CN105957691A - Three-dimensional winding inductor, transformer, equalizer and LC filter - Google Patents
Three-dimensional winding inductor, transformer, equalizer and LC filter Download PDFInfo
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- CN105957691A CN105957691A CN201610559188.2A CN201610559188A CN105957691A CN 105957691 A CN105957691 A CN 105957691A CN 201610559188 A CN201610559188 A CN 201610559188A CN 105957691 A CN105957691 A CN 105957691A
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- 238000004804 winding Methods 0.000 title abstract description 10
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- 239000004020 conductor Substances 0.000 claims description 10
- 238000007639 printing Methods 0.000 claims description 3
- 230000001939 inductive effect Effects 0.000 abstract description 7
- 230000008878 coupling Effects 0.000 description 19
- 238000010168 coupling process Methods 0.000 description 19
- 238000005859 coupling reaction Methods 0.000 description 19
- 239000007787 solid Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010923 batch production Methods 0.000 description 4
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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- 239000003989 dielectric material Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/0026—Multilayer LC-filter
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Abstract
The invention discloses a three-dimensional winding inductor. The three-dimensional winding inductor comprises a PCB, an input bonding pad, an output bonding pad, a plurality of conductive channels and a plurality of inductive coil conducting wires, wherein the PCB is a PCB including dual dielectric layers or multiple dielectric layers; various conductive channels pass through adjacent two dielectric layers or multiple dielectric layers of the PCB; various inductive coil conducting wires are arranged on the same dielectric layer of the PCB; two ends of various inductive coil conducting wires are respectively connected with two conductive channels; furthermore, all the inductive coil conducting wires are divided into more than two layers; all the inductive coil conducting wires are sequentially connected through the corresponding conductive channels; and two ends of all the inductive coil conducting wires sequentially connected through the corresponding conductive channels are electrically connected to the input bonding pad and the output bonding pad respectively. The Q value of the three-dimensional winding inductor is proper; and thus, the three-dimensional winding inductor can satisfy practical engineering use requirements. The invention further discloses an LC filter, a transformer and an equalizer.
Description
Technical field
The present invention relates to inductive technologies field, particularly relate to a kind of three-dimensional wire-wound inductor, transformator, equalizer and LC wave filter.
Background technology
In radio frequency and microwave circuit, use inductance element in a large number.As a example by lumped wave filter (LC wave filter), main employing air core inductor and magnet ring inductance are as resonance or matching element, and at lower frequency (general below 150MHz), required inductance value is relatively big, generally uses magnet ring inductance.At upper frequency (more than 150MHz), required inductance value is less, generally uses air core inductor.Air core inductor and magnet ring inductance are after technique is completed, by the turn-to-turn of regulating winding away from carrying out adjusting inductance, it is thus achieved that final required properties of product.Again it is carried out a glue, cured.The inductance inductance value of air core inductor and magnet ring inductance is inaccurate, discreteness is big, need repeatedly to debug, assemble, the technical process such as solidification the most complex.
In recent years, IC(Integrated
Circuit, integrated circuit) technique is increasingly mature, and substantial amounts of planar spiral inductor is used, and these planar inductor inductance value are accurate, reproducible.And the Q-value of such planar inductor is only 10-20, broadband filter (band of high pass, low pass or relative bandwidth more than 20% leads to) application can only be met.
Summary of the invention
The technical problem to be solved in the present invention is for above-mentioned the deficiencies in the prior art, it is provided that three-dimensional wire-wound inductor, wave filter, transformator and the equalizer that a kind of Q-value is moderate.
For solving above-mentioned technical problem, the technical solution used in the present invention is: a kind of three-dimensional wire-wound inductor, including pcb board, input pad, o pads, multiple conductive channel and Duo Gen inductance coil wire；Wherein, described pcb board is dual dielectric layer or multi-medium-layer pcb board；
Each described conductive channel is all through two dielectric layers adjacent in described pcb board or multiple dielectric layer；
Every described inductance coil wire is arranged on the same dielectric layer of described pcb board；The two ends of every described inductance coil wire are connected with two described conductive channels respectively；At least two dielectric layer is provided with described inductance coil wire；
All described inductance coil wires are sequentially connected electrically by corresponding described conductive channel；
All described inductance coil wires be sequentially connected with by corresponding described conductive channel after be electrically connected to both ends of described input pad and described o pads.
Preferably, described conductive channel includes plated through-hole and conductor；Described conductor is arranged on inside described plated through-hole.
Preferably, described input pad and described o pads are arranged at the electrical connection of the two ends after the surface of described pcb board, described input pad and described o pads are all sequentially connected with by corresponding described conductive channel with all described inductance coil wires respectively by conductive channel.
Preferably, intermediate contact pads is also included；Described inductance coil wire is more than three；Described intermediate contact pads is arranged on the surface of described pcb board, between described input pad and described o pads；
Described intermediate contact pads is connected with described inductance coil wire by described conductive channel.
Preferably, it is parallel to each other between the described inductance coil wire of same layer；Between the described inductance coil wire of different layers, there is default angle.
Preferably, described inductance coil wire is the band line graph according to preset pitch arrangement.
Preferably, the printing plate of described dielectric layer is copper-clad plate.
Invention additionally discloses a kind of transformator, including above-mentioned any one three-dimensional wire-wound inductor with intermediate contact pads.
Invention additionally discloses a kind of equalizer, including above-mentioned any one three-dimensional wire-wound inductor with intermediate contact pads.
Invention additionally discloses a kind of wave filter, including any one described three-dimensional wire-wound inductor above-mentioned.
Use and have the beneficial effects that produced by technique scheme: compare with prior art uses the air core inductor of wire coiling, magnet ring wire-wound inductor and Si base or GaAs base plane inductance, above-mentioned three-dimensional wire-wound inductor uses two-layer or layer stereo structure to prepare inductance, be suitable to obtain the inductance value required for RF/Microwave Integrated Circuits, Q-value is moderate, it is possible to meets Practical Project and uses requirement.Further, the reliability of this solid wire-wound inductor is high, be suitable for batch production, can reduce debugging, shorten life cycle of the product, be of great immediate significance and practical value.
Accompanying drawing explanation
Fig. 1 is the perspective view of solid wire-wound inductor embodiment one of the present invention；
Fig. 2 is the upward view of Fig. 1；
Fig. 3 is the top view of Fig. 1；
Fig. 4 is the perspective view of solid wire-wound inductor embodiment two of the present invention；
Fig. 5 is the top view of Fig. 4；
Fig. 6 is the perspective view of solid wire-wound inductor embodiment three of the present invention；
Fig. 7 is the upward view of Fig. 6；
Fig. 8 is the perspective view of solid wire-wound inductor embodiment four of the present invention；
Fig. 9 is the circuit theory diagrams of one embodiment of LC wave filter of the present invention；
Figure 10 is a kind of structural representation of Fig. 9；
Figure 11 is the upward view of Figure 10；
Figure 12 is the circuit theory diagrams of LC another embodiment of wave filter of the present invention；
Figure 13 is a kind of structural representation of Figure 12.
Detailed description of the invention
The present invention is further detailed explanation with detailed description of the invention below in conjunction with the accompanying drawings.
Below in each embodiment, three-dimensional wire-wound inductor can include pcb board (Printed
Circuit Board, printed circuit board) 100, input pad 210, o pads 220, multiple conductive channel 300 and Duo Gen inductance coil wire 400.Wherein, pcb board 100 is dual dielectric layer or multi-medium-layer pcb board.Each conductive channel 300 is all through adjacent two dielectric layers of pcb board 100 or multiple dielectric layer.Every inductance coil wire 400 is arranged on the same dielectric layer of pcb board 100, and the two ends of every inductance coil wire 400 are connected with two conductive channels 300 respectively.All inductance coil wires 400 are divided into more than two-layer.All inductance coil wires 400 are sequentially connected with by corresponding conductive channel 300, form the open type distorted loop with an input and an outfan.All inductance coil wires 400 be sequentially connected with by corresponding conductive channel 300 after be electrically connected to both ends of input pad 210 and o pads 220.Wherein, the shape of described open type distorted loop is slightly different with the shape of usually said coil, but is a coil with input and outfan, and input and outfan are not connected to.
Wherein, three-dimensional wire-wound inductor utilizes double-deck or multi-layer PCB technique manufacture, and printing plate can choose Rogers, Arlon, Taconic and the copper-clad plate of other circuit board manufacturer production.Inductance coil wire 400 can be the band line graph being distributed at a certain distance.Band line graph can be one or more, and parallel or regular proper alignment is on dielectric layer.These are positioned at the inductance coil wire 400 of different medium layer, are connected by running through the conductive channel 300 of dielectric layer.
Embodiment one
Seeing Fig. 1 to Fig. 3, in the present embodiment, three-dimensional wire-wound inductor is the three-dimensional wire-wound inductor of two layer of two circle.This solid wire-wound inductor includes pcb board (Printed Circuit Board, printed circuit board) 100, input pad 210,220, four conductive channels 301 ~ 304 of o pads and three inductance coil wires 401 ~ 403.Wherein, pcb board 100 is dual dielectric layer pcb board, including first medium layer 110 and second dielectric layer 120.Conductive channel 301 ~ 304 is all through first medium layer 110 and the second dielectric layer 120 of pcb board 100.Inductance coil wire 401 ~ 403 is separately positioned in first medium layer 110 and the second dielectric layer 120 of pcb board 100.And, every inductance coil wire is positioned on same dielectric layer, and the two ends of every inductance coil wire are connected with two conductive channels respectively.All inductance coil wires 401 ~ 403 are divided into two-layer.All inductance coil wires 401 ~ 403 are sequentially connected with by corresponding conductive channel 301 ~ 304.All inductance coil wires 401 ~ 403 be sequentially connected with by corresponding conductive channel 301 ~ 304 after be electrically connected to both ends of input pad 210 and o pads 220.
Concrete, as it is shown in figure 1, in the present embodiment, set the surface away from second dielectric layer 120 of first medium layer 110 as the first surface of first medium layer 110.Inductance coil wire 402 is arranged between first medium layer 110 and second dielectric layer 120.Inductance coil wire 401 and inductance coil wire 403 are arranged on the first surface of first medium layer 110.It is parallel to each other between inductance coil wire 401 and inductance coil wire 403, there is between inductance coil wire 401 and inductance coil wire 402 default angle.Certainly, in other embodiments, also can have angle between inductance coil wire 401 and inductance coil wire 403, this is not restricted.
Wherein, input pad 210 is connected with conductive channel 301.The two ends of inductance coil wire 401 are connected with conductive channel 301 and conductive channel 302 respectively.The two ends of inductance coil wire 402 are connected with conductive channel 302 and conductive channel 303 respectively.The two ends of inductance coil wire 403 are connected with conductive channel 303 and conductive channel 304 respectively.O pads 220 is connected with conductive channel 304.Inductance coil wire 401 ~ 403 passes sequentially through conductive channel 301 ~ 304 sequentially three-dimensional connection.
In the present embodiment, conductive channel 301 ~ 304 may each comprise plated through-hole (figure is not marked) and conductor (figure is not marked).Conductor is arranged on inside plated through-hole.Conductor plays connection and is positioned at the effect of different layers winding wire 401 ~ 403, and the part simultaneously as three-dimensional wire-wound inductor coil forms an overall inductance coil.The exit of three-dimensional wire-wound inductor, is connected on input pad 210 and o pads 220 draw by plated through-hole.
It addition, input pad 210 and o pads 220 are separately positioned on the first surface of second dielectric layer 120, it is separately positioned on the both sides of first surface.In the present embodiment, the volume of three-dimensional wire-wound inductor can be 3mm × 2.5mm × 2.2mm, and inductance value is about 5.4nH.In the case of volume holding is constant, increases the number of turn and can increase inductance value.The three-dimensional wire-wound inductor of 3,4,5 circles also can be realized under this volume.
Embodiment two
Seeing Fig. 4 and Fig. 5, in the present embodiment, three-dimensional wire-wound inductor is the three-dimensional wire-wound inductor of two layer of four circle.This solid wire-wound inductor includes pcb board (Printed Circuit Board, printed circuit board) 100, input pad 210,220, eight conductive channels 301 ~ 308 of o pads and seven inductance coil wires 401 ~ 407.Wherein, pcb board 100 is dual dielectric layer pcb board, including first medium layer 110 and second dielectric layer 120.Conductive channel 301 ~ 308 is all through first medium layer 110 and the second dielectric layer 120 of pcb board 100.Inductance coil wire 401 ~ 407 is separately positioned in first medium layer 110 and the second dielectric layer 120 of pcb board 100.And every inductance coil wire is positioned on same dielectric layer, the two ends of every inductance coil wire are connected with two conductive channels respectively.All inductance coil wires 401 ~ 407 are divided into two-layer.All inductance coil wires 401 ~ 407 are sequentially connected with by corresponding conductive channel 301 ~ 308.All inductance coil wires 401 ~ 407 be sequentially connected with by corresponding conductive channel 301 ~ 308 after be electrically connected to both ends of input pad 210 and o pads 220.
Concrete, as shown in Figure 4, in the present embodiment, set the surface away from second dielectric layer 120 of first medium layer 110 as the first surface of first medium layer 110.Inductance coil wire 401, inductance coil wire 403, inductance coil wire 405 and inductance coil wire 407 are arranged on the first surface of first medium layer 110.And be parallel to each other between inductance coil wire 401, inductance coil wire 403, inductance coil wire 405 and inductance coil wire 407.Inductance coil wire 402, inductance coil wire 404 and inductance coil wire 406 are arranged between first medium layer 110 and second dielectric layer 120.And be parallel to each other between inductance coil wire 402, inductance coil wire 404 and inductance coil wire 406.Having default angle between inductance coil wire 401 and inductance coil wire 402, this default angle is set according to actual needs.Inductance coil wire 403 is arranged on the first surface of first medium layer 110.
Input pad 210 is connected with conductive channel 301.The two ends of inductance coil wire 401 are connected with conductive channel 301 and conductive channel 302 respectively.The two ends of inductance coil wire 402 are connected with conductive channel 302 and conductive channel 303 respectively.The two ends of inductance coil wire 403 are connected with conductive channel 303 and conductive channel 304 respectively.The two ends of inductance coil wire 404 are connected with conductive channel 304 and conductive channel 305 respectively.The two ends of inductance coil wire 405 are connected with conductive channel 305 and conductive channel 306 respectively.The two ends of inductance coil wire 406 are connected with conductive channel 306 and conductive channel 307 respectively.The two ends of inductance coil wire 407 are connected with conductive channel 307 and conductive channel 308 respectively.O pads 220 is connected with conductive channel 308.Inductance coil wire 401 ~ 407 passes sequentially through conductive channel 301 ~ 308 sequentially three-dimensional connection.
Certainly, in other embodiments, can not also entirely be parallel to each other between inductance coil wire 401, inductance coil wire 403, inductance coil wire 405 and inductance coil wire 407 or entirely not be parallel to each other, this is not restricted.Same, can not also entirely be parallel to each other between inductance coil wire 402, inductance coil wire 404 and inductance coil wire 406 or entirely not be parallel to each other, this is not restricted.
In the present embodiment, conductive channel 301 ~ 308 may each comprise plated through-hole (figure is not marked) and conductor (figure is not marked).Conductor is arranged on inside plated through-hole.Conductor plays connection and is positioned at the effect of different layers winding wire 401 ~ 407, and the part simultaneously as three-dimensional wire-wound inductor coil forms an overall inductance coil.The exit of three-dimensional wire-wound inductor, is connected on input pad 210 and o pads 220 draw by plated through-hole.
The three-dimensional wire-wound inductor in the present embodiment inductance value under 3mm × 2.5mm × 2.2mm volume is about 20nH.Furthermore it is possible to by changing the three-dimensional medium number of plies of wire-wound inductor, inductance volume, dielectric material and band wire winding, attainable inductance value is 1nH～150nH, and Q-value can reach between 60-200, it is possible to the radio frequency microwave circuit meeting the overwhelming majority uses.
Embodiment three
Seeing Fig. 6 and Fig. 7, the three-dimensional wire-wound inductor in the present embodiment is with the difference of the three-dimensional wire-wound inductor in embodiment two: intermediate contact pads 500.Intermediate contact pads 500 is arranged on the surface of pcb board 120, between input pad 210 and o pads 220.Intermediate contact pads 500 is connected with inductance coil wire by conductive channel.
Concrete, in the present embodiment, set the surface away from second dielectric layer 120 of first medium layer 110 as the first surface of first medium layer 110.Inductance coil wire 401, inductance coil wire 403, inductance coil wire 405 and inductance coil wire 407 are arranged on the first surface of first medium layer 110.Inductance coil wire 402, inductance coil wire 404 and inductance coil wire 406 are arranged between first medium layer 110 and second dielectric layer 120.Input pad 210 is connected with conductive channel 301.O pads 220 is connected with conductive channel 308.Intermediate contact pads 230 is connected with inductance coil wire 404 by conductive channel 309.
The tap inductor that three-dimensional wire-wound inductor is stereochemical structure in the present embodiment, on the surface of attachment pad, in addition to input pad 210, o pads 220, adds an intermediate contact pads 230 in centre position.The three-dimensional wire-wound inductor of this structure can be applicable to the fields such as transformator, equalizer.
Being provided with the three-dimensional wire-wound inductor of intermediate contact pads 500, the number of general inductance coil wire to be more than three.Preferably, intermediate contact pads 500 is electrically connected by conductive channel 300, the inductance coil wire 400 being positioned at middle part with all inductance coil wires 400 after being sequentially connected with by corresponding conductive channel 300.That is, intermediate contact pads 500 is connected Ei by conductive channel 300 with 400, inductance coil wire in the middle part of open type distorted loop.
Embodiment four
Seeing Fig. 8, the three-dimensional wire-wound inductor in the present embodiment is the stereochemical structure inductance of three dielectric layer bifilar windings.This solid wire-wound inductor includes pcb board (Printed Circuit Board, printed circuit board) 100, input pad 210,220,13 conductive channels 301 ~ 313 of o pads and 13 inductance coil wires 401 ~ 413.Wherein, pcb board 100 is three dielectric layer pcb boards, including first medium layer 110, second dielectric layer 120 and the 3rd dielectric layer 130.Conductive channel 301 ~ 313 is through first medium layer 110, second dielectric layer 120 and the 3rd dielectric layer 130 of pcb board 100.Inductance coil wire 401 ~ 413 is separately positioned on the first medium layer 110 of pcb board 100, second dielectric layer 120 and the 3rd dielectric layer 130.And every inductance coil wire is positioned on same dielectric layer, the two ends of every inductance coil wire are connected with two conductive channels respectively.All inductance coil wires 401 ~ 413 are divided into four layers.All inductance coil wires 401 ~ 413 are sequentially connected with by corresponding conductive channel 301 ~ 313.All inductance coil wires 401 ~ 413 be sequentially connected with by corresponding conductive channel 301 ~ 313 after be electrically connected to both ends of input pad 210 and o pads 220.
Concrete, as shown in Figure 8, in the present embodiment, set the surface away from second dielectric layer 120 of first medium layer 110 as the first surface of first medium layer 110, the surface away from second dielectric layer 120 of the 3rd dielectric layer 130 is the first surface of the 3rd dielectric layer 130.Inductance coil wire 408, inductance coil wire 410 and inductance coil wire 412 are arranged on the first surface of first medium layer 110.Inductance coil wire 402, inductance coil wire 404 and inductance coil wire 406 are arranged between first medium layer 110 and second dielectric layer 120.Inductance coil wire 401, inductance coil wire 403, inductance coil wire 405 and inductance coil wire 407 are arranged between second dielectric layer 120 and the 3rd dielectric layer 130.Inductance coil wire 409, inductance coil wire 411 and inductance coil wire 413 are arranged on the first surface of the 3rd dielectric layer 130.Input pad 210 is arranged on the first surface of first medium layer 110 position near conductive channel 301.O pads 220 is arranged on the first surface of the 3rd dielectric layer 130 position near conductive channel 301.
Input pad 210 is connected with inductance coil wire 401 by conductive channel 301.Inductance coil wire 401 is connected with inductance coil wire 402 by conductive channel 302.Inductance coil wire 402 is connected with inductance coil wire 403 by conductive channel 303.Inductance coil wire 403 is connected with inductance coil wire 404 by conductive channel 304.By that analogy, inductance coil wire 412 is connected with inductance coil wire 413 by conductive channel 313.Inductance coil wire 413 is connected with o pads 220.
See Fig. 8, arranged in parallel between inductance coil wire 408, inductance coil wire 410 and inductance coil wire 412.Between inductance coil wire 402, inductance coil wire 404 and inductance coil wire 406 arranged in parallel.Between inductance coil wire 401, inductance coil wire 403 and inductance coil wire 405 arranged in parallel.Between inductance coil wire 407 and inductance coil wire 401, there is angle.Between inductance coil wire 409, inductance coil wire 411 and inductance coil wire 413 arranged in parallel.And there is between inductance coil wire 408 and inductance coil wire 409 certain angle.There is between inductance coil wire 402 and inductance coil wire 401 certain angle.
Three-dimensional wire-wound inductor in the present embodiment, owing to the magnetic line of force of two-wire is the most overlapping, under identical volume, can effectively increase inductance value.Above in each embodiment, input pad 210 and o pads 220 are arranged at the surface of pcb board.Two ends after input pad 210 and o pads 220 are all sequentially connected with by corresponding conductive channel 300 with all inductance coil wires respectively by conductive channel 300 electrically connect.I.e. input pad 210 and o pads 220 is electrically connected with input and the outfan of open type distorted loop by conductive channel 300.
Compare with prior art uses the air core inductor of wire coiling, magnet ring wire-wound inductor and Si base or GaAs base plane inductance, above-mentioned three-dimensional wire-wound inductor uses two-layer or layer stereo structure to prepare inductance, be suitable to obtain the inductance value required for RF/Microwave Integrated Circuits, Q-value is moderate, it is possible to meets Practical Project and uses requirement.And this solid wire-wound inductor reliability is high, be suitable for batch production, can reduce debugging, shorten life cycle of the product, be of great immediate significance and practical value.
Single inductance coil, multiple independent inductance coil, multiple inductance coil having interconnected relationship, with separately or combined form application, or apply with other structure over all Integrations.In one embodiment, a kind of LC wave filter includes any one three-dimensional wire-wound inductor above-mentioned.This LC wave filter includes coupling electric capacity, resonant capacitance and resonant inductance.Wherein, resonant inductance uses above-mentioned any one three-dimensional wire-wound inductor in addition to embodiment three.
Concrete, seeing Fig. 9, coupling electric capacity includes coupling electric capacity C1, coupling electric capacity C3, coupling electric capacity C5, coupling electric capacity C7, coupling electric capacity C9 and coupling electric capacity C11.Resonant capacitance C2, resonant capacitance C4, resonant capacitance C6, resonant capacitance C8 and resonant capacitance C10.Resonant inductance includes resonant inductance L1, resonant inductance L3, resonant inductance L5, resonant inductance L7 and resonant inductance L9.Use the three-dimensional wire-wound inductor of the present invention, it is achieved LC wave filter, is an application of the present invention.
See Figure 10 and Figure 11, the present embodiment provides the 5 joint Surface Mount structure LC wave filter that a kind of three-dimensional wire-wound inductor using the present invention realizes.This LC wave filter includes multiple coupling electric capacity 20, multiple resonant inductance 10 and multiple resonant capacitance (figure is not marked).Coupling electric capacity 20 and resonant capacitance all can use leaded multilayer ceramic capacitor.The two ends of LC wave filter are provided with i/o pads 30.Compared with traditional LC wave filter, the LC wave filter in the present embodiment can use automatic attachment process, leaded multilayer ceramic capacitor and three-dimensional wire-wound inductor has once been mounted, has been suitable for batch production, can shorten the production cycle, reduce production cost.And there is the advantage that electrical performance indexes concordance is good, practical engineering application has important practical value.
In another embodiment, above-mentioned any one three-dimensional wire-wound inductor in addition to embodiment three is embedded in multi-layer PCB, reserves the attachment pad of capacity cell at PCB surface, thus realize the LC wave filter of Surface Mount structure.Seeing Figure 12, this LC wave filter can include coupling electric capacity, resonant capacitance, resonant inductance and coupling inductance.
Concrete, coupling electric capacity includes coupling electric capacity C13 and coupling electric capacity C16.Resonant capacitance includes resonant capacitance C12, resonant capacitance C14, resonant capacitance C15 and resonant capacitance C17.Resonant inductance includes resonant inductance L7 and resonant inductance L9.Coupling inductance includes coupling inductance L6, coupling inductance L8 and coupling inductance L10.Use the embedded three-dimensional wire-wound inductor of 5 layers of pcb board, compared with traditional LC wave filter, automatic attachment process can be used leaded multilayer ceramic capacitor once to have been mounted, be suitable for batch production, the production cycle can be shortened, reduce production cost.And there is the advantage that electrical performance indexes concordance is good.Figure 13 is the structural representation in an embodiment of Figure 12.
In one embodiment, transformator includes above-mentioned any one three-dimensional wire-wound inductor with intermediate contact pads 230, and has above-mentioned three-dimensional wire-wound inductor have the advantage that.
In one embodiment, equalizer includes above-mentioned any one three-dimensional wire-wound inductor with intermediate contact pads 230, and has above-mentioned three-dimensional wire-wound inductor have the advantage that.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all any amendment, equivalent and improvement etc. made within the spirit and principles in the present invention, should be included within the scope of the present invention.
Claims (10)
1. a three-dimensional wire-wound inductor, it is characterised in that include pcb board, input pad, o pads, multiple conductive channel and Duo Gen inductance coil wire；Wherein, described pcb board is dual dielectric layer or multi-medium-layer pcb board；
Each described conductive channel is all through two dielectric layers adjacent in described pcb board or multiple dielectric layer；
Every described inductance coil wire is arranged on the same dielectric layer of described pcb board；The two ends of every described inductance coil wire are connected with two described conductive channels respectively；At least two dielectric layer is provided with described inductance coil wire；
All described inductance coil wires are sequentially connected electrically by corresponding described conductive channel；
All described inductance coil wires be sequentially connected with by corresponding described conductive channel after be electrically connected to both ends of described input pad and described o pads.
Three-dimensional wire-wound inductor the most according to claim 1, it is characterised in that described conductive channel includes plated through-hole and conductor；Described conductor is arranged on inside described plated through-hole.
Three-dimensional wire-wound inductor the most according to claim 1, it is characterized in that, described input pad and described o pads are arranged at the electrical connection of the two ends after the surface of described pcb board, described input pad and described o pads are all sequentially connected with by corresponding described conductive channel with all described inductance coil wires respectively by conductive channel.
Three-dimensional wire-wound inductor the most according to claim 2, it is characterised in that also include intermediate contact pads；Described inductance coil wire is more than three；Described intermediate contact pads is arranged on the surface of described pcb board, between described input pad and described o pads；
Described intermediate contact pads is connected with described inductance coil wire by described conductive channel.
5. according to the three-dimensional wire-wound inductor described in claims 1 to 3 any one, it is characterised in that be parallel to each other between the described inductance coil wire of same layer；Between the described inductance coil wire of different layers, there is default angle.
6. according to the three-dimensional wire-wound inductor described in claims 1 to 3 any one, it is characterised in that described inductance coil wire is the band line graph according to preset pitch arrangement.
7. according to the three-dimensional wire-wound inductor described in claims 1 to 3 any one, it is characterised in that the printing plate of described dielectric layer is copper-clad plate.
8. a transformator, it is characterised in that include the three-dimensional wire-wound inductor described in claim 4.
9. an equalizer, it is characterised in that include the three-dimensional wire-wound inductor described in claim 4.
10. a wave filter, it is characterised in that include the three-dimensional wire-wound inductor described in any one in claim 1,2,3,5,6 and 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111834339A (en) * | 2019-04-23 | 2020-10-27 | 福建省福联集成电路有限公司 | Inductor structure for integrated circuit and manufacturing method |
| WO2022134847A1 (en) * | 2020-12-25 | 2022-06-30 | 京东方科技集团股份有限公司 | Substrate integrated with passive device and manufacturing method therefor |
| CN114928939A (en) * | 2022-05-12 | 2022-08-19 | 成都频岢微电子有限公司 | Radio frequency front end chip matching network structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103219139A (en) * | 2012-01-19 | 2013-07-24 | 财团法人工业技术研究院 | Inductance structure |
| CN104272406A (en) * | 2012-05-03 | 2015-01-07 | 高通Mems科技公司 | Three-dimensional multilayer solenoid transformer |
| CN204906863U (en) * | 2015-06-10 | 2015-12-23 | 马瑞利汽车电子(广州)有限公司 | Utilize inductor and wave filter of printed circuit board preparation |
-
2016
- 2016-07-15 CN CN201610559188.2A patent/CN105957691A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103219139A (en) * | 2012-01-19 | 2013-07-24 | 财团法人工业技术研究院 | Inductance structure |
| CN104272406A (en) * | 2012-05-03 | 2015-01-07 | 高通Mems科技公司 | Three-dimensional multilayer solenoid transformer |
| CN204906863U (en) * | 2015-06-10 | 2015-12-23 | 马瑞利汽车电子(广州)有限公司 | Utilize inductor and wave filter of printed circuit board preparation |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111834339A (en) * | 2019-04-23 | 2020-10-27 | 福建省福联集成电路有限公司 | Inductor structure for integrated circuit and manufacturing method |
| WO2022134847A1 (en) * | 2020-12-25 | 2022-06-30 | 京东方科技集团股份有限公司 | Substrate integrated with passive device and manufacturing method therefor |
| CN114928939A (en) * | 2022-05-12 | 2022-08-19 | 成都频岢微电子有限公司 | Radio frequency front end chip matching network structure |
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