TW444309B - Improved leadframe structure with locked inner leads and process for manufacturing same - Google Patents

Improved leadframe structure with locked inner leads and process for manufacturing same Download PDF

Info

Publication number
TW444309B
TW444309B TW087100906A TW87100906A TW444309B TW 444309 B TW444309 B TW 444309B TW 087100906 A TW087100906 A TW 087100906A TW 87100906 A TW87100906 A TW 87100906A TW 444309 B TW444309 B TW 444309B
Authority
TW
Taiwan
Prior art keywords
leads
integrated circuit
patent application
lead frame
scope
Prior art date
Application number
TW087100906A
Other languages
Chinese (zh)
Inventor
Guiseppe D Bucci
Paul H Voisin
Original Assignee
Gcb Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gcb Technologies Inc filed Critical Gcb Technologies Inc
Application granted granted Critical
Publication of TW444309B publication Critical patent/TW444309B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/485—Material
    • H01L2224/48505—Material at the bonding interface
    • H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
    • H01L2224/486—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/48638—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/48639—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/485—Material
    • H01L2224/48505—Material at the bonding interface
    • H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
    • H01L2224/486—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/48663—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/48664—Palladium (Pd) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/85438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/85439—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/85463—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/85464—Palladium (Pd) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01028—Nickel [Ni]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent

Abstract

An improved leadframe structure and process of manufacturing the same are provided. The leadframe includes a plurality of leads with inner portions extending toward an IC bonding pad within an IC encapsulation area. A polymer structure having a preselected configuration is provided to interlock the inner portions of the leads to prevent lateral, torsional and vertical displacement thereof during the IC packaging process, thus improving yield and reducing packaging cost.

Description

4443 Ο 9 經濟部智慧財產局員4消黄合作社印製 Α7 ------- Β7___五、發明説明（I ) 此專利申請係關於申請號08/744,520，於一九九六年 十一月五日申請之用於封裝積體電路之改良引線架結構及 製手壬’署名發明人係G. D. Bucci以及Paul Voisin，亦爲本 發明標的之發明人，且該案係讓與給本發明之受讓人， GCB科技，LLC。該案之揭示係納入於此，如同在此完整 地闡述。 本發明之背景 1·本發明之頜城 本發明係大致有關於半導體積體電路之封裝，且尤指 關於”引線架"，其在封裝後的積體電路與該外部環境之間 提供電氣連接。 2-祖關技術之背景 現今用於積體電路(IC's)封裝之引線架設計係具有許多 缺點，其導致成本增加以及產量降低。這些缺點之一部份 係被指出以及敘述於相關之申請號08/744,520中，其進一 步地確認且於此被納入作爲參考。 許多現用之引線架設計之另一缺點係在於該積體電路 包封體區域內以及相鄰積體電路安裝襯墊之該引線架之內 部部份係自由且無支撐的。在封裝製程進行時，該未支撐 之引線架容易移位或是受損。此易於移位或損壞之敏感性 係減慢該封裝製程之速度、增加成本且導致產量減少。該 問題在高引線數以及細微引線間距之設計顯得特別嚴重’ 其中該引線趨向於非常細微且易於碎裂。 ______3_________ 氏張尺度適用中國國家梯準（CNS ) Α4規格（210Χ 297公釐） i^I 、^-------漆 {請先閲讀背面之注意事項再填穿A頁) 4443 Ο 9 經濟部智慧財產局員工消費合作社印製 Α7 Β7______ 五、發明説明（/) 例如，在進行打線製程時，所期望的是連結介於該積 體電路及該內部引線之間的連接線之端點’盡量靠近積體 電路上之連結襯墊的中心以及該內部引線之中心。連結該 連接線之端點於該內部引線之中心係使得引線短路之機會 減至最低，其尤指非常細微之引線間距之設計。此亦令該 連結之強度達到最大，且令在非常細微之引線間距之設計 中的引線"捲曲，，之可能性降至最低’其中該引線係藉由微 蝕刻成形。此蝕刻導致引線該引線之頂部表面比底部表面 寬，其幫助較密之引線封裝，但此令該引線易於扭轉位移 ，或從偏離中心之連接“捲曲”出來。在該打線製程進行之 時或之前，該引線之側向移位係偏離中心連接之首要原因 〇 由於已知該內部引線易於產生此種移位，廣泛且昂貴 之測量用於偵測及預防此移位β —光學識別系統或視訊引 線定位器(VVL)在打線之前常用於定位該引線。然而，使 用視訊引線定位器以定位該引線典型地用去全製程時間之 30% »再者，該視訊引線定位器系統傾向比易於具有圓弧 之外型的蝕刻引線架更成功地用於易於具有直引線的沖壓 引線架。有時候，該視訊引線定位器設備可能因圓弧外形 的引線形狀而產生混淆且產生錯誤之讀値，導致偏離中心 之連接。因此，該視訊引線定位器系統對於高引線數目、 細引線間距之設計(典型地以蝕刻之方式）比起較低引線數 之設計(典型地以沖壓之方式)有較不易成功之傾向。再者 ，該視訊引線定位器設備傾向於非常昂貴》 ----------4_______ t悵尺度適用中國國家標準（CNS > Α4规格（2丨0X297公釐} (請先閲讀背面之注意事項再填矿λ頁) 裝· 訂 4443 0 9 ^ 經濟部智慧財產局員工消费合作社印製 五、發明説明（j) 一種習知用以在封裝製程進行時，預防引線移位之方 式係已經應用線帶之段於包封區域內之內部引線。通常使 用的線帶係包括Kpaton，其係由DuPont所製造、以及 UpUex，其係由Ube工業製造。該線帶係典型地在熱與壓 力之下、施加於該引線之一表面上1其通常係爲頂部。然 而不幸地，該線帶對於減少該引線之側向移位有些許作用 ，但對於預防扭轉或垂直移位則幾乎沒有效果。此引線移 位之型式導致共面性之喪失，係爲在引線架階段以及在打 線以前之產量損失之非常普遍的原因。該線帶方式之另一 種缺點係在於當使用該線帶之前，假若該引線已經移位， 則該線帶傾向於保持該引線於移位過之位置。再者，即使 該線帶適當地加以使用，而且該引線未移位，在進行封裝 製程時，該線帶仍無法一植有效地預防移位。 而該線帶方法之另一缺點係在於不同引線架設計、使 用者規格、以及封裝製程，在關於線帶之形狀之範圍內有 不同之需求。每一種形狀需要相對昂貴之機器及治具，以 剪切該線帶且放置於該引線架上所需要之位置。又更一步 地，該線帶本身傾向於相當昂貴，通常比該引線架金屬本 身昂貴兩倍。 因此對於改良內部引線之支撐結構，以提供進行封裝 製程時更有效預防引線移位之保護有著明顯之需求。所期 望的是該支撐結構能容易且低廉地使用。也期望的是該結 構比現行之線帶能更有效地預防側向移位之外，也能預防 扭轉及垂直之非共面移位。 _____5_ 本紙張尺度適用中國國家梯準（CNS ) A4規格（210 X 297公釐） ----------^-------------- 線 (請先閲讀背面之注意事項再填浐.人页) Α7 Β7 4443 Ο 9 五、發明説明（中） 本發明之一目的係在於提供一種引線支撐結構，其克 服現行線帶結構之缺點。 本發明之另一目的係在於提供此結構，其不僅有效地 預防側向之引線移位，亦能預防扭轉以及非共面移位，因 此降低或免除對於昂貴且耗時的視訊引線定位器設備與製 程之需要。 本發明之另一目的係在於提供此結構，其係容易及低 廉地使用且爲經濟的。 又本發明之另一目的係在於提供此結構，其與全部封 裝製程之其它步驟相容，而不加任何移除或是其它額外步 驟於該製程中。 發明槪論 本發明之一特點係爲一種改良的引線架結構以及製造 其之方法。該改良引線架結構係具有一框架、一襯墊，其 用於安裝一積體電路晶片、以及複數條引線，其內部部份 係朝向該襯墊延伸且外部部份係朝該框架延伸。該內部部 份具有用以與該積體電路晶片電氣連接之表面。一聚合物 製結構係連接至少一些引線之內部部份，以幫助在封裝製 程期間’預防移位或是損壞。 本發明之另一特點係爲一種改良的積體電路封裝以及 封裝製程’其係利用該改良的引線架結構。該改良的積體 電路封裝係包含具有一襯墊以及複數條引線之引線架。該 些引線具有朝該襯墊延伸之內部部份，並且提供用於電氣 ----------^-------tr-------ί ^ {請先聞讀背面之注意事項再填穸ί·寅) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家榡準（CNS) Α4規格（210χ297公釐） 經濟部智慧財產局員工消费合作社印奴 4443 0 9 a? B7 五、發明説明（< ) 連接該積體電路晶片之表面。一聚合物製結構係連接至少 一些引線之內部部份，以預防封裝製程期間之移位或損壞 。一積體電路晶片係安裝於該襯墊’且複數條電氣導體係 連接該積體電路以及該引線架。一種環氧樹脂結構係包封 該積體電路晶片、該襯墊、該電氣導體以及該些引線之內 部部份。該些引線之外部部份係延伸出該環氧樹脂°爲預 防在包封製程期間發生環氧材料之溢料，該引線架可包括 ~傳統節流棒(dambar)結構，其必需在包封製程之後移除 ’或是包括一第二聚合物製結構，其係納入成爲該封裝成 品之一部份。 圖式之簡要說明 圖1係一方形扁平封裝形狀之168接腳之引線架平面 視圖’其中線帶係用於內部之引線； 圖2係相鄰之內部引線之一部份之平面示意圖’其顯 示一較佳連接區域； 圖3係相鄰之內部引線之一部份之立體示意圖，其顯 示線帶結構應用於其上； 圖4係一顯示方形扁平封裝形狀之2〇8接腳之引線架 的平面視圖，其中一種根據本發明之聚合物製結構係嵌緊 該內部引線； 圖5係一顯示相鄰、相對方形之利用根據本發明之較 #聚合物製結構所嵌緊之內部引線的截面視圖；並且 圖6a及6b係一顯示相鄰、微蝕刻製造之利用根據本 家標準（CNS ) A4規格（210X2^7公釐） ~ I---------裝------訂-------線 (請先聞讀背面之注$項再填tv.λ頁) Α7 Β7 4443 〇9 五、發明説明（心） 發明之較佳聚合物製結構所嵌緊之內部引線圖示，該聚合 物係分別從該引線之頂部及底部加以施加= 主要元件代表圖號之簡要說明 10引線架 15框架 20開口 25襯墊 30引線 32內部部份 34外部部份 40節流棒 45寬度尺寸 5〇引線間距 55打線目標區域 50、65、70 尺寸 75線帶 8〇聚合物製結構 85表面 90引線 95連接棒 較佳實施例之詳細說明 根據本發明之一種改良引線架結構之目前爲較佳的實 施例可利用已知之沖壓或蝕刻或其它合適的方法加以製造 。本發明並不限於該引線架用何種方法製造。任何合適之 材料皆可用於該引線架，其係包括例如許多銅或鎳合金之 習知材料。本發明之適用性並不受限於該引線架所用之特 定材料。 此外，該引線架基本上可形成爲任何形狀’包括現在 已知之方形扁平封裝(QFP)、模塑載體環(MCR)、小外形 (S0)、晶片載體(CC)或雙排直列封裝(DIP)之形狀。本發明 ----------装------1Τ------- ^ (請先閲讀背面之注意事項再填rA.頁) 經濟部智慧財產局員工消費合作社印製 本&張尺度適ϋ困國家標準（CNS ) A4規格（2丨0><2*97公釐） 一 “43 09 at B7 經濟部智慧財產局員工消費合作杜印製 五、發明説明（fj ) 之適用性不限於形狀、引線接腳數目或該引線架之引線間 距。 適用於本發明之典型引線架之一範例係顯示於圖1 ^ 該引線架10，其以方形扁平封裝形狀顯示，係包括一外部 框架15。成千上百之此種引線架可根據習知之方法從一條 共同之材料帶來形成，且該外部引線架15在同一條帶中將 會相通的，直到個別之引線架分開爲止。該外部框架15典 型地包括一或多個放置與定位開口 20。所有該引線之功能 元件係相對於這些開口 20而精確地放置，以在該引線架之 成形以及該積體電路之封裝製程期間，促進該些元件之準 確安置該引線架亦包括該積體電路將裝置於其上之襯墊 或蹼狀物25，以及複數條引線30，在此例中係168條。 每一引線30均具有一鄰接該襯墊25之內部部份32 以及一外部部份34。該引線30之內部端係非連接該框架 15，即係自由的，而該外部端係連接於該框架15且受該框 架15支撐。靠近該端點之內部部份32係提供電氣連接該 積體電路之點，當該積體電路安裝於該襯墊之上時。在積 體電路包封或模封步驟期間，該內部部份32以及該自由端 係典型地包封於該積體電路。該外部部份34典型地延伸出 該積體電路封裝以提供與外部電氣元件與電路的電氣連接 之點。 一"節流棒”之結構40可用於連接該引線在介於其內部 及外部端之中間點處。如共同申請之相關申請案號 08/744,520所敘述，該節流棒40之主要目的係在進行模 ----------^------1T-----ΙΦ. {請先閱讀背面之注意Ϋ項再填K V頁) 本紙張尺度適用中國國家摞準（CNS ) A4規格（210X297公釐） “43 0 9 at B7 經濟部智慧財產局員工消费合作社印製 五、發明説明（3 ) 封或包封製程時作爲阻礙物，以預防環氧樹脂脫模或”流溢 ”至該外部引線。其次，該節流棒爲該引線提供額外之支撐 以輔助該引線在進行積體電路組裝時之相對位置。然而， 該引線架10之成形以不具有節流棒，且提供如申請案號 08/744,520所顯示以及敘述之聚合物製結構爲較佳的。如 其中所述，該聚合物製結構不僅提供一改良之阻礙物以在 進行該積體電路包封製程時預防"溢料"，亦爲該引線提供 改良之支撐。再者，不似在包封製程之後必需移除之節流 棒，該較佳之聚合物製結構係結合入該封裝成品。然而， 必須注意的是本發明適用於使用節流棒結構、聚合物製結 構、兩者之合倂或其它之引線架設計。 參考圖2，兩相鄰引線30之內部部份32之部份圖示 ，包括該自由端，係以平面圖表示。典型地，在至少許多 現行高引線數之設計中，該引線之寬度尺寸45將在約 0.006英吋之等級且引線間距50將在0.0035英吋之等級。 所要之打線目標區域55係由尺寸60及65或70所界定。 尺寸60係從鄰接該襯墊25 (如圖1所示)之內部引線32之 端、沿該引線30延伸回來約0.007英吋之長。尺寸6S係 包含約50%左右的引線之寬度，對稱於該引線之縱向中心 線，並且界定最佳之打線目標區域。然而’視引線厚度以 及成形其之方法而定，一稍微較寬之尺寸70 ’包含相對於 縱向中心係對稱之寬度之80%係可接受的。如前所提’在 該打線步驟進行之前由該引線3〇移位所造成之偏離中心之 連結，基於許多理由，係爲非常不願見到的’該些理由包 ----------¥------#------- ^ (請先閲讀背面之注意事項再填穿) 本紙張尺度通用中國國家標準（CNS ) A4規格（210X297公釐） 經濟部智慧財產局員工消f合作社印製 4443 0 9 a? Β7 五、發明説明（/) 括該引線之"捲曲"之潛在性、相鄰引線短路、以及欲連結 引線之連結不良。 參考圖1及3，在本發明之前，線帶75之一或多個區 段可施加於該引線30之內部部份32之一表面上，在進行 積體電路封裝時用以預防其移位。典型地，線帶75之一層 係具有一底面之黏性層80，將直接使用於該引線30之一 表面β如圖1所示，該線帶75將典型地用於該引線30之 內部部份上之將與該積體電路一起包封之區域。在提供一 節流棒結構40之處，如圖1所示，該線帶將使用介於該引 線30之內部部份與該節流棒結構之中間點。該線帶75可 被施加成爲如圖1所示之多重相互連接的帶、或是單一連 續之片，視特定的引線架形狀及封裝製程之需要而定。 然而，尤其如圖3所示，該線帶75將僅覆蓋該引線 30之一表面。該引線30將因例如一偏離中心之連結的扭 力而扭轉位移、或是垂直地位移，其導致喪失共面性。此 外，雖然如圖3所示之該引線30係相對彼此地在適當之位 置，若該引線30 —條或一條以上在應用該線帶75之前發 生移位，則該線帶75將傾向保持該引線於已移位之位置， 其導致在進行打線步驟時產生問題。 圖4_6顯示本發明之一目前較佳實施例，其克服許多 先前所敘述之缺點及問題。根據本發明，該引線架10係較 佳地提供一聚合物製結構80，其較佳地連接大致上所有引 線30。該聚合物製結構80可爲連續的，如圖4所示，或 是一或多個獨立的部分。該聚合物製結構80可爲封閉的， 本紙張尺度逍用中國國家榡率（CNS ) Α4规格{ 210X29?公釐） ----------种衣-------#------- (請先聞讀背面之注意事項再填穿乂頁) 4443 0 9 at B7 五、發明説明（㈧） 如圖4所示，或在一或多邊或角落處具有開口。視該引線 架之設計以及特定封裝製程需求而定，該聚合物製結構可 爲方形，如圖所示，或其它的形狀》 該聚合物製結構80通常較佳地在該引線30之內部部 份32之區域形成，其將與該積體電路一起包封。此將通常 介於該引線之內部部份32之自由端以及該節流棒40之間 ，若如圖顯示地提供其一，或在更佳之實施例中，取代節 流棒之該聚合物製結構，如共同申請之相關專利申請號 08/744,520所顯示及敘述。 該聚合物製結構80將較佳地與該引線30之內部部份 32以及該積體電路一起包封，且將在積體電路封裝之成品 中留存爲永久之部份。因此，該聚合物材料以和用於封裝 積體電路之環氧樹脂爲電氣以及化學相容爲較佳的。視使 用之環氧材料而定，任何在共同申請之相關專利申請號 08/744,520中指出之聚合物製材料皆爲合適的。 除了該聚合物製結構80之外，若需要時，該引線30 之內部部份32之自由端可經由一或多根連接棒95來加以 連接，用以提供額外支撐以及防止移位之保護。這些棒將 較佳地在進行引線架沖壓或蝕刻時成形，且在打線之前可 在標準襯墊25向下設定(downset)之操作同時加以移除。 連接結構之成形與移除皆爲熟習此項技術者所熟知，而對 於完全了解本發明是不須做進一步之敘述。 尤其如圖5及6所示，該聚合物製結構80較佳地以三 維方式連接相鄰之引線以大致防止側向、垂直、與扭轉移 ----------I-- (请先聞讀背面之注$項再填产k頁) 訂 線 經濟部智慧財產局員工消費合作杜印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 4443 Ο 9 Α7 Β7 經濟部智慧財產局員工消費合作社印製 五、發明説明（丨1 ) 位。較佳地，該聚合物製結構在沖壓或蝕刻之後，且在安 裝一積體電路於襯墊25上之前係被施加到該引線架。 用以施加該聚合物材料於該些引線30之較佳的製程係 在共同申請之相關專利申請案號08/744,520中敘述。該引 線架可放置緊靠一底板或其他支撐結構。插銷可被設置以 嚙合該引線架之標準定位孔20，以保持該引線架在確知且 固定之位置。該聚合物材料可隨後被施加於所要的位置處 。然而，不似在共同申請之相關專利申請案號08/744,520 所述之製程，通常爲了達到現在所需要之目標及目的，施 加該聚合物材料於該引線之上下兩面是非必需的。施加足 夠量之聚合物材料以在引線90之間以及在該些表面85之 一表面上流動通常係足夠。然而，若有需要，在共同申請 相關專利申請案號08/744,520中所示及描述之引線的完全 包封可加以進行。該聚合物材料可從引線架之頂部或底部 施加。特別如圖6a及6b所示，當該聚合物從該頂部施加 時’聚合物材料將較佳地連接該引線之頂部表面（圖6a)， 且當該聚合物從該底部施加時，聚合物材料將較佳地連接 該引線之底部表面(圖6b)。 另一與共同申請之相關專利申請案號08/744,520所敘 述之製程不同之處係在於因爲該聚合物製結構80將不涉入 成形一阻封，以在進行積體電路包封時預防"溢料"，因此 該聚合物可在施加至引線之後以及包封之前完全地硬化， 其以藉由紫外線硬化爲較佳的。然而，若在包封前只需要 部份地硬化該聚合物材料，則該包封製程本身可完成該硬 ----------奸衣------1T------ί ^ (請先閲讀背面之注意事項再填{4 \貢) 本紙張尺度適用中國國家樣準（CNS ) Α4規格（210><297公釐> 4443 Ο 9 Α7 Β7 經濟部智慧財產局員工消費合作社印製 五、發明説明（γ) 化步驟。在任一情況中，在共同申請之相關專利申請案號 08/744,520所敘述之硬化製程及參數均適用於硬化聚合物 製結構80。 該聚合物材料之黏度可由共同申請之相關專利申請案 號08/744,520所敘述之方式加以控制。在該引線之平面表 面上’該結構之所需要的寬度尺寸以及深度將視引線之厚 度、引線之間距 '以及所需支撐之量而定。然而，通常提 供足夠之厚度及深度以大致包封該引線至少三面於該結構 內，且以預防該引線至少三種方向之移位爲較佳的。 相似地，從底部或從頂部施加該聚合物材料將視特定 引線架或封裝製程而定。例如，由沖壓成形之引線架傾向 於具有方形形狀之引線30，如圖5所示。在此情況中， 該聚合物材料從頂部或底部施加可能有些許不同。然而， 在引線架具有以微蝕刻方式成形之引線30的情況下，如圖 6a及6b所示，該引線可能大致上頂部之寬度較底部之寬 度大。在此情況下，從底部施加該聚合物材料可能是較佳 的，特別如圖6b之顯示，以消除在施加該材料時該引線發 生捲曲之潛在可能。當然，若需要額外之支撑時，該聚合 物材料可在該引線及雙面之間施加，如共同申請之相關專 利申請案號08/744,520所顯示及敘述。 較佳地在該聚合物製結構80被施加於該引線30之內 部部份之後，一積體電路晶片係安裝於該襯墊25之上。電 氣傳導之連結線隨後係連接在該引線30之內部部份之表面 55以及該積體電路晶片之間。對於熟習安裝該積體電路晶 -U________ 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公嫠） ' I---------^------1Τ------0 (請先閡讀背面之注f項再填穸.\頁) 4443 Ο 9 五、發明説明（\々） 片於該連接襯塾以及連接該積體電路晶片與引線之技術者 ’許多合適之方法以及材料係廣爲熟知。故無須做詳細敘 述，就能完全了解本發明。 隨後安裝該積體電路晶片於該襯墊並且連接該積體電 路晶片與該引線’該積體電路以及該引線之內部部份較佳 地包封於一種環氧封裝之中，典型地經由環氧樹脂模封製 程。許多合適之環氧材料以及模封製程對於熟習用於此目 的之技術者係習知’且無須做詳細敘述以更了解本發明。 然而，在無節流棒之引線架設計之情況下，其具有一第二 聚合物製結構以取代節流棒，一種較佳模封製程係顯示且 敘述於共同申請之相關專利申請案號08/744,520中。 本發明之此較佳實施例之先前描述係僅經由範例爲之 ，而無意限制本發明之範圍。許多在材料、設計、尺寸及 相類似之性質所做之變更仍未脫離本發明之精神，此對於 熟知此技術者將非常明顯，其發明之範圍將僅經由附加之 申請專利範圍加以界定。 ----------^------1T-------.^ (請先聞讀背面之注意^項再填K..,.頁) 經濟部智慧財產局員工消費合作社印製 一張 一紙 本 通 縣 -S 規 Α4 S Ν . 一釐 公 97 24443 Ο 9 Member of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 Printed by the Yellow Cooperatives A7 ------- Β7 ___ V. Description of the Invention (I) This patent application is for application number 08 / 744,520, and was issued in November 1996 Improved lead frame structure and hand piece for packaging integrated circuits applied on May 5 'The inventors are GD Bucci and Paul Voisin, and are the inventors of the subject invention, and this case is assigned to the invention Assignee, GCB Technology, LLC. The disclosure of the case is incorporated here, as it is set out in its entirety here. BACKGROUND OF THE INVENTION 1. The Jaw City of the Invention The present invention relates generally to the packaging of semiconductor integrated circuits, and more particularly to "lead frames", which provides electrical power between the packaged integrated circuit and the external environment. Connections 2-Background of Zuguan Technology Today's leadframe designs for integrated circuit (IC's) packages have a number of disadvantages that lead to increased costs and reduced yield. One of these disadvantages is pointed out and described in relation In Application No. 08 / 744,520, it is further identified and incorporated herein by reference. Another disadvantage of many current leadframe designs is the area of the integrated circuit package and the adjacent integrated circuit circuit mounting pads. The internal part of the lead frame is free and unsupported. During the packaging process, the unsupported lead frame is easily displaced or damaged. This sensitivity to easy displacement or damage slows down the packaging process. Speed, increased cost and reduced yield. This problem is particularly serious in designs with high lead counts and fine lead pitches, where the leads tend to be very fine and easily broken ______3_________ The Zhang scale is applicable to China National Standard (CNS) A4 specification (210 × 297 mm) i ^ I, ^ ------- paint {Please read the precautions on the back before filling in page A) 4443 〇 9 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Α7 Β7 ______ 5. Description of the Invention (/) For example, in the wire bonding process, what is expected is a connection line connecting the integrated circuit and the internal lead. The end point 'is as close as possible to the center of the connection pad on the integrated circuit and the center of the internal lead. The end point connecting the connection line to the center of the internal lead minimizes the chance of the short circuit of the lead, especially very fine The design of the lead pitch. This also maximizes the strength of the connection and minimizes the possibility of "curling" of the leads in a very fine lead pitch design, where the leads are formed by micro-etching This etch causes the top surface of the lead to be wider than the bottom surface, which helps dense lead packaging, but this makes the lead easily torsionally displaced, or "curls" out of the off-center connection At the time of or before the wire bonding process, the lateral displacement of the lead is the primary reason for the off-center connection. As the internal lead is known to be prone to such displacement, extensive and expensive measurements are used to detect and Preventing this shift β—Optical identification systems or video lead locators (VVLs) are often used to locate the lead before wiring. However, using a video lead locator to locate the lead typically takes 30% of the total process time »more The video lead locator system tends to be more successfully used in stamped lead frames that are prone to have straight leads than etched lead frames that are susceptible to arcs. Sometimes, the video lead locator device may have arc-shaped leads Confusion and erroneous reading caused by the shape, leading to off-center connections. Therefore, the video lead locator system tends to be less successful for designs with high lead counts and fine lead pitch (typically by etching) than designs with lower lead counts (typically by punching). Moreover, the video lead locator device tends to be very expensive. "---------- 4_______ t 怅 size applies to Chinese national standards (CNS > Α4 specifications (2 丨 0X297 mm) (Please read the back first Note for refilling λ page) Binding and ordering 4443 0 9 ^ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (j) A method used to prevent lead displacement during the packaging process The internal leads in the envelope area have been applied with a wire band. Commonly used wire bands include Kpaton, which is manufactured by DuPont, and UpUex, which is manufactured by Ube Industries. The wire bands are typically in the heat It is usually tied to the top under pressure and applied to one of the surfaces of the lead. Unfortunately, however, the tape has a little effect on reducing the lateral displacement of the lead, but almost prevents it from twisting or vertical displacement. No effect. The loss of coplanarity caused by this type of lead displacement is a very common reason for the loss of production at the lead frame stage and before wiring. Another disadvantage of the tape method is that when using the tape Previously, if the lead had been shifted, the tape tended to keep the lead in the shifted position. Furthermore, even if the tape is used properly and the lead is not shifted, during the packaging process, The wire tape still cannot effectively prevent displacement. Another disadvantage of the wire tape method is that different lead frame designs, user specifications, and packaging processes have different needs within the scope of the shape of the wire tape. Each shape requires relatively expensive machines and fixtures to cut the wire and place it on the lead frame. Furthermore, the wire itself tends to be quite expensive, usually more expensive than the lead frame The metal itself is twice as expensive. Therefore, there is a clear need to improve the support structure of the internal leads to provide more effective protection against lead displacement during the packaging process. It is desirable that the support structure can be used easily and inexpensively. It is also expected What's more, this structure can prevent lateral displacement more effectively than the current line belt, and can also prevent twist and vertical non-coplanar displacement. __5_ This paper ruler Applicable to China National Ladder Standard (CNS) A4 specification (210 X 297 mm) ---------- ^ -------------- (Please read the Note for refilling. Man page) Α7 Β7 4443 Ο 9 V. Description of the invention (middle) One object of the present invention is to provide a lead support structure that overcomes the shortcomings of the current wire and tape structure. Another object of the present invention is The purpose is to provide this structure, which not only effectively prevents lateral lead displacement, but also prevents twisting and non-coplanar displacement, thus reducing or eliminating the need for expensive and time-consuming video lead locator equipment and manufacturing processes. Another object is to provide such a structure, which is easy and inexpensive to use and economical. Yet another object of the present invention is to provide such a structure, which is compatible with other steps of the entire packaging process without any removal or other additional steps in the process. Summary of the Invention One of the features of the present invention is an improved lead frame structure and a method for manufacturing the same. The improved lead frame structure has a frame, a pad for mounting an integrated circuit chip, and a plurality of leads, and an inner portion thereof extends toward the pad and an outer portion thereof extends toward the frame. The internal portion has a surface for electrical connection with the integrated circuit chip. A polymer structure is connected to the internal portions of at least some of the leads to help prevent displacement or damage during the packaging process. Another feature of the present invention is an improved integrated circuit package and packaging process', which utilizes the improved lead frame structure. The improved integrated circuit package includes a lead frame having a pad and a plurality of leads. The leads have internal portions that extend toward the pad and are provided for electrical use ---------- ^ ------- tr ------- ί ^ {Please Note on the back of the reading, please fill in again. Yin) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs of the Consumer Cooperatives. The paper size is applicable to the Chinese National Standards (CNS) Α4 specification (210 × 297 mm). Slave 4443 0 9 a? B7 5. Description of the invention (<) The surface of the integrated circuit chip is connected. A polymer structure is connected to the internal portion of at least some of the leads to prevent displacement or damage during the packaging process. An integrated circuit chip is mounted on the pad 'and a plurality of electrical conduction systems are connected to the integrated circuit and the lead frame. An epoxy resin structure encloses the integrated circuit chip, the pad, the electrical conductor, and inner portions of the leads. The external parts of the leads extend out of the epoxy. In order to prevent flashover of the epoxy material during the encapsulation process, the lead frame may include a traditional dambar structure, which must be encapsulated. Removal after the process' or includes a second polymer structure that is incorporated as part of the packaged finished product. Brief description of the drawings Figure 1 is a plan view of a lead frame of 168 pins in a square flat package shape, wherein the wire ribbon is used for internal leads; Figure 2 is a schematic plan view of a part of an adjacent internal lead; Shows a better connection area; Figure 3 is a schematic perspective view of a part of an adjacent internal lead, which shows the wire strip structure applied to it; Figure 4 is a lead of 208 pins showing the shape of a square flat package A plan view of a frame, in which a polymer structure according to the present invention is embedded in the inner lead; FIG. 5 is a diagram showing adjacent, relatively square inner leads which are embedded using a #polymer structure according to the present invention 6a and 6b show the use of adjacent, micro-etched manufacturing according to our standard (CNS) A4 specification (210X2 ^ 7 mm) ~ I -------- install --- --- Order ------- line (please read the note $ on the back and then fill in the tv.λ page) Α7 Β7 4443 〇9 5. Description of the invention (Heart) The best polymer structure of the invention Illustration of the clamped inner lead, the polymer is applied from the top and bottom of the lead respectively = The main components represent the brief description of the drawing number 10 lead frame 15 frame 20 opening 25 pad 30 lead 32 internal part 34 external part 40 throttle rod 45 width dimension 50 lead pitch 55 wiring target area 50, 65, 70 size 75 Detailed description of the preferred embodiment of the wire rod 80 polymer structure 85 surface 90 lead 95 connecting rod According to the present invention, an improved lead frame structure is currently the preferred embodiment, which can be known by stamping or etching or other suitable Method to manufacture. The present invention is not limited to the method by which the lead frame is manufactured. Any suitable material can be used for the lead frame, which is a conventional material including, for example, many copper or nickel alloys. The applicability of the present invention is not limited to the specific materials used in the lead frame. In addition, the leadframe can be formed in almost any shape, including what is now known as a square flat package (QFP), a molded carrier ring (MCR), a small form factor (S0), a wafer carrier (CC), or a dual-row in-line package (DIP) ) Shape. This invention ---------- Installation ----- 1T ------- ^ (Please read the notes on the back before filling rA. Page) Employees ’Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Printed book & National Standard (CNS) A4 specification (2 丨 0 > < 2 * 97 mm) for a printed version 1 "43 09 at B7 Consumer cooperation between employees of the Intellectual Property Bureau of the Ministry of Economic Affairs. The applicability of the description (fj) is not limited to the shape, the number of lead pins, or the lead pitch of the lead frame. An example of a typical lead frame suitable for the present invention is shown in FIG. 1 ^ The lead frame 10 is a square flat package The shape shows that it includes an outer frame 15. Hundreds of such lead frames can be formed from a common material belt according to conventional methods, and the outer lead frames 15 will communicate in the same strip until The individual lead frames are separated. The outer frame 15 typically includes one or more placement and positioning openings 20. All functional elements of the leads are accurately placed relative to the openings 20 to shape the lead frame and the During the packaging process of integrated circuits, promote the accuracy of these components The placement of the lead frame also includes the pad or web 25 on which the integrated circuit is to be mounted, and a plurality of leads 30, in this case 168. Each lead 30 has an abutting pad The inner portion 32 of 25 and an outer portion 34. The inner end of the lead 30 is not connected to the frame 15, that is, free, and the outer end is connected to and supported by the frame 15. Close to the The internal portion 32 of the endpoint provides a point for electrically connecting the integrated circuit when the integrated circuit is mounted on the pad. During the integrated circuit encapsulation or molding step, the internal portion 32 and The free end is typically encapsulated in the integrated circuit. The external portion 34 typically extends out of the integrated circuit package to provide points of electrical connection with external electrical components and circuits. A "throttle rod" The structure 40 can be used to connect the lead at an intermediate point between its inner and outer ends. As described in the related application No. 08 / 744,520 of the joint application, the main purpose of the throttle rod 40 is to perform the mold ------------ ^ ------ 1T ----- ΙΦ . (Please read the note on the back first and then fill in the KV page) This paper size applies to China National Standard (CNS) A4 (210X297 mm) "43 0 9 at B7 3. Description of the invention (3) It acts as an obstacle during the sealing or encapsulation process to prevent the epoxy resin from being demolded or "overflowing" to the external lead. Secondly, the throttling rod provides additional support for the lead to assist the lead in The relative position when the integrated circuit is assembled. However, the lead frame 10 is formed without a throttling rod, and it is preferable to provide a polymer structure as shown and described in Application No. 08 / 744,520. As mentioned, the polymer structure not only provides an improved obstruction to prevent " overfill " during the integrated circuit encapsulation process, but also provides improved support for the lead. Furthermore, it does not seem to Throttle rods that must be removed after the sealing process, the preferred polymer structure It is incorporated into the packaged product. However, it must be noted that the present invention is applicable to a lead frame design using a throttle rod structure, a polymer structure, a combination of the two, or other. Referring to FIG. 2, two adjacent leads 30 A partial illustration of the inner portion 32, including the free end, is shown in a plan view. Typically, in at least many current designs with high lead counts, the width of the lead 45 will be on the order of 0.006 inches and the lead The pitch 50 will be on the order of 0.0035 inches. The desired target area 55 is defined by sizes 60 and 65 or 70. The size 60 is from the end of the inner lead 32 adjacent to the pad 25 (shown in Figure 1), It extends back about 0.007 inches along the lead 30. The size 6S includes about 50% of the width of the lead, is symmetrical to the longitudinal centerline of the lead, and defines the optimal target area for the wire. However, 'depending on the thickness of the lead and Depending on the method by which it is formed, a slightly wider dimension 70 'including 80% of the width symmetrical with respect to the longitudinal center is acceptable. As mentioned previously,' the lead 30 is shifted before the wire bonding step is performed. Made by The off-center link is, for many reasons, a very unwilling to see 'these reasons package ---------- ¥ ------ # ------- ^ ( Please read the precautions on the back before filling in) The paper size is in accordance with the Chinese National Standard (CNS) A4 specification (210X297 mm). It is printed by the staff of the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by the cooperative 4443 0 9 a? Β7 V. Description of the invention ( /) Including the potential of " curl " of the lead, short circuit of adjacent leads, and poor connection of the leads to be connected. Referring to Figures 1 and 3, before the present invention, one or more sections of the tape 75 may It is applied to one surface of the inner portion 32 of the lead 30 to prevent its displacement when the integrated circuit is packaged. Typically, one layer of the wire strip 75 has an adhesive layer 80 with a bottom surface, which will be directly used on one surface of the lead 30 as shown in FIG. 1. The wire strip 75 will typically be used on the inner portion of the lead 30. Share the area that will be enclosed with the integrated circuit. Where a throttling rod structure 40 is provided, as shown in Fig. 1, the wire strip will use an intermediate point between the inner portion of the lead 30 and the throttling rod structure. The wire tape 75 can be applied as multiple interconnected tapes as shown in FIG. 1 or a single continuous piece, depending on the specific lead frame shape and the needs of the packaging process. However, as shown in FIG. 3 in particular, the wire strip 75 will cover only one surface of the lead 30. The lead 30 will be twisted or displaced vertically by, for example, an off-center linking torque, which results in a loss of coplanarity. In addition, although the leads 30 are in a suitable position relative to each other as shown in FIG. 3, if the lead 30 or more is displaced before applying the strap 75, the strap 75 will tend to maintain the The leads are in a displaced position, which causes problems during the wiring step. Figures 4-6 show a presently preferred embodiment of the present invention which overcomes many of the disadvantages and problems previously described. According to the present invention, the lead frame 10 preferably provides a polymer structure 80 which is preferably connected to substantially all of the leads 30. The polymer structure 80 may be continuous, as shown in Fig. 4, or one or more separate parts. The polymer structure 80 may be closed, and the paper size is in accordance with the Chinese National Standard (CNS) A4 specification {210X29? Mm) ---------- seed coat ------- # ------- (Please read the notes on the back before filling in the title page) 4443 0 9 at B7 V. Description of the invention (㈧) As shown in Figure 4, or with one or more sides or corners Opening. Depending on the design of the lead frame and specific packaging process requirements, the polymer structure may be square, as shown in the figure, or other shapes. The polymer structure 80 is usually preferably located inside the lead 30. A region of part 32 is formed, which will be encapsulated with the integrated circuit. This will usually be between the free end of the inner portion 32 of the lead and the throttle rod 40. If one is provided as shown, or in a better embodiment, the polymer rod of the throttle rod is replaced. Structure, as shown and described in related patent application No. 08 / 744,520. The polymer structure 80 is preferably encapsulated with the inner portion 32 of the lead 30 and the integrated circuit, and will remain as a permanent part in the finished product of the integrated circuit package. Therefore, it is preferable that the polymer material is electrically and chemically compatible with the epoxy resin used to package the integrated circuit. Depending on the epoxy material used, any of the polymeric materials indicated in the related patent application No. 08 / 744,520 of the joint application is suitable. In addition to the polymer structure 80, the free end of the inner portion 32 of the lead 30 can be connected via one or more connecting rods 95, if necessary, to provide additional support and protection against displacement. These rods will preferably be formed during leadframe stamping or etching, and can be removed simultaneously with the standard pad 25 downset operation prior to wire bonding. The formation and removal of connection structures are well known to those skilled in the art, and further description is not necessary for a complete understanding of the present invention. As shown in FIGS. 5 and 6 in particular, the polymer structure 80 preferably connects adjacent leads in a three-dimensional manner to substantially prevent lateral, vertical, and twisting transfers. (Please read the note on the back of $ before filling in page k.) The consumer cooperation of the Intellectual Property Bureau of the Ministry of Economic Affairs and Du Du printed this paper to apply the Chinese National Standard (CNS) A4 (210X297 mm) 4443 Ο 9 Α7 Β7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of invention (丨 1). Preferably, the polymer structure is applied to the lead frame after stamping or etching and before mounting a integrated circuit on the pad 25. A preferred process for applying the polymer material to the leads 30 is described in the related patent application No. 08 / 744,520 of the joint application. The lead frame can be placed next to a base plate or other support structure. The latch may be provided to engage the standard positioning hole 20 of the lead frame to keep the lead frame in a known and fixed position. The polymer material can then be applied at the desired location. However, unlike the process described in the related patent application No. 08 / 744,520 of the common application, it is generally not necessary to apply the polymer material on the upper and lower sides of the lead in order to achieve the goals and objectives currently required. It is usually sufficient to apply a sufficient amount of polymer material to flow between the leads 90 and on one of the surfaces 85. However, if necessary, complete encapsulation of the leads shown and described in the related patent application No. 08 / 744,520 can be performed. The polymer material can be applied from the top or bottom of the lead frame. As shown particularly in Figures 6a and 6b, when the polymer is applied from the top, the 'polymer material will preferably connect to the top surface of the lead (Figure 6a), and when the polymer is applied from the bottom, the polymer The material will preferably connect to the bottom surface of the lead (Figure 6b). Another difference from the process described in the related patent application No. 08 / 744,520 of the joint application is that the polymer structure 80 will not involve forming a barrier seal to prevent " "Flash", so the polymer can be completely hardened after being applied to the lead and before encapsulation, which is preferably hardened by ultraviolet rays. However, if the polymer material only needs to be partially hardened before encapsulation, the encapsulation process itself can complete the hard ------------ rape garments ----- 1T --- --- ί ^ (Please read the notes on the back before filling in {4 \ tribute) This paper size applies to China National Standard (CNS) Α4 size (210 > < 297mm > 4443 Ο 9 Α7 Β7 Ministry of Economy Printed by the Intellectual Property Bureau's Consumer Cooperatives. 5. The description of the invention (γ). In any case, the hardening process and parameters described in the related patent application No. 08 / 744,520 of the common application are applicable to the structure of the hardened polymer. 80. The viscosity of the polymer material can be controlled in the manner described in the related patent application No. 08 / 744,520 of the joint application. On the plane surface of the lead, 'the required width dimension and depth of the structure will depend on the thickness of the lead , The distance between the leads' and the amount of support required. However, usually sufficient thickness and depth are provided to substantially encapsulate the lead at least three sides within the structure, and it is better to prevent the lead from being displaced in at least three directions. Similarly, from the bottom or The application of the polymer material on top will depend on the particular lead frame or packaging process. For example, a lead frame formed by stamping tends to have a square shaped lead 30, as shown in Figure 5. In this case, the polymer material starts from The top or bottom application may be slightly different. However, in the case where the lead frame has a micro-etched lead 30, as shown in Figs. 6a and 6b, the lead may be substantially wider at the top than at the bottom. In this case, it may be better to apply the polymer material from the bottom, especially as shown in Figure 6b, to eliminate the potential for the lead to curl when the material is applied. Of course, if additional support is needed, the polymer Material can be applied between the lead and both sides, as shown and described in the related patent application No. 08 / 744,520 of the common application. Preferably, the polymer structure 80 is applied to the inner portion of the lead 30 Thereafter, an integrated circuit chip is mounted on the pad 25. The electrically conductive connecting wire is then connected to the surface 55 of the inner portion of the lead 30 and the integrated circuit Between the chips. For the familiar installation of the integrated circuit crystal-U ________ This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 cm) 'I --------- ^ ------ 1T ------ 0 (Please read the note f on the back before filling in. \ Page) 4443 Ο 9 V. Description of the invention (\ 々) A piece on the connection liner and the integrated circuit chip and the lead Many suitable methods and materials are well known to the skilled person. Therefore, the present invention need not be described in detail to fully understand the present invention. Subsequently, the integrated circuit chip is mounted on the pad and connected to the integrated circuit chip and the lead. The integrated circuit and the inner portion of the lead are preferably encapsulated in an epoxy package, typically through an epoxy molding process. Many suitable epoxy materials and molding processes are well known to those skilled in the art 'and need not be described in detail to better understand the present invention. However, in the case of a lead frame design without a throttling rod, it has a second polymer structure to replace the throttling rod. A preferred molding process is shown and described in the related patent application number 08 of the common application. / 744,520. The previous description of this preferred embodiment of the present invention is by way of example only, and is not intended to limit the scope of the present invention. Many changes in materials, design, dimensions, and similar properties have not deviated from the spirit of the present invention. It will be apparent to those skilled in the art that the scope of their invention will be defined only by the scope of additional patent applications. ---------- ^ ------ 1T -------. ^ (Please read the notes on the back ^ before filling in K ..,. Pages) Intellectual Property of the Ministry of Economic Affairs Bureau Consumer Consumption Cooperative Printed a Paper-on-Tong County-S Code A4 S Ν. One centimeter 97 2

Claims (1)

4443 0 9 Λ8 Β8 C8 D8 經濟部智慧財產局員工消费合作社印製 六、申請專利範圍 1-一種用於封裝積體電路晶片之改良引線架結構，其 係包含： 一用以安裝一裸露的積體電路晶片之襯墊； 一大致環繞該襯墊之框架； 複數條引線，其具有內部部份及外部部份，該內部部 份係朝該襯墊延伸且提供用以與該積體電路晶片電氣連接 之表面，且該外部部份朝該框架延伸；以及 一聚合物製結構，其係個別地形成在至少一些引線之 內部部份的表面之上以及之間，藉以永久地連接至少一些 引線之內部部份，以避免在製造期間內引線的移位，該聚 合物製結構係適合用於與該積體電路晶片包封在一個封裝 成品中，而不需移除。 2. 如申請專利範圍第1項之引線架結構，其中該些引 線之外部部份具有外部端’該些外部端係連接至該引線架 結構，且該些引線之內部部份係具有鄰接該襯墊之內部自 由端。 3. 如申請專利範圍第1項之引線架結構，其中該些引 線之內部部份係具有鄰接該襯墊之內部端’且至少—些內 部端係互相連結。 4. 如申請專利範圍第1項之引線架結構，其中該聚合 物製結構係爲一封閉結構。 5. 如申請專利範圍第1項之引線架結構，其中該聚合 物製結構係環狀且連接大致所有的引線之內部部份° 6. 如申請專利範圔第1項之引線架結構’其中該聚合 __. __]______ __ 本紙張纽it财CNS ) Μ麟（2丨㈣97公釐） ---------S------訂------^ * (請先閎讀背面之注意事項再填寫本頁〕 4443 09 A8 B8 C8 D8 六、申請專利範圍 物製結構包含一種材料’其係從一個包含聚醯胺酸、聚醯 胺醋、聚(醯胺-亞胺）、丙烯酸酯、甲基丙烯酸酯、氰酸酯 以及環氧樹脂之群組中選擇。 7.如申請專利範圍第6項之引線架結構，其中該材料 係可以輻射進行硬化的。 8_如申請專利範圍第7項之引線架結構，其中該輻射 係紫外線。 9. 如申請專利範圍第1項之引線架結構，其包括一節 流棒’其在介於該些引線的內部部份及外部部份之中間連 接至少一些引線。 10. 如申請專利範圍第1項之引線架結構，其包括一第 二聚合物製結構，其在介於該些引線的內部部份及外部部 份之中間連接至少一些引線。 11-—種用以製造一個用於封裝一積體電路晶片之改良 引線架結構之方法，其係包含： 形成一引線架結構，該引線架結構係包括： 一用以安裝一裸露的積體電路晶片之襯墊； 一大致上環繞該襯墊之框架； 具有內部部份以及外部部份之複數條引線，該些內部 部份係朝向該襯墊延伸並且提供與該積體電路晶片電氣連 接之表面，且該外部部份係朝向該框架延伸；並且 個別地在至少一些引線之內部部份的表面之上以及之 間形成一聚合物製結構，藉以永久地連接至少一些引線之 內部部份，以避免在製造期間內引線的移位，該聚合物製 ______—_2_____；____ 本紙張尺度適用中國國家棵準（CNS ) A4規格（210X297公釐） (請先《讀背面之注意事項再填寫本頁) '?! 線· 1 經濟部智慧財產局員工消費合作社印製 A8 ΰ8 C8 D8 4443 0 9 六、申請專利範圍 結構係適合用於與該積體電路晶片包封在一個封裝成品中 ’而不需移除。 12. 如申請專利範圍第u項之方法，其中該些引線之 外部部份係具有連接於該框架結構之外部端，並且該些引 線之內部部份係具有鄰接該観墊之內部自由端。 13. 如申請專利範圍第11項之方法，其中該些引線之 內部部份係具有鄰接該襯墊之內部端，並且至少一些內部 端係互相連接。 H.如申請專利範圍第11項之方法，其中該聚合物製 結構係爲一封閉結構。 15.如申請專利範圍第11項之方法，其中該聚合物製 結構係環狀且連接大致所有引線之內部部份。 16·如申請專利範圍第11項之方法，其中該聚合物製 結構包含一種材料，其係從一個包含聚醯胺酸、聚醯胺酯 、聚(醯胺-亞胺）、丙烯酸酯、甲基丙烯酸酯以及環氧樹脂 之群組中選擇。 Π.如申請專利範圍第16項之方法，其中該材料係可 以輻射進行硬化的。 18. 如申請專利範圍第Π項之方法’其中該輻射係紫 外線。 19. 如申請專利範圍第11項之方法，其中該引線架結 構係包括一節流棒，其在介於該些引線的內部部份及外部 部份之中間連接至少一些引線。 2〇.如申請專利範圍第11項之方法，其中該引線架結 _ _______3________ 本紙張尺度適用中國國家#率（CNS ) A4規格（210X297公釐） {請先閲讀背面之注$項再填寫本頁) 訂 線 經濟部智慧財產局員工消費合作社印製 4443 0 9 Λ8 BS C8 D8 經濟部智慧財產局員工消費合作社印製 六、申請專利範圍 構係包括一第二聚合物製結構，其在介於該些引線的內部 部份及外部部份之中間連接至少一些引線。 21·—種改良的積體電路封裝，其係包含： 一引線架，其係包括： 一用以安裝一裸露的積體電路晶片之襯墊； 具有內部部份以及外部部份之複數條引線，該些內部 部份係朝向該襯墊延伸並且提供與該積體電路晶片電氣連 接之表面；以及 個別地在至少一些引線之內部部份的表面之上以及之 間形成的聚合物製結構，藉以永久地連接至少一些引線之 內部部份，以避免在製造期間內引線的移位，該聚合物製 結構係適合用於與該積體電路晶片包封在一個封裝成品中 ，而不需移除； 一被安裝至該襯塾之積體電路晶片； 複數條連接在該積體電路晶片與該引線架之間的電氣 連接線；以及 一環氧樹脂結構，其係包封該積體電路晶片、該襯墊 、該電氣連接線以及該些引線之內部部份與該聚合物製結 構，該些引線之外部部份係延伸出該環氧樹脂結構。 22. 如申請專利範圍第21項之積體電路封裝，其中該 聚合物製結構係爲一封閉結構。 23. 如申請專利範圍第21項之積體電路封裝，其中該 聚合物製結構係環狀且連接大致所有引線之內部部份。 24. 如申請專利範圍第23項之積體電路封裝，其中該 4 (請先閩讀背面之注意事項再填寫本頁) ,ιτ 線 本紙法尺度逋用中國國家揉準（CNS ) A4规格（210X297公羡） 4443 〇 9 A8 B8 C8 D8 經濟部智.¾財產局員工消骨合作社印製 六、申請專利範圍 聚合物製結構包含一種材料，其係從一個包含聚醯胺酸、 聚醯胺酯、聚（醯胺-亞胺）、丙烯酸酯、甲基丙烯酸酯以及 環氧樹脂之群組中選擇。 25. 如申請專利範圍第24項之積體電路封裝，其中該 材料係可以輻射進行硬化的。 26. 如申請專利範圍第25項之積體電路封裝，其中該 輻射係紫外線。 27. 如申請專利範圍第21項之積體電路封裝，其中包 括一第二聚合物製結構，其在介於該些引線的內部部份及 外部部份之中間連接至少一些引線。 28. —種用以封裝一積體電路之改良方法，其係包含： 形成一引線架，其係包括： 一用以安裝一裸露的積體電路晶片之襯墊； 具有內部部份以及外部部份之複數條引線，該些內部 部份係朝向該襯墊延伸並且提供與該積體電路晶片電氣連 接之表面；以及 個別地在至少一些引線之內部部份的表面之上以及之 間形成的聚合物製結構，藉以永久地連接至少一些引線之 內部部份，以避免在製造期間內引線的移位’該聚合物製 結構係適合用於與該積體電路晶片包封在一個封裝成品中 ，而不需移除； 安裝一積體電路晶片至該襯墊； 以複數條電氣連接線來將該積體電路晶片與該引線架 連接起來；以及 ____ ^__ ---------/------訂------線4 (請先閲讀背面之注意事項再填寫本頁) 4443 0 9 A8 B8 C8 DS 經濟部智慧財產局員工消費合作社印製 六、申請專利範圍 將該積體電路晶片、該襯墊、該電氣連接線以及該些 引線之內部部份與該聚合物製結構包封在一種環氧樹目旨P 構中，其中該些引線之外部部份係延伸出該環氧樹脂結構 0 29. 如申請專利範圍第28項之方法，其中該些引線之 外部部份係具有外部端，並且其中該引線架係包括—框架 結構，其中該些引線之外部端係連接至其上；並且包括在 包封該積體電路晶片之後，切除該框架結構之步驟。 30. 如申請專利範圍第28項之方法，其中該些引線之 內部部份係具有鄰接該襯墊之內部部份，並且其中該弓丨線 架係包括一棒狀物，其連接至少一些引線之內部端；並且 包括在連接該積體電路與該引線架之前切除該連接棒之步 驟。 31. 如申請專利範圍第28項之方法，其中該聚合物製 結構係爲一封閉結構。 32. 如申請專利範圍第28項之方法，其中該聚合物製 結構係環狀且連接大致所有引線之內部部份。 33. 如申請專利範圍第28項之方法，其中該聚合物製 結構包含一種材料，其係從一個包含聚醯胺酸、聚醯胺酯 、聚(醯胺-亞胺）、丙烯酸酯、甲基丙烯酸酯以及環氧樹脂 之群組中選擇。 34·如申請專利範圍第33項之方法，其中該材料係可 以輻射進行硬化的。 35·如申請專利範圍第34項之方法，其中該輻射係紫 __-__ ^_______ _ X------訂------ (請先閎讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家禕率（CNS ) A4規格（210X297公釐) ABCD 4443 0 9 六、申請專利範圍 外線。 36.如申請專利範圍第28項之方法’其係包括形成一 第二聚合物製結構，其在介於該些引線的內部部份及外部 部份之中間連接至少一些引線。 37·如申請專利範圍第28項之方法，其中包封該積體 電路於一環氧樹脂結構內，其係包含以下步驟： 提供一模具’其凹口具有一具有預先決定之封裝形狀 及體積，該模具係具有一外側邊緣，其界定一合模區域； 包圍被安裝於該引線架上之積體電路晶片於該模具之 內，該些引線之內部部份係在該模具凹口之內，且該些引 線之外部部份係延伸出該模具凹口之外； 引入一種環氧樹脂材料於該模具內；以及 對該環氧樹脂材料進行硬化。 (請先閎讀背面之注意事項再填寫本萸) 經濟部智慧財產局員工消費合作社印製 β 一本 公 7 9 24443 0 9 Λ8 Β8 C8 D8 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs VI. Patent application scope 1- An improved lead frame structure for packaging integrated circuit chips, which includes: One for mounting an exposed product A pad of a body circuit chip; a frame substantially surrounding the pad; a plurality of leads having an inner portion and an outer portion, the inner portion extending toward the pad and provided to the integrated circuit chip A surface of the electrical connection with the external portion extending toward the frame; and a polymer structure formed individually on and between the surfaces of the internal portion of at least some of the leads to permanently connect at least some of the leads The polymer structure is suitable for encapsulating the integrated circuit chip in a packaged product without removing the lead during the manufacturing process. 2. If the lead frame structure of the scope of patent application item 1, wherein the external parts of the leads have external ends, the external ends are connected to the lead frame structure, and the internal parts of the leads are adjacent to the lead frame structure. Internal free end of the pad. 3. For the lead frame structure of the scope of patent application, the inner part of the lead wires has an inner end adjacent to the gasket 'and at least some of the inner ends are connected to each other. 4. For the lead frame structure of the scope of patent application, the polymer structure is a closed structure. 5. If the lead frame structure of the first scope of the patent application, the polymer structure is ring-shaped and connected to the inner part of almost all the leads. The aggregation __. __] ______ __ This paper New Zealand CN it) ulin (2 丨 ㈣97 mm) --------- S ------ Order ------ ^ * (Please read the precautions on the back before filling out this page) 4443 09 A8 B8 C8 D8 VI. Patent application scope The material structure contains a material 'which consists of a material containing polyamic acid, polyamide vinegar, poly (聚Amine-imine), acrylate, methacrylate, cyanate, and epoxy. 7. For example, the lead frame structure in the scope of patent application No. 6, where the material can be cured by radiation. 8_ If the lead frame structure of the scope of patent application item 7, wherein the radiation is ultraviolet rays. 9. If the lead frame structure of the scope of patent application item 1, includes a throttle rod 'which is located inside the leads. At least some of the leads are connected between the part and the outer part. A rack structure includes a second polymer structure that connects at least some leads between the inner and outer portions of the leads. 11-A method for manufacturing an integrated circuit for packaging A method for improving a lead frame structure of a wafer includes: forming a lead frame structure, the lead frame structure including: a pad for mounting a bare integrated circuit wafer; a frame substantially surrounding the pad A plurality of leads having an inner portion and an outer portion, the inner portions extending toward the pad and providing a surface electrically connected to the integrated circuit chip, and the outer portion extending toward the frame; and A polymer structure is individually formed on and between the surfaces of the internal portions of at least some of the leads to permanently connect the internal portions of at least some of the leads to avoid displacement of the leads during manufacturing. The polymer ______—_ 2_____; ____ This paper size is applicable to China National Standards (CNS) A4 (210X297 mm) (please read the "Cautions on the back side" first) (This page) '?! Line · 1 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A8 ΰ8 C8 D8 4443 0 9 6. The scope of the patent application structure is suitable for encapsulating the integrated circuit chip in a packaged finished product' It does not need to be removed. 12. In the method of applying for item u of the patent scope, wherein the outer portions of the leads are connected to the outer ends of the frame structure, and the inner portions of the leads are adjacent to the frame. The internal free end of the pad. 13. The method of claim 11 in which the inner portion of the leads has an inner end adjacent to the pad, and at least some of the inner ends are interconnected. H. The method according to item 11 of the application, wherein the polymer structure is a closed structure. 15. The method according to item 11 of the scope of patent application, wherein the polymer structure is ring-shaped and connected to an inner portion of substantially all leads. 16. The method according to item 11 of the patent application scope, wherein the polymer structure comprises a material comprising a polyamic acid, a polyamidate, a poly (amido-imine), an acrylate, a Choose from the group of acrylic and epoxy resins. Π. The method of claim 16 in which the material is hardened by radiation. 18. The method according to item Π of the scope of patent application, wherein the radiation is ultraviolet. 19. The method of claim 11 in which the leadframe structure includes a throttle rod that connects at least some leads between the inner and outer portions of the leads. 20. If you apply for the method of item 11 in the scope of patent application, where the lead frame knot _ _______3________ This paper size is applicable to China's national #rate (CNS) A4 specification (210X297 mm) {Please read the note on the back before filling in this Page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 4443 0 9 Λ8 BS C8 D8 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 6. The scope of patent application includes a second polymer structure, which is in At least some leads are connected between the inner and outer portions of the leads. 21 · —An improved integrated circuit package comprising: a lead frame including: a pad for mounting an exposed integrated circuit chip; a plurality of leads having an internal portion and an external portion The internal portions extend toward the pad and provide a surface electrically connected to the integrated circuit chip; and a polymer structure individually formed on and between the surfaces of the internal portions of at least some of the leads, By permanently connecting at least some of the inner portions of the leads to avoid displacement of the leads during manufacturing, the polymer structure is suitable for encapsulating the integrated circuit chip in a packaged product without removing Except; an integrated circuit chip mounted to the liner; a plurality of electrical connection lines connected between the integrated circuit chip and the lead frame; and an epoxy resin structure encapsulating the integrated circuit The chip, the pad, the electrical connection lines, and the inner portions of the leads and the polymer structure, and the outer portions of the leads extend out of the epoxy structure. 22. The integrated circuit package of item 21 of the patent application, wherein the polymer structure is a closed structure. 23. The integrated circuit package of the scope of application for item 21, wherein the polymer structure is ring-shaped and connects almost all of the inner portions of the leads. 24. For the integrated circuit package of the 23rd in the scope of patent application, where 4 (please read the precautions on the back before filling out this page), the paper scale of the paper method uses the Chinese National Standard (CNS) A4 specification ( 210X297 public envy) 4443 〇9 A8 B8 C8 D8 Intellectual Property of the Ministry of Economic Affairs. ¾ Printed by the bone-eliminating cooperative of the property bureau. 6. Scope of patent application. The polymer structure contains a material, which consists of a material containing polyamic acid, polyamine. Ester, poly (amido-imine), acrylate, methacrylate, and epoxy. 25. The integrated circuit package of item 24 of the patent application, wherein the material is hardened by radiation. 26. The integrated circuit package of claim 25, wherein the radiation is ultraviolet light. 27. The integrated circuit package of item 21 of the scope of patent application, which includes a second polymer structure that connects at least some leads between the inner and outer portions of the leads. 28. An improved method for packaging an integrated circuit, comprising: forming a lead frame, comprising: a pad for mounting a bare integrated circuit chip; having an internal portion and an external portion A plurality of leads, the internal portions extending toward the pad and providing a surface electrically connected to the integrated circuit chip; and individually formed on and between the surfaces of the internal portions of at least some of the leads Polymer structure to permanently connect at least some of the leads 'internal parts to avoid lead displacement during manufacturing' The polymer structure is suitable for encapsulation with the integrated circuit chip in a packaged finished product Without removing; mounting an integrated circuit chip to the pad; connecting the integrated circuit chip to the lead frame with a plurality of electrical connection lines; and ____ ^ __ ------- -/ ------ Order ------ Line 4 (Please read the notes on the back before filling in this page) 4443 0 9 A8 B8 C8 DS Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Patent application scope for this integrated circuit The chip, the gasket, the electrical connection wires, and the inner portions of the leads are encapsulated with the polymer structure in an epoxy tree structure P structure, wherein the outer portions of the leads extend out of the ring. Oxygen resin structure 0 29. The method according to item 28 of the patent application, wherein the outer portions of the leads have external ends, and wherein the lead frame includes a frame structure, wherein the outer ends of the leads are connected to Thereon; and including the step of cutting off the frame structure after encapsulating the integrated circuit wafer. 30. The method of claim 28, wherein the inner portion of the leads has an inner portion adjacent to the pad, and wherein the bow frame includes a rod connected to at least some of the leads The inner end of the connector; and the step of cutting off the connecting rod before connecting the integrated circuit to the lead frame. 31. The method of claim 28, wherein the polymer structure is a closed structure. 32. The method of claim 28, wherein the polymer structure is ring-shaped and connected to the inner portion of substantially all leads. 33. The method of claim 28, wherein the polymer structure comprises a material comprising a polyamic acid, a polyamidate, a poly (amido-imine), an acrylate, a Choose from the group of acrylic and epoxy resins. 34. The method of claim 33, wherein the material is hardened by radiation. 35. If you apply for the method of item 34 in the scope of patent application, where the radiation is purple __-__ ^ _______ _ X ------ Order ------ (Please read the precautions on the back before filling in this Page) This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) ABCD 4443 0 9 6. Outside the scope of patent application. 36. The method of claim 28, which comprises forming a second polymer structure that connects at least some of the leads between the inner and outer portions of the leads. 37. The method of claim 28, wherein encapsulating the integrated circuit in an epoxy resin structure includes the following steps: Provide a mold with a notch having a predetermined package shape and volume The mold has an outer edge that defines a mold clamping area; the integrated circuit chip mounted on the lead frame is enclosed in the mold, and the internal portions of the leads are within the mold recess. And the outer portions of the leads extend beyond the notch of the mold; introduce an epoxy material into the mold; and harden the epoxy material. (Please read the notes on the back before filling in this card.) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs.
TW087100906A 1997-01-30 1998-01-21 Improved leadframe structure with locked inner leads and process for manufacturing same TW444309B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US79077997A 1997-01-30 1997-01-30

Publications (1)

Publication Number Publication Date
TW444309B true TW444309B (en) 2001-07-01

Family

ID=25151727

Family Applications (2)

Application Number Title Priority Date Filing Date
TW087100777A TW383436B (en) 1997-01-30 1998-01-21 Improved leadframe structure with preplated leads and process for manufacturing the same
TW087100906A TW444309B (en) 1997-01-30 1998-01-21 Improved leadframe structure with locked inner leads and process for manufacturing same

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW087100777A TW383436B (en) 1997-01-30 1998-01-21 Improved leadframe structure with preplated leads and process for manufacturing the same

Country Status (4)

Country Link
EP (1) EP1021831A1 (en)
JP (1) JP2002511187A (en)
TW (2) TW383436B (en)
WO (1) WO1998034277A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1406300B1 (en) * 2001-07-09 2012-02-22 Sumitomo Metal Mining Company Limited Method of manufacturing a lead frame
JP4888992B2 (en) * 2005-01-27 2012-02-29 東洋鋼鈑株式会社 Method for producing surface-treated Al plate
JP5101798B2 (en) * 2005-02-14 2012-12-19 東洋鋼鈑株式会社 Surface treatment Al plate
US8920617B1 (en) 2010-07-06 2014-12-30 Greatbatch Ltd. Selective plating fixture

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0595079A (en) * 1991-10-02 1993-04-16 Ibiden Co Ltd Lead frame, substrate for mounting semiconductor integrated circuit and semiconductor device, and manufacture thereof
US5541447A (en) * 1992-04-22 1996-07-30 Yamaha Corporation Lead frame

Also Published As

Publication number Publication date
EP1021831A1 (en) 2000-07-26
WO1998034277A1 (en) 1998-08-06
TW383436B (en) 2000-03-01
JP2002511187A (en) 2002-04-09

Similar Documents

Publication Publication Date Title
KR0145768B1 (en) Method for manufacturing a semiconductor package using lead frame
US6002167A (en) Semiconductor device having lead on chip structure
US20090004774A1 (en) Method of multi-chip packaging in a tsop package
US5563443A (en) Packaged semiconductor device utilizing leadframe attached on a semiconductor chip
JP2007509485A (en) Semiconductor device package and manufacturing method thereof
US20060270117A1 (en) Method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part
TW571402B (en) Leadframe semiconductor device and the manufacturing method thereof, circuit substrate and electronic machine
TW519739B (en) Substrate-type semiconductor encapsulation process capable of preventing flash
US20050110127A1 (en) Semiconductor device
US6255720B1 (en) Modified bus bar with Kapton tape or insulative material on LOC packaged part
TW444309B (en) Improved leadframe structure with locked inner leads and process for manufacturing same
TW268143B (en)
US6677662B1 (en) Clamp and heat block assembly for wire bonding a semiconductor package assembly
JPS58171839A (en) Method of mounting package for semiconductor device
EP0495474A1 (en) Plastic package type semiconductor device
US6501158B1 (en) Structure and method for securing a molding compound to a leadframe paddle
US6897550B1 (en) Fully-molded leadframe stand-off feature
KR19980044211A (en) Semiconductor package and manufacturing method
CN217334014U (en) Semiconductor device with a plurality of transistors
JP3136029B2 (en) Semiconductor device
US7201327B1 (en) Memory card and its manufacturing method
CN218957727U (en) Semiconductor device with a semiconductor layer having a plurality of semiconductor layers
CN108022902B (en) Semiconductor device and lead frame for semiconductor device
US20040159931A1 (en) Electronic package, heater block and method
KR100203936B1 (en) Module package

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent