4 ^42 8 9 Λ7 ____B7_ 五、發明說明（） 發明領域-‘ 本發明與一種晶圓傳送系統有關，特別是一種可自 動偵測用以承載晶圓之承載平板與其週圍物體間距離的 智慧型晶圓傳送系統（smart robot wafer transfer system)。 發明背景= 隨著半導體工業持續的進步，積體電路其設計尺寸 已進入次微米階段。而伴隨著這股趨勢與潮流的演進，在 半導體工業中相關機台與設備的設計與製造上，亦朝著符 合小規模尺寸且高效率產能之機器設備加以發展，以便能 有效的縮短製程週期且提高產品之良率。其中晶圓傳送系 統（wafer transfer system)的設計亦受到持續的發展與改 良，除了方便在數量愈趨繁複的各式機台設備間傳遞晶圓 時，能更迅速且更精確的將晶圓傳送到所需的位置之外1 更要有效的防止晶圓在傳送過程中受到不當的損害。 經濟部智慧財產局員工消費合作社印製 (請先閱讀背面之注t事項再填寫本頁) 請參照第一圖，該圖所顯示爲典型的晶圓傳送過程 之截面圖。其中一卡匣（casette)2用以儲存晶圓，如第一 圖中之晶圓4及晶圓6。另外，一連接於機器手臂（robot arm)(未顯示於圖中）之承載平板8，則經由該機器手臂的 控制而伸入該卡匣2中以承托欲進行製程之晶圓4，其中値 得注意的是該承載平板8具有上表面8a與下表面8b，而上 本纸張尺度通用中國國家標準（CNS)A4規烙（210 =< 297公釐了 B7 五、發明說明（） (請先閱讀f面之注意事項再填寫本頁> 表面8a用以與晶圓4接觸，且承托住晶圓4。請參照第二 圖，該圖所顯示爲該承載平板8之仰視圖，其中該承載平 板8如同前述將晶圓4托起。接著請參照第三圖，在承托起 欲進行製程之晶圓4後，該承載平板8經由機器手臂的控制 而離開該卡匣2，而將該晶圓4傳送至第四圖中之機台10 之上。其中該機台1〇上表面具有支架12,用以在進行該項 製程時，承托該晶圓4。在將該晶圓4放置於支架12上後， 在機器手臂的控制下，該承載平板8會自該機台10上方移 開，而留下該晶圓4於該機台10上，以便進行該項製程。 經濟部智慧財產局員工消費合作社印製 値得注意的是由於承載平板8在進行承載或卸載晶 圓4之程序時，往往是使用一指標裝置（mdexer)來控制承 載平板S之相關位置。亦即藉由指標裝置所設定的位置， 使用機器手臂將承載平板8移至定位，以進行承載/卸載動 作。然而如此一來，當該承載平板8的位置與所設定位置 產生誤差時，機器手臂並無法立即有效的反應及處置，而 仍祇依照指標裝置所提供之資料移動承載平板。在此情形 下，往往在進行如第三圖所示之承載/卸載程序時，造成 所承載晶圓4其上表面4a與卡匣2發生觸碰，或是造成該承 載平板8其下表面8b與晶圖6之上表面6a發生觸碰，而使該 晶圓4或6其上表面發生刮傷（scratch)。另外，在進行如第 四圖所示，將晶圓4傳送至機台1 0上方時，亦可能由於上 述誤差而造成承載平板8與機台10發生擦撞，而導致承載 平板8與機台1 0的損壞。特別是如同上述，隨著半導體元 本紙張尺度適用中國國家標準（CNS)A‘l規格（210 x 297公笼） 424289 Λ7 B7 五、發明說明（） 件尺寸的持續縮小，即使極輕微的刮傷皆有可能造成大是 元件受損，而降低了產品之良率。 (清先閱讀背面之注意事項再填寫本頁) 更者，由於此種晶圓表面的損傷往往無法立即有效 的被檢測而加以處置，是以經常祇能在進行後續製程或直 到積體元件在進行相關測試時才被發現。如此一來’往往 已造成大量的晶片損壞，從而大幅的降低產品良率且提高 了所消耗的成本。因此在傳統製程中’往往藉著對傳送系 統進行定期的保養與校正，以期有效降低晶圓損傷之機 率。此外，也藉由在機台與卡匣等機器設備中，裝設鎖定 裝置（interlock)，以利用雷射探測光束來判斷晶圓是否到 達定位。如此，雖可有效得知晶圖是否已到達定位’然仍 無法有效的判斷晶圓表面是否在傳送過程中，與其週圍物 體發生碰觸而在表面發生刮傷° / 發明目的及槪述= 本發明之目的在提供一種晶圓傳送系統，用以防止 承載平板在傳送晶圓之過程中與週圍物體發生觸碰。 經濟部智慧財產局員工消費合作社印製 本發明之再一目的在提供一種晶圓傳送系統，以便 即時監控該承載平板之操作狀況。 本發明之又一目的在提供一種即時監控晶圓傳送 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公堃） 424289 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（ 系統其承載平板操作狀況之方法 本發明之另一目的在提供一種避免造成晶圓刮傷 之晶圓傳送系統。 本發明提出一種晶圓傳送系統用以傳送晶圓於機 台與卡匣之間》該晶圓傳送系統包括了一承載平板’連接 於機器手臂（robot arm)上，其中該承載平板具有上表面與 下表面，且該上表面用以承載該晶圓。另外，形成電容偵 測器於該承載平板之下表面，用以偵測承載平板與第一物 體間之電容訊號，其中該第一物體位於該承載平板之下 方。利用一放大裝置，回應於該電容偵測器，用以放大該 電容偵測器所偵測之電容訊號。然後，使用一轉換裝置’ 於該電容訊號小於預定啓始値時，轉換該電容訊號爲數位 訊號“是”，當電容訊號大於或等於該預定啓始値時’則 轉換該電容訊號爲數位訊號“否”。此外一 “及”邏輯裝 置，用以回應於該轉換裝置，且當上述數位化訊號爲 “否”時，則暫停該自動手臂，且啓動一警示裝置。 式簡單說明= 藉由以下詳細之描述結合所附圖示，將可輕易的了 解上述內容及此項發明之諸多優點，其中： 第一圖爲使用承載平板對卡匣中晶圓進行承載/卸 本纸張尺度適用令國國家標準（CNS)A4規格（210 X 297公釐） ------_-----裝----.----訂 (請先閲讀背面之注意事項再填寫本頁) 4 經濟部智慧財產局員工消費合作社印製 242 89 A7 ___B7__ 五、發明說明（） 載步驟之截面圖： 第二圖爲承載平板之仰視圖，顯示使用承載平板承 托晶圓之步驟.； 第三圖爲使用承載平板自卡匣中承載並傳送晶圓 之步驟； 第四圖爲使用承載平板將晶圓卸載至機台上方之 步驟； 第五圖爲承載平板之仰視圖，顯示根據本發明使用 具有偵測裝置之承載平板承托晶圓之步驟； 第六圖爲根據本發明使用承載平板對卡匣中晶圓 進行承載/卸載之步驟； 第七圖爲使用承載平板對位於機台上之晶圓進行 承載/卸載之步驟； 第八圖爲根據本發明所提供之晶圓傳送系統裝置 圖；及 第九圖爲根據本發明所提供用以即時偵測晶圓傳 送系統其操作狀況之方法流程圖。 發明詳細說明： 本發明提供一種晶圓傳送系統，藉著在承載平板上 裝設偵測裝置，以有效得到該承載平板與其週遭物體之相 關距離。如此在使用該承載平板進行傳送晶圓、或承載/ 卸載晶圓等程序時，將可有效的避免由於該承載平板與其 本纸張尺度適用令國國家標準（CNS)A4規格（210 X 297公釐） (請先閲璜背面之注意事項再填寫本頁) ^24289 A7 B7 五、發明說明（） 現損 傷生 刮發 生台 產機 面關 表相 圓之 晶程 致製 導行 所進 ,或 擊板 撞平 或載 碰承 觸該 生致 發導 體至 物甚 圍， 週象 經濟部智慧財產局員工消費合作社印製 壞。有關本發明之詳細說明如下所述。 請參照第五圖，該圖所顯示爲一承載平板108之仰 視圖。其中該承載平板108連接於一機器手臂（robot arm) 並受其控制，用以承載或卸載一晶圓104以進行傳送程 序。在該承載平板108之下表面丨08b上，則貼附有偵測裝 置116，用以偵測該承載平板108其下表面108b與其週遭物 體之距離。在一較佳實施例中，該偵測裝置116爲電容感 應裝置，可用以偵測該承載平板108其下表面108b與其週 圍物體之間的電容値（capacitance)，並根據該電容値來獲 得該承載平板108其下表面108b與週圍物體間的距離。一 般而言，可在該承載平板108下表面108b上貼附複數個偵 測裝置11 6，以便在進行偵測時，可根據所得到之複數組 資料，而更淸晰的判斷該承載平板丨0S在機台與卡匣間進 行晶圓傳送程序之操作狀況。亦即可以更淸楚的判斷該承 載平板108與其週遭物體間之距離關係。値得注意的是該 複數個偵測裝置116亦可貼附於該承載平板108之上表面 10Sa，甚至該承載平板108之邊緣側壁上 > 以更有效的顯 示出該承載平板108之操作狀況。 請參照第六圖，該圖所顯示爲使用承載平板丨08對 位於卡匣102中之晶圖104進行承載/卸載之步驟。一般而 言，該卡匣102中用以存放尙未進行製程之晶圓（如106)或 是已完成相關製程之晶圓。並藉著利用機器手臂上之承載 7 本紙張尺度適用中因國家標準（CNS)A4規格（210x297公爱） ； ^------裝----：----訂r (清先閲讀背面之没意事項再填寫本頁) 424289 ____B7____ 五、發明說明（） 平板108，將欲進行製程之晶圓104自卡匣102中傳送至機 台上以進行相關製程。同樣地，在完成相關程序後，再藉 由承載平板108將晶圓104自機台上卸載且傳送至卡匣102 中。接著再對下一塊晶圓106進行相同的承載與傳送程 序，以進行相關製程。其中該承載平板108具有一上表面 108a與下表面108b，且如同上述，偵測裝置116被貼附於 該承載平板108之下表面108b，以便用來偵測該承載平板 108與其下方物體（如第六圖中晶圓106)間之距離dl。至於 該承載平板1 08之上表面I 08a，則用以與晶圓接觸以進行 承載與傳送之程序。 同理，當該承載平板108經由機器手臂的控制而傳 送晶圖至如第七圖中之機台110時，亦可有效的偵測該承 載平板108其下表面108b與機台110間之距離d2。其中當該 承載平板108移動至該機台110的上方時，可將該晶圓104 卸載於該機台110上表面之支架112上。如同上述，此時位 於該承載平板108下表面108b上之偵測裝置U6，將可有效 的偵測出承載平板108下表面108b與機台110間之電容 値，且根據所得電容値而決定該承載平板108與機台110 間之距離d2。 經濟部智慧財產局員工消費合作社印製 ---：---T--- •-裝----卜---訂_ (請先閱讀背面之注意事項再填冩本頁) 然後請參照第八圖，該圖顯示根據本發明所形成之 晶圓傳送系統裝置圖。其中，可將複數組偵測裝置116貼 附於承載平板108之表面上，以偵測該承載平板1〇8與週圍 物體之複數組距離。如同上述，在一較佳實施例中，使用 複數組電容感應器來作爲上述偵測裝置116，以偵測該承 本纸張尺度適用令國國家辟（CNS〉A4規格（2lG x 297公餐 4242 89 B7__ 五、發明說明（） 載平板108與週圍物體間之複數組電容値。在測得相關複 數組電容値後，將選擇性的利用一放大（amplifier)裝置 120，以便放大所得之電容訊號，並由此得到複數組放大 訊號。如此，藉著放大所得之電容訊號，以方便後續進行 訊號處理時，可更淸楚有效时獲得該承載平板108之操作 狀況- 經濟部智慧財產局員工消費合作社印製 ；--------- 裝----訂- {請先閱讀背面之注意事項再填寫本頁) 一般而言，由於所得到之電容訊號爲類比訊號，是 以爲了獲得數位化訊號以方便進行後續程序，可將所得到 之複數組放大訊號傳輸至一轉換裝置130，以便將所得到 之複數組類比訊號轉換爲複數組數位訊號。在一較佳實施 例中，可使用電容偵測器電路板（capacitance sensor board) 來作爲上述轉換裝置1 30，並根據所得到之類比訊號其電 壓値是否大於一預定啓始値（specific threshold voltage)， 來轉換該類比訊號爲數位訊號。例如當所得到之類比訊號 其電壓値小於該預定啓始値時，則決定該類比訊號爲數位 化訊號如“是”（True)或“接受（acceptable);反之，當所 得到之類比訊號大於該預定啓始値時，則轉換其數位化訊 號爲“否”（False)或是“不可接受”（unacceptable)。亦即 當所得到之類比訊號顯示該承載平板108與其週遭物體之 距離已小於一預定之安全距離時，則轉換裝置130會將該 類比訊號轉換爲上述“否”或“不可接受”之數位化訊 號；反之當承載平板108與其週遭物體之距離尙大於一預 定之安全距離時，則轉換裝置1 30會將該類比訊號轉換爲 上述“是”或“可接受”之數位化訊號。 本.紙張尺度滷用中®國家螵準（CNSM4規格（210x297公楚） 424289 A7 一 ____ B7 五、發明說明（） 接著再將該複數組數位訊號傳送至一處理裝置 140，並由該處理裝置140根據所得到之複數組數位訊號， 決定是否產生一暫停訊號以停止該機器手臂之操作（亦即 停止該承載平板108之操作），且同時啓動一警示裝置150 以便進行後續進行排除狀況之相關程序。其中該處理裝置 140在一較佳實施例中，可使用一 “及”邏輯閘（AND logic gate)來構成，當所得之複數組數位訊號皆爲“是”或 “可接受”時，則繼續進行相關傳送及承載/卸載等程序； 反之，當所得之複數組數位訊號中的任何一組數位訊號爲 “否”或“不可接受”時，則產生一暫停訊號以暫時停止 該機器手臂之動作，亦即停止該承載平板108之操作，且 同時啓動一警示（alarm)裝置150以待後續進行處理。 經濟部智慧財產局員工消費合作社印製 . -----裳--------訂-. (請先閱tl背面之>i意事項再填寫本頁) 然後，請參照第九圖，該圓所顯示爲根據本發明所 提供一種用來即時偵測晶圓傳送系統其承載平板操作狀 況之方法流程圖。其中，首先進行步驟200，偵測承載平 板與週圍物體間之距離。如同上述步驟200可藉著利用貼 附於承載平板108表面之電容偵測器11 6來進行。接著進行 步驟210，比較所量測距離與所設預定啓始値（specific t h r e s h ο 1 d v a 1 u e)之大小以產生數位訊號。其中當所量測距 離小於該預定啓始値時’則產生數位訊號“否”；當該距 離大於或等於該預定啓始値時’則產生數位訊號“否”。 値得注意的是對於上述電容偵測器Π 6而言’可藉著提供 預定啓始電壓値（specific threshold voltage)，以便與電容 偵測器116所測得之電容訊號進行比較，並由此產生數位 本紙張尺度適用中國囷家標準（CNS)A4規格（210 X 297公坌） 424289 Α7 ______Β7 五、發明說明（） 訊號。然後，再進行步驟220,根據所產生之數位訊號進 行承載平板108之操作。其中當數位訊號爲“否”時，則 經由暫停機器手臂以停止該承載平板108之操作，且啓動 一警示裝置以待後續進行處理程序。 本發明具有相當多之優點，例如，藉著運用本發明 所提供之晶圓傳送系統除了可有效的在繁雜多樣的機台 等設備中，進行晶圓傳送、承載/卸載等程序之外，更可 有效的避免位於卡匣中之晶圓表面，由於承載平板其下表 面之觸碰或撞擊而產生刮傷現象。此外*也可有效的避免 由於位移誤差所導致該承載平板在傳送晶圓過程中與機 台表面發生觸碰，進而使機台或承載平板發生損壞。更 者，藉著使用本發明所提供之晶圓傳送系統，可即時 (real-time)偵測該承載平板在進行傳送程序時之操作狀 況，而方便操作者立刻進行排除故障，如此將可有效的縮 短進行製程之週期，且提高所製造產品之良率。 本發明雖以一較佳實例閩明如上，然其並非用以限 定本發明精神與發明實體，僅止於此一實施例爾。對熟悉 此領域技藝者，在不脫離本發明之精神與範圍內所作之修 改，均應包含在下述之申請專利範圍內° - ------裝--------訂· <諝先閲績背面之;it事項再填寫本頁) 經 濟 智 慧 財 產 局 消 費 合 作 社 印 η 11 本紙張尺度通用中國國家標隼（CNrs)A4規格（2i〇X297公釐）4 ^ 42 8 9 Λ7 ____B7_ V. Description of the invention () Field of the invention-The present invention relates to a wafer transfer system, especially a smart type that can automatically detect the distance between a carrier plate used to carry a wafer and its surrounding objects Wafer transfer system (smart robot wafer transfer system). BACKGROUND OF THE INVENTION = With the continuous advancement of the semiconductor industry, the design dimensions of integrated circuits have entered the sub-micron stage. With the evolution of this trend and trend, in the design and manufacture of related machines and equipment in the semiconductor industry, they are also developing towards machines and equipment that meet the small-scale and high-efficiency production capacity, so as to effectively shorten the process cycle. And improve product yield. The design of the wafer transfer system has also been continuously developed and improved. In addition to facilitating the transfer of wafers between various types of equipment, the wafers can be transferred more quickly and accurately. Going beyond the desired position1 It is more effective to prevent the wafer from being damaged improperly during the transfer process. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs (please read the note on the back before filling out this page) Please refer to the first figure, which shows a cross-sectional view of a typical wafer transfer process. One cassette 2 is used to store wafers, such as wafer 4 and wafer 6 in the first figure. In addition, a load plate 8 connected to a robot arm (not shown in the figure) is extended into the cassette 2 through the control of the robot arm to support the wafer 4 to be processed, where It should be noted that the carrying plate 8 has an upper surface 8a and a lower surface 8b, and the upper paper size is in accordance with the Chinese National Standard (CNS) A4 standard (210 = < 297 mm B7. V. Description of the invention) (Please read the precautions on the f side before filling in this page> The surface 8a is used to contact the wafer 4 and support the wafer 4. Please refer to the second figure, which shows the bottom view of the carrier plate 8 In the figure, the carrier plate 8 holds the wafer 4 as described above. Then please refer to the third figure. After the wafer 4 to be processed is held, the carrier plate 8 leaves the cassette through the control of the robot arm. 2, and the wafer 4 is transferred to the machine 10 in the fourth figure. The upper surface of the machine 10 is provided with a bracket 12 for supporting the wafer 4 during the process. After the wafer 4 is placed on the support 12, under the control of a robot arm, the carrying plate 8 is released from the machine 10 Fang removed it, leaving the wafer 4 on the machine 10 to perform the process. It is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. It should be noted that the carrier plate 8 is loading or unloading the wafer. In the 4 procedure, an indicator device (mdexer) is often used to control the relevant position of the bearing plate S. That is, by using the position set by the indicator device, the bearing plate 8 is moved to the position by a robot arm for carrying / unloading. However, in this case, when the position of the carrying plate 8 is different from the set position, the robot arm cannot immediately and effectively respond and dispose, but still only moves the carrying plate according to the data provided by the index device. In this case Next, when the loading / unloading procedure shown in the third figure is performed, the upper surface 4a of the loaded wafer 4 and the cassette 2 are caused to touch, or the lower surface 8b of the loaded flat plate 8 and the crystal pattern are caused. 6 The upper surface 6a touches and scratches the upper surface of the wafer 4 or 6. In addition, as shown in the fourth figure, when the wafer 4 is transferred above the machine 10 ,also Due to the above-mentioned errors, the loading plate 8 and the machine 10 can collide with each other, resulting in damage to the loading plate 8 and the machine 10. Especially as mentioned above, as the semiconductor element paper size applies the Chinese National Standard (CNS) A 'l size (210 x 297 male cage) 424289 Λ7 B7 V. Description of the invention () The continuous reduction in the size of the piece, even the slightest scratches may cause damage to the components, which reduces the yield of the product. Please read the precautions on the back before filling in this page.) Furthermore, because such wafer surface damage is often not immediately and effectively detected and disposed of, it is often only in the subsequent process or until the integrated component is being processed. Only relevant tests were found. As a result, it has often caused a large amount of chip damage, which has greatly reduced the product yield and increased the cost consumed. Therefore, in the traditional process, the periodic maintenance and calibration of the transfer system is often used to effectively reduce the chance of wafer damage. In addition, interlocks are also installed in the equipment such as the machine table and the cassette, so as to determine whether the wafer has been positioned using a laser detection beam. In this way, although it is effective to know whether the crystal pattern has reached the positioning position, it is still not effective to determine whether the surface of the wafer is in contact with surrounding objects and scratched on the surface during the conveyance ° / Purpose of the invention and description = This The object of the invention is to provide a wafer transfer system for preventing the carrier plate from touching the surrounding objects during the wafer transfer process. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Another object of the present invention is to provide a wafer transfer system for real-time monitoring of the operation status of the carrier plate. Another object of the present invention is to provide a real-time monitoring wafer transfer. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 cm). 424289 A7 B7 Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economy (The method for the system to carry the operating condition of the flat plate. Another object of the present invention is to provide a wafer transfer system that avoids scratching the wafer. The present invention proposes a wafer transfer system for transferring wafers to a machine and a cassette. The wafer transfer system includes a carrier plate 'connected to a robot arm, wherein the carrier plate has an upper surface and a lower surface, and the upper surface is used to carry the wafer. In addition, a capacitance detection is formed. The detector is on the lower surface of the bearing plate for detecting the capacitance signal between the bearing plate and a first object, wherein the first object is located below the bearing plate. Using an amplifying device in response to the capacitance detector, It is used to amplify the capacitance signal detected by the capacitance detector. Then, a conversion device is used to switch the capacitance signal when the capacitance signal is less than a predetermined start. The capacitor signal is a digital signal "Yes", and when the capacitor signal is greater than or equal to the predetermined start time, the capacitor signal is converted to a digital signal "No". In addition, an "AND" logic device is used to respond to the conversion device , And when the above-mentioned digitized signal is "No", the automatic arm is suspended and a warning device is activated. Brief description of the formula = By the following detailed description combined with the attached diagram, the above content and this will be easily understood Many advantages of this invention, among them: The first picture shows the loading / unloading of wafers in the cassette by using the loading plate. The paper size is applicable to the national standard (CNS) A4 specification (210 X 297 mm) ---- --_----- Installation ----.---- Order (please read the notes on the back before filling out this page) 4 Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives 242 89 A7 ___B7__ V. Invention Explanation () Cross-sectional view of the loading step: The second figure is a bottom view of the carrying plate, showing the steps of using the carrying plate to support the wafer. The third figure is the step of carrying and transferring the wafer from the cassette using the carrying plate; The fourth picture shows the use of a bearing plate The step of unloading the wafer above the machine; the fifth figure is a bottom view of the carrier plate, showing the steps of using the carrier plate with the detection device to support the wafer according to the present invention; the sixth diagram is the use of the carrier plate according to the present invention Steps for loading / unloading wafers in a cassette; Figure 7 is a step for loading / unloading wafers on a machine using a load plate; Figure 8 is a wafer transfer system device provided according to the present invention Figures; and Figure 9 are flowcharts of a method for real-time detection of the operating condition of a wafer transfer system according to the present invention. Detailed Description of the Invention: The present invention provides a wafer transfer system by mounting on a carrier plate. Detection device to effectively obtain the relevant distance between the bearing plate and its surrounding objects. In this way, when using the carrier plate to carry wafers, or to load / unload wafers, it can effectively avoid the national standard (CNS) A4 specification (210 X 297 public) due to the application of the carrier plate and its paper size. (%) (Please read the precautions on the back of the page before filling out this page) ^ 24289 A7 B7 V. Description of the invention () The damage caused by the scratches occurred on the machine's surface is caused by the crystal process, or The striker smashed or bumped into contact with the hair-generating conductor to the surrounding area, which was badly printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. A detailed description of the present invention is as follows. Please refer to the fifth figure, which shows a bottom view of a carrying plate 108. The carrying plate 108 is connected to and controlled by a robot arm, and is used for carrying or unloading a wafer 104 for a transfer process. On the lower surface 08b of the carrying plate 108, a detecting device 116 is attached to detect the distance between the lower surface 108b of the carrying plate 108 and the surrounding objects. In a preferred embodiment, the detection device 116 is a capacitance sensing device, which can be used to detect a capacitance (capacitance) between the lower surface 108b of the carrying plate 108 and surrounding objects, and obtain the capacitance according to the capacitance The distance between the lower surface 108b of the carrying plate 108 and the surrounding objects. Generally speaking, a plurality of detection devices 116 can be attached to the lower surface 108b of the bearing plate 108, so that when detecting, the bearing plate can be more clearly judged based on the obtained complex array data. 0S The operating status of the wafer transfer process between the machine and the cassette. That is, the distance relationship between the carrier plate 108 and the surrounding objects can be judged more carefully. It should be noted that the plurality of detection devices 116 can also be attached to the upper surface 10Sa of the carrier plate 108, and even on the side walls of the carrier plate 108 > to more effectively display the operation status of the carrier plate 108 . Please refer to the sixth figure, which shows the steps of loading / unloading the crystal map 104 located in the cassette 102 using the loading plate 08. Generally speaking, the cassette 102 is used to store unprocessed wafers (such as 106) or wafers that have completed related processes. And by using the load on the robot arm, 7 paper sizes are applicable due to the national standard (CNS) A4 specification (210x297 public love); ^ ------ installation: ---- order r (clear Read the unintentional matter on the back before filling this page.) 424289 ____B7____ 5. Description of the invention () Flat plate 108: Transfer the wafer 104 to be processed from the cassette 102 to the machine for related processes. Similarly, after the relevant procedures are completed, the wafer 104 is unloaded from the machine by the carrier plate 108 and transferred to the cassette 102. Then, the same load and transfer process is performed on the next wafer 106 to perform related processes. The carrying plate 108 has an upper surface 108a and a lower surface 108b. As described above, the detection device 116 is attached to the lower surface 108b of the carrying plate 108 so as to detect the carrying plate 108 and objects below it (such as The distance dl between the wafers 106) in the sixth figure. As for the upper surface I 08a of the carrying plate 108, it is used for contacting the wafer for carrying and carrying procedures. Similarly, when the bearing plate 108 transmits the crystal map to the machine 110 as shown in the seventh figure through the control of the robot arm, the distance between the lower surface 108b of the bearing plate 108 and the machine 110 can also be effectively detected. d2. When the carrier plate 108 is moved above the machine 110, the wafer 104 may be unloaded on a support 112 on the upper surface of the machine 110. As described above, at this time, the detection device U6 located on the lower surface 108b of the carrying plate 108 can effectively detect the capacitance 値 between the lower surface 108b of the carrying plate 108 and the machine 110, and determine the capacitance 根据 according to the obtained capacitance 値. The distance d2 between the carrying plate 108 and the machine 110. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ---: --- T --- • ----------------- Order_ (Please read the precautions on the back before filling out this page) Then please Referring to the eighth figure, the figure shows a device diagram of a wafer transfer system formed according to the present invention. Among them, the complex array detection device 116 may be attached to the surface of the carrying plate 108 to detect the complex array distance between the carrying plate 108 and surrounding objects. As mentioned above, in a preferred embodiment, a complex array capacitor sensor is used as the above-mentioned detection device 116 to detect that the paper size is suitable for national standards (CNS> A4 specification (2lG x 297 meals) 4242 89 B7__ V. Description of the invention () The complex array capacitance 载 between the carrier plate 108 and the surrounding objects. After the relevant complex array capacitance 测 is measured, an amplifier 120 is selectively used to amplify the obtained capacitance. Signal, and thus obtain a complex array of amplified signals. In this way, by using the amplified capacitor signal to facilitate subsequent signal processing, the operating status of the carrier plate 108 can be obtained more effectively when it is effective-Employees at the Intellectual Property Bureau, Ministry of Economic Affairs Printed by Consumer Cooperatives; --------- Mounting ---- Order-{Please read the notes on the back before filling out this page) Generally speaking, since the capacitance signal obtained is an analog signal, it is based on In order to obtain the digitized signal for the convenience of subsequent procedures, the obtained complex array amplified signal may be transmitted to a conversion device 130 so as to convert the obtained complex array analog signal into a complex array digit. In a preferred embodiment, a capacitance sensor board can be used as the conversion device 130, and whether the voltage 値 is greater than a predetermined start value (specific) according to the analog signal obtained. threshold voltage) to convert the analog signal to a digital signal. For example, when the voltage of the obtained analog signal is less than the predetermined threshold, the analog signal is determined to be a digital signal such as "True" or "Accepted" Conversely, when the analog signal obtained is greater than the predetermined start value, the digital signal is converted to "False" or "unacceptable". That is, when the analog is obtained When the signal indicates that the distance between the carrying plate 108 and its surrounding objects is less than a predetermined safe distance, the conversion device 130 converts the analog signal into the above-mentioned "No" or "unacceptable" digital signal; otherwise, when the carrying plate 108 When the distance from the surrounding objects is greater than a predetermined safe distance, the conversion device 1 30 will convert the analog signal to the above-mentioned "yes" or "Acceptable" digital signal. The paper size is used in the national standard (CNSM4 specification (210x297)) 424289 A7 A ____ B7 V. Description of the invention () Then the complex array of digital signals is sent to a The processing device 140, and the processing device 140 determines whether to generate a pause signal to stop the operation of the robot arm (that is, to stop the operation of the carrying plate 108) according to the obtained digital signal of the complex array, and simultaneously starts a warning device 150 in order to carry out the relevant procedures for subsequent exclusion. Wherein, the processing device 140 can be formed by using an AND logic gate in a preferred embodiment. When the obtained digital signals of the plurality of arrays are all “yes” or “acceptable”, the process continues. Carry out related transmission and carrying / unloading procedures; otherwise, when any set of digital signals in the complex digital signal obtained is "No" or "Unacceptable", a pause signal is generated to temporarily stop the movement of the robot arm That is, the operation of the carrying plate 108 is stopped, and an alarm device 150 is started at the same time for subsequent processing. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. ----- Shang -------- Order-. (Please read > I on the back of tl before filling in this page) Then, please refer to Section Nine figures, the circle shows a flowchart of a method for real-time detection of the operating condition of the carrying plate of the wafer transfer system according to the present invention. First, step 200 is performed to detect the distance between the bearing plate and surrounding objects. Step 200 as described above can be performed by using a capacitance detector 116 attached to the surface of the carrying plate 108. Then, step 210 is performed to compare the measured distance with a predetermined predetermined start threshold (specific t h r e s h ο 1 d v a 1 u e) to generate a digital signal. Wherein when the measured distance is smaller than the predetermined start threshold, a digital signal "No" is generated; when the distance is greater than or equal to the predetermined start threshold, a digital signal "No" is generated. It should be noted that for the above-mentioned capacitance detector Π 6 'by providing a predetermined threshold voltage (specific threshold voltage), in order to compare with the capacitance signal measured by the capacitance detector 116, and thus Digitally generated paper This paper is compliant with China National Standard (CNS) A4 (210 X 297 cm) 424289 Α7 ______ Β7 5. Description of the invention () signal. Then, step 220 is performed again, and the operation of carrying the tablet 108 is performed according to the generated digital signals. When the digital signal is "No", the robot arm is suspended to stop the operation of the carrying plate 108, and a warning device is activated for subsequent processing procedures. The present invention has many advantages. For example, by using the wafer transfer system provided by the present invention, in addition to effectively performing procedures such as wafer transfer, loading / unloading in various and diverse equipment, and more, It can effectively prevent the surface of the wafer located in the cassette from being scratched due to the contact or impact of the lower surface of the carrier plate. In addition, * it can also effectively prevent the carrier plate from touching the surface of the machine during the wafer transfer process due to the displacement error, thereby causing damage to the machine or the plate. Furthermore, by using the wafer transfer system provided by the present invention, it is possible to detect the operation status of the carrier plate during the transfer process in real-time, and it is convenient for the operator to immediately troubleshoot, which will be effective It shortens the cycle of the manufacturing process and improves the yield of the manufactured products. Although the present invention is as described above with a preferred example, it is not intended to limit the spirit and the entity of the present invention, but only to this embodiment. Modifications made by those skilled in the art without departing from the spirit and scope of the present invention should be included in the scope of the patent application described below. < 谞 Please read the back of the results first; then fill in this page) Printed by the Economic and Intellectual Property Bureau Consumer Cooperatives 11 This paper size is in accordance with China National Standards (CNrs) A4 (2i × 297mm)