapnel and its products", which includes the following steps in the manufacturing method: (1). Selecting materials Deal with it, so its hard: Degree Bai Dang high. C 2). For electroplating, gold or tin-lead alloy is used as 隹. ≪ 3). The stamping treatment t is so as to form each elastic non-electricity sheet product. (4). Packaging. This paper size applies Chinese National Standard (CNS) A4 specification (2IO × 297 mm) 4 5 7 843 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of invention o) Because each elastic conductive sheet is electrically charged Good properties, good flexibility, strong toughness J, low resistance and non-oxidizing 萆, so it can increase the added value of the product. Please refer to the second and third figures, and the side view and the side view of the single elastic conductive pad of the present invention. The conductive Hi is provided with a piece of search surface 11 for the green cover of the military cover 2. One of the contact faces is extended downward to form a sheet-like plate portion 12 in green, and a first chamfer R1 is formed therebetween, and a slot I4 is punched in the central part of the first chamfer Hi, and the first Two chamfer edges adjacent to a chamfer B1 are respectively folded down and extended to form-the vertical side plate portion 15 and the free end of the sheet plate portion 12 extend green and fold down to form a piece: the welding surface 13 r and A second chamfer B2 is formed therebetween, and the inner surface of the second chamfer B2 is in the same direction as the inner surface of the first chamfer BJL. Since each of the elastic faulty sheets 1 has many functions such as good electrical conductivity, good elasticity (strong toughness>, low resistance, and non-oxidation), it can increase the added value of the product. Please refer to the 7 series elastic conductive shown in the west figure. The example of the application of the film to the computer motherboard. It is arranged on the microprocessor and memory adjacent to the cypress green of the computer motherboard 3. Most of the elastic conductive sheets i are arranged, and the arrangement of each elastic conductive sheet 1 is huge. The distance depends on the function of the microprocessor. Generally, a microprocessor with a lower function has a distance of 2 cm between the two flexible power strips 1; a stronger microprocessor has a distance of 1 cm between the free elastic conductive sheet i ; Jiangju on Xiaoyu is based on EMI., And a military cover 2 is connected to the contact surface 11 of the elastic conductive sheet 1; ► 俾 cover 4 (Please read the precautions on the back first (Fill in this page again) \ 1 / · -c Threading The paper size is applicable to Chinese national standards (CNS > A4 size (210 X297 mm) 45784 3 A7 B7 V. Description of the invention (邙) Microprocessor and memory The electromagnetic 谀 released by 鳢. In summary, through the special design of the present invention, The elastic conductive sheet is used to replace the conductive sponge ^ μ to prevent electromagnetic interference. In the manufacturing process, it can increase production speed and reduce costs, which is completely in line with the patent application documents. Therefore, apply according to the patent law. Please check and approve it. In this case, in order to protect the rights of the inventor, if there is any suspicion in the review committee of the Bureau, please do not write the instructions. According to the above, it is only one of the most important examples of the present invention. The Zhiyuan special emblem is not limited to this. Any familiarity with the top technique can be easily considered in the field of the invention, such as changes or modifications. | R alloy; or tin-heteroalloys on the back of the contact face and the fascia face) The back can be covered by the following patents in this case. (Please read the precautions on the back before filling this page) System 5 Paper Standards Dgj Home Rule (CNS) (2ιαχ29 < 7 gram)

Claims (1)

457843 A8 B8 CS D8 申請專利範圍 >年?月/。曰丨 — 1 種防止電磁干擾之彈片製造方法’包含下列 步驟 (1) .選用經熱處理之材質; (2) •電鍍加工; (3) .衝壓處理; 如此,即彤成製品= 2·如申請專利範圔第1項所述之防止電磁干擾之 彈片製造方法,其中步驟(1)之材質可用鈹銅。 3·如申請專利範圍第1項所述之防止電磁干擾之 彈片製造方法,其中步驟(2)電鍍加工時之材質可採用 錫鉛合金。 (請先閲讀背面之注意事項再填寫本頁) HI H— - i I -I - - I - I --1 '?T. Ϊ~ 經濟部智慧財產局員工消費合作社印製 4 *如申請專利範圍第1項所述之防止電磁干擾之 彈片製造方法,其中步驟(2)電鍍加工時之材質可探用 金與錫鉛合金。 5 · —種防止電磁干擾之彈片製品,包括至少一弾 性導電片,各彈性導電片中設有一片狀接觸面部,接觸 面部之一外緣向下延伸折彎形成一片狀板部,且於其閭 彩成一第一倒角,片狀板部之自由端綠商下延伸折灣开多 成一片狀焊接面部,且於其間形成一第二倒角,該第二 倒角之內面係與第一倒角之內面呈相對方向。 6·如申請專利範圍第5項所述之防止電磁干瘦之 本紙法尺度適用中國國家標準(CNS ) A4規格(210X297公釐了 線 ABCD 457843 六、申請專利範圍 弾片製品,其中在各彈性導電片之接觸面部,與第一倒 角相鄰之兩側緣分別向下延伸一側板部。 7 *如申請專利範圍第5項所述之防止電磁干擾之 彈片製品,其中第一倒角之弧面上可沖設一槽孔。 8 *如申請專利範圍第5項所述之防止電磁干擾之 彈片製品,其中接觸面部於電鍍時之材質可用金,焊接 面部用錫鉛合金。 9 *如申請專利範圍第5項所述之防止電磁干擾之 彈片製品,其中接觸面部與焊接面部於電鍍時之材質可 用錫錯合金。 ^訂------—線 (請先Η讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度逍用令國國家揉準(〇肥)八4規格(210父297公釐)457843 A8 B8 CS D8 Patent Application Scope > Year? month/. Said 丨 — A method of manufacturing a shrapnel to prevent electromagnetic interference 'includes the following steps (1). Selection of heat-treated materials; (2) • Plating process; (3). Stamping process; In this way, Tongcheng products = 2 · 如The manufacturing method of the anti-electromagnetic interference shrapnel described in item 1 of the patent application, wherein the material of step (1) can be beryllium copper. 3. The manufacturing method of the shrapnel as described in item 1 of the scope of patent application, wherein the material in the step (2) of the electroplating process can be a tin-lead alloy. (Please read the notes on the back before filling this page) HI H—-i I -I--I-I --1 '? T. The method for manufacturing an anti-electromagnetic interference shrapnel as described in the first item of the scope, wherein the material in step (2) during the electroplating process can detect gold and tin-lead alloy. 5 · An elastic sheet product for preventing electromagnetic interference, including at least one conductive sheet, each elastic conductive sheet is provided with a sheet-shaped contact surface, and an outer edge of the contact surface is extended and bent downward to form a sheet-shaped plate portion, and The color is a first chamfer, and the free end of the sheet-shaped plate part extends below the green quotient to form a piece of welded face, and a second chamfer is formed in between. The inner surface of the first chamfer is opposite. 6. As mentioned in item 5 of the scope of the patent application, the paper size method for preventing electromagnetic thinning is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm line ABCD 457843) 6. The scope of patent application for cymbal products, in which the elastic conductive The contact surface of the sheet, and the two side edges adjacent to the first chamfer respectively extend one side of the plate downward. 7 * The electromagnetic interference-preventing shrapnel product as described in item 5 of the patent application scope, wherein the arc of the first chamfer A slot can be punched on the surface. 8 * As described in item 5 of the scope of the patent application, the anti-electromagnetic interference shrapnel products can be made of gold when the contact surface is plated, and tin-lead alloy is used for welding the surface. 9 * If applied The electromagnetic interference-preventing shrapnel product described in item 5 of the patent scope, in which the contact surface and the welding surface can be tin-alloyed during plating. ^ Order --- --- (Please read the precautions on the back first (Fill in this page again.) Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs.
TW88121226A 1999-12-03 1999-12-03 Manufacturing method of elastic plate for preventing electromagnetic interference and its products TW457843B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88121226A TW457843B (en) 1999-12-03 1999-12-03 Manufacturing method of elastic plate for preventing electromagnetic interference and its products

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88121226A TW457843B (en) 1999-12-03 1999-12-03 Manufacturing method of elastic plate for preventing electromagnetic interference and its products

Publications (1)

Publication Number Publication Date
TW457843B true TW457843B (en) 2001-10-01

Family

ID=21643254

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88121226A TW457843B (en) 1999-12-03 1999-12-03 Manufacturing method of elastic plate for preventing electromagnetic interference and its products

Country Status (1)

Country Link
TW (1) TW457843B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6817588B2 (en) 2002-04-17 2004-11-16 Quanta Computer, Inc. Port replicator and resilient piece used therein

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6817588B2 (en) 2002-04-17 2004-11-16 Quanta Computer, Inc. Port replicator and resilient piece used therein

Similar Documents

Publication Publication Date Title
TWI323639B (en) Shield structure for information technology equipments
TWI261715B (en) Flexible wiring board and electrical device using the same
EP0682322B1 (en) An IC card
CN107484328B (en) A kind of display device
TWI421775B (en) Wireless identification tag with capacitive load
JP2004287767A (en) Noncontact communication type information carrier
TW541763B (en) High inductance coupling antenna
CN208478559U (en) Anneta module and electronic device
TW531941B (en) Flash memory card connector
RU2232421C2 (en) Flat medium with at least one semiconductor integrated circuit
TW457843B (en) Manufacturing method of elastic plate for preventing electromagnetic interference and its products
JP4176244B2 (en) Chip card
JP2012108860A (en) Foldable storage device
CN104466346B (en) Mobile terminal
US8009105B2 (en) RFID antenna and electronic product having the RFID antenna
CN204315708U (en) Mobile terminal
CN204376967U (en) Mobile terminal
TWI378759B (en) Stacking structure of printed circuit board
TWI306218B (en)
CN206481497U (en) A kind of NFC FPC antennas
WO2019220261A1 (en) Shielding tape for electromagnetic wave
TWM317103U (en) Spring structure of the shielding case for connectors
CN101296571B (en) Memory body device manufacturing carrier tool, manufacturing method and memory body device
CN212968041U (en) Novel NFC antenna design is used for supporting NFC card of different sizes
TWM368950U (en) LVDS connector