JP2004287767A - Noncontact communication type information carrier - Google Patents

Noncontact communication type information carrier Download PDF

Info

Publication number
JP2004287767A
JP2004287767A JP2003078180A JP2003078180A JP2004287767A JP 2004287767 A JP2004287767 A JP 2004287767A JP 2003078180 A JP2003078180 A JP 2003078180A JP 2003078180 A JP2003078180 A JP 2003078180A JP 2004287767 A JP2004287767 A JP 2004287767A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
coil
non
semiconductor chip
booster
information carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003078180A
Other languages
Japanese (ja)
Other versions
JP4034676B2 (en )
Inventor
Toru Kajiyama
Kazunari Nakagawa
Shintaro Suzumura
和成 中川
透 梶山
伸太郎 鈴村
Original Assignee
Hitachi Maxell Ltd
日立マクセル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To provide a noncontact communication type information carrier having satisfactory communication characteristic and excellent in multifunctionality and versatility. <P>SOLUTION: This noncontact communication type information carrier comprises a semiconductor chip 2 having an antenna coil 1 integrally formed thereon, a booster coil 3 electromagnetic induction-coupled with the antenna coil 1 integrally formed on the semiconductor chip 2 and an antenna coil provided on a reader/writer, and an insulating member 6 supporting the semicondcutor chip 2 and the booster coil 3. The semiconductor chip 2 is set in an angle corner part of the booster coil 3 so that the antenna coil 1 is turned to the insulating member 6 side, and the coil non-forming area 1a of the antenna coil 1 partially overlaps with the coil non-forming area 3a of the booster coil 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【0001】 [0001]
【発明の属する技術分野】 BACKGROUND OF THE INVENTION
本発明は、アンテナコイルが一体形成された半導体チップとブースタコイルとを有する非接触通信式情報担体に係り、特に、アンテナコイル及びブースタコイルの形状と配列とに関する。 The present invention relates to a non-contact communication type information carrier comprising a semiconductor chip and the booster coil antenna coil are integrally formed, in particular, relates to an arrangement and shape of the antenna coil and the booster coil.
【0002】 [0002]
【従来の技術】 BACKGROUND OF THE INVENTION
従来より、絶縁部材内に半導体チップと当該半導体チップの端子部に電気的に接続されたアンテナコイルとを備え、リーダライタからの電力の受給及びリーダライタとの間の信号の送受信を電磁波を用いて非接触で行う非接触式の情報担体が知られている。 Conventionally, an antenna coil electrically connected to the terminals of the semiconductor chip and the semiconductor chip in the insulating member, using an electromagnetic wave transmitting and receiving signals between the receiving and the reader-writer of power from the reader writer noncontact information carrier performing Te without contact are known. この種の情報担体としては、その外形により、カード形、コイン形、ボタン形又はタグ形などがある。 As this type of information carrier, the outer shape, card shape, a coin shape, there is a button-type or tag-type.
【0003】 [0003]
従来、この種の情報担体としては、アンテナコイルを絶縁部材にパターン形成したもの、或いは、巻線からなるアンテナコイルを絶縁部材に担持したものが用いられているが、近年に至って、アンテナコイルと半導体チップとの接続点の保護処理や防湿対策が不要で安価に作成できること、及び絶縁部材に曲げやねじれ等のストレスが作用した場合にもコイルに断線を生じることがなく耐久性に優れることなどから、半導体チップ自体にアンテナコイルが一体形成された半導体チップを絶縁部材に搭載したものが提案されている。 Conventionally, as this type of information carrier, the antenna coil that is patterned in the insulating member, or, but those carrying an antenna coil made of winding insulation member is used, it led to recent years, an antenna coil the protection processing and moisture protection at the connection point of the semiconductor chip can create unnecessary and inexpensively, and stress such as bending or twisting the insulating member and to be excellent in durability without causing disconnection in the coil even when working from the antenna coil to the semiconductor chip itself is proposed that the semiconductor chips are integrally formed is mounted on the insulating member.
【0004】 [0004]
アンテナコイルを半導体チップに一体形成した場合、アンテナコイルを絶縁部材にパターン形成したり、巻線からなるアンテナコイルを絶縁部材に担持する場合に比べて、コイルの巻径や導体幅が小さくなり、巻数についても自ずと限界があるため、リーダライタとの間の通信距離を大きくすることが困難で、必要な通信距離を確保することできない場合がある。 If integrally formed antenna coil to the semiconductor chip, an antenna coil or a pattern formed in the insulating member, as compared with the case of carrying the antenna coil made of winding insulation member, winding diameter and the conductor width of the coil is reduced, because of naturally is a limit for the number of turns, it is difficult to increase the communication distance between the reader-writer, it may not be possible to secure the necessary communication distance. そこで、従来より、半導体チップに一体形成されたアンテナコイルとリーダライタに備えられたアンテナコイルとの間に、各アンテナコイル間の電磁誘導結合を強化するため、少なくとも1つの巻数を持ちその断面積がほぼデータ媒体装置(絶縁部材)の寸法を有する第2の導体ループと、少なくとも1つの巻数を持ちその断面積が半導体チップに接続された第1の導体ループ(半導体チップに一体形成されたアンテナコイル)の寸法をほぼ有する第3のループとを備え、第1及び第3の導体ループをほぼ同心的に配置し、第1及び第2の導体ループを第3のループを介して互いに誘導結合する技術が提案されている(例えば、特許文献1参照。)。 Therefore, conventionally, between the antenna coil provided in the antenna coil and the reader-writer which is integrally formed on a semiconductor chip, in order to enhance the electromagnetic induction coupling between the antenna coil, the cross-sectional area having at least one winding and approximately data medium device second conductive loop having a size of (an insulating member), the antenna sectional area having at least one winding is formed integrally with the first conductor loop (semiconductor chip connected to the semiconductor chip and a third loop having approximately the dimensions of the coil), substantially concentrically arranged, inductive coupling together first and second conductor loop through the third loop of the first and third conductor loop technology has been proposed (e.g., see Patent Document 1.).
【0005】 [0005]
なお、本明細書においては、このアンテナコイル間の電磁誘導結合を強化するための導体ループを、「ブースタコイル」という。 In this specification, the conductor loop to enhance the electromagnetic induction coupling between the antenna coil, referred to as "booster coil".
【0006】 [0006]
【特許文献1】 [Patent Document 1]
特開平8−532904号公報(図1) JP-8-532904 discloses (Fig. 1)
【0007】 [0007]
【発明が解決しようとする課題】 [Problems that the Invention is to Solve
前記特許文献に記載の技術によれば、ブースタコイルを介して半導体チップに一体形成されたアンテナコイルとリーダライタに備えられたアンテナコイルとが互いに電磁誘導結合されるので、各アンテナコイル間の電磁誘導結合が強化され、非接触通信式情報担体とリーダライタとの間の通信距離の延長を図ることができる。 According to the technique described in the Patent Document, since the antenna coil provided in the antenna coil and the reader-writer which is integrally formed on the semiconductor chip through the booster coil is inductively coupled to each other, electromagnetic between the antenna coil inductive coupling is strengthened, it is possible to extend the communication distance between the non-contact communication type information carrier and the reader-writer.
【0008】 [0008]
しかしながら、前記特許文献に記載の技術は、半導体チップに一体形成されたアンテナコイル(第1の導体ループ)とブースタコイルに形成された第3の導体ループとをほぼ同心の所定の位置関係に配置することによって各導体ループ間の良好な電磁誘導結合を実現するというものであるので、各導体ループの配設位置を厳密に規制しないと良好な電磁誘導結合が得られず、非接触通信式情報担体とリーダライタとの間の通信距離にばらつきが生じやすいという問題がある。 However, the technique described in the patent literature, generally concentric arrangement at a predetermined positional relationship with integrally formed antenna coil (first conductor loop) and a third conductor loop formed on the booster coil to the semiconductor chip good because is that to realize the electromagnetic induction coupling, can not be obtained good electromagnetic induction coupling unless strictly regulate the arrangement position of each conductor loop, a non-contact communication type information between each conductor loop by there is a problem that variation is likely to occur in the communication distance between the carrier and the reader-writer. また、各導体ループの配設位置を厳密に規制しなくてはならないことから、絶縁部材に対する半導体チップの搭載工程が複雑化し、非接触通信式情報担体が高コスト化するという問題がある。 Further, since the must be strictly regulate the arrangement position of each conductor loop, step of mounting the semiconductor chip is complicated with respect to the insulating member, the non-contact communication type information carrier there is a problem that high cost.
【0009】 [0009]
本発明は、かかる従来技術の不備を解決するためになされたものであって、その課題は、安価に製造できてリーダライタとの間の通信特性が安定な非接触通信式情報担体を提供することにある。 The present invention was made to solve the deficiencies of the prior art, and an object thereof is, communication characteristics between the reader writer can inexpensively provide a stable non-contact communication type information carrier It lies in the fact.
【0010】 [0010]
【課題を解決するための手段】 In order to solve the problems]
本発明は、前記の課題を解決するため、第1に、アンテナコイルが一体形成された半導体チップと、前記半導体チップに一体形成されたアンテナコイル及びリーダライタに備えられたアンテナコイルと電磁誘導結合するブースタコイルと、これら半導体チップ及びブースタコイルを担持する絶縁部材とを備えた非接触通信式情報担体において、前記ブースタコイル及び前記半導体チップに一体形成されたアンテナコイルの双方を内周部にコイル非形成領域を有する渦巻き状に形成し、前記絶縁基板の平面方向から見たとき、前記ブースタコイルのコイル非形成領域と前記半導体チップに一体形成されたアンテナコイルのコイル非形成領域とが少なくとも一部において重なり合うように前記半導体チップとブースタコイルとを配置するという構 The present invention for solving the above problems, the first, a semiconductor chip having an antenna coil are integrally formed, the semiconductor chip antenna coil and the electromagnetic induction coupling provided in the antenna coil and the reader-writer which is integrally formed on the a booster coil, the coil in the contactless communication type information carrier and an insulating member for carrying these semiconductor chips and the booster coil, both of the antenna coil which is integrally formed on the booster coil and the semiconductor chip to the inner peripheral portion formed in a spiral shape having a non-forming region, wherein when viewed from the direction of the plane of the insulating substrate, wherein the non-coil-forming regions of the booster coil and the non-coil-forming regions of the antenna coil which is integrally formed on the semiconductor chip at least a Organization of placing said semiconductor chip and the booster coil so as to overlap in part にした。 It was.
【0011】 [0011]
このように、ブースタコイルのコイル非形成領域と半導体チップに一体形成されたアンテナコイルのコイル非形成領域とが少なくとも一部において重なり合うように半導体チップとブースタコイルとを配置すると、ブースタコイルの巻数及びアンテナコイルの巻数に関係なくブースタコイルのコイル非形成領域内にアンテナコイルを構成する各ターンの導体を少なくともその一部において露出させることができるので、当該露出部分において磁気的な干渉のない電磁誘導結合が行われ、ブースタコイルとアンテナコイルとの電磁誘導結合を強化することができて、非接触通信式情報担体とリーダライタとの通信距離の延長を図ることができる。 Thus, when the non-coil-forming regions of the antenna coil which is integrally formed on the non-coil-forming regions and the semiconductor chip of the booster coil is disposed between the semiconductor chip and the booster coil so as to overlap at least in part, to the number of turns of the booster coil and can be exposed at least in part the conductor of each turn that constitute the antenna coil in the coil non-formation region of the booster coil regardless the number of turns of the antenna coil, the electromagnetic induction without magnetic interference in the exposed portion binding is performed, and it is possible to enhance the electromagnetic induction coupling between the booster coil and an antenna coil, it is possible to extend the communication distance of the non-contact communication type information carrier and the reader-writer. また、各コイル非形成領域が少なくとも一部において重なり合うように配置されている限り、半導体チップとブースタコイルとの配置が若干ずれたとしてもブースタコイルとアンテナコイルとの間の良好な電磁誘導結合を維持することができるので、絶縁部材に対する半導体チップの搭載工程を簡略化できて非接触通信式情報担体を低コスト化できると共に、非接触通信式情報担体とリーダライタとの間の通信距離のばらつきを小さくすることができる。 Further, as long as each coil formed area is disposed so as to overlap at least in part, a good electromagnetic induction coupling between the booster coil and the antenna coil as the arrangement of the semiconductor chip and the booster coil is shifted slightly can be maintained, variations in the communication distance between it is possible lower the cost of the non-contact communication type information carrier can simplify the mounting process of the semiconductor chip, a non-contact communication type information carrier and the reader-writer for the insulating member it can be reduced.
【0012】 [0012]
また、本発明は、前記の課題を解決するため、第2に、前記第1の課題解決手段に記載の非接触通信式情報担体において、前記ブースタコイル及び前記半導体チップに一体形成されたアンテナコイルの双方を内周部にコイル非形成領域を有する矩形渦巻き状に形成し、前記ブースタコイルの角隅部に前記半導体チップを配置するという構成にした。 Further, the present invention is to solve the above problems, the second, the first problem in the non-contact communication type information carrier according to the solving means, an antenna coil which is integrally formed on the booster coil and the semiconductor chip both formed in a rectangular spiral shape having a non-coil-forming regions in the inner peripheral portion of, and the configuration of disposing the semiconductor chip on the corners of the booster coil.
【0013】 [0013]
このように、矩形渦巻き状に形成されたブースタコイルの角隅部に半導体チップを配置すると、ブースタコイルと半導体チップに一体形成されたアンテナコイルとの電磁誘導結合をより一層強化することができるので、その結果、非接触通信式情報担体とリーダライタとの間のより一層の通信距離の延長を図ることができる。 Thus, placing the semiconductor chip on the corners of the booster coil which is formed in a rectangular spiral, so the electromagnetic induction coupling with the antenna coil formed integrally with the booster coil and the semiconductor chip can be further strengthened as a result, it is possible to further extend the communication distance between the non-contact communication type information carrier and the reader-writer.
【0014】 [0014]
また、本発明は、前記の課題を解決するため、第3に、前記第1の課題解決手段に記載の非接触通信式情報担体において、前記ブースタコイル及び前記半導体チップに一体形成されたアンテナコイルの双方を内周部にコイル非形成領域を有する矩形渦巻き状に形成し、前記ブースタコイルの側辺部に沿って前記半導体チップを配置するという構成にした。 Further, the present invention is to solve the above problems, the third, the first problem in the non-contact communication type information carrier according to the solving means, an antenna coil which is integrally formed on the booster coil and the semiconductor chip both formed in a rectangular spiral shape having a non-coil-forming regions in the inner peripheral portion of, and the configuration of disposing the semiconductor chip along the side portion of the booster coil.
【0015】 [0015]
このように、矩形渦巻き状に形成されたブースタコイルの側辺部に沿って半導体チップを配置すると、ブースタコイルの側辺に沿う方向に関して半導体チップの設定位置の自由度を高めることができるので、絶縁部材に対する半導体チップの搭載工程を簡略化できて非接触通信式情報担体を低コスト化することができる。 Thus, placing the semiconductor chip along the side portion of the booster coil which is formed in a rectangular spiral, so in the direction along the side of the booster coil can improve the degree of freedom in position of the semiconductor chip, cost can be reduced and made simplified mounting process of the semiconductor chip non-contact communication type information carrier with respect to the insulating member.
【0016】 [0016]
また、本発明は、前記の課題を解決するため、第4に、前記第1の課題解決手段に記載の非接触通信式情報担体において、前記絶縁基板上に1つのブースタコイルを形成し、当該1つのブースタコイルに対して複数個の前記半導体チップを配置するという構成にした。 Further, the present invention is to solve the above problems, in the fourth, in the non-contact communication type information carrier according to the first means for solving problems, to form a single booster coil on the insulating substrate, the and the configuration of placing a plurality of said semiconductor chip to one of the booster coil.
【0017】 [0017]
このように、絶縁基板上に1つのブースタコイルを形成すると、絶縁部材に複数個のブースタコイルを形成する場合に比べて1つのブースタコイルに対して複数個の前記半導体チップを配置すると、各半導体チップごとに異なる機能を発揮させ、異なる用途に適用することができるので、非接触通信式情報担体の多機能化及び多用途化を図ることができる。 Thus, by forming the single booster coil on an insulating substrate, placing a plurality of said semiconductor chip to one of the booster coil in comparison with the case of forming a plurality of booster coils insulating member, each of the semiconductor to exert different functions for each chip, it is possible to apply to the different applications, it is possible to achieve multiple functions and versatility of the non-contact communication type information carrier.
【0018】 [0018]
【発明の実施の形態】 DETAILED DESCRIPTION OF THE INVENTION
以下、本発明に係る非接触通信式情報担体の一実施形態例を、図1乃至図8に基づいて説明する。 Hereinafter, an example embodiment of the non-contact communication type information carrier according to the present invention will be described with reference to FIGS. 1-8. 図1は実施形態例に係る非接触通信式情報担体に備えられたブースタコイルと半導体チップとの配列を示す平面図、図2は図1のA−A断面図、図3はブースタコイルと半導体チップに一体形成されたアンテナコイルとの配列を模式的に示す図、図4はブースタコイルと半導体チップに一体形成されたアンテナコイルとの配列を模式的に示す図、図5は絶縁部材の表面図、図6は絶縁部材の裏面図、図7は半導体チップの平面図、図8は本例の非接触通信式情報担体に備えられたブースタコイルの等価回路図である。 Figure 1 is a plan view showing the arrangement of the booster coil and the semiconductor chip provided in non-contact communication type information carrier according to the embodiment, FIG. 2 is a sectional view taken along A-A of FIG. 1, FIG. 3 is a booster coil and the semiconductor shows the arrangement of integrally formed antenna coil to the chip schematically, FIG. 4 shows the arrangement of the antenna coil formed integrally with the booster coil and the semiconductor chip schematically figure 5 the surface of the insulating member FIG, 6 is a rear view of the insulating member, FIG. 7 is a plan view of the semiconductor chip, FIG. 8 is an equivalent circuit diagram of the booster coil provided in the non-contact communication type information carrier of this embodiment.
【0019】 [0019]
図1及び図2に示すように、本例の非接触通信式情報担体は、アンテナコイル1が一体形成された半導体チップ2と、ブースタコイル3及び静電容量を形成する導体膜4a,4b,5a,5bが形成された絶縁部材6と、これら半導体チップ2及び絶縁部材6を一体にケーシングする基体7とからなる。 As shown in FIGS. 1 and 2, the non-contact communication type information carrier of this embodiment includes a semiconductor chip 2 on which the antenna coil 1 is integrally formed, the conductive film 4a to form the booster coil 3 and the capacitance, 4b, 5a, an insulating member 6 which 5b are formed, these semiconductor chips 2 and the insulating member 6 from the substrate 7 for the casing together.
【0020】 [0020]
半導体チップ2は、図7に示すように、入出力端子2aの形成面に、ポリイミド樹脂膜等からなる絶縁層2bを介して、内周部にコイル非形成領域1aを有する矩形渦巻き状のアンテナコイル1を一体に形成してなる。 The semiconductor chip 2, as shown in FIG. 7, the forming surface of the input-output terminal 2a, through the insulating layer 2b made of a polyimide resin film or the like, rectangular spiral antenna having a coil-formed region 1a on the inner peripheral portion the coil 1 is formed by integrally formed. アンテナコイル1は、フォトレジスト法、即ち、半導体チップ2(より実際的には、個々の半導体チップに分割される以前の完成ウエハ)の絶縁層形成面に、入出力端子形成部を除いてフォトレジスト層を均一の厚さに形成し、このフォトレジスト層に所要のコイルパターンを露光・現像した後、フォトレジスト層をマスクとして半導体チップ2の絶縁層2b上に導電性金属材料をスパッタリング又は真空蒸着し、しかる後に、フォトレジスト層を除去して入出力端子2aの形成面に導電性金属材料からなるコイルパターンを形成するといった方法で形成することができる。 The antenna coil 1, a photoresist method, i.e., the semiconductor chip 2 (in more practical, the previous finished wafer is divided into individual semiconductor chips) in the insulating layer forming surface of, except for the input-output terminal portion Images the resist layer is formed on a uniform thickness, the photo after exposure and development the required coil pattern on the resist layer, a photoresist layer sputtering or vacuum conductive metal material on the insulating layer 2b of the semiconductor chip 2 as a mask deposited, thereafter, it can be formed by a method such as forming a coil pattern made of a conductive metal material forming surface of the input-output terminal 2a by removing the photoresist layer. なお、コイルパターンの電気抵抗を減少するため、導電性金属膜の表面に銅のめっき層を形成することもできる。 In order to reduce the electrical resistance of the coil patterns, it is also possible to form a plating layer of copper on the surface of the conductive metal film.
【0021】 [0021]
なお、図7の例では、アンテナコイル1が複数のターン数を有する矩形渦巻き状に形成されているが、当該アンテナコイル1のターン数や平面形状はこれに限定されるものではない。 In the example of FIG. 7, the antenna coil 1 is formed in a rectangular spiral shape having a number of plurality of turns, the number of turns and the planar shape of the antenna coil 1 is not limited thereto. 即ち、ターン数に関しては、1ターン以上の任意のターン数とすることができ、平面形状に関しては、角部に斜線状又は円弧状の面取りが施された矩形や円形など、任意の形状に形成できる。 That is, with respect to the number of turns, can be any number of turns of one or more turns, with respect to the planar shape, the hatched-like or arc-shaped chamfer and a rectangle or a circle which has been subjected to the corners, formed into any shape it can.
【0022】 [0022]
ブースタコイル3は、図5に示すように、絶縁部材6の表面側に、内周部にコイル非形成領域3aを有する矩形渦巻き状に形成される。 Booster coil 3, as shown in FIG. 5, the surface side of the insulating member 6, is formed in a rectangular spiral shape having a non-coil-forming regions 3a on the inner peripheral portion. このブースタコイル3は、基体7内に収まる範囲でなるべく大きく形成され、その両端部には静電容量を形成する導体膜4a,4bがそれぞれ接続されている。 The booster coil 3 is as large as possible formed in a range that fits within a substrate 7, a conductor film 4a to form an electrostatic capacitance, 4b are connected respectively to both ends.
【0023】 [0023]
なお、図5の例では、ブースタコイル3が複数のターン数を有する矩形渦巻き状に形成されているが、ブースタコイル3のターン数や平面形状はこれに限定されるものではなく、前述のアンテナコイル1と同様に、任意のターン数及び形状に形成することができる。 In the example of FIG. 5, although the booster coil 3 is formed in a rectangular spiral shape having a number of plurality of turns, the number of turns and the planar shape of the booster coil 3 is not limited thereto, the above-described antenna similar to the coil 1, can be formed in any number of turns and shape.
【0024】 [0024]
半導体チップ2は、図1乃至図4に示すように、アンテナコイル1を絶縁部材6側に向け、かつ、アンテナコイル1のコイル非形成領域1aとブースタコイル3のコイル非形成領域3aとが一部において重なり合うようにして、ブースタコイル3の角隅部に設定される。 The semiconductor chip 2, as shown in FIGS. 1 to 4, directed to the antenna coil 1 to the insulating member 6 side, and is a non-coil-forming regions 3a of the coil-formed region 1a and the booster coil 3 of the antenna coil 1 one as overlapping in part, it is set in the corners of the booster coil 3.
【0025】 [0025]
静電容量を形成する導体膜4aと5a及び4bと5bは、絶縁部材6の表面及び裏面に対向に形成される。 Conductive films 4a and 5a and 4b, 5b for forming an electrostatic capacitance is formed on the opposite front and rear surfaces of the insulating member 6. また、絶縁部材6の表面側に形成された静電容量を形成する導体膜4a,4bは、前記したように、ブースタコイル3を介して電気的に接続され、絶縁部材6の裏面側に形成された静電容量を形成する導体膜5a,5bは、図6に示すように、導線5cを介して電気的に接続される。 The conductor film 4a to form an electrostatic capacitance formed on the surface side of the insulating member 6, 4b, as described above, are electrically connected via the booster coil 3, formed on the rear surface side of the insulating member 6 conductive films 5a, 5b forming the by capacitance, as shown in FIG. 6, are electrically connected through a lead wire 5c. したがって、前記ブースタコイル3は、相対向に配置された静電容量を形成する導体膜4aと5a及び4bと5bを介してその両端部で容量結合されており、図8に模式的に示すように、両端に導体膜4aと5aとで形成される静電容量Caと導体膜4bと5bとで形成される静電容量Cbとが接続されたブースタコイル3が得られる。 Therefore, the booster coil 3 is capacitively coupled at its opposite ends through the conductive film 4a and 5a and 4b, 5b to form a capacitance which is arranged in opposed, as schematically shown in FIG. 8 , the electrostatic capacitance Ca and the conductive film 4b and the booster coil 3 and the capacitance Cb is connected formed by the 5b formed by the conductive film 4a and 5a obtained across. 各導体膜4a,5a,4b,5bの面積は、前記2個の静電容量Ca,Cbの直列インピーダンスが、半導体チップ2に一体形成されたアンテナコイル1及びブースタコイル3を含む系において、アンテナコイル1の両端に最大電圧が得られるように調整される。 Each conductor films 4a, 5a, 4b, area 5b, the two capacitances Ca, series impedance of Cb is, the antenna coil 1 and system including a booster coil 3 which is integrally formed on the semiconductor chip 2, antenna the maximum voltage is adjusted so as to obtain across the coil 1.
【0026】 [0026]
前記ブースタコイル3及び静電容量を形成する導体膜4a,5a,4b,5bは、絶縁部材6の片面に形成された均一厚さの導電性金属層にエッチングを施して所要のコイルパターンを形成するエッチング法や、絶縁部材6の片面に導電性インクを用いて所要の導電パターンを印刷形成する印刷法などをもって形成することができる。 Conductive film 4a to form the booster coil 3 and the capacitance, 5a, 4b, 5b may form a predetermined coil pattern by etching the conductive metal layer of uniform thickness formed on one side of the insulating member 6 and etching method, can be formed with a printing method of printing form desired conductive pattern by using a conductive ink on one surface of the insulating member 6.
【0027】 [0027]
絶縁部材6は、所要の誘電率と剛性とをもった絶縁材料をもって形成される。 The insulating member 6 is formed with an insulating material having a desired dielectric constant and rigidity. 絶縁部材6を構成するに好適な絶縁材料としては、一例として、ガラスエポキシ樹脂、ポリイミド樹脂、ポリアミド樹脂、ポリエチレンテレフタレート樹脂(以下、PETと略称する。)又は塩化ビニル樹脂などを挙げることができる。 Suitable insulating material constituting the insulating member 6, as an example, a glass epoxy resin, polyimide resin, polyamide resin, polyethylene terephthalate resin (hereinafter, abbreviated as PET.) Or the like may be mentioned vinyl chloride resin.
【0028】 [0028]
基体7は、カバーシート8と接着剤層9とをもって構成される。 Body 7 is configured with a cover sheet 8 and the adhesive layer 9. このうち、カバーシート8は、紙やプラスチックシートなど、任意のシート状材料をもって形成することができるが、廃棄しても分解し、焼却してもダイオキシン等の有害物質を発生しないことから、紙をもって形成することが最も好ましい。 Of these, the cover sheet 8, such as paper or plastic sheet, since it can be formed with any sheet material, which be discarded decomposed, does not generate harmful substances such as dioxin even when incinerated, paper it is most preferably formed with a. カバーシート材料としてプラスチックシートを用いる場合には、焼却してもダイオキシン等の有害物質を発生しないことから、PETのような塩素を含まないプラスチックシートを用いることが特に好ましい。 When using a plastic sheet as the cover sheet material, since it be incinerated without generating harmful substances such as dioxin, it is particularly preferable to use a plastic sheet that does not contain chlorine, such as PET. 一方、接着剤層9を構成する接着剤としては、硬化後に所要の硬度を有する任意の接着剤を用いることができるが、ブースタコイル1、アンテナコイル3及び半導体チップ4の保護効果を高めるため、例えばエポキシ樹脂のように吸湿性の低い樹脂材料を用いることが特に好ましい。 On the other hand, the adhesive which constitutes the adhesive layer 9, but may be any adhesive having the required hardness after curing, to enhance the protective effect of the booster coil 1, the antenna coil 3 and the semiconductor chip 4, for example, it is particularly preferable to use a low resin material hygroscopicity as epoxy resin.
【0029】 [0029]
本例の非接触通信式情報担体は、半導体チップ2に一体形成されたアンテナコイル1のコイル非形成領域1aとブースタコイル3のコイル非形成領域3aとが一部において重なり合うように半導体チップ2とブースタコイル3とを配置したので、図4に模式的に示すように、アンテナコイル1の巻数及びブースタコイル3の巻数に関係なくブースタコイル3のコイル非形成領域3a内にアンテナコイル1を構成する各ターンの導体の1部を露出させることができる。 Non-contact communication type information carrier of this embodiment, the non-coil-forming regions 1a of the antenna coil 1 which is integrally formed on the semiconductor chip 2 and the non-coil-forming regions 3a of the booster coil 3 and the semiconductor chip 2 so as to overlap in part Having placed the booster coil 3, as schematically shown in FIG. 4, constituting the antenna coil 1 in the non-coil-forming regions 3a of the booster coil 3 regardless of the number of turns of the windings and the booster coil 3 of the antenna coil 1 it is possible to expose the part of the conductor of each turn. そして、当該露出部分においては、ブースタコイル3より放射される磁力線に干渉を生じないので、最適な電磁誘導結合が行われ、非接触通信式情報担体とリーダライタとの電磁誘導結合を強化することができる。 Then, in the exposed portion, since no interference with magnetic field lines emanating from the booster coil 3, the optimum electromagnetic induction coupling is performed, to enhance the electromagnetic induction coupling between the non-contact communication type information carrier and the reader-writer can. アンテナコイル1からブースタコイル3への送信時にも同様の理由により最適な電磁誘導結合が行われる。 Optimum electromagnetic induction coupling is carried out for the same reason even during transmission from the antenna coil 1 to the booster coil 3. また、本例の非接触通信式情報担体は、各コイル非形成領域1a,3aが一部において重なり合うように配置されている限り、半導体チップ2とブースタコイル3との配置が若干ずれたとしてもアンテナコイル1とブースタコイル3との間の良好な電磁誘導結合を維持することができるので、絶縁部材6に対する半導体チップ2の搭載工程を簡略化できて非接触通信式情報担体を低コスト化できると共に、非接触通信式情報担体とリーダライタとの間の通信距離のばらつきを小さくすることができる。 The non-contact communication type information carrier of this embodiment, the non-coil-forming regions 1a, as long as 3a is disposed so as to overlap in part, be disposed between the semiconductor chip 2 and the booster coil 3 is slightly displaced it is possible to maintain good electromagnetic induction coupling between the antenna coil 1 and the booster coil 3 can lower the cost of the made simplified mounting process of the semiconductor chip 2 non-contact communication type information carrier with respect to the insulating member 6 together, it is possible to reduce variations in communication distance between the non-contact communication type information carrier and the reader-writer. さらに、本例の非接触通信式情報担体は、矩形渦巻き状に形成されたブースタコイル3の角隅部に半導体チップ2を配置したので、アンテナコイル1とブースタコイル3との電磁誘導結合をより一層強固なものとすることができる。 Further, non-contact communication type information carrier of this embodiment, since the arrangement of the semiconductor chip 2 to the corners of the booster coil 3 formed in a rectangular spiral, the electromagnetic induction coupling between the antenna coil 1 and the booster coil 3 and more it can be made more robust.
【0030】 [0030]
以下、本発明の他の実施形態について列挙する。 Listed below are for the other embodiments of this invention. なお、図9はブースタコイル3に対するアンテナコイル1の他の配列例を模式的に示す図である。 Incidentally, FIG. 9 is a diagram showing another example of the arrangement of the antenna coil 1 with respect to the booster coil 3 schematically.
【0031】 [0031]
(1)前記実施形態例においては、アンテナコイル1のコイル非形成領域1aとブースタコイル3のコイル非形成領域3aとが一部において重なり合うように半導体チップ2とブースタコイル3とを配置したが、本発明の要旨はこれに限定されるものではなく、図9(a)に示すように、アンテナコイル1のコイル非形成領域1aとブースタコイル3のコイル非形成領域3aとが完全に重なり合うように半導体チップ2とブースタコイル3とを配置することもできる。 (1) In the exemplary embodiment, although the non-coil-forming regions 3a of the coil-formed region 1a and the booster coil 3 of the antenna coil 1 is arranged and the semiconductor chip 2 and the booster coil 3 so as to overlap in part, gist of the present invention is not limited to this, as shown in FIG. 9 (a), as the non-coil-forming regions 3a of the coil-formed region 1a and the booster coil 3 of the antenna coil 1 is completely overlapped it is also possible to arrange the semiconductor chip 2 and the booster coil 3.
【0032】 [0032]
(2)前記実施形態例においては、ブースタコイル3の角隅部に半導体チップ2を配置したが、本発明の要旨はこれに限定されるものではなく、図9(b)に示すように、ブースタコイル3の側辺部に沿って半導体チップ2を配置することもできる。 (2) In the exemplary embodiment has been arranged semiconductor chip 2 to the corners of the booster coil 3, the gist of the present invention is not limited to this, as shown in FIG. 9 (b), it is also possible to arrange the semiconductor chip 2 along the side portion of the booster coil 3. このように、ブースタコイル3の側辺部に沿って半導体チップ2を配置すると、ブースタコイル3の側辺に沿う方向に対する半導体チップ2の設定位置の自由度を高めることができるので、絶縁部材6に対する半導体チップ2の搭載工程を簡略化でき、非接触通信式情報担体を低コスト化することができる。 Thus, placing the semiconductor chip 2 along the side portion of the booster coil 3, it is possible to enhance the degree of freedom in setting the position of the semiconductor chip 2 with respect to a direction along the side of the booster coil 3, the insulating member 6 It simplifies the mounting process of the semiconductor chip 2 with respect to the non-contact communication type information carrier can be low cost.
【0033】 [0033]
(3)前記実施形態例においては、1枚の絶縁基板6上に半導体チップ2を1つのみ搭載したが、本発明の要旨はこれに限定されるものではなく、図9(c)に示すように、1枚の絶縁基板6上に複数個の半導体チップ2を搭載することもできる。 (3) In the above embodiment, although the semiconductor chip 2 was only one mounted on one insulating substrate 6, the gist of the present invention is not limited thereto, shown in FIG. 9 (c) as such, it is also possible to mount a plurality of semiconductor chips 2 on one insulating substrate 6. このように、1枚の絶縁基板6上に複数個の半導体チップ2を搭載すると、各半導体チップ2ごとに異なる機能を発揮させ、異なる用途に適用することができるので、非接触通信式情報担体の多機能化及び多用途化を図ることができる。 Thus, when mounting a plurality of semiconductor chips 2 on one insulating substrate 6, is exerted different functions for each semiconductor chip 2, it is possible to apply to the different applications, the non-contact communication type information carrier it is possible to multi-functionality and multi-purpose of.
【0034】 [0034]
(4)前記実施形態例においては、絶縁基板6に静電容量を形成する導体膜4a,5a,4b,5bを形成したが、本発明の要旨はこれに限定されるものではなく、チップコンデンサ等のチップ部品を絶縁基板6上に形成されたブースタコイル3に接続することもできる。 (4) In the exemplary embodiment, the conductive film 4a to form the capacitance insulating substrate 6, 5a, 4b, were formed 5b, the gist of the present invention is not limited to this, chip capacitors chip parts etc. can also be connected to the booster coil 3 formed on the insulating substrate 6.
【0035】 [0035]
【発明の効果】 【Effect of the invention】
以上説明したように、本発明の非接触通信式情報担体は、半導体チップに一体形成されたアンテナコイルのコイル非形成領域とブースタコイルのコイル非形成領域とが少なくとも一部において重なり合うように半導体チップとブースタコイルとを配置したので、アンテナコイルの巻数及びブースタコイルの巻数に関係なくブースタコイルのコイル非形成領域内にアンテナコイルを構成する各ターンの導体の一部を露出させることができ、当該露出部分においてアンテナコイルとブースタコイルとの間で磁気的な干渉のない最適な電磁誘導結合を行うことができて、非接触通信式情報担体とリーダライタとの電磁誘導結合を強化することができる。 As described above, the non-contact communication type information carrier of the present invention, a semiconductor such as non-coil-forming regions and the booster coil unformed region of the coil of the antenna coil which is integrally formed on a semiconductor chip overlap at least a portion the chip and so arranged and the booster coil, it is possible to expose a portion of the conductor of each turn that constitute the antenna coil in the coil-formed region of the booster coil regardless the number of turns of the windings and the booster coil of the antenna coil, the to be able to perform optimal electromagnetic induction coupling with no magnetic interference between the antenna coil and the booster coil in the exposed portion, it is possible to enhance the electromagnetic induction coupling between the non-contact communication type information carrier and the reader-writer . また、本発明の非接触通信式情報担体は、アンテナコイルのコイル非形成領域とブースタコイルのコイル非形成領域とが少なくとも一部において重なり合うように配置されている限り、半導体チップとブースタコイルとの配置が若干ずれたとしてもアンテナコイルとブースタコイルとの間の良好な電磁誘導結合を維持することができるので、絶縁部材に対する半導体チップの搭載工程を簡略化できて非接触通信式情報担体を低コスト化できると共に、非接触通信式情報担体とリーダライタとの間の通信距離のばらつきを小さくすることができる。 The non-contact communication type information carrier of the present invention, as long as the non-coil-forming regions of the antenna coil and the non-coil-forming regions of the booster coil is disposed so as to overlap at least a portion, of the semiconductor chip and the booster coil since the arrangement can maintain good electromagnetic inductive coupling between the antenna coil and the booster coil even slightly deviates, the non-contact communication type information carrier can simplify the mounting process of the semiconductor chip against the insulating member low it is possible cost, it is possible to reduce variations in communication distance between the non-contact communication type information carrier and the reader-writer.
【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS
【図1】実施形態例に係る非接触通信式情報担体に備えられたブースタコイルと半導体チップとの配列を示す平面図である。 1 is a plan view showing the arrangement of the booster coil and the semiconductor chip provided in non-contact communication type information carrier according to the embodiment.
【図2】図1のA−A断面図である。 2 is an A-A sectional view of FIG.
【図3】ブースタコイルと半導体チップに一体形成されたアンテナコイルとの配列を模式的に示す図である。 [3] The sequence of integrally formed antenna coil to the booster coil and the semiconductor chip is a diagram schematically illustrating.
【図4】ブースタコイルと半導体チップに一体形成されたアンテナコイルとの配列を模式的に示す図である。 [4] The sequence of the antenna coil formed integrally with the booster coil and the semiconductor chip is a diagram schematically illustrating.
【図5】絶縁部材の表面図である。 5 is a top plan view of the insulating member.
【図6】絶縁部材の裏面図である。 6 is a rear view of the insulating member.
【図7】半導体チップの平面図である。 7 is a plan view of a semiconductor chip.
【図8】非接触通信式情報担体に備えられたブースタコイルの等価回路図である。 8 is an equivalent circuit diagram of the booster coil provided in the non-contact communication type information carrier.
【図9】ブースタコイルに対する半導体チップの他の配列例を模式的に示す図である。 [9] Another example of the arrangement of the semiconductor chip against the booster coil is a diagram schematically illustrating.
【符号の説明】 DESCRIPTION OF SYMBOLS
1 アンテナコイル1a コイル非形成領域2 半導体チップ3 ブースタコイル3a コイル非形成領域4a,4b,5a,5b 静電容量を形成する導体膜6 絶縁部材7 基体8 カバーシート9 接着剤層 1 antenna coil 1a coil unformed region 2 semiconductor chip 3 booster coil 3a coil-formed region 4a, 4b, 5a, the conductive film 6 insulating member 7 base 8 cover sheet 9 adhesive layer to form a 5b capacitance

Claims (4)

  1. アンテナコイルが一体形成された半導体チップと、前記半導体チップに一体形成されたアンテナコイル及びリーダライタに備えられたアンテナコイルと電磁誘導結合するブースタコイルと、これら半導体チップ及びブースタコイルを担持する絶縁部材とを備えた非接触通信式情報担体において、前記ブースタコイル及び前記半導体チップに一体形成されたアンテナコイルの双方を内周部にコイル非形成領域を有する渦巻き状に形成し、前記絶縁基板の平面方向から見たとき、前記ブースタコイルのコイル非形成領域と前記半導体チップに一体形成されたアンテナコイルのコイル非形成領域とが少なくとも一部において重なり合うように前記半導体チップとブースタコイルとを配置したことを特徴とする非接触通信式情報担体。 A semiconductor chip having an antenna coil are integrally formed, wherein an antenna coil provided in the antenna coil and the reader-writer which is integrally formed on the semiconductor chip and the booster coil for electromagnetic induction coupling, insulating member carrying these semiconductor chips and the booster coil the non-contact communication type information carrier with the door, is formed in a spiral shape having a non-coil-forming regions in the inner peripheral portion of both of the antenna coil which is integrally formed on the booster coil and the semiconductor chip, the plane of the insulating substrate when viewed from a direction, that the non-coil-forming regions of the antenna coil which is integrally formed on the non-coil-forming regions and said semiconductor chip of said booster coil is disposed between the semiconductor chip and the booster coil so as to overlap at least a portion non-contact communication type information carrier, characterized in.
  2. 請求項1に記載の非接触通信式情報担体において、前記ブースタコイル及び前記半導体チップに一体形成されたアンテナコイルの双方を内周部にコイル非形成領域を有する矩形渦巻き状に形成し、前記ブースタコイルの角隅部に前記半導体チップを配置したことを特徴とする非接触通信式情報担体。 The non-contact communication type information carrier according to claim 1, formed in a rectangular spiral shape having a non-coil-forming regions in the inner peripheral portion of both of the antenna coil which is integrally formed on the booster coil and the semiconductor chip, said booster non-contact communication type information carrier, characterized in that a semiconductor chip on the corners of the coil.
  3. 請求項1に記載の非接触通信式情報担体において、前記ブースタコイル及び前記半導体チップに一体形成されたアンテナコイルの双方を内周部にコイル非形成領域を有する矩形渦巻き状に形成し、前記ブースタコイルの側辺部に沿って前記半導体チップを配置したことを特徴とする非接触通信式情報担体。 The non-contact communication type information carrier according to claim 1, formed in a rectangular spiral shape having a non-coil-forming regions in the inner peripheral portion of both of the antenna coil which is integrally formed on the booster coil and the semiconductor chip, said booster non-contact communication type information carrier, characterized in that a said semiconductor chip along the side portions of the coil.
  4. 請求項1に記載の非接触通信式情報担体において、前記絶縁基板上に1つのブースタコイルを形成し、当該1つのブースタコイルに対して複数個の前記半導体チップを配置したことを特徴とする非接触通信式情報担体。 The non-contact communication type information carrier according to claim 1, wherein the insulation forms a single booster coil on the substrate, characterized in that a plurality of said semiconductor chip with respect to the one booster coil non contact communication type information carrier.
JP2003078180A 2003-03-20 2003-03-20 Non-contact communication type information carrier Expired - Fee Related JP4034676B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003078180A JP4034676B2 (en) 2003-03-20 2003-03-20 Non-contact communication type information carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003078180A JP4034676B2 (en) 2003-03-20 2003-03-20 Non-contact communication type information carrier

Publications (2)

Publication Number Publication Date
JP2004287767A true true JP2004287767A (en) 2004-10-14
JP4034676B2 JP4034676B2 (en) 2008-01-16

Family

ID=33292733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003078180A Expired - Fee Related JP4034676B2 (en) 2003-03-20 2003-03-20 Non-contact communication type information carrier

Country Status (1)

Country Link
JP (1) JP4034676B2 (en)

Cited By (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007083574A1 (en) * 2006-01-19 2007-07-26 Murata Manufacturing Co., Ltd. Radio ic device and radio ic device part
JP2008226099A (en) * 2007-03-15 2008-09-25 Dainippon Printing Co Ltd Noncontact data carrier device
US7764928B2 (en) 2006-01-19 2010-07-27 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US7762472B2 (en) 2007-07-04 2010-07-27 Murata Manufacturing Co., Ltd Wireless IC device
US7786949B2 (en) 2006-04-14 2010-08-31 Murata Manufacturing Co., Ltd. Antenna
US7830311B2 (en) 2007-07-18 2010-11-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic device
US7857230B2 (en) 2007-07-18 2010-12-28 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US7871008B2 (en) 2008-06-25 2011-01-18 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US7880680B2 (en) 2005-01-07 2011-02-01 Fujitsu Limited Tag device, antenna, and portable card
US7931206B2 (en) 2007-05-10 2011-04-26 Murata Manufacturing Co., Ltd. Wireless IC device
US7932730B2 (en) 2006-06-12 2011-04-26 Murata Manufacturing Co., Ltd. System for inspecting electromagnetic coupling modules and radio IC devices and method for manufacturing electromagnetic coupling modules and radio IC devices using the system
US7967216B2 (en) 2008-05-22 2011-06-28 Murata Manufacturing Co., Ltd. Wireless IC device
US7990337B2 (en) 2007-12-20 2011-08-02 Murata Manufacturing Co., Ltd. Radio frequency IC device
US7997501B2 (en) 2007-07-17 2011-08-16 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US8009101B2 (en) 2007-04-06 2011-08-30 Murata Manufacturing Co., Ltd. Wireless IC device
US8031124B2 (en) 2007-01-26 2011-10-04 Murata Manufacturing Co., Ltd. Container with electromagnetic coupling module
US8070070B2 (en) 2007-12-26 2011-12-06 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8081121B2 (en) 2006-10-27 2011-12-20 Murata Manufacturing Co., Ltd. Article having electromagnetic coupling module attached thereto
US8081541B2 (en) 2006-06-30 2011-12-20 Murata Manufacturing Co., Ltd. Optical disc
US8081119B2 (en) 2006-04-26 2011-12-20 Murata Manufacturing Co., Ltd. Product including power supply circuit board
US8081125B2 (en) 2006-07-11 2011-12-20 Murata Manufacturing Co., Ltd. Antenna and radio IC device
JP2012049714A (en) * 2010-08-25 2012-03-08 Nec Tokin Corp Antenna module
US8179329B2 (en) 2008-03-03 2012-05-15 Murata Manufacturing Co., Ltd. Composite antenna
US8177138B2 (en) 2008-10-29 2012-05-15 Murata Manufacturing Co., Ltd. Radio IC device
US8193939B2 (en) 2007-07-09 2012-06-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8228075B2 (en) 2006-08-24 2012-07-24 Murata Manufacturing Co., Ltd. Test system for radio frequency IC devices and method of manufacturing radio frequency IC devices using the same
US8228252B2 (en) 2006-05-26 2012-07-24 Murata Manufacturing Co., Ltd. Data coupler
US8235299B2 (en) 2007-07-04 2012-08-07 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8264357B2 (en) 2007-06-27 2012-09-11 Murata Manufacturing Co., Ltd. Wireless IC device
US8299968B2 (en) 2007-02-06 2012-10-30 Murata Manufacturing Co., Ltd. Packaging material with electromagnetic coupling module
US8299929B2 (en) 2006-09-26 2012-10-30 Murata Manufacturing Co., Ltd. Inductively coupled module and item with inductively coupled module
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8342416B2 (en) 2009-01-09 2013-01-01 Murata Manufacturing Co., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8360325B2 (en) 2008-04-14 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device, electronic apparatus, and method for adjusting resonant frequency of wireless IC device
US8360324B2 (en) 2007-04-09 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device
US8381997B2 (en) 2009-06-03 2013-02-26 Murata Manufacturing Co., Ltd. Radio frequency IC device and method of manufacturing the same
US8384547B2 (en) 2006-04-10 2013-02-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8390459B2 (en) 2007-04-06 2013-03-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8400307B2 (en) 2007-07-18 2013-03-19 Murata Manufacturing Co., Ltd. Radio frequency IC device and electronic apparatus
US8400365B2 (en) 2009-11-20 2013-03-19 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8418928B2 (en) 2009-04-14 2013-04-16 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8424769B2 (en) 2010-07-08 2013-04-23 Murata Manufacturing Co., Ltd. Antenna and RFID device
US8474725B2 (en) 2007-04-27 2013-07-02 Murata Manufacturing Co., Ltd. Wireless IC device
US8531346B2 (en) 2007-04-26 2013-09-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8546927B2 (en) 2010-09-03 2013-10-01 Murata Manufacturing Co., Ltd. RFIC chip mounting structure
US8544754B2 (en) 2006-06-01 2013-10-01 Murata Manufacturing Co., Ltd. Wireless IC device and wireless IC device composite component
US8583043B2 (en) 2009-01-16 2013-11-12 Murata Manufacturing Co., Ltd. High-frequency device and wireless IC device
US8590797B2 (en) 2008-05-21 2013-11-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8596545B2 (en) 2008-05-28 2013-12-03 Murata Manufacturing Co., Ltd. Component of wireless IC device and wireless IC device
JP2013247436A (en) * 2012-05-24 2013-12-09 Murata Mfg Co Ltd Coil antenna and communication terminal device
US8602310B2 (en) 2010-03-03 2013-12-10 Murata Manufacturing Co., Ltd. Radio communication device and radio communication terminal
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8632014B2 (en) 2007-04-27 2014-01-21 Murata Manufacturing Co., Ltd. Wireless IC device
US8668151B2 (en) 2008-03-26 2014-03-11 Murata Manufacturing Co., Ltd. Wireless IC device
US8680971B2 (en) 2009-09-28 2014-03-25 Murata Manufacturing Co., Ltd. Wireless IC device and method of detecting environmental state using the device
US8692718B2 (en) 2008-11-17 2014-04-08 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8718727B2 (en) 2009-12-24 2014-05-06 Murata Manufacturing Co., Ltd. Antenna having structure for multi-angled reception and mobile terminal including the antenna
US8720789B2 (en) 2012-01-30 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device
US8740093B2 (en) 2011-04-13 2014-06-03 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal
US8757500B2 (en) 2007-05-11 2014-06-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8770489B2 (en) 2011-07-15 2014-07-08 Murata Manufacturing Co., Ltd. Radio communication device
US8797148B2 (en) 2008-03-03 2014-08-05 Murata Manufacturing Co., Ltd. Radio frequency IC device and radio communication system
US8797225B2 (en) 2011-03-08 2014-08-05 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US8810456B2 (en) 2009-06-19 2014-08-19 Murata Manufacturing Co., Ltd. Wireless IC device and coupling method for power feeding circuit and radiation plate
US8814056B2 (en) 2011-07-19 2014-08-26 Murata Manufacturing Co., Ltd. Antenna device, RFID tag, and communication terminal apparatus
US8847831B2 (en) 2009-07-03 2014-09-30 Murata Manufacturing Co., Ltd. Antenna and antenna module
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8905316B2 (en) 2010-05-14 2014-12-09 Murata Manufacturing Co., Ltd. Wireless IC device
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8981906B2 (en) 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US8994605B2 (en) 2009-10-02 2015-03-31 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
US9064198B2 (en) 2006-04-26 2015-06-23 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US9077067B2 (en) 2008-07-04 2015-07-07 Murata Manufacturing Co., Ltd. Radio IC device
US9104950B2 (en) 2009-01-30 2015-08-11 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9123996B2 (en) 2010-05-14 2015-09-01 Murata Manufacturing Co., Ltd. Wireless IC device
US9166291B2 (en) 2010-10-12 2015-10-20 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US9178279B2 (en) 2009-11-04 2015-11-03 Murata Manufacturing Co., Ltd. Wireless IC tag, reader-writer, and information processing system
US9231305B2 (en) 2008-10-24 2016-01-05 Murata Manufacturing Co., Ltd. Wireless IC device
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9281873B2 (en) 2008-05-26 2016-03-08 Murata Manufacturing Co., Ltd. Wireless IC device system and method of determining authenticity of wireless IC device
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US9444143B2 (en) 2009-10-16 2016-09-13 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9460376B2 (en) 2007-07-18 2016-10-04 Murata Manufacturing Co., Ltd. Radio IC device
US9460320B2 (en) 2009-10-27 2016-10-04 Murata Manufacturing Co., Ltd. Transceiver and radio frequency identification tag reader
US9461363B2 (en) 2009-11-04 2016-10-04 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9543642B2 (en) 2011-09-09 2017-01-10 Murata Manufacturing Co., Ltd. Antenna device and wireless device
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device

Cited By (131)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4717830B2 (en) * 2005-01-07 2011-07-06 富士通株式会社 Tag device
US7880680B2 (en) 2005-01-07 2011-02-01 Fujitsu Limited Tag device, antenna, and portable card
US8326223B2 (en) 2006-01-19 2012-12-04 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8078106B2 (en) 2006-01-19 2011-12-13 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8725071B2 (en) 2006-01-19 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8676117B2 (en) 2006-01-19 2014-03-18 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
WO2007083574A1 (en) * 2006-01-19 2007-07-26 Murata Manufacturing Co., Ltd. Radio ic device and radio ic device part
US7764928B2 (en) 2006-01-19 2010-07-27 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8384547B2 (en) 2006-04-10 2013-02-26 Murata Manufacturing Co., Ltd. Wireless IC device
US7786949B2 (en) 2006-04-14 2010-08-31 Murata Manufacturing Co., Ltd. Antenna
US9165239B2 (en) 2006-04-26 2015-10-20 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US8081119B2 (en) 2006-04-26 2011-12-20 Murata Manufacturing Co., Ltd. Product including power supply circuit board
US9064198B2 (en) 2006-04-26 2015-06-23 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US8228252B2 (en) 2006-05-26 2012-07-24 Murata Manufacturing Co., Ltd. Data coupler
US8544754B2 (en) 2006-06-01 2013-10-01 Murata Manufacturing Co., Ltd. Wireless IC device and wireless IC device composite component
US7932730B2 (en) 2006-06-12 2011-04-26 Murata Manufacturing Co., Ltd. System for inspecting electromagnetic coupling modules and radio IC devices and method for manufacturing electromagnetic coupling modules and radio IC devices using the system
US8081541B2 (en) 2006-06-30 2011-12-20 Murata Manufacturing Co., Ltd. Optical disc
US8228765B2 (en) 2006-06-30 2012-07-24 Murata Manufacturing Co., Ltd. Optical disc
US8081125B2 (en) 2006-07-11 2011-12-20 Murata Manufacturing Co., Ltd. Antenna and radio IC device
US8228075B2 (en) 2006-08-24 2012-07-24 Murata Manufacturing Co., Ltd. Test system for radio frequency IC devices and method of manufacturing radio frequency IC devices using the same
US8299929B2 (en) 2006-09-26 2012-10-30 Murata Manufacturing Co., Ltd. Inductively coupled module and item with inductively coupled module
US8081121B2 (en) 2006-10-27 2011-12-20 Murata Manufacturing Co., Ltd. Article having electromagnetic coupling module attached thereto
US8031124B2 (en) 2007-01-26 2011-10-04 Murata Manufacturing Co., Ltd. Container with electromagnetic coupling module
US8299968B2 (en) 2007-02-06 2012-10-30 Murata Manufacturing Co., Ltd. Packaging material with electromagnetic coupling module
JP2008226099A (en) * 2007-03-15 2008-09-25 Dainippon Printing Co Ltd Noncontact data carrier device
US8390459B2 (en) 2007-04-06 2013-03-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8009101B2 (en) 2007-04-06 2011-08-30 Murata Manufacturing Co., Ltd. Wireless IC device
US8360324B2 (en) 2007-04-09 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device
US8424762B2 (en) 2007-04-14 2013-04-23 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8531346B2 (en) 2007-04-26 2013-09-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8474725B2 (en) 2007-04-27 2013-07-02 Murata Manufacturing Co., Ltd. Wireless IC device
US8632014B2 (en) 2007-04-27 2014-01-21 Murata Manufacturing Co., Ltd. Wireless IC device
US7931206B2 (en) 2007-05-10 2011-04-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8757500B2 (en) 2007-05-11 2014-06-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8264357B2 (en) 2007-06-27 2012-09-11 Murata Manufacturing Co., Ltd. Wireless IC device
US8662403B2 (en) 2007-07-04 2014-03-04 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US7762472B2 (en) 2007-07-04 2010-07-27 Murata Manufacturing Co., Ltd Wireless IC device
US8235299B2 (en) 2007-07-04 2012-08-07 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8552870B2 (en) 2007-07-09 2013-10-08 Murata Manufacturing Co., Ltd. Wireless IC device
US8193939B2 (en) 2007-07-09 2012-06-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8191791B2 (en) 2007-07-17 2012-06-05 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US7997501B2 (en) 2007-07-17 2011-08-16 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US8413907B2 (en) 2007-07-17 2013-04-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US9460376B2 (en) 2007-07-18 2016-10-04 Murata Manufacturing Co., Ltd. Radio IC device
US9830552B2 (en) 2007-07-18 2017-11-28 Murata Manufacturing Co., Ltd. Radio IC device
US7857230B2 (en) 2007-07-18 2010-12-28 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US8400307B2 (en) 2007-07-18 2013-03-19 Murata Manufacturing Co., Ltd. Radio frequency IC device and electronic apparatus
US7830311B2 (en) 2007-07-18 2010-11-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic device
US8610636B2 (en) 2007-12-20 2013-12-17 Murata Manufacturing Co., Ltd. Radio frequency IC device
US7990337B2 (en) 2007-12-20 2011-08-02 Murata Manufacturing Co., Ltd. Radio frequency IC device
US8070070B2 (en) 2007-12-26 2011-12-06 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8360330B2 (en) 2007-12-26 2013-01-29 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8915448B2 (en) 2007-12-26 2014-12-23 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8179329B2 (en) 2008-03-03 2012-05-15 Murata Manufacturing Co., Ltd. Composite antenna
US8797148B2 (en) 2008-03-03 2014-08-05 Murata Manufacturing Co., Ltd. Radio frequency IC device and radio communication system
US8668151B2 (en) 2008-03-26 2014-03-11 Murata Manufacturing Co., Ltd. Wireless IC device
US8360325B2 (en) 2008-04-14 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device, electronic apparatus, and method for adjusting resonant frequency of wireless IC device
US8960557B2 (en) 2008-05-21 2015-02-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8973841B2 (en) 2008-05-21 2015-03-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8590797B2 (en) 2008-05-21 2013-11-26 Murata Manufacturing Co., Ltd. Wireless IC device
US9022295B2 (en) 2008-05-21 2015-05-05 Murata Manufacturing Co., Ltd. Wireless IC device
US7967216B2 (en) 2008-05-22 2011-06-28 Murata Manufacturing Co., Ltd. Wireless IC device
US8047445B2 (en) 2008-05-22 2011-11-01 Murata Manufacturing Co., Ltd. Wireless IC device and method of manufacturing the same
US9281873B2 (en) 2008-05-26 2016-03-08 Murata Manufacturing Co., Ltd. Wireless IC device system and method of determining authenticity of wireless IC device
US8596545B2 (en) 2008-05-28 2013-12-03 Murata Manufacturing Co., Ltd. Component of wireless IC device and wireless IC device
US8011589B2 (en) 2008-06-25 2011-09-06 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US7871008B2 (en) 2008-06-25 2011-01-18 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US9077067B2 (en) 2008-07-04 2015-07-07 Murata Manufacturing Co., Ltd. Radio IC device
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US9231305B2 (en) 2008-10-24 2016-01-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8177138B2 (en) 2008-10-29 2012-05-15 Murata Manufacturing Co., Ltd. Radio IC device
US8692718B2 (en) 2008-11-17 2014-04-08 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8917211B2 (en) 2008-11-17 2014-12-23 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8342416B2 (en) 2009-01-09 2013-01-01 Murata Manufacturing Co., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8544759B2 (en) 2009-01-09 2013-10-01 Murata Manufacturing., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8583043B2 (en) 2009-01-16 2013-11-12 Murata Manufacturing Co., Ltd. High-frequency device and wireless IC device
US9104950B2 (en) 2009-01-30 2015-08-11 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8876010B2 (en) 2009-04-14 2014-11-04 Murata Manufacturing Co., Ltd Wireless IC device component and wireless IC device
US8690070B2 (en) 2009-04-14 2014-04-08 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8418928B2 (en) 2009-04-14 2013-04-16 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US9564678B2 (en) 2009-04-21 2017-02-07 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US9203157B2 (en) 2009-04-21 2015-12-01 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8381997B2 (en) 2009-06-03 2013-02-26 Murata Manufacturing Co., Ltd. Radio frequency IC device and method of manufacturing the same
US8810456B2 (en) 2009-06-19 2014-08-19 Murata Manufacturing Co., Ltd. Wireless IC device and coupling method for power feeding circuit and radiation plate
US8847831B2 (en) 2009-07-03 2014-09-30 Murata Manufacturing Co., Ltd. Antenna and antenna module
US8680971B2 (en) 2009-09-28 2014-03-25 Murata Manufacturing Co., Ltd. Wireless IC device and method of detecting environmental state using the device
US8853549B2 (en) 2009-09-30 2014-10-07 Murata Manufacturing Co., Ltd. Circuit substrate and method of manufacturing same
US9117157B2 (en) 2009-10-02 2015-08-25 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US8994605B2 (en) 2009-10-02 2015-03-31 Murata Manufacturing Co., Ltd. Wireless IC device and electromagnetic coupling module
US9444143B2 (en) 2009-10-16 2016-09-13 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US9460320B2 (en) 2009-10-27 2016-10-04 Murata Manufacturing Co., Ltd. Transceiver and radio frequency identification tag reader
US9178279B2 (en) 2009-11-04 2015-11-03 Murata Manufacturing Co., Ltd. Wireless IC tag, reader-writer, and information processing system
US9024725B2 (en) 2009-11-04 2015-05-05 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9461363B2 (en) 2009-11-04 2016-10-04 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US8400365B2 (en) 2009-11-20 2013-03-19 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8704716B2 (en) 2009-11-20 2014-04-22 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8718727B2 (en) 2009-12-24 2014-05-06 Murata Manufacturing Co., Ltd. Antenna having structure for multi-angled reception and mobile terminal including the antenna
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device
US8602310B2 (en) 2010-03-03 2013-12-10 Murata Manufacturing Co., Ltd. Radio communication device and radio communication terminal
US8528829B2 (en) 2010-03-12 2013-09-10 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
US9123996B2 (en) 2010-05-14 2015-09-01 Murata Manufacturing Co., Ltd. Wireless IC device
US8905316B2 (en) 2010-05-14 2014-12-09 Murata Manufacturing Co., Ltd. Wireless IC device
US8424769B2 (en) 2010-07-08 2013-04-23 Murata Manufacturing Co., Ltd. Antenna and RFID device
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US8981906B2 (en) 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
JP2012049714A (en) * 2010-08-25 2012-03-08 Nec Tokin Corp Antenna module
US8546927B2 (en) 2010-09-03 2013-10-01 Murata Manufacturing Co., Ltd. RFIC chip mounting structure
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US9166291B2 (en) 2010-10-12 2015-10-20 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US8960561B2 (en) 2011-02-28 2015-02-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8757502B2 (en) 2011-02-28 2014-06-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8797225B2 (en) 2011-03-08 2014-08-05 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8740093B2 (en) 2011-04-13 2014-06-03 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8770489B2 (en) 2011-07-15 2014-07-08 Murata Manufacturing Co., Ltd. Radio communication device
US8814056B2 (en) 2011-07-19 2014-08-26 Murata Manufacturing Co., Ltd. Antenna device, RFID tag, and communication terminal apparatus
US9543642B2 (en) 2011-09-09 2017-01-10 Murata Manufacturing Co., Ltd. Antenna device and wireless device
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8720789B2 (en) 2012-01-30 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device
US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
JP2013247436A (en) * 2012-05-24 2013-12-09 Murata Mfg Co Ltd Coil antenna and communication terminal device

Also Published As

Publication number Publication date Type
JP4034676B2 (en) 2008-01-16 grant

Similar Documents

Publication Publication Date Title
US6719206B1 (en) Data transaction card and method of manufacture thereof
US6367143B1 (en) Coil element and method for manufacturing thereof
US20110253795A1 (en) Wireless ic device, wireless ic module and method of manufacturing wireless ic module
US6268796B1 (en) Radio frequency identification transponder having integrated antenna
US20060158380A1 (en) Antenna using inductively coupled feeding method, RFID tag using the same and antenna impedence matching method thereof
US6378774B1 (en) IC module and smart card
US5999409A (en) Contactless IC card
US8474726B2 (en) RFID antenna modules and increasing coupling
JP2007096768A (en) Antenna unit and non-contact ic tag
JP2008072243A (en) Wireless ic device
JP2009027291A (en) Wireless ic device
JP2008197714A (en) Non-contact data carrier device, and auxiliary antenna for non-contact data carrier
US6974909B2 (en) IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC module
JP2004151968A (en) Noncontact data transmitter/receiver
JP2001168628A (en) Auxiliary antenna for ic card
JPH1069533A (en) Non-contact ic card
US20120176282A1 (en) Antenna device and mobile communication terminal
US20140014732A1 (en) Coupling in and to rfid smart cards
JP2008211572A (en) Contactless data carrier device, and booster antenna substrate
JP2004127230A (en) Semiconductor device, method of manufacturing semiconductor device, method for electronic commerce and transponder reader
JPH11149536A (en) Composite ic card
US8991712B2 (en) Coupling in and to RFID smart cards
JPH11149538A (en) Composite ic module and composite ic card
JP2005352858A (en) Communication type recording medium
JPH11149537A (en) Composite ic card and composite ic module

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050620

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070619

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070810

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20071016

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20071025

R150 Certificate of patent (=grant) or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101102

Year of fee payment: 3

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101102

Year of fee payment: 3

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101102

Year of fee payment: 3

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111102

Year of fee payment: 4

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111102

Year of fee payment: 4

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121102

Year of fee payment: 5

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121102

Year of fee payment: 5

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121102

Year of fee payment: 5

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131102

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees