TW451609B - Flexibly combined slot of programmable multi-chip module - Google Patents

Abstract

The present invention provides a flexibly combined slot for connecting a plurality of dies to a programmable multi-chip module. The programmable multi-chip module includes a plurality of field programmable interconnect chips. The flexibly combined slot is connected to a solder pad of the programmable multi-chip module through at least one field programmable interconnect chip. The flexibly combined slot includes a plurality of first slot modules for being selectively installed with and connected to at least one die. The routing among the plurality of the dies and between the die and the solder pad is accomplished by burning the field programmable interconnect chip. Therefore, with the programmable multi-chip module constructed by the flexible combined slot, the user is provided with a general substrate that can be quickly constructed and easily debugged.

Description

A7 451609 --------- B7____ V. Description of the invention (/) The present invention relates to a flexible combination foot, especially to a programmable chip module or a high-density, multilayer printed circuit board. Elastic combination feet. With the popularity of portable systems and the increasing requirements of users for system operating speeds, low power, small size, and high operating speeds have become essential characteristics of many electronic products. In order to meet these characteristics, it has become a trend to make electronic products on Mu 1 ti-Chip Module (MCM) or high-density 'multilayer printed circuit boards (PCBs). However, because the multi-chip module or printed circuit board (MCM / PCB) process is similar to the VLSI process, it is not only burdensome and time-consuming, but also requires redesign and production of each new product. Dedicated substrate to complete different circuit designs. To solve the above problem, a Programmable MCM / PCB is proposed. The programmable MCM / PCB can be used to place and connect multiple dies or chips, and the connection between the multiple dies or chips is to program multiple on-site programmable chips on the MCM / PCB ( Field Programmable Interconnect Chip (FPIC). 4LAN / 199902TW 1 This paper size applies to Chinese National Standard (CKS) A- 丨 size (210 χ 297 mm) ------------- Installation -------- Order-- ------- line (I first read the notes on the back "% write this page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Employee Cooperatives 451609 A7 B7 V. Description of the invention (2)-A common scene is available Manufacturer of program-linked chips, such as Aptix * Ι-Cub. Please refer to FIG. 1, which illustrates a conventional programmable multi-chip module 10. The programmable module B includes a substrate 2 and a plurality of slots 14 are disposed on the substrate 12 for placing and connecting a plurality of bare crystals 6 to the substrate 12. A plurality of bonding pads 18 are provided on the periphery of the substrate 12 and are used as external connection points for the plurality of bare dies 16. A plurality of field-programmable connection chips 20 are disposed on the base plate 12 and are located around the corresponding feet 14 for connecting the feet 14 and the pads s. It allows each die 16 to be placed on a foot stand 14 in a wire-bounding manner. At the same time, a plurality of metal pads (not shown) are connected to the foot stand 14 and a plurality of The connection between the bare die 6 or the die 6 and the solder pad 18 is completed by programming a plurality of field programmable chips 20 in the field. Since it is known that each foot 14 of the private multi-chip module 10 can only place one die 16 ', the number of bare chips 1 that can be placed on the programmable multi-chip module 10 will be completely end-viewed. On the feet! Depending on the number of 4, the programmable multi-chip module 10 does not provide a flexible die placement method. In addition, the plurality of metal pins of each foot 14 have a limit on the number of feet when designing the foot (C ο nstraint). Therefore, when the programmable multi-chip module 10 is provided with a different size, connection When the number of pins of a plurality of bare dies is 6, the programmable multi-chip module 10 is known to have its application limitation. 4LAN / 199902TW 2 This paper is suitable for China's 0 standard (CNS) Al grid (210 X 297 mm) I ---- install --- < Please read the notes on the back first ^^-^- (This page). Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Α7

The summary explains that in order to improve the above problems, the present invention proposes an elastic combination foot that can be applied to a programmable multi-chip module or a printed circuit board. The elastic combination foot can easily and quickly change a plurality of The size and number of pins of the die or chip are combined with a programmable multi-chip module or a printed circuit board. The flexible combination foot socket includes a plurality of _foot socket modules. The plurality of first chat socket modules can be selectively placed and connected with at least one die or chip, and the programmable multi-chip module or The routing on a printed circuit board between a plurality of bare dies or wafers and between the die or the wafer and the outside world is completed by programmably connecting the wafers at the burning site. Therefore, the flexible combination feet of the present invention are used for construction. The programmable multi-chip module or printed circuit board can provide users with a universal substrate that can be quickly constructed and easily debugged.

• — — — ml — — — — — — — f I (please read the notes on the back ^-^-this page first) Line Logical Simple Description Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

This paper size applies the Chinese Standard (CNS) Al specification (210 χ 297 public copy A7) V. Description of the invention (< 4) Figure 6 is a schematic diagram of another embodiment of the flexible combination foot of the present invention Figure 7 is a bare crystal The first embodiment of the elastic combination foot seat shown in Figure 6 is a circle. Figure 8 is the second embodiment of the bare crystal seated on the elastic combination foot seat of FIG. Example schematic symbol description of circle type 30 32 34, 60 Possible: it-type multi-chip module substrate elastic combination foot socket 36, 37, 39, 41 bare 40 field programmable chip 42, 62 50 64 first foot socket Module pin 2nd socket module Detailed description of the invention printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Refer to Figure 1 in May. Figure 1 is a programmable multi-chip module 30 using the flexible combination of the socket M of the present invention. The present invention provides a spring-loaded combination base 3 4 for connecting a plurality of bare crystals 3 6 to a programmable multi-return > 1 module 30. The programmable multi-chip module 30 includes a substrate 32 , Fuhui flexible combination feet 34 'plurality And a plurality of pads 3S field connection box crystal 34 months plurality of elastic foot 40 ° based on a combination of the substrate 3 is provided:

4LAN / 199902TW 4 This paper size applies to Chinese National Standards (CNS > Al Specifications (2) 0 X 297 Public Meal > ------------- · I--tfl— Order ---- —II-- (Please read the "Notes on the back"-" -this page)

In the description of the invention, a plurality of bare dies 36 are arranged and connected to the programmable multi-chip module 30. Each pad 38 is provided on the periphery of the substrate 32 and is used as a connection point for the external connection of the die 36. Each on-site programmable connection chip 40 is located on the base plate 32 and is located around the elastic combination feet 34 to selectively connect the elastic combination feet 34 and the solder pads 38. Please refer to FIG. 3 and FIG. 4. FIG. 3 is a schematic diagram of the elastic combination foot base 34 of the present invention, and FIG. 4 is a schematic diagram of the first embodiment of the bare crystal 36 disposed on the elastic combination foot base 34 of FIG. The elastic combination foot base 34 of the present invention includes four first foot base modules 42, and each of the first foot base modules 42 is disposed on the substrate 3 2 for selectively positioning and connecting at least one bare crystal 3 6 Each of the first foot socket modules 42 is provided with a plurality of internal metal pins 44. Each of the internal metal pins 4 and 4 is used to connect the bare crystal 3 6 'and the plurality of internal metal pins 44. The connection method is completed by connecting a plurality of metal wires 46 to each pair of internal metal pins (A 丨 -A2) in the horizontal direction and each pair of internal metal pins (B1_B2) in the vertical direction. Furthermore, the elastic combination foot base 34 further includes a plurality of external metal pins 48 for connecting each pair of internal metal pins (A1A2) in the horizontal direction and each pair of internal metal pins (B1B2) in the vertical direction. It is used as the connection point of the elastic combination feet 3 4 to the outside. Please refer to FIG. 4, four bare crystals 36 are arranged on the elastic combination foot seat 3 4, and each of the bare crystals 3 6 includes a plurality of pins 5 0 ′, which are used as external connection points of the bare crystals 3 6. And each of the bare crystals 3 and 6 is fixed by wire bonding 4LAN / 199902TW j This paper is again applicable to national standards (CNS), \. 丨 蚬 格 (2) 0 * 297 mm y (Please read the back Note, please fill out this page) Order ··-丨 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 451609 A7 B7 V. Description of the invention (6) (Wire Bounding) to selectively connect its pins 50 and The internal metal pins 44 of the first pin module 4 2 are disposed on a first pin module 42. In addition, a plurality of bare crystals 36 or a plurality of bare crystals can be programmed in the multi-chip module 30. The connection between 36 and the solder pad 38 is completed by programming the chip 40 on the scene to selectively connect the plurality of external metal pins 48 of the flexible combination foot 34. See Figure 5 for details. 'Figure 5 is a schematic diagram of the second embodiment of the bare crystal 37 placed on the 圊 3 elastic combined foot base 34. A bare body is placed on the elastic combined foot base 34. 3 7 'Bare die 3 7 contains a plurality of pins 50, which are used as external connection points for the bare die 3 7', while the bare die 3 7 is selectively connected to it by wire bonding. The pin 50 and the inner metal pin 44 of the first pin module 42 are arranged on the four first pin modules 42. In addition, a plurality of bare crystals on the programmable multi-chip module 3 3 7 or the connection between the bare die 37 and the solder pad 38 is connected to the chip 40 by programming at the scene to selectively connect the plurality of external metal pins 48 of the flexible combination foot 34. Done. Since the elastic combination foot base 34 of the present invention includes four first foot base modules 4 2 ′, the elastic combination foot base 34 of the present invention can be used to selectively place at least one bare crystal 3 6, 37, such as The elastic combination foot base 3 4 shown in FIG. 4 means that the female has four bare crystals 3 6 ′, and the elastic combination foot base 3 4 shown in FIG. 5 is provided with one bare crystal 3 7. Secondly, each first Each foot module 42 includes a plurality of internal metal pins 44. Therefore, the elastic combination foot of the present invention

4LAN / 199902TW The size of this paper applies to China National Standard (CNS) A! Specification (2) 〇x 297 公 „） — ί .. (Please read the note on the back first? Difficult page on this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 451 0 9 A7 B7 V. Description of the invention (read) (Please read the notes on the back t) " This page) Block 3 4 can also be used selectively A plurality of bare crystals 3 6 and 3 7 with different sizes and numbers of contacts are arranged. Similarly, the flexible combination foot socket 3 4 of the present invention can also be used to connect a plurality of chips (not shown) to a programmable multi-chip module 3 〇, where the chip is an electronic component that has been packaged and has a plurality of pins (p, n). Finally, the flexible combination foot base 34 of the present invention can also be applied to a multi-layer, high-density programmable printed circuit board (Not shown), used to connect a plurality of bare crystals 3, 6, 7 or wafers to the printed circuit board. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Refer to Figure 6, which is the flexible combination foot of the present invention 6 〇 Another embodiment of the schematic diagram. Another embodiment of the present invention elastic combination The seat 6 includes four first-pedestal chess groups 62, and each of the first-pedestal modules 62 includes four second-pedestal modules 64, and each of the second-pedestal modules 64 is disposed on the substrate 32 for selective placement and connection of at least one die 37. Each of the second foot socket modules 64 is provided with a plurality of internal metal pins 44. Each internal metal pin 44 is used for connection "Bare crystal", and the plurality of internal metal pins 44 are connected by a plurality of metal wires 46 respectively, each pair of internal metal pins (A1_A2) w in the horizontal direction and each pair of internal metal pins in the vertical direction. The metal pins (B〗 _B2) are connected and completed. In addition, the elastic combination pin base 60 further includes a plurality of external metal pins 48 for connecting each pair of internal metal pins (A1-A2) in the horizontal direction and each pair of internal metal pins ( βι · β2) 'is used as an external connection point of the elastic combination foot 60. Please refer to Figure 7. Figure 7 shows the placement of bare crystals 41 and 37 in the elastic group of Figure 6.

4LAN / 199902TW This paper size is applicable to China National Standards (CNS) A] specifications (2) 0 X 297 public meals 451609 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 5. Description of the invention () The schematic diagram of the first embodiment is that eleven bare crystals 41 and one bare crystal 37 are arranged on the elastic combination foot socket 60, and each of the bare crystals 41 and 37 includes a plurality of pins 50 for bare The connection points of the crystals 41 and 37 are external, and each of the bare crystals 41 and 37 is selectively connected to the internal metal pins of the second pin module 64 and the second pin module 64 by wire bonding. 44 and placed on one second foot module 64 or four second foot modules 64 "In addition, a plurality of bare crystals 41 '37 or bare crystals 41, The connection between the '37 and the spring pad 38 is completed by programming the chip 4 (3) on the programming site to selectively connect the plurality of external metal pins 4 8 of the elastic combination foot 3 4. See the figure Fig. 8 is a schematic diagram of the second embodiment of the bare crystal 3 7 placed on the elastic composite foot stand 60. The elastic composite foot stand 6 〇 Four bare aa 3 7 are arranged on the top, and each of the bare crystals 3 7 includes a plurality of pins 5 0, which are used as external connection points of the bare crystals 3 7, and each of the bare crystals 3 7 is fixed by wire bonding. (Wire Bounding) method to selectively connect its pin 50 and the internal metal pin 44 of the second pin module 64, and place it on the four second pin modules 64. In addition, it can be programmed more The connection between the plurality of bare dies 37 on the chip module 30 or between the bare dies 37 and the pads 3S is programmable through the programming site to connect the chip 40 to selectively connect the plurality of flexible combination feet 60. The external metal pins 4S are completed. Please refer to Fig. 9 '. Fig. 9 is a schematic diagram of the second example of the bare crystal 39 placed on the elastic combination foot seat 60 of Fig. 6. One is placed on the elastic combination foot seat 60.

4LAN / 199902TW This paper size is in accordance with Chinese National Standard (CNS) Aj specification (210 χ 297 public love) I— n I —rn I nn IIII (Please read the note on the back ^ -15 first and fill in the “clothing page}” Ministry of Economy Printed by the Intellectual Property Bureau employee consumer cooperative 4 5 16 0 9 A7 B7 V. Description of the invention (gas) Bare crystal 39. Bare crystal 39 contains a plurality of pins 50 and is used as the external connection point of the crystal 39, and Die 39 is used to selectively connect its pins 50 to the inner metal pins 44 of the second pin module 64 by wire bonding, and is arranged on sixteen second pin modules 64 In addition, the connection between a plurality of bare dies 39 on the programmable multi-chip module 30 or between the bare dies 39 and the pads 38 is to programmatically connect the chip 40 to the programming site to select It is completed by flexibly connecting the plurality of external metal pins 48 of the elastic combination foot base 60. As another embodiment of the present invention, the elastic combination foot base 60 includes four first foot base modules 62 and sixteen second bases. The foot base module 64, so the elastic combined foot base 60 of the present invention can be used to selectively place at least one bare crystal 37 39, 41, as shown in Fig. 7, the flexible combination foot seat 60, that is, twelve bare crystals 41 and one bare crystal 3 7 'are arranged, and the elastic group shown in Fig. 8 is a coherent seat 6 0. Four bare crystals 3 7 ′ are arranged, and the elastic combination foot socket 60 shown in FIG. 9 is arranged with one bare crystal 39. Secondly, each second foot socket module 64 includes a plurality of internal metal pins 44 Therefore, the elastic combination foot seat 60 of the present invention can also be used to selectively place a plurality of bare crystals 3 7, 3, 9 and 4 1 with different sizes and pin numbers as shown in FIG. 7. Furthermore, the elastic combination of the present invention The foot stand 60 can also be used to connect a plurality of chips (not shown) to a known polycrystalline module; module 30. Finally, the flexible combination foot stand 60 of the present invention can also be applied to multi-layer, high-density, programmable printed circuits. A board (not shown) for placing a plurality of bare dies 36, 37, 39, 41 or wafers on the printed circuit board.

4LAN / 199902TW This paper size is applicable due to the national standard (CNS) A'l specification (210x297 public love) (Please read the precautions on the back before filling out this page) Loading -------- Order ---- ----- Line- Α7 Β7 V. Description of the Invention (U) Modules can continue to contain multiple smaller foot groups. Therefore, on the contrary, the materials and the arrangements for changing the minds are the norms that the invention wants to be protected. Therefore, the scope of the patent scope claimed in the present invention should be explained in the broadest sense according to the above description, and cover all possible equal changes and arrangements with equality. Ί1_install ------- order ------- 1-line f Please read the phonetic on the back first? Please fill in this page for further information) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs

4LAN / 199902TW 11 This paper size applies to China National Standard (CNS) A4 (210 x 297

Claims (1)

5 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 0gB81 17699 Application scope of patents A8 B8 CS D8 1 · —A kind of flexible combination feet (s 丨 〇 ”, which is used to connect P bare crystals to-Cheng A substrate The programmable substrate contains Q field programmable connection chips (FPIC). The combination is difficult to connect to one of the solderable joints on the programmable substrate through at least the field-programmable connection chip. The flexible combination The foot socket includes L-foot socket modules, and the L-foot socket modules can be selectively placed and connected to at least one die. Ten p, Q, and L are integers and greater than 10 . For example, the flexible combination foot of item 1 of the patent application range, wherein each of the first-foot module is provided with M internal metal pins (Pads), the M internal metal pins are used for selective connection The bare crystal, and M is an integer and is larger than Bu 3. The flexible combination foot of item 2 in the scope of the patent application, wherein the connection manner between the M internal metal pins is a horizontal direction by a plurality of metal wires, respectively. Each pair of internal metal pins and each pair of internal gold The metal pins are connected and completed. 4. For example, the elastic combination foot of item 3 of the patent application scope, wherein the elastic combination foot further includes N external metal pins, which are used to connect each pair of internal parts in the horizontal direction. Metal pins and each pair of internal metal pins in the vertical direction are used as the external connection points of the elastic combination foot socket, and N is an integer and is greater than 1. 4LAN7199902TW 12 Each paper music scale applies China National Standards (CNS) A4 Specifications (210X297 mm) Packing ------ Order ------- ii ·· ~ (谙 Please read the notes on the back first Feng 4 write this page} 、 Applicable patent scope ABC0 5. If applying for patent scope The elastic combination foot of item 4, wherein the connection between the P bare crystals on the programmable substrate is a programmable chip on the scene to selectively connect the N external metal contacts of the flexible combination foot. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 6. If the flexible combination of the patent application item No. 1, the IMS bare crystals on the programmable substrate are ρ bare crystals with different pin counts . 7. If the scope of patent application The elastic combination foot of item, in which each die is selectively placed on at least one first foot module in a wire bonding manner. 8. For example, the flexible combination of item i in the scope of patent application The flexible combination base can also be used to connect p crystals > 1 to the programmable substrate. 9. If the flexible combination foot of item i of the patent application scope, the programmable substrate can be a Program multi-chip module substrate. 10. As stated in the patent claim for the flexible combination foot of item!, The programmable substrate can be a programmable printed circuit board. U.-A flexible combination foot (S 丨. t), used to connect p bare crystals to a programmable substrate. The programmable substrate contains Q field programmable connection chips (FPICs). The flexible combination foot is made by at least one field programmable. 4LAN / 199902TW _____13 ^ The paper size is applicable to the Chinese National Standard (CNS) A4 · (21Gx297g I [I nn _ i Order 1 n line (please read the precautions on the back first-so write this page) Employees of the Intellectual Property Bureau of the Ministry of Economy Cooperative printed 々, patent-application scope connection crystal moon is connected to one of the pads on the programmable substrate, the flexible combination foot socket contains L first foot socket modules = each first foot socket module contains There are R second foot socket modules, and the R second foot socket modules can be selectively placed and connected to at least one die, wherein P, Q, L, and R are integers and greater than 1. 12. As requested The elastic combination feet of item 11 of the patent, wherein each second foot module is provided with M internal metal pins, the M internal metal pins are used to selectively connect the bare crystal, and M It is an integer and is greater than 1. 13. For example, the flexible combination foot of item 12 of the scope of patent application The connection between the M internal metal pins is completed by connecting a plurality of metal wires to each pair of internal metal pins in the horizontal direction and each pair of internal metal pins in the vertical direction. For example, the elastic combination foot of item 13 of the scope of patent application, wherein the elastic combination foot further includes N external metal pins for connecting each pair of internal metal pins in the horizontal direction and each pair of vertical pins in the vertical direction. The internal metal pins are used as the external connection points of the elastic combination foot, and N is an integer and greater than 1. 15. For example, the elastic combination foot of the scope of application for item 14, wherein P on the programmable substrate The connection between the two bare chips is programmed by a programmable chip on the spot to selectively connect the N external metal pins of the flexible combination foot. 4LAN / 199902TW 14 This paper is compliant with China National Standard (CNS) A4 specifications. (210X297 mm) (Please read the notes on the back first. ¾ Write this page) 5 1 6 0 9 cs ___ D8 6. The scope of patent application is completed. The foot socket, wherein the P bare crystals on the programmable substrate are P bare crystals with different pin counts. 17, such as the flexible combination foot socket of the patent application No. Π, each of which is fixed by wire (Wire Bounding) method is selectively placed on at least one second foot module. 18. For example, the flexible combination foot of item 11 of the patent application scope, wherein the flexible combination foot can also be used to connect P chips to On the programmable substrate. 19_ For example, the flexible combination foot of item π of the patent application park allows the programmable substrate to be a programmable multi-chip module substrate. 20. The flexible combination foot of item I 1 of the scope of patent application, wherein the programmable substrate can be a programmable printed circuit board. --------- ^ ------ 玎 ------ ^ • (Please read the notes on the back / W page first) Consumer Cooperation for Intellectual Property Bureau of the Ministry of Economic Affairs Du printed 4LAN / 199902TW_ / s This paper size applies to China National Standard (CNS) A4 specification (21〇 × 297々 ^) _