TW456588U - Light emitting diode display unit - Google Patents

Light emitting diode display unit

Info

Publication number
TW456588U
TW456588U TW89217885U TW89217885U TW456588U TW 456588 U TW456588 U TW 456588U TW 89217885 U TW89217885 U TW 89217885U TW 89217885 U TW89217885 U TW 89217885U TW 456588 U TW456588 U TW 456588U
Authority
TW
Taiwan
Prior art keywords
light emitting
display unit
emitting diode
diode display
light
Prior art date
Application number
TW89217885U
Other languages
English (en)
Inventor
Shingo Kawakami
Junichi Mizutani
Hideki Mori
Original Assignee
Koha Co Ltd
Toyoda Gose Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koha Co Ltd, Toyoda Gose Co Ltd filed Critical Koha Co Ltd
Publication of TW456588U publication Critical patent/TW456588U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
    • H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Devices (AREA)
TW89217885U 1997-05-19 1998-05-19 Light emitting diode display unit TW456588U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12853197A JPH10319871A (ja) 1997-05-19 1997-05-19 Ｌｅｄディスプレイ装置

Publications (1)

Publication Number Publication Date
TW456588U true TW456588U (en) 2001-09-21

Family

ID=14987062

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89217885U TW456588U (en) 1997-05-19 1998-05-19 Light emitting diode display unit

Country Status (4)

Country Link
US (2) US6236382B1 (zh)
JP (1) JPH10319871A (zh)
KR (1) KR100277269B1 (zh)
TW (1) TW456588U (zh)

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DE10016817A1 (de) * 2000-04-05 2001-10-18 Mannesmann Vdo Ag Farb-Head-up Display, insbesondere für ein Fahrzeug
US7292209B2 (en) * 2000-08-07 2007-11-06 Rastar Corporation System and method of driving an array of optical elements
JP3801931B2 (ja) * 2002-03-05 2006-07-26 ローム株式会社 Ｌｅｄチップを使用した発光装置の構造及び製造方法
JP3896027B2 (ja) 2002-04-17 2007-03-22 シャープ株式会社 窒化物系半導体発光素子およびその製造方法
TW575828B (en) * 2002-05-07 2004-02-11 Giga Byte Tech Co Ltd Method for directly displaying signal intensity and the device thereof
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TWI282022B (en) * 2003-03-31 2007-06-01 Sharp Kk Surface lighting device and liquid crystal display device using the same
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US20050116635A1 (en) * 2003-12-02 2005-06-02 Walson James E. Multiple LED source and method for assembling same
US7250611B2 (en) * 2003-12-02 2007-07-31 3M Innovative Properties Company LED curing apparatus and method
US7329887B2 (en) * 2003-12-02 2008-02-12 3M Innovative Properties Company Solid state light device
US7456805B2 (en) 2003-12-18 2008-11-25 3M Innovative Properties Company Display including a solid state light device and method using same
US8174036B2 (en) * 2003-12-30 2012-05-08 Osram Opto Semiconductors Gmbh Lighting device
JP4504056B2 (ja) * 2004-03-22 2010-07-14 スタンレー電気株式会社 半導体発光装置の製造方法
US6988899B2 (en) * 2004-04-19 2006-01-24 General Electric Company Electronic assembly, and apparatus and method for the assembly thereof
JP4060841B2 (ja) * 2004-10-06 2008-03-12 住友ゴム工業株式会社 生タイヤビード部成型方法、及びそれに用いる生タイヤビード部成型装置
US9929326B2 (en) 2004-10-29 2018-03-27 Ledengin, Inc. LED package having mushroom-shaped lens with volume diffuser
US8816369B2 (en) 2004-10-29 2014-08-26 Led Engin, Inc. LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices
KR101112542B1 (ko) * 2004-11-03 2012-02-15 삼성전자주식회사 발광다이오드와 그 렌즈
TWI274214B (en) 2005-04-19 2007-02-21 Young Lighting Technology Inc Multi-chip light emitting diode illumination apparatus
KR101113236B1 (ko) * 2005-04-26 2012-02-20 삼성전자주식회사 다이나믹한 영상을 위한 백라이트 유닛 및 이를 채용한디스플레이 장치
US7479660B2 (en) 2005-10-21 2009-01-20 Perkinelmer Elcos Gmbh Multichip on-board LED illumination device
JP4724618B2 (ja) 2005-11-11 2011-07-13 株式会社 日立ディスプレイズ 照明装置及びそれを用いた液晶表示装置
KR100828891B1 (ko) * 2006-02-23 2008-05-09 엘지이노텍 주식회사 Ｌｅｄ 패키지
TWI303494B (en) * 2006-04-26 2008-11-21 Everlight Electronics Co Ltd Surface mounting optoelectronic device
US7883238B2 (en) * 2006-06-16 2011-02-08 Koninklijke Philips Electronics N.V. Light collimation and mixing of remote light sources
DE102006062066A1 (de) * 2006-12-29 2008-07-03 Osram Opto Semiconductors Gmbh Linsenanordnung und LED-Anzeigevorrichtung
CN201066688Y (zh) * 2007-05-11 2008-05-28 群康科技(深圳)有限公司 发光二极管及背光模组
CN101325193B (zh) * 2007-06-13 2010-06-09 先进开发光电股份有限公司 发光二极管封装体
US7748148B2 (en) * 2007-08-27 2010-07-06 E-Llumineering Llc Display sign adapted to be backlit by widely spaced light emitting diodes
US7991226B2 (en) * 2007-10-12 2011-08-02 Pictometry International Corporation System and process for color-balancing a series of oblique images
KR100992778B1 (ko) * 2008-05-23 2010-11-05 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
TWI392125B (zh) * 2009-02-18 2013-04-01 Everlight Electronics Co Ltd 發光裝置
US8772802B2 (en) * 2009-02-18 2014-07-08 Everlight Electronics Co., Ltd. Light emitting device with transparent plate
US8405105B2 (en) * 2009-02-18 2013-03-26 Everlight Electronics Co., Ltd. Light emitting device
JP2012109475A (ja) 2010-11-19 2012-06-07 Rohm Co Ltd 発光装置、発光装置の製造方法、および光学装置
KR101208703B1 (ko) * 2011-02-21 2012-12-06 한국건설기술연구원 전광판용 광학렌즈 및 이를 이용한 ｌｅｄ 전광판
US8957440B2 (en) * 2011-10-04 2015-02-17 Cree, Inc. Light emitting devices with low packaging factor
CN108333856B (zh) * 2017-01-19 2023-07-07 奥比中光科技集团股份有限公司 光学投影装置及应用其的深度相机

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Also Published As

Publication number Publication date
US20010001241A1 (en) 2001-05-17
KR100277269B1 (ko) 2001-01-15
US6236382B1 (en) 2001-05-22
US6496162B2 (en) 2002-12-17
KR19980087151A (ko) 1998-12-05
JPH10319871A (ja) 1998-12-04

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004