TW431124B - Manufacturing method of multi-layer printed circuit board - Google Patents

Manufacturing method of multi-layer printed circuit board

Info

Publication number
TW431124B
TW431124B TW88107369A TW88107369A TW431124B TW 431124 B TW431124 B TW 431124B TW 88107369 A TW88107369 A TW 88107369A TW 88107369 A TW88107369 A TW 88107369A TW 431124 B TW431124 B TW 431124B
Authority
TW
Taiwan
Prior art keywords
layer
circuit board
printed circuit
insulation layer
manufacturing
Prior art date
Application number
TW88107369A
Other languages
English (en)
Inventor
Tsung-Jin Chiou
Yu-Sen Pei
Original Assignee
World Wiser Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by World Wiser Electronics Inc filed Critical World Wiser Electronics Inc
Priority to TW88107369A priority Critical patent/TW431124B/zh
Priority to JP15544599A priority patent/JP2000323837A/ja
Application granted granted Critical
Publication of TW431124B publication Critical patent/TW431124B/zh

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
TW88107369A 1999-05-06 1999-05-06 Manufacturing method of multi-layer printed circuit board TW431124B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW88107369A TW431124B (en) 1999-05-06 1999-05-06 Manufacturing method of multi-layer printed circuit board
JP15544599A JP2000323837A (ja) 1999-05-06 1999-06-02 多層印刷配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88107369A TW431124B (en) 1999-05-06 1999-05-06 Manufacturing method of multi-layer printed circuit board

Publications (1)

Publication Number Publication Date
TW431124B true TW431124B (en) 2001-04-21

Family

ID=21640569

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88107369A TW431124B (en) 1999-05-06 1999-05-06 Manufacturing method of multi-layer printed circuit board

Country Status (2)

Country Link
JP (1) JP2000323837A (zh)
TW (1) TW431124B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8726495B2 (en) 2003-02-13 2014-05-20 Fujikura Ltd. Multi-layer board manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103517573B (zh) * 2012-06-20 2017-06-16 深南电路有限公司 一种电路板的加工方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8726495B2 (en) 2003-02-13 2014-05-20 Fujikura Ltd. Multi-layer board manufacturing method thereof

Also Published As

Publication number Publication date
JP2000323837A (ja) 2000-11-24

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees