TW383436B - Improved leadframe structure with preplated leads and process for manufacturing the same - Google Patents

Improved leadframe structure with preplated leads and process for manufacturing the same Download PDF

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Publication number
TW383436B
TW383436B TW087100777A TW87100777A TW383436B TW 383436 B TW383436 B TW 383436B TW 087100777 A TW087100777 A TW 087100777A TW 87100777 A TW87100777 A TW 87100777A TW 383436 B TW383436 B TW 383436B
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Taiwan
Prior art keywords
lead
integrated circuit
patent application
leads
item
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TW087100777A
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Chinese (zh)
Inventor
Guiseppe D Bucci
Paul H Voisin
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Gcb Technologies Inc
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Publication of TW383436B publication Critical patent/TW383436B/en

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    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
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    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

An improved leadframe structure, process of manufacturing the same, and improved IC package and packaging process using the same are provided. The leadframe includes a plurality of leads having inner portions located within an IC encapsulation area and outer portions extending outside the encapsulation area into contact with the outside environment. A plating mask cooperates with a polymer structure having a preselected configuration to form a substantially fluid-tight gasket to facilitate selective preplating of the outer portions of the leads of the leadframe prior to beginning the IC packaging process. Since the polymer structure is electrically insulative, concerns regarding of the plating mask misalignment of the are minimized.

Description

經濟部中央標準局員工消費合作社印製 A7 ' ______B7__.一 五、發明説明（[) 本案係關於專利申請號08/744,520,申請於1996年 11月5日，用以封裝積體電路之改良引線架結構與製造 其之方法，以及專利申請號_，1996年12月 19日申請之具有鎖定之內引線之改良引線架結構與製造 其之方法，兩者具名發明人皆爲Giuseppe D. Bucci以及 Paul Voisin，係此申請專利之主題發明之發明人，且皆讓 與給本案之受讓人GCB科技，LLO該些專利案之內容 在此被納入作爲參考，如同完整地展示於此。 本發明之背景 1. 本發明之範圍 本發明係一般地關於積體電路之封裝，尤其關於連接 封裝積體電路與外部環境之“引線架“。 (請先聞讀背面之注意事項再填寫本頁) 裝· 訂 經濟部中央標率局員工消費合作社印製 A7 , :, B7 五，發明説明（> ) * 學鍍金，以及蒸氣沈積。該特殊製程之選擇一部份視該結 合線之材質而定。典型之材質包括金以及銅。類似地，該 引線之外部部份，即延伸出該積體電路封裝成品之外之部 份，典型地塗佈一選擇材料之薄層。在許多筒業應用中， 該外黃引線係以一在印刷電路板率類似底材上之其他元件 電氣與物理地連接，其使用電導性之焊錫，例如許多習知 之錫/鉛（Sn/Pb)組成物。該焊錫之組成物亦可能包括材料 如錫(Sn)，銦(In)，銀(Ag)及/或鉍(Bi)，視特殊之應用而定 。爲促進良好之焊錫接合之.成形，該外部引線典型地以相 :似之焊錫組成物塗佈成一薄層，其中精確之組成將視該特 殊應用而定，但其可能包括擇定比例之錫(Tin)與鉛(Pb)。 在相對高溫之應用中，該焊錫組成物以及該引線之被覆物 熔化且接合在一起，或者“再熱流‘(以形成物理及電氣地 連接該引線與該底材之焊錫接合。 在需要高可靠度之軍事以及其他用途之一些積體電路 封裝中，黃金用以被覆該引線之外部部份。黃金通常與傳 統錫/鉛組成物具有相當之相容性。然而’該黃金被覆之 厚度必須小心地控制以限制錫/鉛混合焊錫中黃金之厚度 。超過約3%之黃金濃度傾向形成不必要之合金相，例如 Au4Sn，其可能導致焊錫接合產生裂縫，其俗稱”紫色瘟疫 ”，以及可靠度之問題。 近來，鈀以及鈀/鎳合金已用塗覆該外部引線。與黃 金相同地，鈀與傳統之錫/鉛焊錫組成物相當地相容。鈀 另有額外之優點，典型地僅約爲黃金所耗費3〇-4〇%之成 _;____4___ 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） (請先聞讀背面之注意事項再填寫本頁) ;袭-------^---1T------ΙΦ. A7 1 、’ B7__1 五、發明説明（V) 本，雖然兩種材料之成本對市場皆高度地依賴市場之情況 0 今日茼業用積體電路之製程中，外部引線之電鍍典型 地在該製程之後端進行。在一典型之製程中，該電鍍操作 在包封之後進行，且在任何去節流棒以及去廢料操作之後. 。其典型地在去除該引線架之橫條及外框架，且該外部引 線分隔及成形之最後之修裁/成形擇作之前進行。 經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 在封裝製程之最後階段裡電鍍該外部引線具有許多缺 點V例如，不似其他封裝製程，在本質上非常地機械化， 該被覆製程本質上係典型地屬於電化學β因此，積體電路 之封裝者必須不只投資於及維護機械化封裝製程之進行， 亦必須促進化學之操作。積體電路封裝者必須努力於與電 鍍化學品，特別爲鉛（Pb)，有關之環保及健康課題》 另外，所用之典型包封用材料，例如典型塡充矽之環氧樹 脂，非密封且因此有鍍金溶液滲進該封裝體之風險。又另 外’在電鍍進行之時’ ”錫鬚”有時可能在相鄰引線之間形 成’其成因在電鍍材料沿著有時由去節流棒而形成之溝槽 沈積。此可能導致電氣性能降低或甚至導致相鄰引線之短 路。這些缺點以及其他缺點合倂，使封裝之循環加長，降 低產出，以及增加成本。 由前述之缺點看來’必須在該封裝製程開始之前預鑛 該外引線，例如在裝置該積體電路晶片於該引線架之前0 許多努力用於發展電鍍製程。然而，當達到預鍍之一般目 的之後，此努力卻已產生新問題及缺點β 5 本紙張尺度適用中國國家標準（CNS ) A4^c格（210Χ297公釐) ---- Α7 Β7 五、發明説明（4 ) 例如，對選擇性地以錫/鉛焊錫預鍍該引線暴露之外 部部份之努力當然已成功。然而’此焊錫組成物典型地癌 攝氏160-200度之範圍內熔化，且因此限制用於相對低成 本，低可靠度積體電路之封裝，其中晶片之連接，模封以 及硬化之操作在相對低溫之下進行，且使用相對低品質之 環氧樹脂。 對於標準之應用，可用完全之黃金電鍍取代錫/鉛組 成物。然而，由於其相對之高成本，黃金只用於偶而小量 之原型。 經濟部中央標準局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 近來，發現鈀以及許多不同鈀/鎳合金用於預鍍材料 之有限應用，因其承受封裝操作之相對高溫以及比黃金相 對低之成本。德州儀器已發展一種製程，其在晶片安裝前 使用鈀或鈀/鎳合金之薄層被覆該全部引線架。在此製程 中，不僅被覆引線架暴露之外部部份’亦被覆該內部部份 ，包括連結線將連結該引線處之表面。此製程，雖達到預 鍍該引線所需要之目標，卻無選擇性且產生數項新問題以 及缺點。即使鈀以及鈀/鎳合金成本比黃金小’對於整個 引線架仍然所費不貲。將與該積體電路一起包封’以及不 牽渉入積體電路之連接之該引線之內部部份將不暴露於外 部環境，且不需任何保護性被覆β此外，該引線之內部部 份之端點在傳統上被覆銀之理由係在促進與連結線之連結 ，其連結線典型地以黃金製作。當該銀被覆以鈀或鈀/鎳 合金取代，該連結製程可能需要修正以確保該連結之連續 完整。此外，亦有關於銀環氧樹脂之連結晶片黏性組成物 6 本紙張尺度適用中國國家標率（CNS ) Α4規格U10X297公釐） 經濟部中央標準局員工消費合作社印製 Α7 Β7 五、發明説明（1；) 之附著力之關切課題β再者，建議爲確保黃金連結線與鈀 或鈀/鎳合金之間連結之完整，該被覆之厚度應不超過3〜 5微英吋。然而，引線之外部暴露之部份通常需要稍厚之 被覆，以預防由刮傷及龜裂造成之孔洞及損壞，或其他在 '封裝製程進行時造成之原因，尤其在修裁/成形操作進行 時。較薄之被覆亦可能需要使用額外之化學品用於去廢料 之操作，而不只有泥漿介質，以預防該引線之揖壞。這些 不同厚度需求替製程設計以及控制產生一相當大之挑戰。 此外，用於包封製程之典型環氧樹脂模封組成物通常在銅 以及鎳基底表面比鈀/或鈀/鎳合金具有較佳之附著性◊結 果，使用非選擇性之鈀或鈀/鎳合金之電鍍’該引線與環 氧樹脂封裝體之間之脫層以及水分侵入該封裝體之風險增 加。此水分可能在該積體電路晶片連接用環氧樹脂內累積 且導致該積體電路封裝體之所謂”爆米花”現象。 另一預鍍傳統引線架製程之普遍缺點係在進行節流棒 移除時，該引線架之底部基底金屬部份暴露在外部環境而 無保護性之被覆。此發生於無論整個引線架是否初始地被 覆或僅有該外部暴露之部份被覆，且無論使用任何被覆材 料亦同◊ 仍爲現用之無選擇性預鍍製程之缺點係在於其明顯地 降低銅製引線架之碎片之價値，例如外框架及橫條’由於 該電鍍材料被視爲一種污染物，其必須從碎片裡移除。在 電鍍材料相對地昂貴且必須回收之情況裡’例如把’增加 回收費用之分離步驟亦使成本增加。 7 ____ 本紙張尺度適用中國國家標準（CNS〉Α4規格（210Χ297公釐） ---------------j裝--- /•V· (請先閲讀背面之注意事項再填寫本頁) 訂------®--------- 經濟部中央標準局員工消費合作社印製 A7 , _ . _B7 五、發明説明（& ) 1 在許多積體電路市場中，價格與可靠度係重要之關鍵 。結果，封裝之成本，改善之產出，以及良好之可靠度對 於積體電路製造者係重要之關鍵因此需要一種改良引線 架以及伴隨之製造流程，其中僅該外部暴露之引線部份選 擇性地預鍍，藉以降低昂貴電鍍材料之使用量，因此降低 製造者之封裝成本，且允許降低售價。 亦需要一種改良引線架及其伴隨製程，其中該引線之 外部暴露部份之選擇性預鍍大致上不影響其他封裝製程， 且其中該封裝者免於投資及維護額外設施之負擔，以及免 於處理許多環保及健康相關問題？ 亦需要一種改良引線框架及其伴隨製程，其克服由去 節流棒操作而引起基底金屬暴露之問題。 因此，本發明之一目的在於提供一種改良引線架結構 以及伴隨之製造流程，其克服現有引線架及引線架預鍍製 程之缺點。 本發明之其他目的係在於提供此低成本結構及製程， 其整合且不影響其他封裝製程之操作，且其使封裝者免於 投資及維護化學藥品之設施，免於健康及環保問題之負擔 0 本發明之另一目的係在於提供此種結構及製程，其克 服由去節流棒操作而引起之基底金屬暴露之問題β 又本發明之另一目的係在於增加廢棄之引線框架材料 之價値，其藉由降低選擇性材料之污染，以及降低回收相 對價昂之電鍍材料之成本，例如鈀。 __8____ 本紙張尺度適用中國國家標準（CNS ) Α4*#· ( 210X297公釐） (請先閲讀背面之注意事項再填寫本頁) 裝- 、1T- A7 ·, B7_____丨 五、發明説明（彳） 同樣本發明之其他目的係在於提供一種改良之積體電 路封裝體及積體電路封裝製程，其分別結合應用該改良之 引線架結構及製造流程。 、發明槪論 本發明一方面係一改良引線架以及其製造之方法。該 改良引線架具有一框架，一用以裝置積體電路之襯墊，以 及複數條具有朝向該襯墊延伸之內部部份以及朝向該框架 延伸之外部部份。該改良引線#具有一聚合物製結構，其 在至少一些引線之間延伸，介於其外部及內部部份之中間 〇該聚合物製結構與一電鑛阻罩結合，使該引線之該外部 部份以選定之材料，例如黃金之合金，鈀.，鈀/鎳合金， 錫鉛焊錫，銦，鉍，錫，銀及其他等等，進行選擇性電鍍 ，而大致防止該電鍍材料通入該引線之內部部份^ 經濟部中央標準局員工消費合作社印裝 (請先閱讀背面之注意事項再填寫本頁) 本發明之另一方面係一改良積體電路封裝體及封裝製 程，其利用該改良引線架。該改良積體電路封裝體包括一 引線架，其具有一襯墊，具內部部份及外部部份之複數條 引線，以及在至少一些該引線之間，介於該內部及外部之 間延伸之聚合物製結構。該聚合物製結構與該電鍍阻罩結 合，使得該引線之外部部份選擇性地預鍍，使用選定之材 料，大致上到達該引線框架之位置，而大致上阻絕該電鍍 材料進入該引線之內部部份。一積體電路裝置於該襯墊上 且一電性導體連接該積體電路及引線架。一環氧樹脂結構 封裝體結構包封該積體電路’該電性導體以及該引線之內 部部份。該引線之預鍍之外部部份延伸出該環氧樹脂結構 __9__ 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明u ) ，其消除與去節流棒與去廢料相關製程步驟之需要，且因 此消除該引線之外部部份之基底金屬暴露在外。 簡要圖說 圖1係一現用之.208接腳引線架結構，其用於具有一 節流棒之一塑膠方形扁平積體電路封裝體(QFP); 圖la係一現用之176接腳無襯墊引線架結構，其具 有用於多晶片模組(MCM)底材之節流棒； 圖2係具有用於裝置積體電路晶片之積層底材之無襯 墊引線架結構之一部份截面示意圖； 圖3係一根據本發明之一較佳引線架之平面視圖，其 引線架在一 208接腳扁平方塊內成形且在該節流棒之處具 有一聚合物製結構； 圖4係一根據本發明之一較佳引線架之一部份之鳥瞰 圖，其在該節流棒之處具有一聚合物製結構； 圖5係一傳統引線架之一部份之放大鳥瞰圖，其在封 裝及移除節流棒之後，顯示暴露之相鄰外部引線及基底金 屬； 圖6係一根據本發明之一較佳引線架之一部份之放大 鳥瞰圖，其在節流棒之處具有一聚合物製結構且顯示預鍍 之外部引線及橫條； 圖7係一根據本發明之較佳引線架之一部份之放大鳥 瞰圖，其在節流棒之處具有一聚合物製結構，且顯示預鍍 之外部引線；以及 圖8係一根據本發明之一較佳引線架，其在節流棒之 10 本紙張尺度適用中國國家標準（CNS ) A4規格（21〇><297公釐） ---------( 秀-- ./\ (請先閱讀背面之注意事項再填寫本頁) 1A7 '______B7__ printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs. 15. Description of the Invention ([) This case is about patent application No. 08 / 744,520, which was applied on November 5, 1996 to package improved leads for integrated circuits. Frame structure and method for manufacturing the same, and Patent Application No. _, an improved lead frame structure with locked inner lead and method for manufacturing the same, which were filed on December 19, 1996. Both named inventors are Giuseppe D. Bucci and Paul Voisin, the inventor of the subject invention of this patent application, has been assigned to the assignee of this case, GCB Technology. The contents of these patent cases of LLO are hereby incorporated by reference as if fully shown here. BACKGROUND OF THE INVENTION 1. Scope of the Invention The present invention relates generally to the packaging of integrated circuits, and more particularly to a "lead frame" that connects the packaged integrated circuits to the external environment. (Please read the precautions on the back before filling out this page) Binding and printing Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7,:, B7 V. Invention Description (>) * Learn about gold plating and vapor deposition. The selection of the special process depends in part on the material of the bonding wire. Typical materials include gold and copper. Similarly, the outer portion of the lead, that is, the portion extending beyond the finished product of the integrated circuit package, is typically coated with a thin layer of a selected material. In many barrel applications, the outer yellow lead is electrically and physically connected to other components on a printed circuit board-like substrate using electrically conductive solder, such as many conventional tin / lead (Sn / Pb ) 组合 物。 Composition. The composition of the solder may also include materials such as tin (Sn), indium (In), silver (Ag) and / or bismuth (Bi), depending on the particular application. To promote good solder joint forming, the outer leads are typically coated in a thin layer with a similar solder composition, where the precise composition will depend on the particular application, but it may include a selected proportion of tin (Tin) and lead (Pb). In relatively high temperature applications, the solder composition and the cover of the lead are melted and bonded together, or "reheat flow" (to form a solder joint that physically and electrically connects the lead to the substrate. Where high reliability is required In some integrated circuit packages for military and other uses, gold is used to cover the outer part of the lead. Gold is generally compatible with traditional tin / lead compositions. However, the thickness of the gold coating must be careful Ground control to limit the thickness of gold in the tin / lead mixed solder. A gold concentration exceeding about 3% tends to form unnecessary alloy phases, such as Au4Sn, which may cause cracks in solder joints, which is commonly known as "purple plague" and reliability Recently, palladium and palladium / nickel alloys have been used to coat the external leads. Like gold, palladium is quite compatible with traditional tin / lead solder compositions. Palladium has additional advantages, typically only about 30% to 40% of the cost of gold _; ____ 4___ This paper size applies Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the back first Note for this page, please fill in this page again); Attack ------- ^ --- 1T ------ IΦ. A7 1 、 'B7__1 V. Description of the invention (V), although the cost of the two materials The market is highly dependent on the market. In today's industrial integrated circuit manufacturing process, the plating of external leads is typically performed at the rear end of the process. In a typical process, the plating operation is performed after encapsulation, and After any throttling and scrap removal operations ... it is typically done before the lead frame's crossbars and outer frame are removed, and the outer lead is separated and shaped for the final trimming / forming option. Central Ministry of Economic Affairs Printed by the Consumer Bureau of Standards Bureau (please read the precautions on the back before filling out this page) Plating the external lead in the final stage of the packaging process has many disadvantages. V For example, unlike other packaging processes, it is very mechanized in nature. The coating process is typically electrochemical β in nature. Therefore, packagers of integrated circuits must not only invest in and maintain the mechanized packaging process, but also promote chemical operations. Integrated circuit packagers must Efforts related to environmental protection and health issues related to electroplating chemicals, especially lead (Pb). In addition, the typical encapsulating materials used, such as typical epoxy resin filled with silicon, are not sealed and therefore have a gold plating solution infiltration. The risk of the package. In addition, 'while plating' 'tin whiskers' can sometimes form 'adjacent' between adjacent leads due to the deposition of the plating material along the trenches sometimes formed by de-throttled rods This can lead to reduced electrical performance or even short-circuiting of adjacent leads. These shortcomings and other shortcomings combine to lengthen the cycle of the package, reduce output, and increase costs. From the foregoing shortcomings, it must be seen in the packaging process Pre-mine the outer leads before starting, for example, before installing the integrated circuit wafer on the lead frame. Many efforts are used to develop the electroplating process. However, after the general purpose of pre-plating has been achieved, this effort has created new problems and shortcomings. Β 5 This paper size applies the Chinese National Standard (CNS) A4 ^ c (210 × 297 mm) ---- Α7 Β7 V. Invention Explanation (4) For example, efforts to selectively pre-plat the exposed external portions of the leads with tin / lead solder have certainly succeeded. However, 'this solder composition is typically melted in the range of 160-200 ° C and is therefore limited to the packaging of relatively low-cost, low-reliability integrated circuits, in which the operations of chip connection, molding and hardening are relatively It is carried out at a low temperature, and a relatively low-quality epoxy resin is used. For standard applications, tin / lead compositions can be replaced with full gold plating. However, due to its relatively high cost, gold is only used for occasional small prototypes. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the notes on the back before filling this page) Recently, it has been found that palladium and many different palladium / nickel alloys are used for limited applications of pre-plated materials because of their relative resistance to packaging operations. High temperature and relatively lower cost than gold. Texas Instruments has developed a process that covers the entire leadframe with a thin layer of palladium or a palladium / nickel alloy before wafer mounting. In this process, not only the exposed external portion of the lead frame, but also the internal portion is covered, including the surface where the lead wire will connect to the lead. Although this process achieves the goals required for pre-plating the leads, it is non-selective and creates several new problems and disadvantages. Even if the cost of palladium and palladium / nickel alloy is lower than gold ', it still costs a lot of the entire lead frame. The inner part of the lead that will be encapsulated with the integrated circuit and not involved in the connection of the integrated circuit will not be exposed to the external environment and does not require any protective coating. In addition, the internal part of the lead The reason that the endpoints are traditionally covered with silver is to facilitate the connection with a link, which is typically made of gold. When the silver coating is replaced with palladium or a palladium / nickel alloy, the bonding process may need to be modified to ensure the continuous integrity of the bonding. In addition, there are also adhesive components for the bonding chip of silver epoxy resin. 6 This paper size is applicable to China National Standard (CNS) A4 specification U10X297 mm. Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. A7 B7 V. Description of the invention (1;) The concern of adhesion β. Furthermore, it is suggested that in order to ensure the integrity of the connection between the gold connection line and palladium or palladium / nickel alloy, the thickness of the coating should not exceed 3 to 5 micro inches. However, the exposed parts of the leads usually require a slightly thicker cover to prevent holes and damage caused by scratches and cracks, or other causes during the 'encapsulation process, especially during trimming / forming operations. Time. Thinner coatings may also require the use of additional chemicals for waste removal operations, not just muddy media, to prevent the leads from being damaged. These different thickness requirements create a considerable challenge for process design and control. In addition, the typical epoxy resin molding composition used for the encapsulation process generally has better adhesion on copper and nickel substrate surfaces than palladium / or palladium / nickel alloys. As a result, non-selective palladium or palladium / nickel alloys are used. The risk of delamination between the lead and the epoxy package and moisture intrusion into the package is increased. This moisture may accumulate in the integrated circuit chip epoxy resin and cause a so-called "popcorn" phenomenon of the integrated circuit package. Another common shortcoming of the conventional pre-plated lead frame process is that when the throttle rod is removed, the bottom base metal portion of the lead frame is exposed to the external environment without a protective coating. This occurs whether the entire lead frame is initially covered or only the externally exposed part is covered, and regardless of the use of any covering material, the disadvantage of the non-selective pre-plating process that is still in use is that it significantly reduces copper The value of the leadframe fragments, such as the outer frame and the crossbars', must be removed from the fragments as the plating material is considered a contaminant. In the case where the electroplating material is relatively expensive and must be recycled, the separation step which increases the recycling cost also increases the cost. 7 ____ This paper size is in accordance with Chinese national standard (CNS> Α4 size (210 × 297 mm) --------------- j installed --- / • V · (Please read the note on the back first (Please fill in this page for matters) Order ------ ® --------- Printed by A7, _. _B7 of the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economy In the integrated circuit market, price and reliability are important. As a result, the cost of packaging, improved output, and good reliability are important to integrated circuit manufacturers. Therefore, an improved lead frame and accompanying manufacturing are needed. A process in which only the externally exposed lead portions are selectively pre-plated, thereby reducing the use of expensive plating materials, thereby reducing packaging costs for manufacturers and allowing lower selling prices. There is also a need for an improved lead frame and accompanying process The selective pre-plating of the exposed portions of the leads generally does not affect other packaging processes, and the packager is free from the burden of investing and maintaining additional facilities, and from dealing with many environmental and health related issues? Improved lead The frame and its accompanying process overcome the problem of base metal exposure caused by the de-throttle operation. Therefore, an object of the present invention is to provide an improved lead frame structure and accompanying manufacturing process, which overcome the existing lead frame and lead frame. Disadvantages of the pre-plating process. Another object of the present invention is to provide this low-cost structure and process, its integration without affecting the operation of other packaging processes, and it saves the packager from investment and maintenance of chemical facilities and health. And environmental protection burden 0 Another object of the present invention is to provide such a structure and process, which overcomes the problem of base metal exposure caused by the operation of the throttling rod β. Another object of the present invention is to increase the amount of waste The price of lead frame materials is reduced by reducing the pollution of selective materials and reducing the cost of recycling relatively expensive electroplating materials, such as palladium. __8____ This paper size applies to Chinese National Standards (CNS) Α4 * # · (210X297 mm ) (Please read the notes on the back before filling this page) Installation-、 1T- A7 ·, B7_____ 丨 V. Description of the invention彳) Another object of the present invention is to provide an improved integrated circuit package and an integrated circuit packaging process, which are respectively combined with the improved lead frame structure and manufacturing process. Invention The first aspect of the present invention is a Improved lead frame and manufacturing method thereof. The improved lead frame has a frame, a pad for mounting integrated circuits, and a plurality of inner portions extending toward the pad and outer portions extending toward the frame. The improved lead # has a polymer structure that extends between at least some of the leads, intermediate between its outer and inner parts. The polymer structure is combined with a power shield to make the leads of the lead The outer part is selectively plated with a selected material, such as gold alloy, palladium, palladium / nickel alloy, tin-lead solder, indium, bismuth, tin, silver, and others, and substantially prevents the plating material from entering. The internal part of the lead ^ Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page) Another aspect of the present invention is Improved integrated circuit package and packaging process, which is improved by using the lead frame. The improved integrated circuit package includes a lead frame having a pad, a plurality of leads having an inner portion and an outer portion, and at least some of the leads extending between the inner and outer portions. Polymer made structure. The polymer structure is combined with the plating shield, so that the outer part of the lead is selectively pre-plated, and the selected material is used to substantially reach the position of the lead frame, and the plating material is substantially prevented from entering the lead. Internal part. An integrated circuit device is on the pad, and an electrical conductor connects the integrated circuit and the lead frame. An epoxy resin structure package structure encloses the integrated circuit ', the electrical conductor and an inner portion of the lead. The pre-plated external part of the lead extends the epoxy structure. __9__ This paper size applies to China National Standard (CNS) A4 (210X297 mm). Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. A7 B7. V. Invention Note u), which eliminates the need for process steps related to throttling rods and waste removal, and therefore eliminates the exposure of the base metal to the outer portion of the lead. Brief description: Figure 1 is a currently used .208 pin lead frame structure, which is used for a plastic square flat integrated circuit package (QFP) with one of the throttle rods; Figure la is a currently used 176-pin unpadded lead Figure 2 is a schematic cross-sectional view of a portion of an unleaded leadframe structure with a laminated substrate for a device integrated circuit wafer; FIG. 3 is a plan view of a preferred lead frame according to the present invention. The lead frame is formed in a 208-pin flat square and has a polymer structure at the throttle rod. A bird's-eye view of a part of one of the preferred lead frames of the invention, which has a polymer structure at the throttling rod; FIG. 5 is an enlarged bird's-eye view of a part of a conventional lead frame, showing After removing the throttle rod, exposed adjacent external leads and the base metal are shown; FIG. 6 is an enlarged bird's-eye view of a portion of a preferred leadframe according to the present invention, which has a polymerisation at the throttle rod Physical structure and showing pre-plated external leads and bars; Figure 7 series An enlarged bird's-eye view of a portion of a preferred leadframe according to the present invention, which has a polymer structure at the throttle rod and shows pre-plated outer leads; and FIG. 8 is a view of one of the present invention. A better lead frame, which is in accordance with the Chinese National Standard (CNS) A4 specification (21〇 > < 297 mm) at the 10 paper size of the throttle rod --------- (Xiu-./ \ (Please read the notes on the back before filling this page) 1

經濟部中央標準局員工消費合作、社印製 A7 B7 五、發明説明（q ) 處具有一聚合物製結構，顯示該聚合物結構結合成該完成 之積體電路封裝體之一組件以及已鍍之外部引線。 該具體例之詳細描述 現在展示之根據本發明之一改良引線架具體例可利用 習知之沖齡或蝕刻之方法’或可能合適之方法。本發明對 於該引線架成形之行爲不予限定。任何可能合適之材料可 用於該引線架，包括例如銅或鎳合金之現用材料。本發明 之適用性不限定於用於該引線架之特定材料。 此外，基本上該引線架可成形成任何形狀，包括現今 使用之方形扁平(QFP)，封鑄載體環(MCR) ’小外形（S0) ，晶片載體(CC)，或雙排直列封裝體(DIP)之形狀。本發 明之適用性不經由該引線架之形狀，接腳數或接腳之間隔 而受到限制。 一典型之方形扁平封裝引線架形狀之例顯示於圖 用於多晶片模組之習知引線架結構之其他範例顯示於圖 la以及圖2。如圖所示’該引線架1〇典型地包括〜外部 框架15〇數百或數千條引線架可根據習知之方法從 常之材料線帶成形，且所有引線架之該外部框架15在年目 同之線帶裡將完全相同，直到個別之引線架分離β該外部 框架15典型地包括一個以上之放置及定位開口 20 〇 引線架之功能元件相對該開口 準確地安置’以幫助該 元件之準確放置，在該引線架成形或積體電路進行梅裝_ 。圖1中該方形扁平封裝型引線架亦包括一襯墊或_ 25 ，一積體電路裝置其上，以及複數個引線30 ’在此例中 11 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) -裝· 、-β 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（π ) 爲其中208條。而當圖la及2相似地具有複數條引線30( 在圖la引線架之例中评其中Π6條)亦非具有一積體電路 裝置襯墊。用以替代地，圖1之該引線架中’該積體電路 襯墊裝置於一多晶片模組(MCM)底材。該底材可爲單或多 層，且以玻璃強化。數片積體電路晶片亦可容納。相似地 ，在圖2之該引線架之中，該積體電路晶片裝置於積層底 材35。典型地，該積層底材35將包含多層玻璃之強化介 電材料，其與環氧樹脂連接。該底材可爲單或雙面且可具 有一個以上裝置區域36,在任一面或雙面上用於一片以 上之積體電路晶片β該引線30之內部部份係以該底材35 薄板覆蓋。該底材之層次可具有在其中形成之導孔(未顯 示）且以銅塡充或在其上成形之銅質圖形，其以傳統之方 式成形以製造許多不同之電氣連接。 每一條引線30具有一內部部份，其具有一內部端32 ，連接至該襯墊25，或該底材35，與具有一端34之外部 部份。該內部自由端提供用以電氣連接該積體電路之點， 一旦其裝置於該襯墊上，或者連接至該底材，其可分別地 連結至該積體電路。該引線之內部部份典型地沿著該積體 電路(以及該底材，若合適的話）包封，且因此免於暴露於 外·$環境。該外部部份典型地延伸出該積體電路封裝體且 暴露於外部環境該外部部份提供與外部電氣元件及電路 之一電氣連接之點。 大部分現行之引線架設計，包括圖1及la所示，包 含一”節流棒，，結構40，其連接引線之該內部端及外部端 ,· ·.» --- 12 本紙張尺度通用中國國家標準（CNS ) A4規格（210X297公釐） C裝1T— (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 A7 ' ' __. _B7 ____ 五、發明説明（（I ) 之間之中間點。該節流棒40之主要目的係在進行模封或 包封製程時工阻絕之用，以預防環氧樹脂從模具逸出且” 溢流至該外部引線上，在我們相關專利申請號No. 08/744,52有進一步之詳細敘述。在一多晶片模組或積層 底材之情況中，該環氧樹脂層42被覆蓋成形模覆，與方 形扁平封裝形狀之情況不同。然而，該節流棒40在兩種 情況中功用相似。其次，該節流棒爲該引線提供支撐，以 在該積體電路構裝製程進行時輔助該引線之相對位置。 參考圖3，顯示方形扁平封裝形狀之一較佳引線架75 之範例，其外部部份90及內部部份95具有一外部框架 80，襯墊100，以及複數條引線85。在圖3之該較隹引線 架中，其一區段亦顯示於圖4，未顯示節流棒結構。替代 地，一聚合物製結構'160在該引線85之內部部份95及外 部部份90之端點之中點成形。.在我們配合相關之申請專 利號No. 08/744，520有詳細之顯示，該聚合物製結櫸之 用意與該節流棒相似。其聚合物製結構之作用係在積體電 路包封製程進行時，防止環氧樹脂脫離以及溢流’且爲該 引線提供額外支撐。優越且不似比該節流棒地，該聚合物 製結構結合成該完成積體電路封裝體19〇之一部份’如圖 8所示，而且消除去除節流棒，去溢料以及去廢料之一部 份封裝製程之操作之需要。由本發明之目的’該聚合物製/ 結構以此方式適當地放置，以及成形，而且使用配合相關 之申請專利號No. 〇8/744,520中所敘述之材料。 亦爲本發明之目的，該聚合製結構在開始進行該積體 13 尺度適用中國國家標準（CNS)M規^(210χ297ϋ) .(請先閱讀背面之注意事項再填寫本頁) 一裝· 訂 Φ. 經濟部中央標準局員工消費合作社印製 A7 1 B7 一__ ——— - -一 _______ 五、發明説明（β) 電路製程之前，較佳地放置，即在該方形扁平封裝形狀之 襯墊100上裝置一積體電路封裝體晶片。在一用於多晶片 模組或積層底材之無襯墊引線架，該聚合物製結構在用該 底材覆蓋該引線架之前成形。事實上，在大部分較佳具體 例中，藉由從該線帶分離出來之前，於每一引線上安置該 聚合物製結構，可用一阻罩選擇性地預鍍該引線，而該引 線仍然係線帶狀之形式而且在其上裝置積體電路晶片之前 。此係其優點，允許積體電路封裝者採購選擇性預鍍之引 線架，用於該封裝製程，且在該需要之機械封裝設施之外 ，免於付出投資及維護化學或電化學電鍍設施之負擔。 用於鍍鈀，鈀鎳合金，黃金等之標準引線架浸浴化學 品，廣爲習知且可向例如Lucent Technologies之供應商市 購而得。這些化學品適合於本發明之使用。阻罩之操作’ 例如機械或光阻之阻罩之方式，用於以線帶之形式選擇性 地電鍍該引線架之區域，對於熟知此工藝者亦廣爲習知’ 且無須在此詳細敘述以完全了解本發明。 然而在本發明中，不似其他引線框架之阻罩製程，尤 '其在處理含節流棒之引線架之製程，該聚合物製結構160 提供有利之結果。參考圖5-7，由於該聚合物製結構放置 於該封裝體之周圍，以一機械式電鍍阻罩200用於選擇性 預鍍該引線85之外部部份90之92。在一節流棒結構4〇 之情況中，其可用一光阻或機械式阻罩以進行選擇性預鍍 ，該節流棒結構必須隨後去除。特別地如圖5所示，該節 流棒之去除切裁該節流棒40，以及任何多餘之環氧樹脂 _______14___ 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) 裝. 訂' 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（θ) 45，在包封製程時其包含於該引線外部部份90之節流棒 部份87之內。潛藏電鍍材料之該基底金屬47不需要之殘 留區域暴露在外。由於該聚合物製結構160保留該完成封 裝體之一結合部份’如圖8所示，且未移除，故潛藏之基 底金屬留下而且暴露在外。 此外，該聚合物製結構160與該阻罩200結合’以形 成一大致液密之塡塞物。不似該節流棒結構’該聚合物結 構實際上包裹該引線。因此提供有效之電氣隔絕’液密之 塡塞物以大致預防流體電鍍材料滲出或洩漏’流入該內部 引線區域，其區域係不須或不必要電鍍，因爲該內部引糠 95將在該環氧樹脂封裝體190或層次42之內。 典型地，該聚合物製結構160可在10·15 mil寬之數 量級。阻罩200之邊緣接觸該聚合物製結構之頂部表面之 任一處較合適。本發明之一利益係在於阻罩之邊緣無須壤 確地與該聚合物製結構對準且仍可適度地發揮功能。由於 該聚合物製結構係電氣絕緣，在一典型之電化學電鍍製瘦 中不會被電鍍、即使由於阻罩對準失誤因而暴露於電鍍溶 液之中。 如圖6及7所示，任一該引線85之全部外部部份 ，包括橫條80，可進行預鍍，或另一阻罩210用以限制 預鍍至該區域94，在其處該引線將在後續之裁切/成形燦 作之中被截剪去除。在後者之替代例子特別地適合，當健 用貴重金屬於電鑛時，此係由於成本昂貴之故。 而本發明另一優點係在於藉由選擇性預鍍該引線之外 15 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -----------； ^-- (锖先閲讀背面之注意事項再填寫本頁) ♦ AW. A7 ' ' __-_ B7_______— 五、發明説明（θ ) 部部份’鄰接該積體電路之連結襯墊或底材之內部部份可 選擇性地以銀預鍍’其與現行之打線製程相容。由於無須 修改現行之打線製程，封裝之成牢因此降低，或者可能需 要以例如鈀或鈀/鎳合金做引線之全面電鍍，大幅降低電 鍍材料之使用量。 前述之本發明較佳具體例係僅藉由範例敘述，但並未 意欲限制本發明之範圍。許多材料，設計，尺寸以及其他 變更對於熟知此工藝者將非常地簡單明顯，其可能不超出 本發明之精神，其將完全藉由以下之專利申請範圍定義其 範疇。 (請先閱讀背面之注意事項再填寫本頁) '一裝· 訂 經濟部中央標準局員工消費合作社印製 本紙張尺度適用中國國家檩準..(CNS ) Α4规格（210X297公釐）Employees' cooperation of the Central Bureau of Standards of the Ministry of Economic Affairs, printed by the company A7 B7 5. The description of the invention (q) has a polymer structure, showing that the polymer structure is combined into one component of the completed integrated circuit package and has been plated External leads. Detailed Description of the Specific Example Now, a specific example of an improved lead frame according to the present invention may be shown using a conventional method of ageing or etching 'or a method which may be suitable. The present invention does not limit the behavior of forming the lead frame. Any material that may be suitable may be used for the leadframe, including current materials such as copper or nickel alloys. The applicability of the present invention is not limited to the specific material used for the lead frame. In addition, the leadframe can be formed into basically any shape, including square flat (QFP), encapsulated carrier ring (MCR) 'small form factor (S0), chip carrier (CC), or dual-row in-line package ( DIP). The applicability of the present invention is not limited by the shape of the lead frame, the number of pins, or the distance between the pins. An example of the shape of a typical square flat package leadframe is shown in Figures. Other examples of conventional leadframe structures for multi-chip modules are shown in Figures 1a and 2. As shown in the figure, the lead frame 10 typically includes ~ an external frame 150. Hundreds or thousands of lead frames can be formed from a conventional material tape according to a conventional method, and the outer frame 15 of all lead frames in the year The same tape will be exactly the same until the individual lead frame is separated. The external frame 15 typically includes more than one placement and positioning opening. The functional components of the lead frame are accurately positioned relative to the opening 'to help the component. Precisely place and form or integrate the circuit in this lead frame. The square flat package leadframe in FIG. 1 also includes a pad or _ 25, an integrated circuit device thereon, and a plurality of leads 30 ′. In this example, 11 paper sizes are applicable to China National Standard (CNS) A4 specifications. (210X297 mm) (Please read the notes on the back before filling out this page) -Installation ·, -β Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 5. The invention description (π) is 208 of them. When Figs. 1a and 2 similarly have a plurality of leads 30 (in the case of the lead frame of Fig. 1a, 6 of them are evaluated), they do not have an integrated circuit device pad. Instead, the integrated circuit pad in the lead frame of FIG. 1 is mounted on a multi-chip module (MCM) substrate. The substrate can be single or multi-layered and reinforced with glass. Several integrated circuit chips can also be accommodated. Similarly, in the lead frame of FIG. 2, the integrated circuit wafer is mounted on a laminated substrate 35. Typically, the laminated substrate 35 will include a multilayer glass reinforced dielectric material that is connected to an epoxy resin. The substrate may be single or double-sided and may have more than one device region 36. For one or more integrated circuit wafers on either or both sides, the inner portion of the lead 30 is covered with the substrate 35 sheet. The layer of the substrate may have vias (not shown) formed therein and copper patterns filled with or formed on copper, which are conventionally formed to make many different electrical connections. Each lead 30 has an inner portion having an inner end 32 connected to the pad 25, or the substrate 35, and an outer portion having one end 34. The internal free end provides a point for electrically connecting the integrated circuit, and once it is mounted on the pad or connected to the substrate, it can be separately connected to the integrated circuit. The inner portion of the lead is typically encapsulated along the integrated circuit (and the substrate, if appropriate), and is therefore protected from exposure to the outside environment. The external portion typically extends out of the integrated circuit package and is exposed to the external environment. The external portion provides a point of electrical connection with one of the external electrical components and circuits. Most current leadframe designs, including those shown in Figures 1 and 1a, include a "throttle rod," structure 40, which connects the inner and outer ends of the leads, ··. »--- 12 This paper is universal China National Standard (CNS) A4 specification (210X297mm) C installed 1T— (Please read the precautions on the back before filling this page) Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 '' __. _B7 ____ V. Invention Explain the intermediate point between ((I). The main purpose of the throttle rod 40 is to prevent the epoxy from escaping from the mold and "overflowing to the outside during the molding or encapsulation process." On the leads, there is further detailed description in our related patent application No. 08 / 744,52. In the case of a multi-chip module or a laminated substrate, the epoxy resin layer 42 is covered and molded, and square The flat package shape is different. However, the throttling rod 40 functions similarly in both cases. Second, the throttling rod provides support for the lead to assist the relative positioning of the lead during the integrated circuit fabrication process. Position Refer to Figure 3, showing square flat An example of a preferred lead frame 75 of the package shape is that the outer portion 90 and the inner portion 95 have an outer frame 80, a pad 100, and a plurality of leads 85. In the comparative lead frame of FIG. A section is also shown in FIG. 4, and the throttle rod structure is not shown. Alternatively, a polymer-made structure '160 is formed at a midpoint between the endpoints of the inner portion 95 and the outer portion 90 of the lead 85. We cooperated with the related application patent No. 08 / 744,520 to show in detail that the purpose of the polymer made of beech is similar to that of the throttle rod. The function of the polymer structure is performed in the integrated circuit encapsulation process. At the same time, it prevents the epoxy resin from detaching and overflowing and provides additional support for the lead. Superior and not like the throttle rod, the polymer structure is combined into a part of the completed integrated circuit package 19 'As shown in Figure 8, and eliminates the need to operate the process of removing the throttle rods, flashovers, and part of the waste packaging process. For the purposes of this invention' the polymer / structure is properly placed in this manner, and Forming, and using related applications The material described in Profit No. 〇8 / 744,520. It is also the purpose of the present invention. The aggregate structure is started at the beginning of the integration. The 13 dimensions of the building are applicable to the Chinese National Standard (CNS) M Regulation ^ (210χ297χ). (Please first Read the precautions on the back and fill in this page) Packing and ordering Φ. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 1 B7 One __ ———--One _______ V. Description of Invention (β) Before the circuit manufacturing process It is preferably placed, that is, an integrated circuit package wafer is mounted on the square flat package-shaped gasket 100. A polymer-less lead frame for a multi-chip module or a laminated substrate is made of a polymer The structure is formed before the lead frame is covered with the substrate. In fact, in most of the preferred embodiments, by placing the polymer structure on each lead before separating it from the tape, the lead can be selectively pre-plated with a mask while the lead remains Tie in strip form and before the integrated circuit chip is mounted thereon. This is its advantage, allowing integrated circuit packagers to purchase selectively pre-plated lead frames for the packaging process, and save the investment and maintenance of chemical or electrochemical plating facilities outside the required mechanical packaging facilities burden. Standard leadframe immersion bath chemicals for palladium, palladium-nickel alloys, gold, etc. are widely known and commercially available from suppliers such as Lucent Technologies. These chemicals are suitable for use in the present invention. The operation of the masks, such as mechanical or photoresistive masks, is used to selectively plate the area of the lead frame in the form of a wire strip. It is also widely known to those skilled in the art, and need not be described in detail here. To fully understand the invention. However, in the present invention, unlike other lead frame mask manufacturing processes, especially in the process of processing lead frames containing throttling rods, the polymer structure 160 provides advantageous results. Referring to Figs. 5-7, since the polymer structure is placed around the package, a mechanical plating mask 200 is used to selectively pre-plat the outer portions 90 of 92 of the leads 85. In the case of the throttle rod structure 40, a photoresist or a mechanical mask can be used for selective pre-plating, and the throttle rod structure must be subsequently removed. Specifically, as shown in FIG. 5, the removal of the throttling rod cuts the throttling rod 40, and any excess epoxy _______14___ This paper size applies to China National Standard (CNS) Α4 specification (210X297 mm) (please Please read the notes on the back before filling this page) Packing. Order 'Printed by A7 B7, Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the Invention (θ) 45, which is included in the outer part of the lead 90 during the encapsulation process Within the throttle stick part 87. Remaining areas of the base metal 47 that are not required for the plating material are exposed. Since the polymer structure 160 retains a bonding portion 'of the finished package as shown in Fig. 8 and is not removed, the latent substrate metal remains and is exposed. In addition, the polymer structure 160 is combined with the mask 200 to form a substantially liquid-tight plug. Unlike the throttle rod structure, the polymer structure actually wraps the lead. Therefore, an effective electrical insulation 'liquid-tight plug to substantially prevent the leakage or leakage of the fluid plating material' is provided into the inner lead area, and the area does not need or is unnecessary to be plated because the inner lead 95 will be in the epoxy Within the resin package 190 or layer 42. Typically, the polymer structure 160 can be on the order of 10 · 15 mils wide. It is more appropriate that the edge of the mask 200 contacts any top surface of the polymer structure. An advantage of the present invention is that the edges of the mask need not be properly aligned with the polymer structure and still function properly. Since the polymer structure is electrically insulated, it will not be plated in a typical electrochemical plating process, even if it is exposed to a plating solution due to misalignment of the mask. As shown in Figs. 6 and 7, all the external parts of any of the leads 85, including the bar 80, can be pre-plated, or another mask 210 is used to limit the pre-plating to the area 94, where the leads are It will be cut off in the subsequent cutting / forming work. The latter alternative is particularly suitable when using precious metals for power mining, which is expensive. And another advantage of the present invention is that by selectively pre-plating the lead, 15 paper sizes are applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -----------; ^- -(锖 Please read the precautions on the back before filling this page) ♦ AW. A7 '' __-_ B7 _______— 5. The description of the invention (θ) part 'is adjacent to the inside of the connecting pad or substrate of the integrated circuit Parts can optionally be pre-plated with silver, which is compatible with existing wire bonding processes. Since there is no need to modify the current wire bonding process, the packaging is reduced, or it may be necessary to use palladium or palladium / nickel alloys for complete plating of the leads, which significantly reduces the amount of plating materials. The foregoing preferred embodiments of the present invention are described by way of example only, and are not intended to limit the scope of the present invention. Many materials, designs, dimensions, and other changes will be very simple and obvious to those skilled in the art, which may not exceed the spirit of the present invention, which will completely define its scope by the scope of the following patent applications. (Please read the precautions on the reverse side before filling out this page) 'One pack, order Printed by the Consumer Cooperatives of the Central Bureau of Standards, Ministry of Economic Affairs This paper size applies to China's national standard ... (CNS) Α4 size (210X297 mm)

Claims (1)

經濟部中央標隼局員工消費合作衽印製 A8 B8 C8 D8 六、申請專利範圍 / 1. 一種改良引線架結構，其甩於封裝一積體電路晶片 ，其包括： - 一框架結構； 複數條引線，其具有內部部份以及外部部份，前述之 外部部份向外延伸出朝向該引線架結構且該從此處向內延 伸； —聚合物製結構，其在至少一些引線之間延伸，且其 在該內部及外部部份之中點；.且 該外部部份係選擇性地以擇定之電鍍材料進行預鍍。 2. 如專利申請範圍第1項之引線架結構，其包含一襯 墊，用以於該引線之內部部份之內裝置該積體電路晶片。 3. 如專利申請範圍第1項之引線架結構，其中該外部 部份係大致完全地電鍍至該聚合物製結構之位置。 4. 如專利申請範圔第1項之引線架結構，其中該外部 部份係大致在一裁切點與該聚合物製結構之位置之間電鍍 〇 5. 如專利申請範圍第1項之引線架結構，其中該電鍍 材料係從包括黃金，鈀，鈀/鎳合金’錫鉛焊錫’錫’銀 中選擇° I疲用於封裝一積體電路晶片之改良引線架結構 之方法，其包括： 成形一引線架結構，包括： 一框架結構； 複數條引線，其具有內部部份以及外部部份’該 _、__1 —------ 本紙張尺度適用中國國家梯準（CNS > A4規格（210X297公釐） (.請先閲讀背面之注意事項再填寫本頁) .装- 訂 A8 ?88 ' ' D8 , 六、申請專利範圍 外部部份向外延伸朝向該框架結構且該內部部份在此向內 延伸； 提供一聚合物製結構，其在至少一些之該引線之 間延伸，且在該外部及內部部份之中間點。 7. 如專利申請範圍第6項之方法，其中成形一引線架 結構進一步地包括成形一用以裝置該積體電路晶片，朝該 引線之內部部份。 8. 如專利申請範圍第6項之方法，其中選擇性電鍍該 外部部份進一步地包括： .爲該引線之內部部份加上阻罩，該聚合物製結構與該 阻罩結合，以大致地預防電鍍材料通向該內部部份；以及 對該外部部份之全部未加阻罩區域施以電鍍材料之電 鍍。 9. 如專利申請範圍第6項之方法，其中選擇性電鍍該 外部部份進一步地包括： 爲該引線之內部部份加上阻罩；該聚合物製結構與該 阻罩結合，以大致地預防電鍍材料通向該內部部份； 經濟部中央標準局員工消費合作社印裝 (請先聞讀背面之注意事項再填寫本頁) 爲該引線之外部部份加上阻罩，其超出一選定之裁切 點；以及 對該外部部份之全部未加阻罩區域施以電鍍材料之電 鍍，在該裁切點位置與該聚合物製結構位置之間。 10. 如專利申請範圍第6項之方法，其中該電鍍材料 係從包括黃金，鈀，鈀/鎳合金，錫鉛焊錫，錫，銀及鉍 之群組中選擇。 ___2_；_ 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐) 經濟部中央標準局員工消費合作社印製 Λ8 Β8 C8 D8 六、申請專利範圍 11, 一種積體電路封裝體，其包含： 一引線框架，包括： 用以安裝一積體電路之安裝裝置； 複數條引線，其包含內部部份及外部部份，該內 部部份延伸朝向該安裝裝置； 一聚合物製結構，其在至少一些引線之間延伸， 且其在該內部及外部部份之中點，該外部部份係以選定之 電鍍材料選擇性地預鍍至該引變架結構之位置； 用以裝置一積體電路晶片之安裝用裝置； 一裝置於該安裝裝置之積體電路；以及 一種環氧樹脂結構，其包封該積體電路晶片，該 安裝裝置，該電氣導體以及該引線之內部部份，該引線之 外部部份，其延伸出該環氧樹脂結構β 12. 如專利申請範圔第11項之該積體電路封裝.體，其 中該電鍍材料係從包括黃金，鈀，鈀/鎳合金，錫鉛焊錫 ，錫，銀及鉍之群組中選擇。 13·—種封裝一積體電路之改良方法，包含： 成形一引線架，其包括： 一用以安裝積體電路晶片之安裝裝置； 複數條引線，其包含內部部份及外部部份，該內 部部份延伸朝向該安裝裝置·，以及 一聚合物製結構，其在至少一些引線之間延伸， 且其在該內部及外部部份之中點； 以一選定之電鍍材料選擇性地電鍍該引線之該外 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） --------0— ! (請先聞讀背面之注項再填寫本頁) 訂 經濟部中央標準局員工消費合作社印製 A8 ?88 、 ' D8 . 六、申請專利範圍 j 部部份； 安裝一積體電路晶片至該安裝裝置； 以複數條電氣導線連接該積體電路與該引線架； 以及 包封該積體電路晶片，該安裝裝置，該電氣導線 以及該引線之內部部份於該環氧樹脂結構之內，該引線之 已鍍之外部部份延伸出該環氧樹脂結構。 14. 如專利申請範圍第13項之方法，其中選擇性之預 鍍該引線之外部部份進一步地包括： y 爲該引線之內部部份加上阻罩；該聚合物製結構與該 阻罩結合，以大致地預防電鍍材料通向該內部部份；以及 對該外部部份之全部未加阻罩區域施以電鍍材料之電 鍍，在該裁切點位置與該聚合物製結構位置之間。 15. 如專利申請範圍第13項之方法，其中： ‘該引線架結構啓始地包括一框架結構； 選擇性地預鍍該引線之該外部部份，其進一步地包括 « 爲該引線之內部部份加上阻罩；該聚合物製結構 與該阻罩結合，以大致地預防電鍍材料通向該內部部份； 爲該引線之外部部份加上阻罩，其超出一選定之 …裁切點以及該聚合物製結構之位置；以及 對該外部部份之全部未加阻罩區域施以電鍍材料 之電鍍，在該裁切點位置與赛聚合物製結構位置之間對該 外部部份之全部未加阻罩區域施以電鍍材料之電鍍，在該 (請先閱讀背面之注意事項再填寫本頁) 袈. 訂 II· 本紙張尺度適用中國國家標準（CNS ) Λ4規格（210X297公釐） A8 Βδ 、 ' C8 D8 ' 六、申請專利範圍 裁切點位置與該聚合物製結構位置之間；以及 切除該外部部份之未電鍍部份，其包括該框架結 構。 16.如專利申請範圍第13項之方法，其中該電鍍材料 係從包括黃金，鈀，鈀/鎳合金，錫鉛焊錫，錫，銀及鉍 之群組中選擇。 --------、 装-- (請先閲讀背面之注意事項再填寫本頁) 訂 Ιβ 經濟部中央標隼局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）Printed by A8 B8 C8 D8 for consumer cooperation of the Central Bureau of Standards of the Ministry of Economic Affairs 6. Scope of patent application / 1. An improved lead frame structure, which is packaged with an integrated circuit chip, includes:-a frame structure; Leads having an inner portion and an outer portion, the aforementioned outer portions extending outwardly toward the leadframe structure and extending therefrom inwardly;-a polymer-made structure extending between at least some of the leads, and It is midway between the inner and outer parts; and the outer part is pre-plated selectively with a selected plating material. 2. The leadframe structure of item 1 of the patent application scope, which includes a pad for mounting the integrated circuit chip within the inner portion of the lead. 3. The leadframe structure as described in item 1 of the patent application scope, wherein the outer portion is substantially completely plated to the position of the polymer structure. 4. The lead frame structure of item 1 of the patent application, wherein the outer part is electroplated between a cutting point and the position of the polymer structure. 5. The lead frame of item 1 of the patent application scope Structure, wherein the plating material is selected from the group consisting of gold, palladium, palladium / nickel alloy 'tin-lead solder,' tin 'silver, and a method for improving a lead frame structure for packaging an integrated circuit chip, including: forming A lead frame structure, including: a frame structure; a plurality of leads having an internal part and an external part 'The _, __1 —------ This paper size is applicable to China National Standard (CNS > A4 specifications) (210X297 mm) (Please read the precautions on the back before filling out this page). Binding-Order A8 ~ 88 '' D8, VI. The outer part of the scope of patent application extends outward towards the frame structure and the inner part Extend inward here; Provide a polymer structure that extends between at least some of the leads, and between the outer and inner portions. 7. The method as defined in the scope of patent application item 6, wherein forming One lead The rack structure further includes forming an internal portion for mounting the integrated circuit chip toward the lead. 8. The method of item 6 of the patent application scope, wherein the selective plating of the external portion further includes: A mask is added to the inner portion of the lead, and the polymer structure is combined with the mask to substantially prevent the plating material from passing to the inner portion; and the entire unshielded area of the outer portion is applied. Electroplating of electroplating materials. 9. The method according to item 6 of the patent application, wherein selectively electroplating the outer portion further includes: adding a mask to the inner portion of the lead; the polymer structure and the mask Combined to prevent the plating material from reaching the internal part; Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page) Add a mask to the external part of the lead , Which exceeds a selected cutting point; and electroplating of electroplating material on all unshielded areas of the outer portion, at the position of the cutting point and the position of the polymer structure 10. The method according to item 6 of the patent application scope, wherein the plating material is selected from the group consisting of gold, palladium, palladium / nickel alloy, tin-lead solder, tin, silver, and bismuth. ___ 2 _; _ This paper size Applicable to China National Standard (CNS) A4 specification (210X297 mm) Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Λ8 Β8 C8 D8 6. Application for a patent 11, a integrated circuit package including: a lead frame, including : A mounting device for mounting an integrated circuit; a plurality of leads including an internal portion and an external portion, the internal portion extending toward the mounting device; a polymer structure extending between at least some of the leads And it is in the middle of the internal and external parts, the external part is selectively pre-plated with the selected plating material to the position of the pilot frame structure; a device for mounting an integrated circuit chip An integrated circuit mounted on the mounting device; and an epoxy resin structure encapsulating the integrated circuit chip, the mounting device, the electrical conductor, and the lead The inner part of the wire, the outer part of the lead, which extends out of the epoxy structure β 12. The integrated circuit package according to item 11 of the patent application, wherein the electroplating material consists of gold, Choose from palladium, palladium / nickel alloy, tin-lead solder, tin, silver and bismuth. 13 · —An improved method of packaging an integrated circuit, including: forming a lead frame, including: a mounting device for mounting an integrated circuit chip; a plurality of leads including an internal portion and an external portion, the The inner portion extends towards the mounting device, and a polymer structure extends between at least some of the leads and is midway between the inner and outer portions; the plate is selectively plated with a selected plating material The external paper size of the lead wire applies the Chinese National Standard (CNS) Α4 specification (210X297 mm) -------- 0—! (Please read the note on the back before filling this page) Order by the Ministry of Economic Affairs Standard Bureau employee consumer cooperatives printed A8-88, 'D8. 6. Part of patent application scope j; Install an integrated circuit chip to the mounting device; connect the integrated circuit and the lead frame with multiple electrical wires; And encapsulating the integrated circuit chip, the mounting device, the electrical wires and the inner portion of the lead are within the epoxy structure, and the plated outer portion of the lead extends out of the epoxy Lipid structure. 14. The method according to item 13 of the patent application scope, wherein the optional pre-plating of the outer portion of the lead further includes: y adding a mask to the inner portion of the lead; the polymer structure and the mask Combined to substantially prevent the plating material from reaching the inner portion; and plating the entire unshielded area of the outer portion with plating material between the cutting point position and the polymer structure position. 15. A method as described in item 13 of the patent application, wherein: 'the leadframe structure originally includes a frame structure; optionally pre-plating the outer portion of the lead, which further includes «is the interior of the lead A mask is added to the part; the polymer structure is combined with the mask to substantially prevent the plating material from reaching the inner part; a mask is added to the outer part of the lead, which exceeds a selected ... The cut point and the position of the polymer structure; and electroplating of all the unshielded areas of the outer portion with the plating material, between the cut point position and the position of the polymer structure All unshielded areas are plated with electroplating materials. (Please read the precautions on the back before filling this page) 袈. Order II · This paper size applies the Chinese National Standard (CNS) Λ4 specification (210X297 mm) A8 Βδ, 'C8 D8' 6. Between the position of the cutting point of the patent application range and the position of the polymer structure; and the unplated part of the outer part, which includes the frame structure. 16. The method according to item 13 of the patent application, wherein the plating material is selected from the group consisting of gold, palladium, palladium / nickel alloy, tin-lead solder, tin, silver, and bismuth. -------- 、 Loading-(Please read the precautions on the back before filling this page) Order Ιβ Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs This paper is printed in accordance with China National Standard (CNS) A4 specifications (210X297 mm)
TW087100777A 1997-01-30 1998-01-21 Improved leadframe structure with preplated leads and process for manufacturing the same TW383436B (en)

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US7235868B2 (en) * 2001-07-09 2007-06-26 Sumitomo Metal Mining Co., Ltd. Lead frame and its manufacturing method
JP4888992B2 (en) * 2005-01-27 2012-02-29 東洋鋼鈑株式会社 Method for producing surface-treated Al plate
JP5101798B2 (en) * 2005-02-14 2012-12-19 東洋鋼鈑株式会社 Surface treatment Al plate
US8920617B1 (en) 2010-07-06 2014-12-30 Greatbatch Ltd. Selective plating fixture

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JPH0595079A (en) * 1991-10-02 1993-04-16 Ibiden Co Ltd Lead frame, substrate for mounting semiconductor integrated circuit and semiconductor device, and manufacture thereof
US5541447A (en) * 1992-04-22 1996-07-30 Yamaha Corporation Lead frame

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