TW430877B - Exposure system, exposure device, application device, development device, and method of controlling wafer treating environment in the exposure system - Google Patents

Exposure system, exposure device, application device, development device, and method of controlling wafer treating environment in the exposure system

Info

Publication number
TW430877B
TW430877B TW088116365A TW88116365A TW430877B TW 430877 B TW430877 B TW 430877B TW 088116365 A TW088116365 A TW 088116365A TW 88116365 A TW88116365 A TW 88116365A TW 430877 B TW430877 B TW 430877B
Authority
TW
Taiwan
Prior art keywords
exposure
application
exposure system
development
development device
Prior art date
Application number
TW088116365A
Other languages
Chinese (zh)
Inventor
Toshihiko Tsuji
Original Assignee
Nippon Kogaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kogaku Kk filed Critical Nippon Kogaku Kk
Application granted granted Critical
Publication of TW430877B publication Critical patent/TW430877B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

An exposure system, an exposure device, an application device, a development device, and a method of controlling the wafer treating environment in the exposure system used at a photolithography step in the process of manufacturing a microdevice, a mask, or the like. An application/development device (11) and an exposure device (12) are connected through an interface device (13). This interface device (13) has a blower (52) for exhausting the air in its transfer chamber (53) to under the floor (54) of a clean room (14). The air in a unit chamber (39) of the application/development device (11) and in each of chambers (78 and 65 to 67) in the exposure device (12) is exhausted to under the floor (54) through the transfer chamber (53). As a result, the pressure in the chambers (78 and 65 to 67) of the exposure device (12) is not raised to a level higher than that in the unit chamber (39), and hence various chemicals from the application/development device (11) do not enter the exposure device (12). Therefore, accurate exposure can be realized while avoiding the troublesome pressure adjustments of the devices (11 to 13) and not increasing the size of the devices (11 to 13).
TW088116365A 1999-09-14 1999-09-23 Exposure system, exposure device, application device, development device, and method of controlling wafer treating environment in the exposure system TW430877B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1999/005026 WO2001020650A1 (en) 1999-09-14 1999-09-14 Exposure system, exposure device, application device, development device, and method of controlling wafer treating environment in the exposure system

Publications (1)

Publication Number Publication Date
TW430877B true TW430877B (en) 2001-04-21

Family

ID=14236716

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088116365A TW430877B (en) 1999-09-14 1999-09-23 Exposure system, exposure device, application device, development device, and method of controlling wafer treating environment in the exposure system

Country Status (3)

Country Link
AU (1) AU5651399A (en)
TW (1) TW430877B (en)
WO (1) WO2001020650A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6585430B2 (en) 2000-05-09 2003-07-01 Tokyo Electron Limited System and method for coating and developing
CN113721429A (en) * 2021-09-10 2021-11-30 大连理工大学 Maskless photoetching system and corresponding photoetching method thereof

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1457832A1 (en) * 2003-03-11 2004-09-15 ASML Netherlands B.V. Lithographic projection assembly, load lock and method for transferring objects
SG115631A1 (en) 2003-03-11 2005-10-28 Asml Netherlands Bv Lithographic projection assembly, load lock and method for transferring objects
KR101211451B1 (en) * 2003-07-09 2012-12-12 가부시키가이샤 니콘 Exposure apparatus and method for manufacturing device
JP4759272B2 (en) * 2005-01-13 2011-08-31 ルネサスエレクトロニクス株式会社 Exposure equipment
JP2006286709A (en) * 2005-03-31 2006-10-19 Toppan Printing Co Ltd Exposure apparatus and method of forming photoresist pattern using the same
JP5304647B2 (en) 2007-06-28 2013-10-02 富士通セミコンダクター株式会社 Heat treatment apparatus and semiconductor device manufacturing method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6079358A (en) * 1983-10-07 1985-05-07 Nippon Kogaku Kk <Nikon> Projecting optical device
JPH0590133A (en) * 1991-09-27 1993-04-09 Matsushita Electric Ind Co Ltd X-ray aligner

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6585430B2 (en) 2000-05-09 2003-07-01 Tokyo Electron Limited System and method for coating and developing
CN113721429A (en) * 2021-09-10 2021-11-30 大连理工大学 Maskless photoetching system and corresponding photoetching method thereof

Also Published As

Publication number Publication date
AU5651399A (en) 2001-04-17
WO2001020650A1 (en) 2001-03-22

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees