TW430917B - Method for measuring rough thin film parameter - Google Patents

Method for measuring rough thin film parameter

Info

Publication number
TW430917B
TW430917B TW087110759A TW87110759A TW430917B TW 430917 B TW430917 B TW 430917B TW 087110759 A TW087110759 A TW 087110759A TW 87110759 A TW87110759 A TW 87110759A TW 430917 B TW430917 B TW 430917B
Authority
TW
Taiwan
Prior art keywords
thin film
rough thin
rough
measuring
film parameter
Prior art date
Application number
TW087110759A
Other languages
English (en)
Inventor
Ming-Kuan Gau
Chian-Sung Ju
Original Assignee
Mosel Vitelic Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mosel Vitelic Inc filed Critical Mosel Vitelic Inc
Priority to TW087110759A priority Critical patent/TW430917B/zh
Priority to JP10229452A priority patent/JP2000021943A/ja
Priority to US09/131,405 priority patent/US6310688B1/en
Application granted granted Critical
Publication of TW430917B publication Critical patent/TW430917B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0641—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of polarization

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Memories (AREA)
TW087110759A 1998-07-03 1998-07-03 Method for measuring rough thin film parameter TW430917B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW087110759A TW430917B (en) 1998-07-03 1998-07-03 Method for measuring rough thin film parameter
JP10229452A JP2000021943A (ja) 1998-07-03 1998-07-31 凹凸薄膜の変数値測定方法
US09/131,405 US6310688B1 (en) 1998-07-03 1998-08-10 Method for measuring the parameter of a rough film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW087110759A TW430917B (en) 1998-07-03 1998-07-03 Method for measuring rough thin film parameter

Publications (1)

Publication Number Publication Date
TW430917B true TW430917B (en) 2001-04-21

Family

ID=21630579

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087110759A TW430917B (en) 1998-07-03 1998-07-03 Method for measuring rough thin film parameter

Country Status (3)

Country Link
US (1) US6310688B1 (zh)
JP (1) JP2000021943A (zh)
TW (1) TW430917B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107179055A (zh) * 2017-05-28 2017-09-19 中国计量大学 用于bopp薄膜生产的薄膜厚度监测方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6459482B1 (en) * 2000-10-24 2002-10-01 Advanced Micro Devices, Inc. Grainless material for calibration sample
US6975386B2 (en) 2001-06-01 2005-12-13 Kabushiki Kaisha Toshiba Film quality inspecting method and film quality inspecting apparatus
DE10339227B4 (de) * 2003-08-26 2014-05-28 Byk Gardner Gmbh Verfahren und Vorrichtung zur Charakterisierung von Oberflächen
FR2859485B1 (fr) * 2003-09-04 2006-09-15 Essilor Int Procede de realisation d'un traitement anti-reflets sur un substrat optique, substrat optique obtenu par ce procede et dispositif de mise en oeuvre du procede
US11867497B2 (en) * 2021-03-29 2024-01-09 Changxin Memory Technologies, Inc. Method for measuring film thickness of semiconductor device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5835225A (en) * 1994-11-30 1998-11-10 Micron Technology, Inc. Surface properties detection by reflectance metrology
JP2638554B2 (ja) * 1995-03-16 1997-08-06 日本電気株式会社 表面モニター方法、表面積測定方法、半導体装置の製造装置及び方法
US5825498A (en) * 1996-02-05 1998-10-20 Micron Technology, Inc. Ultraviolet light reflectance method for evaluating the surface characteristics of opaque materials
KR100265328B1 (ko) * 1998-04-22 2000-09-15 김영환 반구형 그레인을 갖는 폴리실리콘 박막의 표면적 변화율 측정방법과 그를 이용한 정전용량 측정 방법 및 장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107179055A (zh) * 2017-05-28 2017-09-19 中国计量大学 用于bopp薄膜生产的薄膜厚度监测方法

Also Published As

Publication number Publication date
US6310688B1 (en) 2001-10-30
JP2000021943A (ja) 2000-01-21

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees