TW431035B - Anti-static socket - Google Patents
Anti-static socketInfo
- Publication number
- TW431035B TW431035B TW084104777A TW84104777A TW431035B TW 431035 B TW431035 B TW 431035B TW 084104777 A TW084104777 A TW 084104777A TW 84104777 A TW84104777 A TW 84104777A TW 431035 B TW431035 B TW 431035B
- Authority
- TW
- Taiwan
- Prior art keywords
- semi
- conductor
- pedestal
- package
- loading surface
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
- H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Elimination Of Static Electricity (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6128232A JPH07311241A (ja) | 1994-05-17 | 1994-05-17 | 帯電防止用ソケット |
Publications (1)
Publication Number | Publication Date |
---|---|
TW431035B true TW431035B (en) | 2001-04-21 |
Family
ID=14979768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW084104777A TW431035B (en) | 1994-05-17 | 1995-05-15 | Anti-static socket |
Country Status (3)
Country | Link |
---|---|
US (1) | US5620327A (zh) |
JP (1) | JPH07311241A (zh) |
TW (1) | TW431035B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060024986A1 (en) * | 2004-07-28 | 2006-02-02 | International Business Machines Corporation | Electrostatic discharge dissipative sockets |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2008333B (en) * | 1977-11-14 | 1982-05-26 | Amp Inc | Electrical connector |
US4388371A (en) * | 1981-06-29 | 1983-06-14 | General Electric Company | Self-bonding acrylic polymer overcoat for coated metal substrates |
US4417777A (en) * | 1981-10-13 | 1983-11-29 | Molex Incorporated | Integrated circuit carrier assembly |
US4595794A (en) * | 1984-03-19 | 1986-06-17 | At&T Bell Laboratories | Component mounting apparatus |
US4560218A (en) * | 1984-12-03 | 1985-12-24 | Amp Incorporated | Socket for surface mount dip |
US4684184A (en) * | 1986-01-14 | 1987-08-04 | Amp Incorporated | Chip carrier and carrier socket for closely spaced contacts |
JPH0715826B2 (ja) * | 1989-12-28 | 1995-02-22 | 山一電機工業株式会社 | Icソケット |
JPH07105257B2 (ja) * | 1991-09-13 | 1995-11-13 | 山一電機株式会社 | Icソケット |
US5249971A (en) * | 1991-09-13 | 1993-10-05 | Foxconn International, Inc. | IC package connector |
JPH0752664B2 (ja) * | 1992-12-28 | 1995-06-05 | 山一電機株式会社 | Icソケット |
-
1994
- 1994-05-17 JP JP6128232A patent/JPH07311241A/ja active Pending
-
1995
- 1995-05-12 US US08/440,092 patent/US5620327A/en not_active Expired - Fee Related
- 1995-05-15 TW TW084104777A patent/TW431035B/zh active
Also Published As
Publication number | Publication date |
---|---|
JPH07311241A (ja) | 1995-11-28 |
US5620327A (en) | 1997-04-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW376556B (en) | Semiconductor package, and semiconductor device and their manufacture | |
TW338180B (en) | Semiconductor and its manufacturing method | |
KR0119464B1 (en) | Semiconductor device and lead frame | |
MY104243A (en) | Static shielding film. | |
TW331008B (en) | Electronic label and carriers thereof | |
TW349249B (en) | Resin-packaged type semiconductor device having a heat sink | |
TW328156B (en) | Resin-sealing type semiconductor and method of manufacture thereof | |
GB2325939A (en) | Thermally conductive chuck for vacuum processor | |
TW333692B (en) | The leadframe with pedestal form raised pedestal on a leadframe die mount pad and form an electrical connection between the die mount pad and the semiconductor die. | |
ES2008664A4 (es) | Captador de posicion electrico y/o electronico. | |
MX9709940A (es) | Chip para tarjeta electronica revestida con una capa de material aislante, y una tarjeta electronica que comprende este chip. | |
KR950034714A (ko) | 소 켓 | |
SG86366A1 (en) | Packaging and interconnection of contact structure | |
TW431035B (en) | Anti-static socket | |
EP0671607A3 (de) | Positionsmesseinrichtung. | |
EP0778599A3 (de) | Schalter mit einem temperaturabhängigen Schaltwerk | |
DE3365144D1 (en) | Electrical connector for an electronic package | |
DE59809477D1 (de) | Stromdurchführungselement | |
DK0730285T3 (da) | Isoleringshus | |
ATE58680T1 (de) | Lenkrollen. | |
TH21311B (th) | เครื่องสำเร็จเต้ารับชนิดต้านไฟฟ้าสถิต | |
GB2249665B (en) | Pressure-contact type semiconductor device | |
ES8104655A1 (es) | Perfeccionamientos en aparatos de instalaciones electricas con anillo de soporte para disposicion empotrada antihumedad | |
JPS55140250A (en) | Semiconductor device | |
JPH0284617A (ja) | 液晶表示器保持装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent |