TW449779B - Evaluation method of pattern and forming method of pattern - Google Patents
Evaluation method of pattern and forming method of pattern Download PDFInfo
- Publication number
- TW449779B TW449779B TW89103474A TW89103474A TW449779B TW 449779 B TW449779 B TW 449779B TW 89103474 A TW89103474 A TW 89103474A TW 89103474 A TW89103474 A TW 89103474A TW 449779 B TW449779 B TW 449779B
- Authority
- TW
- Taiwan
- Prior art keywords
- pattern
- size
- monitoring
- development
- aforementioned
- Prior art date
Links
- 238000011156 evaluation Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims description 28
- 238000012544 monitoring process Methods 0.000 claims abstract description 144
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 33
- 238000011161 development Methods 0.000 claims description 78
- 238000010586 diagram Methods 0.000 claims description 19
- 238000001514 detection method Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims 3
- 238000012937 correction Methods 0.000 claims 1
- 238000013461 design Methods 0.000 claims 1
- 238000004064 recycling Methods 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 16
- 238000005259 measurement Methods 0.000 description 15
- 238000012545 processing Methods 0.000 description 7
- 238000004458 analytical method Methods 0.000 description 6
- 238000012806 monitoring device Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 4
- 239000013307 optical fiber Substances 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000012887 quadratic function Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000010606 normalization Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000012089 stop solution Substances 0.000 description 1
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11074046A JP2000269120A (ja) | 1999-03-18 | 1999-03-18 | パターン評価方法及びパターン形成方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW449779B true TW449779B (en) | 2001-08-11 |
Family
ID=13535857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW89103474A TW449779B (en) | 1999-03-18 | 2000-02-29 | Evaluation method of pattern and forming method of pattern |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2000269120A (enExample) |
| TW (1) | TW449779B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI418944B (zh) * | 2004-07-12 | 2013-12-11 | 尼康股份有限公司 | A method of determining exposure conditions, an exposure method, an exposure apparatus, and an element manufacturing method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI238465B (en) | 2002-07-24 | 2005-08-21 | Toshiba Corp | Method of forming pattern and substrate processing apparatus |
| JP4962419B2 (ja) * | 2008-06-06 | 2012-06-27 | 富士通セミコンダクター株式会社 | 半導体装置 |
-
1999
- 1999-03-18 JP JP11074046A patent/JP2000269120A/ja active Pending
-
2000
- 2000-02-29 TW TW89103474A patent/TW449779B/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI418944B (zh) * | 2004-07-12 | 2013-12-11 | 尼康股份有限公司 | A method of determining exposure conditions, an exposure method, an exposure apparatus, and an element manufacturing method |
| US8654308B2 (en) | 2004-07-12 | 2014-02-18 | Nikon Corporation | Method for determining exposure condition, exposure method, exposure apparatus, and method for manufacturing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000269120A (ja) | 2000-09-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |