TW429734B - Method of forming solder mask - Google Patents

Method of forming solder mask

Info

Publication number
TW429734B
TW429734B TW88108168A TW88108168A TW429734B TW 429734 B TW429734 B TW 429734B TW 88108168 A TW88108168 A TW 88108168A TW 88108168 A TW88108168 A TW 88108168A TW 429734 B TW429734 B TW 429734B
Authority
TW
Taiwan
Prior art keywords
wires
green paint
board
pad region
solder mask
Prior art date
Application number
TW88108168A
Other languages
Chinese (zh)
Inventor
Jen-Hua Jeng
Original Assignee
Unimicron Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unimicron Technology Corp filed Critical Unimicron Technology Corp
Priority to TW88108168A priority Critical patent/TW429734B/en
Priority to JP11177411A priority patent/JP2000340931A/en
Application granted granted Critical
Publication of TW429734B publication Critical patent/TW429734B/en

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A method of forming a solder mask for circuit board with a high layout density, comprises providing a substrate board having patterned wires on the surface thereof, in which the wires having a solder pad region for electric connection with other devices; coating a first green paint on the board covering the wires and the board and filling up the gap between the wires; pre-baking the paint; removing a portion of the first green paint to expose the surface of the wires and solidifying the green paint layer between the wires; coating a second green paint on the board covering the wires and the green paint layer between the wires; pre-baking, exposing and developing the second green paint; and removing the second green paint on the solder pad region of the wires to expose the surface of the solder pad region of the wires.
TW88108168A 1999-05-19 1999-05-19 Method of forming solder mask TW429734B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW88108168A TW429734B (en) 1999-05-19 1999-05-19 Method of forming solder mask
JP11177411A JP2000340931A (en) 1999-05-19 1999-06-23 Solder mask forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88108168A TW429734B (en) 1999-05-19 1999-05-19 Method of forming solder mask

Publications (1)

Publication Number Publication Date
TW429734B true TW429734B (en) 2001-04-11

Family

ID=21640756

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88108168A TW429734B (en) 1999-05-19 1999-05-19 Method of forming solder mask

Country Status (2)

Country Link
JP (1) JP2000340931A (en)
TW (1) TW429734B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112235961A (en) * 2020-10-14 2021-01-15 大连崇达电路有限公司 Manufacturing method for improving tin coating on gold surface of blue rubber plate

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102327733B1 (en) * 2014-12-09 2021-11-17 삼성전기주식회사 Printed circuit board and method of manufacturing the same
CN106211609B (en) * 2016-07-27 2019-02-01 东莞万钧电子科技有限公司 The screen printing method of thick copper printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112235961A (en) * 2020-10-14 2021-01-15 大连崇达电路有限公司 Manufacturing method for improving tin coating on gold surface of blue rubber plate

Also Published As

Publication number Publication date
JP2000340931A (en) 2000-12-08

Similar Documents

Publication Publication Date Title
JP4505623B2 (en) Hole filling apparatus and method for printed circuit board and method for manufacturing printed circuit board
EP1032041A3 (en) Semiconductor device comprising an internal wiring pattern
EP0997935A4 (en) Printed wiring board and method for manufacturing the same
TW342580B (en) Printed circuit assembly and method of manufacture therefor
TW200507214A (en) Semiconductor package substrate with protective metal layer on pads formed thereon and method for fabricating the same
WO2002013258A3 (en) Backside contact for integrated circuit and method of forming same
MY118245A (en) Multilayer printed circuit boards
WO2004077548A3 (en) Connection technology for power semiconductors
TW200740326A (en) Method of making a circuitized substrate having a plurality of solder connection sites thereon
MY127243A (en) Process to manufacture tight tolerance embedded elements for printed circuit boards
EP0814510A3 (en) TAB tape and semiconductor device using the TAB tape
IL143440A0 (en) A method for forming a conductive layer on a substrate
JP2767312B2 (en) Connection method between electromagnetic wave shielding layer and ground circuit in printed wiring board
TW429734B (en) Method of forming solder mask
TW200616519A (en) Method for fabricating electrical connections of circuit board
US6210746B1 (en) Method of fabricating a solder resist mask
TW331699B (en) Fabricating a surface laminar circuit
SE0101868L (en) Method of applying copper to substrate
EP0917199A3 (en) Improvements in or relating to semiconductor devices
TW200709453A (en) Circuit board structure of semiconductor package and method for fabricating the same
JPS56130951A (en) Manufacture of semiconductor device
JPH0478197A (en) Manufacture of printed circuit board
TW200501851A (en) Printed circuit board and method for making the same
JPH08288644A (en) Manufacture of printed board
TW200518289A (en) Solder bump structure formed on integrated circuit package substrate and method for fabricating the same

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees