4 46 9 7 k 五、發明說明（l) ---— 本發明為關於一種晶片電感器之製造方法，尤指提 供一種本體上可直接成型線圈之方式，省去繞組線圈製 程’及具有不需整數圏數繞組之實心或中空式無繞線晶片 電感器之製造方法。 、如第一圖所示為習知電感器之封裝方式，於灌膠壓膜 過程中，使本體1外部形成有一樹脂4 ’予以保護，其線圈 2’會受到高溫及高壓之模流影響繞組間距，有移位之疑 慮’使電感值會有不規則變動之狀況，而在插腳1 1，成型 過程中，需將兩側插腳1丨，施以彎折手段，俾能順利插組 於基'板3’上，此種製程方式不僅繁瑣，且在線圈2，之端點 2 11延伸接著於插腳1 Γ需施以打扁彎折作業，易因彎折應 力而影響内部線圈2’端點21，接著有斷線之現象，且插腳~ 11也會有不慎折斷之顧忌’因此在品質可靠度上是有待 改善。 是以，本發明人有鑑於習知電感器的種種缺失，累積 多年從事此行業之經驗’積極從事研究，終有創新之「實 心或中空式無繞線晶片電感器之製造方法」產生。 本發明之主要目的，即在於提供一種實心或中空狀長 條形體彼覆金屬膜之本體設計’於本體上切割直接成型線 圈之方式，省去繞組線圈製程，同時能克服不完整繞組圈 數之特性。 本發明之次要目的’即在於提供一種實心或中空狀長 條形體可直接成型線圈之本體設計，其本體可切割複數個 晶片電感之單一本體’並於晶片電感本體兩側崁接矩形體4 46 9 7 k V. Description of the invention (l) ----- The present invention relates to a method for manufacturing a chip inductor, in particular to provide a method for directly forming a coil on the body, eliminating the need for a winding coil process and Manufacturing method of solid or hollow no-wound chip inductors with integer number of windings. As shown in the first figure, a conventional inductor packaging method is shown. During the process of filling and laminating, a resin 4 'is formed on the outside of the body 1 to protect it. The coil 2' will be affected by the high temperature and high voltage mold current. Pitch, there is a concern of shifting ', so that the inductance value will change irregularly. In the process of pin 1 1, during the molding process, the pins 1 on both sides need to be bent, and it can be smoothly inserted into the base. On 'Board 3', this manufacturing method is not only cumbersome, but also extends at the end 2 of coil 2 and then at pin 1 Γ requires flattening and bending operations, which is likely to affect the inner coil 2 'end due to bending stress. At point 21, there will be a disconnection phenomenon, and pins ~ 11 will be accidentally broken, so the quality and reliability need to be improved. Therefore, the present inventor has accumulated many years of experience in this industry in view of the lack of conventional inductors, and has been actively engaged in research. Finally, an innovative "manufacturing method of solid or hollow wireless chip inductors" was produced. The main purpose of the present invention is to provide a solid or hollow strip-shaped body coated with a metal film on the body design. The method of cutting a direct-shaped coil on the body eliminates the winding coil manufacturing process and can overcome the number of incomplete winding turns characteristic. The secondary object of the present invention is to provide a solid or hollow elongated body which can directly form a coil body design. The body can cut a single body of a plurality of chip inductors and connect rectangular bodies on both sides of the chip inductor body.
第4頁 4 4 6s 五、發明說明（2)Page 4 4 4 6s V. Description of the invention (2)
之金屬端子，其所製成晶片電感器在製程上具有同時加工 夕組成品之特性’提昇生產效率，合乎經濟效益之利用價 值’且本體能進一步採中空之設計’更能提昇品質因素（Q 值）’以滿足射頻（RF)線路產品高品質因素（Q值）之需求 者6 本發明之另一目的，即在於電感本體之線圈路線上採 用不加壓塗膠樹脂保護之方式’免除傳統灌膠壓模製程， 使電感器不會受到高溫、高壓的影響，及避免產生電感值 不規則變動之情形。 依據本發明上揭目的、特徵及其功效所示之實心或中 空式無繞線晶片電感器之製造方法’茲就具體實施例詳加 說明如下： 明參閱第二圖至第六圖所示即為本發明實施例的流程 圖及相關組件示意圖。 於步驟601中，係以陶瓷製出一實心或令空狀長條方 柱體或圓柱體之本體” 於步驟602中，係將該本體於表面予披覆一層具有 電性之金屬膜2。 八 於步驟603中，係該坡覆金屬膜2之本體j安置於一切 割襄置上’採用雷射切割預設去除之跡線，以保留製成 需求之線圈路線3，如此可省去傳統需繞線之製程方式， 且在圈數繞組佈局上，可直接切割完成所需繞組圈數。 於步驟604中，係該製成線圈路線3之本體！採切割手For metal terminals, the chip inductors produced have the characteristics of simultaneous processing of components in the manufacturing process, 'improving production efficiency, economical utilization value', and the design of the body can be further hollow, which can further improve the quality factor (Q Value) 'to meet the demand for high quality factor (Q value) of radio frequency (RF) circuit products. 6 Another object of the present invention is to use a non-pressurized gummed resin to protect the coil of the inductor body. The injection molding process prevents the inductor from being affected by high temperature and high pressure, and avoids the situation that the inductance value changes irregularly. The manufacturing method of the solid or hollow wire-wound chip inductor shown according to the purpose, features, and effects of the present invention is described in detail below with reference to specific embodiments: Refer to the second to sixth figures. It is a flowchart of the embodiment of the present invention and a schematic diagram of related components. In step 601, a solid or hollow rectangular prism or cylinder body is made of ceramics. "In step 602, the body is coated with a layer of electrical metal film 2 on the surface. In step 603, the body j of the slope-covered metal film 2 is placed on a cutting edge, and the traces removed by laser cutting are preset to keep the coil route 3 that is required, so that the tradition can be omitted. The winding method is required, and in the winding layout, the required winding turns can be directly cut. In step 604, the body of the coil route 3 should be made! Use cutting hands
446^ / 五、發明說明（3) 段以分割製成複數個單一個體之晶片電感本體1。 於步驟605中，係提供兩組為金屬導體材質、矩形體 之金屬端子4 ’該金屬端子4於相對面上具有一供本體1卡 固之銜接槽41，使晶片電感本體1兩端得以崁接金屬端子4 與線圈路線3直接導通，如此利用金屬導體材質之金屬端 子4可與線圈路線3直接導通之特性，以具有快速生產及節 省成本之實用價值，又如第三圖所示晶片電感本體丨中空 之5又叶，更能改善品質因素（Q值）’以滿足射頻（r F)線路 高品質因素（Q值）之需求者。 於步驟606中’係於該晶片電感本體i之線圈路線3上 予塗膠樹知5形成一保護層，晶片電感本體1之線圈路線3 上以塗膠樹脂5形成保護層方式，線圈路線3不會受高溫及 高壓的影響，使電感值不致有不規則變動之情形。 於步驟607中’係將塗膠完成之晶片電感實施電性測 試作業，完成後予包裝即製成完成品。 藉由上述步驟程序所製成實心或中空式無繞線晶片電 感器，如第六圖所示上板時，其晶片電感本體丨兩側邊矩 形體之金屬端子4得直接與基板6接著，相當簡捷方便，並 能大幅提高良率及品質之可靠度，極具進步性與實用價 值。 綜上所陳，本發明之實心或中空式無繞線晶片電感器 之製造方法’提供了-種製程簡f、快速上板作業及直接 成型線圈之方法，能改善不完整圈數繞組的問題，同時改 善品質因素（Q值）之特性，顯已符合專利法之可供產業上446 ^ / V. Description of the invention (3) Paragraph is divided into a plurality of single individual chip inductor bodies 1. In step 605, two sets of metal terminals 4 which are made of metal conductors and rectangular bodies are provided. The metal terminals 4 have an engagement groove 41 on the opposite surface for the body 1 to be fixed, so that the two ends of the chip inductor body 1 can be folded. Connect the metal terminal 4 and the coil line 3 directly. In this way, the metal terminal 4 of the metal conductor material can be directly connected to the coil line 3 to have the practical value of rapid production and cost savings, as shown in the third figure. Ontology 丨 The 5th leaf of the hollow can better improve the quality factor (Q value) 'to meet the demand for high quality factor (Q value) of radio frequency (r F) lines. In step 606, a protective layer is pre-coated on the coil route 3 of the chip inductor body i to form a protective layer, and a coil 5 is formed on the coil route 3 of the chip inductor body 1 to form a protective layer. The coil route 3 It will not be affected by high temperature and high voltage, so that the inductance value does not change irregularly. In step 607 ', the chip inductors that have been glued are subjected to electrical test operations. After completion, they are packaged to make finished products. The solid or hollow winding-free chip inductor manufactured by the above steps and procedures, when the board is shown in the sixth figure, the metal terminals 4 of the rectangular body on both sides of the chip inductor body 丨 must be directly connected to the substrate 6, It is very simple and convenient, and can greatly improve the reliability of yield and quality. It is very progressive and practical. To sum up, the manufacturing method of the solid or hollow wireless chip inductor of the present invention 'provides a method of simple process f, fast board operation and direct forming of the coil, which can improve the problem of incomplete windings. At the same time, the quality factor (Q value) is improved, and it is obviously available for the industry in accordance with the patent law.
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圖式簡單說明 第一圖所示為習知電感器之封裝完成之示意圖。 第二圖所示為本發明實心或中空式無繞線式電感器之 實施例之流程圓。 第三圖所示為本發明中空式電感本體切割製成線圈路 線之示意圖。 第四圖所示為本發明實心式無繞線式電感器之相關組 件立體分解示意圖。 第五圖所示為本發明實心或中空式無繞線式電感器之 立體不意圖。 第六圖所示為本發明實心或中空式無繞線式電感器上 板時之實施例圖。Brief Description of the Drawings The first figure shows a schematic diagram of the packaging of a conventional inductor. The second figure shows the flow of the embodiment of the solid or hollow wire-wound inductor of the present invention. The third figure is a schematic diagram of a coil circuit made by cutting a hollow inductor body according to the present invention. The fourth figure shows a three-dimensional exploded view of the relevant components of the solid non-wound inductor of the present invention. The fifth figure shows the three-dimensional intention of the solid or hollow winding-free inductor of the present invention. Fig. 6 is a diagram showing an embodiment of a solid or hollow wire-wound inductor on a board according to the present invention.
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