450837 五、發明說明（1) 本發明係提供一種用於一顯影機台之顯影液喷灑裝 置’尤指一種設有一氣泡收集裝置之顯影液喷灑裝置。 在半導體製程中’顯影（development)製程是於顯 影機台中進行’利用一顯影液喷灑裝置將顯影液喷灑顯影 機台内的半導體晶片表面上，以清除半導體晶月表面經過 曝光的光阻層’使光阻層所轉移之潛在圊案顯現出來。 請參考圈一’圖一為習知顯影液喷灑裝置1〇之示意 圖。習知顯影液喷灑裝置1〇包含有一艙體12，而艙饉〖2之 頂部與一顯影液輸送管14相連接，顯影液輸送營14所輸送 的顯影液會傳輸到艙體12底部，以喷灑於顯影機台（未顯 示）内之半導體晶片表面上。餘體12包含有一排氣口 16位 於餘艘12頂部，複數個喷灑口 22位於艙體12底部，以及一 值温管（未顯示）設於艙體12内部用來使艙體12内之顯影 液保持一定溫度。 顯影液喷灑裝置10喷灑顯影液時，顯影液會經由顯影 液輸送管14被輸送到餘體12内，並經由喷灑口 22喷灑至半 導體晶片表面上。由於顯影液在顯影液輸送管14中流動 時，會因擾流或亂流的因素而產生許多的氣泡，因此顯影 液喷灌裝置10便利用氣泡於液體中會上升的原理，於艙趙 12頂部之排氣口 16定時將位於艙體12内較上方之顯影液吸 去’以將顯影液中所夾帶的氣泡排出艙體12。由於顯影液450837 V. Description of the invention (1) The present invention is to provide a developer spraying device for a developing machine ', especially a developer spraying device provided with a bubble collecting device. In the semiconductor process, the development process is performed in a developing machine, and a developing solution spraying device is used to spray the developing solution on the surface of the semiconductor wafer in the developing machine to remove the exposed photoresist on the surface of the semiconductor wafer. 'Layer' exposes potential cases transferred by the photoresist layer. Please refer to the circle 1 'FIG. 1 is a schematic diagram of a conventional developer spraying device 10. The conventional developer spraying device 10 includes a tank 12, and the top of the tank 2 is connected to a developer transporting pipe 14. The developer transported by the developer transporting camp 14 is transmitted to the bottom of the tank 12, It is sprayed on the surface of the semiconductor wafer in a developing machine (not shown). The hull body 12 includes an exhaust port 16 located at the top of the hull 12, a plurality of spraying ports 22 are located at the bottom of the tank body 12, and a heating pipe (not shown) is provided inside the tank body 12 to make the The developer is kept at a certain temperature. When the developing solution spraying device 10 sprays the developing solution, the developing solution is conveyed into the remainder 12 through the developing solution conveying pipe 14 and is sprayed onto the surface of the semiconductor wafer through the spraying port 22. Because the developing solution flows in the developing solution conveying pipe 14, a lot of bubbles are generated due to turbulence or turbulence. Therefore, the developing solution spray irrigation device 10 conveniently uses the principle that the bubbles will rise in the liquid. The exhaust port 16 regularly sucks out the developer solution located above the chamber body 12 to exhaust the air bubbles entrained in the developer solution from the chamber body 12. Since the developer
第4頁 ^§0 83 7 五、發明說明（2) ------- 輸$管14是垂直設置於艙體12頂部，使得自顯影液輸送管 14流下之顯影液的流速非常快，因此顯影液所夾帶的氣泡 會被快速地往下帶至噴灑口 22附近，而無法上升至顯影液 之液面上，也就無法經由排氣口16排出艙體12。當喷濃口 22附近累積的氣泡越來越大也越多時，便會阻塞部份喷濃 口 22 ,使顯影液無法被均勻地喷灑在半導逋晶片表面上， 降低顯影製程的品質。 因此本發明之主要目的在於提供一種用於顯影機台之 顯影液喷灑裝置，可以有效地減低顯影液的流速，並&顯 影液中所夾帶之氣泡排出艙體外，以避免氣泡阻塞喷激口 而降低顯影製程的品質。 圖示之簡單說明 圖一為習知顯影液喷灑裝置之示意圖。 圖二為本發明顯影液喷灑裝置之示意圖。 圖三為圖二所示之氣泡收集裝置的示意困。 圖四為氣泡黏附於囷三所示之氣泡收集裝置並向上排出之 示意囷。 32艙體 36排氣口 40緩衝室 圖示之符號說明 30顯影液喷灑裝置 34類影液輸送管 3 8恆溫管Page 4 ^ §0 83 7 V. Explanation of the invention (2) ------- The delivery pipe 14 is vertically arranged on the top of the cabin 12, so that the flow rate of the developer flowing down from the developer delivery pipe 14 is very fast. Therefore, the air bubbles entrained by the developing solution will be quickly brought down to the vicinity of the spraying port 22, and cannot rise to the liquid level of the developing solution, and the chamber 12 cannot be discharged through the exhaust port 16. When the accumulated bubbles near the thickening port 22 become larger and larger, a part of the thickening port 22 will be blocked, so that the developing solution cannot be sprayed uniformly on the surface of the semiconductor wafer, thereby reducing the quality of the developing process. Therefore, the main object of the present invention is to provide a developing solution spraying device for a developing machine, which can effectively reduce the flow rate of the developing solution, and the bubbles entrained in the developing solution are discharged out of the cabin to prevent the bubbles from blocking the spray. Mouth and reduce the quality of the development process. Brief Description of the Figures Figure 1 is a schematic diagram of a conventional developer spraying device. FIG. 2 is a schematic diagram of a developer spraying device according to the present invention. FIG. 3 is a schematic diagram of the bubble collection device shown in FIG. 2. Figure 4 is a schematic diagram of bubbles sticking to the bubble collection device shown in Figure 3 and discharged upwards. 32-chamber body 36 Exhaust port 40 Buffer room Explanation of symbols 30 Developer spraying device 34 Type liquid transfer pipe 3 8 Thermostatic tube
第5頁 4 QQ 7 五、發明說明（3) 42喷灑口 44氣泡收集裝置 46收集室 請參考圖二與圖三’圖二為本發明顯影液喷灑裝置3〇 之示意圖，囷三為圖二所示之氣泡收集裝置44的示意圖。 本發明是一種用於一顯影機台之顯影液喷灑裝置3〇，用來 將一顧影液輸送管34所輸送來的顯影液喷灑於該顯影機台 内的一半導體晶片上《顯影液喷灑裝置30包含有一艙體 32 ’以及一氣泡收集裝置44設於艙體32内。艙體32包含有 一排氣口 36位於艙體32頂部，一緩衝室40位於艙體32上半 部’一收集室46位於艙體32下半部，複數個喷灑口 42位於 艙體4 2底部》 顯影液輸送管34為横向連接於緩衝室40之一側壁，排 氣口 36連通於緩衝室40之上部，收集室46則連通於緩衝室 40之下惻》收集室46内另設有一恆溫管38，用來使收集室 [46内之顯影液保持一定溫度》氣泡收集裝置44為一近似梳 j 狀之結構物’設於緩衝室40内，用來減低經由顯影液輸送 管34流入之顯影液的流速，並使顯影液輸送管34流入之顯 影液中的氣泡得以黏附於其上，然後經由排氣口 36向上排 出艙體32。 本發明顯影液喷灑裝置30中進行顯影液喷灑製程時， 顯影液輸送管34所輸送來的顯影液先流入緩衝室40，而經 ΊΗΓΊΗΗΓ *— _ 第6頁 450837 五、發明說明（4) --- 由緩衝室40流下的顯影液會儲存於收集室46内，並可以經 由艙艘32底部之每個喷灑口 42向下流出艙體32外。由於顯 影液輸送管34是橫向連接於緩衝室40之側壁，顯影液輸送 管34送來的顯影液是橫向地流入設有氣泡收集裝置“的緩 衝室40内，並且由於緩衝室40的截面積較顯影液輸送管^ 的截面積為大’因此可以減低流入緩衝室4〇之顯影液的流 速β當顯影液夾帶著氣泡被輸送到緩衝室4〇内時，由於顧 影液輸送管34與喷灑口 42的距離較長，並且緩衝室4〇内之 氣泡收集装置44會減緩顯影液的流速，因此會降低氣泡被 往下帶至喷灑口 42的機會。 ί 1 f 請參考圖四’圖四為氣泡黏附於圈三氣泡收集裝置上 並向上排出之示意®，圖四中箭頭表示氣泡移動的方向。 當顯影液炎帶著氣泡被輸送到緩衝室内時，由於氣泡收 集裝置44是近似梳狀的結構物，因此這些氣泡會黏附於氣 I泡收集裝置44上’而不會被直接地帶至艙艘32的下方的喷 !讓口 42。這些氣泡會逐漸向上，並經由緩衝室40上部之排 氣口 16排出搶趙12外’因此可以有效地防止氣泡被往下帶 至喷激口 42附近而阻塞喷灑口 42 ^氣泡收集裝置44也可為 一由不錄鋼所組成之細網’或是一由泡棉所構成之網狀結 構物’用來使流入顯影液輸送管34之顯影液所夾帶的氣 泡，得以黏附於氣泡收集裝置上，並逐漸經由排氣口 3 6向 上排出艙體32。本發明可以有效地防止氣泡阻塞喷灑口 42 ’因此使喷激液均勻地喷灑在顯影機台内之半導體晶片Page 5 4 QQ 7 V. Description of the invention (3) 42 spraying port 44 bubble collecting device 46 collection chamber Please refer to FIG. 2 and FIG. 3 'FIG. 2 is a schematic diagram of the developer spraying device 30 of the present invention, A schematic view of the bubble collection device 44 shown in FIG. The invention is a developing solution spraying device 30 for a developing machine, which is used to spray the developing solution transported by a film transfer pipe 34 onto a semiconductor wafer in the developing machine. The spraying device 30 includes a cabin body 32 ′ and a bubble collecting device 44 disposed in the cabin body 32. The cabin 32 includes an exhaust port 36 on the top of the cabin 32, a buffer chamber 40 on the upper half of the cabin 32 ', a collection chamber 46 on the lower half of the cabin 32, and a plurality of spray ports 42 on the cabin 4 2 The bottom "developing solution delivery pipe 34 is laterally connected to one side wall of the buffer chamber 40, the exhaust port 36 is connected to the upper part of the buffer chamber 40, and the collection chamber 46 is connected to the lower part of the buffer chamber 40." Thermostat tube 38 is used to keep the developing solution in the collection chamber [46 maintains a certain temperature.] The bubble collection device 44 is an approximately comb-shaped structure 'set in the buffer chamber 40 to reduce the inflow through the developing solution delivery pipe 34. The flow velocity of the developing solution allows the air bubbles in the developing solution flowing into the developing solution conveying pipe 34 to adhere to it, and then the chamber 32 is discharged upward through the exhaust port 36. When the developer spraying process is performed in the developer spraying device 30 of the present invention, the developer delivered by the developer delivery pipe 34 first flows into the buffer chamber 40, and then passes through ΊΗΓΊΗΗΓ * — _ page 6 450837 V. Description of the invention (4 ) --- The developer flowing down from the buffer chamber 40 will be stored in the collection chamber 46 and can flow down out of the cabin body 32 through each spraying port 42 at the bottom of the cabin 32. Because the developer conveying pipe 34 is connected laterally to the side wall of the buffer chamber 40, the developer sent by the developer conveying pipe 34 flows laterally into the buffer chamber 40 provided with a bubble collecting device, and because of the cross-sectional area of the buffer chamber 40 The cross-sectional area is larger than that of the developer conveying tube ^, so the flow rate of the developer flowing into the buffer chamber 40 can be reduced β. When the developer clip is transported into the buffer chamber 40 with air bubbles, since the film transporting tube 34 and The distance of the spraying port 42 is longer, and the air bubble collecting device 44 in the buffer chamber 40 will slow down the flow rate of the developing solution, thereby reducing the chance of air bubbles being carried down to the spraying port 42. ί 1 f Please refer to FIG. 4 'Figure 4 is a schematic diagram of bubbles adhering to the circle 3 bubble collection device and discharged upwards. The arrow in Figure 4 indicates the direction of bubble movement. When the developer is conveyed into the buffer chamber with bubbles, the bubble collection device 44 is The structure is similar to a comb-like structure, so these bubbles will stick to the gas bubble collection device 44 'without being directly brought to the spray below the cabin 32! Let the mouth 42. These bubbles will gradually upward and pass through The exhaust port 16 in the upper part of the flushing chamber 40 is exhausted to grab the outside of Zhao 12. Therefore, it can effectively prevent air bubbles from being brought down to the vicinity of the spray port 42 and block the spray port 42. The bubble collection device 44 can also be a non-recording steel. The formed fine mesh 'or a mesh structure made of foam' is used to make the air bubbles entrained by the developer flowing into the developer conveying pipe 34 adhere to the bubble collecting device and gradually pass through the exhaust The port 36 is discharged upwards from the compartment 32. The present invention can effectively prevent air bubbles from blocking the spray port 42 ', so that the spray liquid is evenly sprayed on the semiconductor wafer in the developing machine
第7頁 450 eg 五、發明說明（5) 上，進而提高顯影製程的品質 相較於習知顯影液噴灑裝置10，本發明顯影液喷灑裝 置30的餘醴32設有緩衝室4〇以及收集室46，並且緩衝室40 設有氣泡收集裝置44 ’因此可以降低顯影液輸送管34流入 之顯影液的流速’並使顯影液中的氣泡黏附於氣泡收集裝 置44上並逐漸向上排出。本發明可以防止氣泡阻塞噴灑口 22 ’因此使噴灑液均勻地喷灑於半導體晶片表面，提高顯 影製程的品質。 以上所述僅為本發明之較佳實施例，凡一本發明申請 專利範圍做之均等變化與修飾，皆應屬本發明專利之涵蓋 範圍》Page 7 450 eg 5. In the description of the invention (5), the quality of the developing process is further improved. Compared with the conventional developer spraying device 10, the buffer 32 of the developer spraying device 30 of the present invention is provided with a buffer chamber 40. The collecting chamber 46, and the buffer chamber 40 is provided with a bubble collecting device 44 'so the flow rate of the developing solution flowing into the developing solution conveying pipe 34 can be reduced' and the bubbles in the developing solution adhere to the bubble collecting device 44 and gradually discharge upward. The invention can prevent air bubbles from blocking the spray opening 22 ', so that the spray liquid is uniformly sprayed on the surface of the semiconductor wafer, and the quality of the developing process is improved. The above description is only a preferred embodiment of the present invention. Any equal changes and modifications in the scope of the patent application for the present invention shall fall within the scope of the patent for the present invention. "