TW441857U - Semiconductor memory substrate package structure - Google Patents

Semiconductor memory substrate package structure

Info

Publication number
TW441857U
TW441857U TW89209308U TW89209308U TW441857U TW 441857 U TW441857 U TW 441857U TW 89209308 U TW89209308 U TW 89209308U TW 89209308 U TW89209308 U TW 89209308U TW 441857 U TW441857 U TW 441857U
Authority
TW
Taiwan
Prior art keywords
semiconductor memory
package structure
memory substrate
substrate package
semiconductor
Prior art date
Application number
TW89209308U
Other languages
Chinese (zh)
Inventor
Jr-Cheng Huang
Original Assignee
Karho Internat Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Karho Internat Co Ltd filed Critical Karho Internat Co Ltd
Priority to TW89209308U priority Critical patent/TW441857U/en
Publication of TW441857U publication Critical patent/TW441857U/en

Links

TW89209308U 2000-05-31 2000-05-31 Semiconductor memory substrate package structure TW441857U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89209308U TW441857U (en) 2000-05-31 2000-05-31 Semiconductor memory substrate package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89209308U TW441857U (en) 2000-05-31 2000-05-31 Semiconductor memory substrate package structure

Publications (1)

Publication Number Publication Date
TW441857U true TW441857U (en) 2001-06-16

Family

ID=21668600

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89209308U TW441857U (en) 2000-05-31 2000-05-31 Semiconductor memory substrate package structure

Country Status (1)

Country Link
TW (1) TW441857U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees