WO2001012384A3 - Apparatus for moving a workpiece - Google Patents

Apparatus for moving a workpiece Download PDF

Info

Publication number
WO2001012384A3
WO2001012384A3 PCT/US2000/021489 US0021489W WO0112384A3 WO 2001012384 A3 WO2001012384 A3 WO 2001012384A3 US 0021489 W US0021489 W US 0021489W WO 0112384 A3 WO0112384 A3 WO 0112384A3
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
fluid
track
moving
base
Prior art date
Application number
PCT/US2000/021489
Other languages
French (fr)
Other versions
WO2001012384A2 (en
Inventor
Anco S Blazev
Wayne L Irwin
Mary A Reker
Original Assignee
Speedfam Ipec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Ipec Corp filed Critical Speedfam Ipec Corp
Publication of WO2001012384A2 publication Critical patent/WO2001012384A2/en
Publication of WO2001012384A3 publication Critical patent/WO2001012384A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Spray Control Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

An improved fluid track for transporting a workpiece is disclosed. The fluid track includes a base having apertures formed therein and rails to guide the workpiece to a desired location. The track is designed such that fluid that flows through the apertures suspends the workpiece above the base of the track. The workpiece is urged in a desired or predetermined direction by applying a fluid (e.g., through a nozzle) to a surface of the workpiece.
PCT/US2000/021489 1999-08-12 2000-08-07 Apparatus for moving a workpiece WO2001012384A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37288699A 1999-08-12 1999-08-12
US09/372,886 1999-08-12

Publications (2)

Publication Number Publication Date
WO2001012384A2 WO2001012384A2 (en) 2001-02-22
WO2001012384A3 true WO2001012384A3 (en) 2001-06-07

Family

ID=23470023

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/021489 WO2001012384A2 (en) 1999-08-12 2000-08-07 Apparatus for moving a workpiece

Country Status (2)

Country Link
TW (1) TW452527B (en)
WO (1) WO2001012384A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7416370B2 (en) * 2005-06-15 2008-08-26 Lam Research Corporation Method and apparatus for transporting a substrate using non-Newtonian fluid
US8480810B2 (en) 2005-12-30 2013-07-09 Lam Research Corporation Method and apparatus for particle removal
US8388762B2 (en) 2007-05-02 2013-03-05 Lam Research Corporation Substrate cleaning technique employing multi-phase solution

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3930684A (en) * 1971-06-22 1976-01-06 Lasch Jr Cecil A Automatic wafer feeding and pre-alignment apparatus and method
US4278366A (en) * 1977-03-18 1981-07-14 Gca Corporation Automatic wafer processing system and method
JPS5879733A (en) * 1981-11-06 1983-05-13 Hitachi Ltd Wafer transferring apparatus
US4624358A (en) * 1983-03-07 1986-11-25 Tokyo Shibaura Denki Kabushiki Kaisha Device for transferring lead frame
US4874273A (en) * 1987-03-16 1989-10-17 Hitachi, Ltd. Apparatus for holding and/or conveying articles by fluid
US5095661A (en) * 1988-06-20 1992-03-17 Westech Systems, Inc. Apparatus for transporting wafer to and from polishing head
FR2734631A1 (en) * 1995-05-23 1996-11-29 Nova Measuring Instr Ltd APPARATUS FOR OPTICALLY INSPECTING PLATES DURING POLISHING
WO1999013498A2 (en) * 1997-09-10 1999-03-18 Speedfam-Ipec Corporation Combined cmp and wafer cleaning apparatus and associated methods

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3930684A (en) * 1971-06-22 1976-01-06 Lasch Jr Cecil A Automatic wafer feeding and pre-alignment apparatus and method
US4278366A (en) * 1977-03-18 1981-07-14 Gca Corporation Automatic wafer processing system and method
JPS5879733A (en) * 1981-11-06 1983-05-13 Hitachi Ltd Wafer transferring apparatus
US4624358A (en) * 1983-03-07 1986-11-25 Tokyo Shibaura Denki Kabushiki Kaisha Device for transferring lead frame
US4874273A (en) * 1987-03-16 1989-10-17 Hitachi, Ltd. Apparatus for holding and/or conveying articles by fluid
US5095661A (en) * 1988-06-20 1992-03-17 Westech Systems, Inc. Apparatus for transporting wafer to and from polishing head
FR2734631A1 (en) * 1995-05-23 1996-11-29 Nova Measuring Instr Ltd APPARATUS FOR OPTICALLY INSPECTING PLATES DURING POLISHING
WO1999013498A2 (en) * 1997-09-10 1999-03-18 Speedfam-Ipec Corporation Combined cmp and wafer cleaning apparatus and associated methods

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 007, no. 174 (E - 190) 2 August 1983 (1983-08-02) *

Also Published As

Publication number Publication date
WO2001012384A2 (en) 2001-02-22
TW452527B (en) 2001-09-01

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