TW428098B - IC testing apparatus - Google Patents

IC testing apparatus

Info

Publication number
TW428098B
TW428098B TW088108065A TW88108065A TW428098B TW 428098 B TW428098 B TW 428098B TW 088108065 A TW088108065 A TW 088108065A TW 88108065 A TW88108065 A TW 88108065A TW 428098 B TW428098 B TW 428098B
Authority
TW
Taiwan
Prior art keywords
socket
baseboard
testing apparatus
type
tested
Prior art date
Application number
TW088108065A
Other languages
Chinese (zh)
Inventor
Satoru Takeshita
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Application granted granted Critical
Publication of TW428098B publication Critical patent/TW428098B/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The present invention relates to an IC testing apparatus with testing head that can only reduces component exchange for the corresponding IC type during the exchange of IC type. The solution is stated below. The IC testing apparatus having IC socket, which is electrically contacted with tested IC, is prepared. The socket baseboard 505 is used to make coaxial cable 506 electrically contact with testing head. The secondary stage of socket baseboard 511, which has the installed IC socket 510, can be assembled and disassembled from the socket baseboard 505. The secondary stage of socket baseboard 511 has the disposed-wire figure corresponding to tested IC type that connects each terminal of IC socket and each terminal of socket baseboard 505.
TW088108065A 1998-05-20 1999-05-18 IC testing apparatus TW428098B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10138410A JPH11326448A (en) 1998-05-20 1998-05-20 Ic testing device

Publications (1)

Publication Number Publication Date
TW428098B true TW428098B (en) 2001-04-01

Family

ID=15221318

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088108065A TW428098B (en) 1998-05-20 1999-05-18 IC testing apparatus

Country Status (3)

Country Link
JP (1) JPH11326448A (en)
KR (1) KR19990088452A (en)
TW (1) TW428098B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3790175B2 (en) * 2002-03-01 2006-06-28 株式会社アドバンテスト Device with substrate abnormality detection circuit
WO2006085364A1 (en) * 2005-02-09 2006-08-17 Advantest Corporation Electronic component test equipment
KR100798104B1 (en) 2006-02-06 2008-01-28 가부시키가이샤 아드반테스트 Electronic component testing apparatus
WO2008139579A1 (en) * 2007-05-09 2008-11-20 Advantest Corporation Electronic part testing apparatus, electronic part testing system and method of testing electronic part

Also Published As

Publication number Publication date
JPH11326448A (en) 1999-11-26
KR19990088452A (en) 1999-12-27

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent