TW452527B - Apparatus for moving a workpiece - Google Patents

Abstract

An improved fluid track for transporting a workpiece is disclosed. The fluid track includes a base having apertures formed therein and rails to guide the workpiece to a desired location. The track is designed such that flows through the apertures suspends the workpiece above the base of the track. The workpiece is urged in a desired or predetermined direction by applying a fluid (e.g., through a nozzle) to a surface of the workpiece.

Description

452527 t

V. Description of the Invention (1) Invention 4 The present invention relates generally to a workpiece moving device. More dare to say, the Ming is about a way of using fluid to suspend and guide the two positions of the workpiece to the background of the invention. The flow boat or water rail can be used for various purposes, and various workpieces can be sent from one position to another. For example, Semiconductor wafer polishing machines (such as chemical mechanical polishing CMP machines) can use water to carry wafers from the processing station to another station in the tool, or between the processing stations of the same tool. A typical CMP machine includes at least one pepper light station ' and a loading and unloading station. The CMP machine may also include additional post-polishing stations, such as wafer cleaning, rinsing, and drying. ^ The water rail on the CMP machine is typically used to transport wafers from the reserve position or index lift near the post-polishing lift to the subsequent process lift. In particular, water can be used to rotate wafers to retreat light washing and rinsing stations. Using water rails to transport wafers is beneficial because the wafers can be kept wet during transport. It is beneficial to keep the wafer wet during the rotation to the post-polishing process, as it prevents residual shoulders, such as the slurry used in the polishing process, or other particles from sticking to the surface when the wafer surface is dry. In other words, the track allows the wafer to be moisturized until the wafer is exposed to the cleaning and rinsing process' to remove debris from the wafer surface. In addition, water can be used to replace robots or other robots' to send wafers from one place to another. Reduced Machine Handling Wafers' have a reduced tendency to damage or crack wafers due to mechanical transport. As will be described in detail later, the water rail of the case technology requires solid water (for example, about 21 liters per minute at a surface area of about 2900 cm2, or about 0.007

Page 4 4525 27 V. Description of the invention (2) l / cm2 / min), in order to keep the crystal garden floating and moving downstream. Water rails often require an upper limit on water pressure, and equipment must be provided to enable the rails to achieve the desired results. 'Internal and external fluctuations in the equipment water supply system may cause confusion in the equipment water supply, which will have a fatal impact on the performance of the water rail.' Furthermore, the consumption of the rails The amount of water affects the operation cost of the track, which affects the cost of wafer processing. That is, the track consumes more water. The wafer is more expensive. Therefore, it is better to improve the water rail to move the wafer over a predetermined surface area, and the water demand is less than about 0.0 07 l / cm2 / mine. A typical water rail includes a channel or a pipe, and has a base and a side that constitute the water storage; from the base An upwardly extending rail guides the wafer along the rail: and water supply devices such as through holes formed in the base supply water to the rail. The through hole supplies a flowing water flow in the pipe, so that the wafer moves in the direction of the water flow. . Although ′, the basic structure is irregular, and it can maintain the space between the concave part and each of the guide crystals. Attach wafers with various sizes. Crystal bleaching and / or convex front technology rounds are generally provided with rails along the rails for crystal inch rails and / or convex parts with recesses and fruits inside, which improve the watercraft track at the bottom of the channel. Code mobile. Rails are easier to support than water rails that pass through the rails, but are solid. For example, the distance between the part and the convex part is extended along the length of the track to help keep the wafer floating, and it exists along the channel, or the convex part exists, which requires extra water or other fluids in the pipeline. Above the area. Therefore, there is a need to reduce rails. The plastic includes two oppositely arranged rails to be fixedly attached to the base of the pipe, and the wafer processed by the rails has a slightly larger diameter. Although it contains manufacturing, and when the wafer is moving along the rail, it is inconvenient to use a single rail to transport the fixed rails. The fixed rails cannot be used to handle large wafers. * The distance between the rails is relatively small.

Page 5 452527 Description of the invention (3) When the diameter of the circle is too large, the wafer encounters the rails during transportation, which will increase the rail loss. In addition, if the distance between the opposite rails is much larger than necessary, the rails are unnecessarily expensive and occupy more space than necessary. Therefore, improved water rails for wafers of various sizes are urgently needed. The through-holes formed in the base are generally drilled through the base at an angle other than 90 * relative to the plane of the base. Β-through-holes are often formed so that the water moves partly in the upward direction and the part moves according to the needs of the wafer. Flow out of the through hole. The outflow water is directed upward and along the desired movement direction of the wafer. The water sprayer provides the water flow in the pipe in a predetermined direction; the outflow water provides support in the upward direction so that the wafer does not sink in the fluid flow (semiconductor wafer) Generally do not float in water) »It is difficult to form through holes in the base that are not perpendicular to the surface. In addition, the base of a typical water rail (between the rails) contains about 06 to 0.9 3¾¾, providing sufficient water movement in the pipe. The formed through holes increase the manufacturing costs associated with the track. Therefore, there is a great need for improved water rails with water supply devices that are easier and cheaper to manufacture. In addition to the through holes formed by the substrate, a side sprayer can be used to assist the wafer in the desired direction. The side water sprayer is typically installed on the channel, so that the water from the water sprayer will touch the edge of the wafer, and the water is generally guided toward the wafer according to the desired movement direction of the wafer. Although side sprayers are effective at moving wafers in the desired direction or forcing them to move, sprayers are less effective. This is partly due to the poor performance of the side sprayers, as the cross-sectional area of the wafer withstanding water is small (wafer thickness is usually less than about 1 mm). As a result, most of the water leading to the edge of the wafer is either deflected up or down, or the water completely falls off the edge of the wafer. Therefore, there is an urgent need for more effective mechanisms to force wafers to improve water rails in the desired direction.

^ 52527 5. Description of the invention (4) Summary of the invention The present invention provides an improved device 'for the workpiece to move in the desired direction. In particular, the present invention provides improved fluid handling, so that less fluid is in the water rail to move the workpiece. The present invention addresses the shortcomings of water or fluid rails known today, and is detailed below. However, in general, the channel formed by the fluid rail package is improved, and the guide provided at the base is improved. The base part contains the pass = so that the fluid is drained into the channel in the direction of the workpiece, so that the workpiece is suspended above the part "... According to the etiquette of the present invention, the flow path contains a substantially flat twisted base" According to another important point of this specific example, the base The & of the included via is perpendicular to the flat surface. According to another gist of this specific example, the surface area of each bottom of the base contains about 6 through holes "According to another specific example of the present invention," the fluid track contains a water jet bow 丨 to the top surface of the workpiece "and pushes the crystal along the desired movement direction of the workpiece The circular press moves. According to a further specific example of the present invention, the fluid channel constitutes a wafer of various sizes. According to this specific example, the distance between opposing guides is a knot. MA-Sj nm The present invention can be changed by referring to the detailed description of the drawings and the scope of patent application. The drawings refer to similar elements on the same plate, wherein FIG. 1 is a perspective view of a chemical mechanical polishing device of the present invention; FIG. 2 The section of the chemical mechanical polishing device shown in 苐 1 或 or its solution is based on the conventional solution, including the base. The line of the base surface of the trajectory is essentially according to the workpiece, and the water required can be completely adjusted.

Page 7 452527 · V. Description of the invention (5) '~ There are three flow ship orbits; No. 3 is a top view of an example of a flow ship orbit according to the present invention; No. 4 is a top view of a modification example of the fluid orbit of the present invention; Top view of another specific example of the fluid track of the present invention; FIG. 6 is a perspective view of the fluid track of the present invention having a washing station and an attached cantilever assembly; FIG. 7 is a top plan circle of the shower head of the present invention. Detailed description of preferred specific examples The present invention generally relates to a workpiece conveying device, particularly a flow track, which is configured to move a workpiece in a desired direction. Although the present invention can be used to convey various workpieces between various mathematical biting devices, the following description of the present invention, for the sake of convenience, will be described by taking the semiconductor wafer transport between various post-chemical mechanical polishing cleaning and rinsing processes as examples. Figures 1 and 2 show a chemical-mechanical polishing machine 100, which includes a plurality of fluid tracks 200, 210, and 220, which are contemplated by the present invention. The polishing machine 100 suitably includes a wafer loading and unloading station 110; a polishing module 120 containing an index station 230 and a polishing station 240 having a polishing surface 250; and a cleaning station 130 containing a track 200, 2 1 0, 220. The polisher 100 is typically used to remove the required amount of material from one or more sides of the wafer 260. The polishing machine 100 is configured as follows to remove the dry wafer 260 from the cassette 270. The wafer 260 is polished, cleaned, rinsed, and dried, and the wafer 260 is sent to the loading and unloading station 110. Back to the cassette 270. In operation, one or more wafers 260 are loaded on the polishing machine WO at the station UI0. The wafer 260 is transferred to the indexing station 230 using the robot 280. In cable

Page 8 45252 ^ t V. Description of the invention (6) The pick-up station 230, the wafer 260 is loaded (for example, the loading cup of the slave station 230) in the polishing carrier 290, and transferred to the polishing station 240 for processing. Removal of this polishing from the surface by moving the surface of the wafer 260 relative to the polishing surface 250 often occurs in deionized water, a slurry composition, or a combination thereof. After the wafer 260 is polished ', it is returned to the index station 230 (e.g., a discharge cup to the station 230). The wafer 260 is moved from the indexing station 230 to the cleaning station 130 using the tapper 300. The cleaning station 130 includes, for example, a first flow track 200 ′, a first flushing station 210, a second fluid track 210, a second flushing station 320, a third fluid track 22 0, a washing station 330, and a dryer 340. The first fluid track 200 receives the wafer 260 'from the tapper 300 and forces the wafer 260 into the first processing station 310. Similarly, the second fluid track 210 receives the wafer 260 from the washing station 310, and forces the wafer 260 into the second washing station 320. The third fluid channel 220 appropriately constitutes the forcing wafer 260 to the washing station 330. After the wafer 260 is rinsed, the robot 280 transfers the wafer 260 into the dryer 340. The robot 280 then moves the wafer 260 from the dryer 340 to the cassette 270 of the loading and unloading station 1.10 »According to the invention, the fluid track 2 0, 2 1 0, 2 2 0 constitutes the wafer 2 6 0 is moved from one place to another by suspending the wafer 260 in a fluid, applying fluid pressure to the wafer 260, and forcing the wafer 260 to a predetermined or desired direction. Wafer 2600 suspension is to provide a fluid film to the bottom surface of wafer 2600 to keep wafer 2600 above the bottom surface of the track. As detailed later, the track 200, 210, 220 cases use less fluid. It is easier and cheaper to manufacture, can move wafers of various sizes, and allows the wafers to move in multiple directions (such as forward, backward, or rotation) within the track. The shape of the special fluid track varies depending on the application. However, generally

t 4525 2 7 V. Description of the invention (Ό In terms of 'the fluid track of the present invention includes a base, a through hole is formed therein, and water flows upward from the base to the wafer', and there are guides to manipulate the workpiece to the desired destination. Round 3 Shows the top view circle of the track 200. The track 200 includes a base 350, forming a through hole 360, and has rails 370, 372, 374 to assist the wafer 260 to move in a desired direction, such as the direction shown by arrow A. The track 200 also contains flow雒 Initiating or advancing mechanisms, such as nozzle 38, force the wafer to move in the desired direction. Similarly, as shown in Figure 4-6, the tracks 210 and 220 moderately include the base 40 0, 500, the through holes 410, 5i0, Rails 42 0-430, 520-530, and nozzles 44 0, 5 40 ° Although the fluid track of the present invention can be constructed in various ways, for example, forming 200 fluid tracks as shown in FIG. 3, for simplicity, the following is the track 220 Detailed description of the fluid track of the present invention is shown in Figures 5 and 6. The base 500 of the track 220 is formed of any material compatible with the fluid used in the suspended wafer 260; the material is also preferably used in wafer 26 polishing. The chemical agent is compatible with the "base 500 can be coated with polishing wafer 260 Suspension and / or chemically compatible materials. According to a preferred embodiment of the present invention, the base 500 is formed of a polymer material such as polyethylene terephthalate (pet). The base 500 is adapted to include a substantially flat surface 550, crystal sleep 260 can pass on it. More specifically, the 'base 500' should not contain any substantially convex or concave portions on the surface 550. The flat surface 550 is more than a base with substantially convex or concave portions. In the track, less fluid is needed to suspend and transport the wafer 26. According to the specific example of the present invention, the width of the base 500 (as shown by the arrow ff) is longer than the longest dimension (for example, the diameter) of the wafer 260 is Wide. This moves the wafer 260 closer to the surface 550. The base 500 also contains a fluid supply device, such as a through hole 51, to supply

Page 10 452527 V. Description of the invention (8) Colonization to track 220 »Generally speaking, the fluid is supplied to the track 220 through the through hole 510, so that the wafer 260 is suspended above the surface 550. However, the flow rate of the current supplied to the track 220 is preferably not sufficient to generate a flow to move the wafer 260 *. Instead, the fluid from the through hole 510 is manipulated to suspend the wafer 2 60 above the surface 550, so that the wafer 260 can Move in the desired direction. For example, the thin film of water can provide sufficient suspension to keep the wafer 260 above the surface 550. According to a specific example of the present invention, the track 220 is supplied through the through hole 510 to about 4 liters per minute (or 0.15 cm / min) per 26000 cm2 to maintain the crystal. Circle 260 is suspended. Although the size and number of the through holes depend on the specific track shape, according to a preferred embodiment of the present invention, the diameter of the through holes 510 is about 0.08 to about 0.1 2 mm, and preferably about 0.10 mra. Furthermore, the 'base portion 500 contains about 4 to about 8 through holes per wafer surface area, preferably about 6 holes. For example, the track 220 constituting a wafer having a diameter of 200 mm is about 6 per (7Γ * r2). Through holes, or 1.91 wood per square millimeter. According to a specific example of the present invention, guides such as rails 520, 530 are attached to the base portion 500. The guide is generally configured to contain a fluid on the surface 550 to prevent the fluid from splashing on the edge of the base 500 (such as the edge 560 or 570), and the wafer 260 can be guided and accommodated when the wafer 260 passes through the surface 550. Any suitable mechanism for attaching the rails 520, 530 to the base 500 may be used in accordance with the present invention, such as a mechanical or chemical attachment mechanism. In addition, the rails 52 0 and 530 may be integrated with the base 500. However, according to a preferred embodiment of the present invention, the rails 52, 530 are made of mechanical yak, that is, nuts and bolts attached to the base 500. »According to another embodiment of the present invention, the rails 520, 5 30 and / Or the base 500 includes a long hole 'for bolt insertion' to adjust the interval between the opposite rails 520, 530,

Page 11 452527 5. Description of the invention (9) Cooperate with wafers of various sizes. The spacing between the opposing rails depends on the size and type of the base 500 through which the workpiece passes. In general, the spacing is chosen so that wafer .260 can move across surface 500 without undue damage to rails 520, 530. For example, if the diameter of the wafer 260 is about 150 mm ', the distance between the rails 520 and 530 is about 165 mm. In addition, if the wafer 260 is about 200 mm in diameter, the interval between the opposing rails 520 and 530 is preferably 220 mm. The nozzle 540 shown in Figs. 5-6 is configured to apply a force to the wafer 260 according to a desired movement direction of the wafer 260, so as to force the wafer 260 to a predetermined direction. Using the fluid from the through hole 510 to suspend the wafer 260 above the surface 550, the nozzle 540 can be used to guide the wafer in any desired direction. To improve the efficiency of the force of the nozzle 540, the effluent from the nozzle 540 does not lead to the edge of the wafer 26. According to a preferred embodiment of the present invention, the effluent from the nozzle 540 is guided to the top surface of the wafer 26 according to the desired movement direction of the wafer 'so that the effluent flows away from the nozzle 54 at an angle of about 5 degrees below the horizontal. In addition, the nozzle 540 should constitute a leading edge that sprays fluid on the surface of the wafer 26, and the nozzle 540 should continue to spray the stream on the surface until the wafer 26 passes the fluid. Multiple nozzles may be provided above or below the periphery of the track 220 and / or the surface 550. In addition, when a porous nozzle such as the nozzle 600 shown in FIG. 6 is used to drive the wafer 260 in the desired direction β, fluid such as deionized water is introduced into the track 22 through the through hole 51 (). As mentioned above, the flow rate of the fluid causes the fluid to suspend the wafer 2600 above the surface 550. Once the fluid is present on the channel 22o, the fluid flowing through the through-hole 51o will stop 'or continue to flow at a flow sufficient to suspend the wafer 26o. Water is then applied to the wafer 260 through the nozzle 540 and / or the nozzle 600, forcing the wafer 260 to the desired position.

Mi ΙΗΗΙΗ Page 12 452527 1 V. Description of invention (ίο) or predetermined direction. In addition, the track 220 may be inclined in one direction or the other direction, forcing the wafer 260 to move in a desired direction. Because the present invention does not use the flowing water in the trench to force the wafer 260 to the desired direction, the amount of water used to transport the wafer 260 according to the present invention is less than the conventional water rail, and the rail 220 can be used to force the wafer 260 in many directions. For example, a plurality of nozzles 540 may be placed on the periphery of the track 220 so that the effluent from the nozzles 540 may point in different directions. Then, by opening or closing one or more nozzles, the movement direction of the wafer can be controlled. In a preferred embodiment of the present invention, the track 2 20 contains the overhead spraying assemblies 610 and 620. The overhead spraying assemblies 610, 620 are suitable for forming the deposition of deionized water or the like on the surface of the wafer 260. Because the track 220 has less fluid than the conventional track, a floating assembly 610,620 should be used to help the wafer 260 moisturize until the wafer 260 passes through the rinse station 330. As shown in Fig. 6, according to a specific example of the present invention, the rail 220 is attached to the washing station 330 or forms an integrated assembly. The shower station 330 preferably contains a shower head 700, see FIG. 7 for details. The shower head 700 is configured to rinse the wafer 260 before the wafer 260 is exposed to a dry environment. Although the shower head 700 can be formed in various shapes, according to a preferred embodiment of the present invention, the shower head 700 includes a substantially semi-circular portion 710. This portion 710 is adapted to include one or more through holes 720 formed therein, allowing fluid such as deionized water to flow through the through holes to the wafer 260. The through hole 720 is preferably configured so that the outflow of the through hole 720 touches the wafer 260 at an angle of 0 to 90 degrees with respect to the surface of the wafer 260, and preferably about 60 degrees. In addition, although the through-hole 720 may point in several different directions, according to the present invention, the through-hole 720 should preferably be directed so that the outflow of the through-hole 720 generally flows in the direction shown by arrow B. During the rinsing process, the wafer 260 moves to the rinsing station 330, allowing the fluid to flow through

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Claims (1)

452527 6. Application for patent Fangu 1. A flow track for moving a workpiece, including: a base, containing a plurality of through holes and a substantially flat surface, wherein the through holes are formed in the flat surface and constitute a supply fluid To the tunnel, by applying pressure to the bottom surface of the workpiece, the fluid suspends the workpiece above the base; a guide attached to the base, wherein the guide constitutes guiding the workpiece in a desired direction; and a workpiece advancing mechanism and the The guides are connected, and the mechanism constitutes a person who applies a flow boat to the surface of the workpiece and pushes the workpiece in a predetermined direction. 2. If the fluid track of item 1 of the patent application scope, wherein the bottom surface area of the workpiece has about 4 to about 8 through holes. 3. The fluid track of item 1 of the patent application, wherein the base is formed of polyethylene terephthalate. 4. The fluid track of item 1 of the patent application park, wherein the through hole is substantially cylindrical and has a diameter of about 0.1 mm. 5. The fluid track of item 1 in the scope of the patent application, wherein the propulsion mechanism includes a nozzle 'to distribute the fluid on the surface. 6. For example, the fluid track of the scope of the patent application also includes a suspended spraying assembly 'connected to a part of the track, wherein the spraying assembly constitutes a person applying a fluid to the top surface of the workpiece. 7. If the fluid track of item 1 of the patent application scope includes a washing station ′ connected to a part of the track, wherein the washing station constitutes a person who applies fluid to the top surface of the workpiece. 8. If the fluid track of item 7 of the patent application scope, the shower head contains the shower head. Page 16 452527 / VI. Patent application scope 9. If the fluid track of item 1 of the patent scope is requested, the width of the substantially wtan surface 'is at least equal to the longest dimension of the bottom surface of the workpiece. 10. A device for forcing a workpiece in a desired direction. The base includes a plurality of through holes that constitute a fluid that allows fluid to flow through the base to the bottom surface of the workpiece. The workpiece is suspended by the fluid above the surface of the base. The number of the through holes per bottom surface area of the workpiece is less than about 8; a rail attached to the base, wherein the rail constitutes a guide to move the workpiece in a desired direction; and a nozzle attached to the rail, wherein The nozzle constitutes a person who uses fluid to be discharged to the surface of the workpiece to assist the workpiece in moving in the desired direction. Π. The device according to item 10 of the patent application, wherein the fluid is deionized. 12. The device as claimed in claim 10, wherein the diameter of the through hole is 1 mm. 13. The device as claimed in claim 10, wherein the base is formed of polyethylene terephthalate. 14. If the device in the scope of patent application No. 10 includes a rinsing station, which is part of the device, the rinsing station constitutes a person who helps to remove debris from the surface of the workpiece. Except 15. The device according to item 14 of the patent application scope, wherein the shower head has 6 shower heads. Contains 16. The device according to item 10 of the patent application scope, further comprising an overhead sprinkler formation, wherein the assembly constitutes a person applying fluid to the workpiece. '' 17. The device according to item 10 of the scope of patent application, wherein the fluid is recorded per entry 45 25 27 VI. Patent application group '--- a flow rate of about 0.15cm. 18. The device according to item 10 of the patent application group, wherein the nozzle is configured to guide the flow to the top surface of the workpiece. 19. The device of claim 10, wherein the through hole is formed in a substantially flat surface of the base. 2〇.—A device for forcing a workpiece in a desired direction, including: ^ a base 'constituting a receiving workpiece', wherein the base includes a through hole, constituting a flow of 4 vessels onto the surface of the base: and an adjustable guide Piece 'attached to the base' The adjustable guide constitutes a piece that allows processing of workpieces of various sizes and guides the movement of the workpiece across a portion of the surface of the base β 21 The device, including the scope of patent application, includes the workpiece The “propulsion mechanism” constitutes a person who pushes the workpiece in a desired direction. 2 2. If the device in the scope of patent application for item 20 includes the nozzle attached to the device, where the nozzle constitutes a supply flow vessel and exerts force on the top surface of the workpiece "23. If the scope of patent application is in item 20 It also includes those in which the base portion includes a substantially flat surface. 24. A fluid track constituting a moving workpiece, comprising: a base portion having a flow boat membrane between the workpiece and the base portion, wherein the $ floats the workpiece above the base portion; and a workpiece pushing mechanism connected to the base portion, the mechanism It is constituted to apply fluid to the top surface of the workpiece and force the workpiece in a predetermined direction. 25. If the fluid track of item 24 of the patent application includes a guide, Article 18 苋 4 5 2 5 2 7 6. Scope of patent application To move the workpiece in the required direction. 26. The fluid track of claim 24, wherein the base includes a substantially flat surface, constituting a recipient. Page 19