TW430936B - Method for making high-reliable vias in semiconductor integrated circuit device - Google Patents
Method for making high-reliable vias in semiconductor integrated circuit deviceInfo
- Publication number
- TW430936B TW430936B TW88104404A TW88104404A TW430936B TW 430936 B TW430936 B TW 430936B TW 88104404 A TW88104404 A TW 88104404A TW 88104404 A TW88104404 A TW 88104404A TW 430936 B TW430936 B TW 430936B
- Authority
- TW
- Taiwan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- circuit device
- metal interconnection
- making high
- Prior art date
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
A method of making a semiconductor integrated circuit device wherein a via plug electrochemical corrosion can be prevented, resulting from charge accumulated in the via plug by plasma after upper metal interconnection is patterned in a multilevel metallization structure. A method for making a semiconductor integrated circuit device in which a upper metal interconnection and a lower metal interconnection are connected through a via, having steps of: performing a plasmaless ozone ashing treatment after patterning the upper metal interconnection, in order to prevent a charge from being accumulated in a surface of a metal plug filling up the via.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88104404A TW430936B (en) | 1999-03-20 | 1999-03-20 | Method for making high-reliable vias in semiconductor integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88104404A TW430936B (en) | 1999-03-20 | 1999-03-20 | Method for making high-reliable vias in semiconductor integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
TW430936B true TW430936B (en) | 2001-04-21 |
Family
ID=21640033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW88104404A TW430936B (en) | 1999-03-20 | 1999-03-20 | Method for making high-reliable vias in semiconductor integrated circuit device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW430936B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108091630A (en) * | 2016-11-23 | 2018-05-29 | 中芯国际集成电路制造(上海)有限公司 | A kind of semiconductor devices and its manufacturing method |
-
1999
- 1999-03-20 TW TW88104404A patent/TW430936B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108091630A (en) * | 2016-11-23 | 2018-05-29 | 中芯国际集成电路制造(上海)有限公司 | A kind of semiconductor devices and its manufacturing method |
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Legal Events
Date | Code | Title | Description |
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GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |