TW440066U - Heat dissipation device of ball grid array package - Google Patents

Heat dissipation device of ball grid array package

Info

Publication number
TW440066U
TW440066U TW88207148U TW88207148U TW440066U TW 440066 U TW440066 U TW 440066U TW 88207148 U TW88207148 U TW 88207148U TW 88207148 U TW88207148 U TW 88207148U TW 440066 U TW440066 U TW 440066U
Authority
TW
Taiwan
Prior art keywords
heat dissipation
grid array
dissipation device
ball grid
array package
Prior art date
Application number
TW88207148U
Other languages
Chinese (zh)
Inventor
Chi-Ren Wang
Original Assignee
Tennmax Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tennmax Inc filed Critical Tennmax Inc
Priority to TW88207148U priority Critical patent/TW440066U/en
Publication of TW440066U publication Critical patent/TW440066U/en

Links

TW88207148U 1999-05-06 1999-05-06 Heat dissipation device of ball grid array package TW440066U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88207148U TW440066U (en) 1999-05-06 1999-05-06 Heat dissipation device of ball grid array package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88207148U TW440066U (en) 1999-05-06 1999-05-06 Heat dissipation device of ball grid array package

Publications (1)

Publication Number Publication Date
TW440066U true TW440066U (en) 2001-06-07

Family

ID=21647746

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88207148U TW440066U (en) 1999-05-06 1999-05-06 Heat dissipation device of ball grid array package

Country Status (1)

Country Link
TW (1) TW440066U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees