• 434039 五、發明說明（1) 本發明係有關於一種廢氣處理裝置以及方法，特别是 有關於處理含有次微米（ΙβΗ!以下）微粒以及酸性氣體之 廢氣的裝置及方法。 目前’在許多工業製程中，次微米微粒為無可避免的 副產品，尤其是光電及半導體產業中，製程尾氣 (residual gas)經常同時含有高濃度的次微米微粒和酸 性氣體，由於其粒徑極小’對人體的呼吸道易造成肺部的 病變’此外，部分製程衍生的微粒具有腐蝕性或可燃性， 如果沈積在工廠的通風系統中，將造成管路堵塞而影響通 風系統之壓力平衡，更嚴重的將造成管壁腐蝕或燃燒，因 此如何控制次微米微粒的排放是目前空氣污染防制技術中 重要的一環。 依據實際工廠中所得之資料顯示，上述尾氣中含有粒 狀物質包括製程的直接副產物或特殊製程尾氣（SiH4、 DCS、PH3等等）以及處理後所衍生之間接副產物，而且該 等物質的粒徑大部分集中在（l#m以下）以下的次微米範 圍（如第1圖所示），而一般所使用的空氣污染防治設 備’例如苯氏洗滌器（Venturi scrub|)„,gjH赴廣處理、較 太一（大於in.)的微粒，並無法有效控制釋放於廢氣中的 ......... 次微米微粒，因此在這樣的技術普遍不足的狀況下，經常 發生廠内通風系統的堵塞，造成廠務系統的不穩定，甚至 引發安全事故，對廠内的安全是一大威脅。除此之外，次 微米微粒容易通過上呼吸道而導致肺部疾病，對人體之健 康具有不容忽視的危險性，因此各先進國家正積極發展控• 434039 5. Description of the invention (1) The present invention relates to an exhaust gas treatment device and method, and more particularly to an apparatus and method for treating exhaust gas containing submicron (IβΗ! Or less) particulates and acid gas. At present, in many industrial processes, sub-micron particles are an unavoidable by-product. Especially in the optoelectronics and semiconductor industries, the process gas (residual gas) often contains high concentrations of sub-micron particles and acid gases. 'It is easy to cause lung lesions on the human respiratory tract'. In addition, some process-derived particles are corrosive or flammable. If deposited in the ventilation system of the factory, it will cause pipeline blockage and affect the pressure balance of the ventilation system, which is more serious. It will cause corrosion or burning of the pipe wall, so how to control the emission of sub-micron particles is an important part of the current air pollution prevention technology. According to the data obtained in the actual factory, the above-mentioned exhaust gas contains granular substances, including direct by-products of the process or special process tail gas (SiH4, DCS, PH3, etc.) and indirect by-products derived after treatment. The particle size is mostly concentrated in the sub-micron range (below l # m) (as shown in Figure 1), and the commonly used air pollution prevention equipment 'for example, Venturi scrub | Widely processed, more than one (greater than in.) Particles, and can not effectively control ... micron particles released in the exhaust gas, so under the condition of such technology is generally inadequate, often occurs in the plant The blockage of the ventilation system causes the instability of the factory service system and even causes safety accidents, which is a major threat to the safety of the plant. In addition, submicron particles easily pass through the upper respiratory tract and cause lung disease, which is harmful to human health The danger cannot be ignored, so advanced countries are actively developing control
第4頁 f 434039 五、發明說明（2) ， * 制環境中次微米微粒濃度的技術與策略。 在以往的習知技術中，處理次微米微粒的方法有過濾 vPage 4 f 434039 5. Description of the invention (2), * Techniques and strategies for controlling the concentration of sub-micron particles in the environment. In the conventional technology, the method for processing sub-micron particles is filtering v
以及靜電集塵兩種。就過濾方法來說，雖然其效率優良， V 但對於次微求這樣大小的微粒’處理過程中需要極大的壓 降’才可發揮作用’而且成本相當高，因此很少用於廢氣 處理裝置，而大部分是應用於無塵室的控制上β而靜電集 塵方法’是藉由施加高壓電而使微粒附著於處理袭置上， 再加以移除’但該技術在設計上以及維修上均較為複雜， 因此亦不適用於擁擠的廠區《也就是說目前尚未有適宜的 技術，不論是設備上、成本上或是維修上均符合需求的廢 〇 基於上述需求，本發明之目的在於提供一種兼具控 次微米微粒以及酸性氣體的廢氣處理裝置，藉此而達到 制次微米微粒及酸性氣體所引發的廠務安全問題及風險二 同時可降低工業製程所引發的環境衝擊。 本發明之另一目的為提供一種控制次微米微粒以及费 性氣體的處理方法’可有效地移除工業製程中對人體以 環境有害的次微米微粒和酸性氣體，並且不需要複雜化 有的製程。 0 又，本發明之另一目的為提供一種步驟簡單兼具 小的廢氣處理裝置，可應用於任何工業製程中。 、承 本發明又一目的為提供—種空氣污染處理裝置， 是針對次微米微粒以及酸性氣體的處理裝置，利用簡2 濕式滌氣方式，可有蜱地移除對人體及環境有不良影響的And electrostatic dust collection. As far as the filtration method is concerned, although it has excellent efficiency, V, but for the micro particles of this size, the process requires a large pressure drop 'to be effective' and the cost is very high, so it is rarely used in exhaust gas treatment devices. And most of them are applied to the control of clean room β, and the electrostatic dust collection method 'is to apply high voltage electricity to make particles attach to the treatment and then remove it', but the technology is designed and maintained They are all relatively complicated, so they are not suitable for crowded factories. "That is to say, there is currently no suitable technology. Waste equipment that meets the requirements in terms of equipment, cost or maintenance. Based on the above requirements, the purpose of the present invention is to provide The utility model relates to an exhaust gas treatment device with both control of submicron particles and acid gas, thereby achieving plant safety problems and risks caused by the production of submicron particles and acid gas. At the same time, it can reduce the environmental impact caused by industrial processes. Another object of the present invention is to provide a treatment method for controlling submicron particles and costly gas, which can effectively remove submicron particles and acid gases that are harmful to the human body and the environment in industrial processes, and does not need to complicate existing processes. . Another object of the present invention is to provide an exhaust gas treatment device with simple steps and small size, which can be applied to any industrial process. Another object of the present invention is to provide an air pollution treatment device, which is a treatment device for sub-micron particles and acid gases. Using the Jane 2 wet scrubbing method, it can be removed with ticks, which has adverse effects on the human body and the environment. of
4 3 4 0 3 9 五、發明說明（3) 氣體。 為了達到上述目地，本發明之廢氣處理裝置主要可分 為四部分：霧化裝置、加速裝置、滌氣槽、氣體抽出裝刀 置。 _ 該霧化裝置，具有第一入氣口，第一出氣口以及噴霧 元件’且經由該噴霧元件將該洗滌液霧化成水滴而喷至由 第一入氣口導入之廢氣，進而由該第一出氣口流出。 該加速裝置，具有第二入氣口及第二出氣口，且該第 二入氣口連結於該第一出氣口，用以將由該第二入氣口流 入的該等水滴以及廢氣予以加速，而由該第二出氣口流 出。 該滌氣槽，用以收容該洗滌液，且具有第三入氣口、 第三出氣口及液體出口，而該第三入氣口連結於該第二出 氣口’用以將由該第三入氣口流入的該等水滴及廢氣予以 撞擊該洗滌液液面。該第三出氣口的位置較佳為設於該條 氣槽的上方。 此時，藉由連接於該第三出氣口之該氣體抽出裝置， 使該滌氣槽中的廢氣反折向上經由該第三出氣口流出該滌 氣槽。該氣體抽出裝置可使用氣閥以及抽氣機等。 此外，該廢氣處理裝置所使兩大量的洗滌液，可另設 置一洗滌液回收裝置，連接該液體出口及該霧化裝置，兩 以回收該洗滌液，例如水泵、控制閥以及流量計等。 根據本發明之廢氣處理方法，首先藉甴霧化裝置將洗 滌液霧化成水滴’然後以加速裝置將導入之廢氣及該水滴4 3 4 0 3 9 V. Description of the invention (3) Gas. In order to achieve the above purpose, the exhaust gas treatment device of the present invention can be mainly divided into four parts: an atomization device, an acceleration device, a scrubbing tank, and a gas extraction device. _ The atomizing device has a first air inlet, a first air outlet, and a spraying element, and the washing liquid is atomized into water droplets through the spraying element to spray the exhaust gas introduced from the first air inlet, and then the first air outlet Out of the air. The acceleration device has a second air inlet and a second air outlet, and the second air inlet is connected to the first air outlet for accelerating the water droplets and exhaust gas flowing in from the second air inlet, and the The second air outlet flows out. The scrubbing tank is used for containing the washing liquid, and has a third air inlet, a third air outlet, and a liquid outlet, and the third air inlet is connected to the second air outlet 'for flowing in from the third air inlet These water droplets and exhaust gas hit the level of the washing liquid. The position of the third air outlet is preferably provided above the air groove. At this time, by the gas extraction device connected to the third air outlet, the exhaust gas in the scrubbing tank is turned back up and flows out of the scrubber tank through the third air outlet. As the gas extraction device, a gas valve, an air extractor, or the like can be used. In addition, the waste gas treatment device can be provided with a large amount of washing liquid, and a washing liquid recovery device may be provided to connect the liquid outlet and the atomizing device to recover the washing liquid, such as a water pump, a control valve, and a flow meter. According to the exhaust gas treatment method of the present invention, the cleaning liquid is first atomized into a water droplet by means of an atomizing device, and then the introduced exhaust gas and the water droplet are accelerated by an accelerating device.
第6頁 m 4. Ο 3 9 五、發明說明（4) 加速並混合，此時藉由慣性衝擊可去除廢氣中之較大微 粒。當廢氣及水滴流入滌氣槽後，受到流速的影響，會先 衝向洗務液之液面’而更進一步地去除較大微粒，接著使 撞及洗蘇液液面之氣流反折向上流，此時次微米微粒因尺 寸微小重量輕，會隨著流線運動，亦反轉向上流動，同時 來自該加速裝置之水滴持續地流向滌氣槽，因此此時類似 下雨的水滴洗除作用（wash out )可去除次微来微粒，在 此過程中’酸性氣體亦在氣液相接觸過程中被水滴吸收。 在上述蘇氣槽中*最重要的是控制流體的流場，必須適當 地控制流速及滌氣槽的大小’使廢氣能撞擊（ifllpact)洗 務液之液面，避免在未與液面接觸就随著氣流流出該滌氣 槽’將有損處理效果，也就是說整個流場的控制是本發明 之廢氣處理裝置效果的重要因素c 在上述處理過程中所指的慣性衝擊是藉由調整進出條 氣槽之流體速度與方向以及槽内洗滌液之液面高度，使氣 流向下運動的深度可達液面，使微粒與液面發生碰撞。 此外該氣流流向反轉則是藉由調整加速流體進出滌氣 槽之速度與方法以及槽内洗滌液之液面高度，使氣流向丁 運動之深度達液面之後，隨著滌氣槽上方之氣體抽出作用 而反折向上。 該水滴洗除作用則是指氣流流向反轉後，次微米微粒 隨氣流向上流動，與自上而下之水滴發生碰撞而產生刷洗 的效果’因此去除氣體中多數的次微米微粒。 經過上述步驟，氣體中所含的微粒，尤其是習知技術Page 6 m 4. Ο 3 9 V. Description of the invention (4) Accelerate and mix. At this time, larger particles in the exhaust gas can be removed by inertial impact. When the exhaust gas and water droplets flow into the scrubber tank, they will be impacted by the flow velocity, and will first rush to the liquid level of the washing liquid to further remove the larger particles, and then the airflow hitting the liquid level of the washing liquid will be reversed and flowed upward. At this time, due to the small size and light weight of the sub-micron particles, it will flow upward and reversely flow with the streamline movement. At the same time, the water droplets from the acceleration device continue to flow to the scrubbing tank. (Wash out) can remove submicron particles, in the process, 'acid gas is also absorbed by water droplets during the gas-liquid contact process. In the above-mentioned aeration tank, the most important thing is to control the flow field of the fluid. The flow rate and the size of the scrubbing tank must be properly controlled so that the exhaust gas can hit the liquid surface of the ifllpact washing solution, and avoid contact with the liquid surface. As the air flows out of the scrubber tank, the treatment effect will be impaired, that is, the control of the entire flow field is an important factor for the effect of the exhaust gas treatment device of the present invention. C The inertial impact referred to in the above treatment process is adjusted by The speed and direction of the fluid entering and exiting the air tank and the height of the liquid surface of the washing liquid in the tank make the air flow move down to the liquid surface, causing the particles to collide with the liquid surface. In addition, the reversal of the air flow direction is to adjust the speed and method of accelerating the flow of fluid into and out of the scrubbing tank and the height of the liquid level of the washing liquid in the tank, so that the depth of the airflow toward the liquid surface reaches the liquid level, and then The gas draws back and folds upward. The water droplet washing effect means that after the airflow direction is reversed, the submicron particles flow upward with the airflow and collide with water droplets from the top to the bottom to produce a scrubbing effect. Therefore, most submicron particles in the gas are removed. After the above steps, the particles contained in the gas, especially the conventional technology
第*7頁 / 广。， 43403 9 五、發明說明（5) 所難以去除之次微米大小的微粒以及酸性氣體均可受到控 制’因而達成本發明β 為讓本發明之上述目的、特徵及優點能更明顯易懂， 下文特舉一實施例，並配合所附圖式，作詳細說明如下： 圖式簡單說明 第1圖係顯示典型半導體製程之尾氣的微粒粒徑分 佈。 第2圖係為根據本發明之廢氣處理裝置之施例的裝 置示意圖。 w 根據本發明之廢氣處理裝置所處理之藥 酸氣體控制效率的測氧結果。 第4圈係顯示根據本發明之廢氣處理裝詈所處理之次 微米微粒控制效率之_試/之㈣該裝置所處理 符號說明 ' & ° 102〜第一出氣口； 20卜喉管； 203~第二入氣口； 3〜滌氣槽； 302-第三出氣口； 40卜氣閥； 50卜水泵； 503〜流量計； 1 01 ~第一入氣口； 1〇3~喷霧元件； 202~差壓計； 204~第二出氣口； 301~第三入氣口； 303~液體出口； 402〜抽氣機； 502~第一控制閥； 504~第二控制閥。 實施例P.7 / wide. 43403 9 V. Description of the invention (5) Sub-micron-sized particles and acidic gases that are difficult to remove can be controlled. Therefore, the invention is achieved. In order to make the above-mentioned objects, features and advantages of the present invention more comprehensible, the following An embodiment is given in detail, in conjunction with the accompanying drawings, which are described in detail as follows: The drawings are briefly explained. The first figure shows the particle size distribution of the tail gas of a typical semiconductor process. Fig. 2 is a schematic diagram of an apparatus of an embodiment of an exhaust gas treatment apparatus according to the present invention. w Oxygen measurement results of the acid gas control efficiency of the chemicals processed by the exhaust gas treatment device of the present invention. The fourth circle shows the control efficiency of the sub-micron particles processed by the exhaust gas treatment device according to the present invention. _ Trial / of the symbol description of the device processing '& ° 102 ~ the first air outlet; 20 pipe throat; 203 ~ Second air inlet; 3 ~ Air scrubbing tank; 302-third air outlet; 40bu air valve; 50bu water pump; 503 ~ flow meter; 1 01 ~ first air inlet; 103 ~ spray element; 202 ~ Differential pressure gauge; 204 ~ second air outlet; 301 ~ third air inlet; 303 ~ liquid outlet; 402 ~ air extractor; 502 ~ first control valve; 504 ~ second control valve. Examples
43403 9 五、發明說明（6) 如第2圖所示’本發明之廢氣處理裝置的較佳實施例 包括霧化裝置、加速裝置、滌氣槽、氣體抽出裝置以及洗 蘇液回收裝置。其中，該霧化裝置具有一第一入氣口 、第一出氣口 102以及喷霧元件103。該第一入氣〇101 用來導入含有次微米微粒和酸性氣體的氣體於系統中；而 該喷霧元件1 03將洗滌液霧化生成水滴噴至由該第一入氣 口導入之氣體，接著該氣體及水滴流出該第一出氣口 102 〇 該加速裝置（在此以低壓損文式管為例）具有第二入 氣口 203、喉管201、差壓計202以及第二出氣口 2〇4 〇該第 二入氣口 203連接至該第一出氣口 1〇2，接收來自該第一出 氣口 102的氣體及水滴’經由一喉管201加速該氣體及水 滴’使得酸性氣體以及較大微粒產生衝擊而被去除。設於 該喉管201前後的差壓計202，可監測系統之操作狀況，進 而調整氣鱧及水滴的流量或速度。加速之氣體及水滴接著 流出該第二出氣口 204來到該滌氣槽3 » 該滌氣槽3具有第三入氣口 301、第三出氣口 302以及 液體出口 303 ◊該第三入氣口 301接收來自該第二出氣口之 氣禮及水滴，該水滴沈激於該蘇氣槽3内形成洗蘇液，此 時氣流中之小微粒因慣性作用隨著氣流衝擊到底部的液面 再次被去除，而位於該滌氣槽3之第三出氣口 302連接至該 氣體抽出裝置，該氣體抽出裝置具有抽氣機402及氣閥 401，可由第三出氣口 302將氣體抽出系統，抽出量可經由 該氣閥401加以控制。由液面而反折向上運動之氣流因此43403 9 V. Description of the invention (6) As shown in FIG. 2 ′ The preferred embodiment of the exhaust gas treatment device of the present invention includes an atomizing device, an acceleration device, a scrubbing tank, a gas extraction device, and a washing liquid recovery device. The atomizing device has a first air inlet, a first air outlet 102 and a spray element 103. The first gas inlet 101 is used to introduce a gas containing sub-micron particles and an acid gas into the system; and the spray element 103 sprays the washing liquid into water droplets to spray the gas introduced from the first gas inlet, and then The gas and water droplets flow out of the first air outlet 102. The acceleration device (here, a low-pressure loss text tube is taken as an example) has a second air inlet 203, a throat 201, a differential pressure gauge 202, and a second air outlet 204. The second air inlet 203 is connected to the first air outlet 102 and receives the gas and water droplets from the first air outlet 102 'accelerating the gas and water droplets through a throat 201' so that acidic gas and larger particles are generated The impact is removed. The differential pressure gauge 202 located before and after the throat 201 can monitor the operating condition of the system, and adjust the flow rate or speed of the gas discs and water droplets. The accelerated gas and water droplets then flow out of the second air outlet 204 to the scrubbing tank 3 »The scrubber tank 3 has a third air inlet 301, a third air outlet 302, and a liquid outlet 303. The third air inlet 301 receives The air salute and water droplets from the second air outlet, the water droplets are immersed in the aerosol tank 3 to form a lotion. At this time, the small particles in the airflow are removed again due to the inertia effect as the airflow hits the bottom liquid level. The third air outlet 302 located in the scrubbing tank 3 is connected to the gas extraction device. The gas extraction device has an air extractor 402 and an air valve 401. The gas can be extracted by the third air outlet 302. The gas valve 401 is controlled. The airflow that moves upwards from the liquid level
第9頁 ’434039 五、發明說明（7) 而向第二出氣口3〇2流動，藉著持續由上至下流動之 ::::的微粒順著氣流方向轉弩被帶往第三出氣口 30’2 將读-而：Ϊ時氣流的方向與水滴相&，導致水滴更容易 將逆k而上的微粒洗刷掉。 另外，為了能重複使用該洗滌液，該洗滌液回收裝置 J該液體出口 303相連，該洗滌液回收系統包括水泵5〇1、 第一控制閥502、&量計503以及第二控制閥5〇4，可將先 滌液回送至該霧化裝置，並可調整該洗滌液之流量β亦可 經由該第二控制閥504，將洗滌液回流至滌氣槽3内而調整 液面高度。 上述過程中，同樣地可去除酸性氣體，因酸性氣體在 喉管加速階段可與水滴均勻混和，並在後續步驟藉由氣液 相的質傳作兩而去除，必要時可加藥劑調整洗滌液的ρΗ值 以提升控制效率。 在此實施例中’以模擬近似於半導體廠製程尾氣特性 的測試氣體作為處理氣體，其中以發電機之排氣作為系統 之微粒產生源’該微粒之平均粒徑大小為0.1〜 右。並於汽油燃料中添加不同比率之機油，控制該微粒之 平均粒徑在0.04至0.2パffl之間β而酸性氣體則為l至5 ppm之鹽酸及破酸氣體。 在本實施例中，因係為針對次微米微粒之實驗’對次 微米大小的微粒來說’無法進行精確的質量測量，因此實 驗結果是以微粒數量作為處理效果之比較，而不是以傳統 的質量分析法。將前後微粒數量換算成移除效率後繪製成Page 9 '434039 V. Description of the invention (7) Flowing to the second air outlet 302, by continuously flowing the particles from top to bottom :::: The particles cross the crossbow along the direction of the airflow and are taken to the third outlet The air port 30'2 will read-while: the direction of the airflow at the time is related to the water droplets, which makes it easier for the water droplets to scrub away the particles that go up to k. In addition, in order to reuse the washing liquid, the washing liquid recovery device J is connected to the liquid outlet 303. The washing liquid recovery system includes a water pump 501, a first control valve 502, a & meter 503, and a second control valve 5 〇4, the first cleaning liquid can be returned to the atomizing device, and the flow rate of the washing liquid can be adjusted. The second control valve 504 can also be used to return the washing liquid to the cleaning tank 3 to adjust the liquid level. In the above process, the acidic gas can also be removed, because the acidic gas can be uniformly mixed with the water droplets during the acceleration phase of the throat, and can be removed by the mass transfer of gas and liquid phases in the subsequent steps. If necessary, chemicals can be added to adjust the washing liquid. ΡΗ value to improve control efficiency. In this embodiment, 'a test gas that simulates the characteristics of the tail gas of a semiconductor factory process is used as the processing gas, and the exhaust gas of the generator is used as the particle generation source of the system'. The average particle size of the particles is 0.1 to right. In addition, different ratios of engine oil are added to the gasoline fuel, and the average particle size of the particles is controlled to be between 0.04 and 0.2 パ ffl, while the acid gas is 1 to 5 ppm of hydrochloric acid and acid-breaking gas. In this example, because the experiment for sub-micron particles is 'for sub-micron-sized particles', accurate mass measurement cannot be performed, so the experimental results are compared with the number of particles as a treatment effect, rather than the traditional Quality analysis method. The number of particles before and after is converted into the removal efficiency and plotted as