TW424272B - Post-CMP wet-HF cleaning station - Google Patents

Abstract

The present invention provides an apparatus for cleaning semiconductor workpieces following a Chemical Mechanical Planarization (""CMP"") procedure. Initially, a workpiece is scrubbed to remove some of the slurry material and other contaminants on the surfaces of the workpiece. Next, the workpiece is transported into a chemical-etch cleaning station wherein the workpiece is positioned horizontally such that both the upper and lower surfaces are substantially exposed. The workpiece then is immersed in a cleaning solution which is moved around the various surfaces of the workpiece. The workpiece is immersed in the cleaning solution for a sufficient length of time to remove an appropriate layer of oxide, thereby removing contaminants and smoothing micro scratches from the surfaces of the workpiece.

Description

4 2 427 2 __Case No. 88101929 Year M " π Day Amendment V. Description of the Invention (2) ''-Inventions of the Invention The present invention generally relates to the cleaning of semiconductor workpieces such as silicon wafers. More specifically, the present invention relates to a method that uses a wet chemical solution to remove surface dirt, buried metallic ions, relaxed oxides, force, and fine scratches. … Background of the Invention The present invention is a continuation of the US patent application No. 09/020, 979 filed by the applicant on February 9, 1998. The removal of foreign matter from the surface of a workpiece is a key element in the manufacture of semiconductor devices. The presence of dirt or foreign matter can cause critical failures or permanently shorten the life of these devices. The use of silicon workpieces in semiconductor device manufacturing is called "wafers." The wafer typically has a flat, circular dish type. First cut the silicon wafer from the silicon ingot, and perform multiple photomask, erosion, dielectric, and conductor fixation processes to generate microelectronic structures and circuits on the wafer. The wafer surface for these processes is processed in the process steps. The gaps must typically be polished or leveled to ensure proper flatness, thus allowing the use of photolithography to build additional dielectric and metallization layers on the wafer surface. Chemical mechanical leveling (CMP) machines have been developed to polish or flatten the surface of silicon wafers to the necessary flat conditions such as manufacturing integrated circuit components. The CMP method and machine are known in the art 'and are described in a number of U.S. patents. Examples include US Patent No. 4,805,348 by Arai et al. (Issued in February 1989), US Patent No. 4,811,522 by Gill (issued in March 1989), and US Patent No. 5,099,614 by Arai et al. No. (issued in March 1992), Karlsrud

Page 6 2000. 11.08. 006 4 2,427 2 _Case No. 8 Magic 0] 929__ about a year f 丨 month _ 0 _ amendment _ V. Description of the invention (3) U.S. Patent No. 5,329,732, et al. ( (Issued in July 1994), Masayoshi et al. US Patent No. 5,476,890 (issued in December 1995) 'Karl srud et al. US Patent Nos. 5,498,196 and 5,498,199 (both 1,996) (Issued in March), and U.S. Patent No. 5,558,568 by Tali eh et al. (Issued in September 1996). CMP processing is typically performed on a wafer when the polishing pad is mechanically polished ′ a polishing slurry must be applied to the wafer surface. The slurry typically contains fine abrasive particles, such as silica and alumina, dispersed in an alkaline or acidic medium. Chemical cleaning components such as surfactants can also be added. Therefore, the CMP process of the wafer will leave dirt such as remaining slurry particles, unwanted metal ions (sodium, potassium, thallium, chromium, nickel, manganese, zinc, titanium, etc.), and the surface of the wafer. Micro scratches. To remove such surface contaminants, the wafer is typically cleaned in a cleaning machine after cMp. Deactivation can also be enabled, and the crystals can be cleaned in the same way as the removable ions. In the cleaning machine after CMP is also used for mechanical work, the wafer is washed with a component flushing brush 'ion (DI) water, ammonia, or various other chemical solutions. The wafer is cleaned by ultrasonic cleaning. Here, the workpiece can be immersed in DI water or ammonium hydroxide during high-frequency ultrasound. Although rinsing and ultrasonic cleaning of certain surface contaminants, they cannot remove surface stresses, implanted metals, micro-scratches, and undesirable contaminants or defects contained in the oxide layer damaged by the CMP process of the wafer. ^ ^ Proper cleaning fluids such as hydrogen hydride (KF) can be combined with mechanical action, although the cleaning fluid can remove a number of damaged oxide layers from the wafer. Mechanical action and erosion fluid may introduce submicroscopic scratches. The mechanism used may increase particles. In addition, this cleaning method

4 2 ^ 2 (2 Ping-Pong, Invention Description (3) A further disadvantage is the issue of safety and waste disposal. Typically, CMP smoothing and post-CMP cleaning are performed in separate machines. 俟 Wafers are flattened on a cmp flattener After that, the wafer is transferred to the CD? Post-cleaner. The time required to transfer the wafer increases the overall processing time and increases the possibility of dirt drying on the wafer surface. 'Wafer is transported in a wet environment and requires special handling and equipment. Moving workpieces from one machine to another has the additional disadvantage of increasing wafer breakage.

Q After CMP cleaning, a chemical attack cleaning method can be used to remove the damaged oxide and material layers from the wafer. In the conventional chemical etching cleaning method, the wafer is vertically in a static liquid such as a chemical solution such as HF solution. However, this method has several disadvantages. For example, when the cleaning operation is repeated, the HF solution is gradually degraded, making it difficult to control the amount of the oxide layer removed from the wafer. In addition, the old solution will circulate in the circle, and the surface will add additional particles. When the wafer is placed in the HF solution, bubbles trapped on the surface can also cause uneven erosion of the wafer. In addition, the reaction of silicon oxide with HF ’will form silicon dioxide and water molecules. Both silicon fluoride and water molecules remain at the interface between the wafer surface and the HF solution, resulting in a low erosion rate and uneven silver invasion on the wafer. In particular, the water remaining at the interface will dilute the HF concentration on the wafer surface, resulting in uneven backlash and a low erosion rate. Typically, the wafer's chemical attack cleaning is performed on a special wet bench for the treatment of hazardous chemicals. After the wafers are cleaned in a post-CMP washer, the wafer is moved to a chemical attack washer. Moving wafers from one machine to another will increase the total processing time, and dirt will easily dry on the wafer surface, which may cause cracks. Therefore, a device is needed to remove dirt and known oxide layers from the surface of the workpiece in order to overcome various shortcomings associated with existing conventional methods.

Page 8 4 2 4 2 7 2 '---- 5. Description of the invention (4) point. The outline of the present invention relates to a device for removing loose oxides, surface stress, metallic ions, / Ip, and fine traces from the surface of a workpiece after CMP leveling and cleaning after CMP. This is done after the workpiece has been polished and / or flattened and post-cleaned 'by removing the undamaged oxide layer from the surface of the workpiece. According to the present invention, the workpiece is essentially pressed into the chemical infiltration and cleaning station from the previous processing station by water. 1 piece, so f water = into 0 pieces of container, exposed on the upper and lower surfaces of ... Next, the liquid is drained into the container, so that the workpiece is immersed in the cleaning liquid. Also, =

:: Various surface movements. After the appropriate oxide layer is removed from the surface of the workpiece, J ^ remove the cleaning solution ’# 出 出 洗液’ rinse from the surface of the guard and finally ’the workpiece is transferred to another processing station. liquid. _Brief description of the drawings The present invention is described below with reference to the drawings, which are the same, where: Π-like numbers generally refer to the same elements

Figure 1 is a top plan view of a representative example of an integrated machine with a CMP cleaning station and a chemical erosion cleaning station; integrated CMP Figure 2 is a side view of the Pei material / unloading station station used by the machine shown in Figure 1; Top plan view of a representative example of a washing machine. Fig. 3B is a side view of the washing machine shown in Fig. 3A; 'Fig. 4 is a top view of a water heater used in the washing station shown in Fig. 3 A; Cross-section view of water rail; Ten-face ring; 424272 V. Description of the invention (5) Figure 6 is a side view of the flushing station; Top plan view of the flushing station shown; Top plan view of the second chemical erosion cleaning station; Along 9-9 A cross-sectional view of a chemical invasion cleaning station on the line; a top view of a specific example of a chemical erosion cleaning station combined with a water drill as shown in the plan view. FIG. 10B is a side view of the combination of a chemical erosion cleaning station not shown in FIG. 11 and FIG. 11A. Top plan view of another specific example of the combined water rail of the chemical erosion cleaning station shown in Figure 1; Figure 1 is a side view of the combined water anchor of the chemical erosion cleaning station shown in Figure 11A; Figure 1 A is shown in Figure 11A and Figures 丨 B A side view of a knife edge holder used in a chemical erosion cleaning station is shown; FIG. 12B is a side view of the knife edge holder shown in FIG. 12A Top plan view; Figure 12C is a rear view of the knife edge holder shown in Figure 12A; Figures 13 to 15 are cross-sectional views of another specific example of a chemical erosion cleaning station; and Figure 16 is a perspective view of a chemical erosion cleaning station ; Figure 17 is a sectional view of the spin-drying station used in the cleaning station shown in Figure 1. Detailed description of the preferred specific example of the present invention Jg Referring now to FIGS. 1 and 2, a representative example of a CMP machine 100 is shown. This machine integrates the CMP station with the CMP post-cleaning station and the chemical erosion cleaning station 'to reduce the risk of dirt drying on the workpiece during the whole process, and the risk of cracking caused by the workpiece being transported between different machines. This machine 100 includes the workpiece

No. 10 Yin 424272 V. Description of the invention (6) Loading / unloading station 200, index station 400, CMP station 600, and cleaning station 800. 0 The robot arm 1 2 0 transfers the workpiece from the loading / unloading station 2 0 0 to the index station 400. The robot arm 120 can load five pieces of workpieces from the loading / unloading station 200 onto the index table 410 of the index station 400. Secondly, the multi-head transfer assembly 420 moves the carrier head 440 to the vicinity of the index table 410 and picks up five pieces of work (Fig. 2). The conveying assembly 420 is then moved sideways into the CMP station 600 and the polishing table 61. "The conveying assembly 420 is lowered, so that five pieces of workpiece are pressed against the polishing table 610. In order to improve the polishing process, a polishing slurry should be provided, and the individual carrier is rotated. And oscillate radially across the polishing surface. The polishing slurry used may be, for example, colloidal oxidation; water-based slurry of 5 grains. In this way, the surface of the workpiece is polished and / or flattened. Although in the above specific example, five pieces were flattened simultaneously Workpiece, but those skilled in the art can quickly understand that any number of workpieces can be polished at one time without departing from the spirit and scope of the present invention. A detailed description of the CMP method can be found in the US patent application filed on September 10, 1997 No. 08/926, 700, which is listed here. Unfortunately, 'the workpiece is polished by the docking-type polishing with polishing slurry, which will leave scratches.' After polishing, there will be slurry materials and other dirt on the workpiece. Dirt and scratches can cause failure or shorten the life of the device made of the workpiece. So 'the workpiece is cleaned, invaded, and dried in the washing station & 00. Therefore,' the limb 460 from the indicator station 400 lift the workpiece and move to the cleaning station 800. The cleaning station 800 should contain the first, second, third, and fourth water rails 802, 803, 804, 806, flushing stations 820, 845, and chemical invasion cleaning station 850 And spin-drying station 890. In the preferred embodiment of the present invention, each sub-station within the cleaning station 800 (rinsing stations 820, 845, chemical erosion cleaning station 8 50, spin-drying station 89), once

424272 V. Description of Invention (7)-Manage a workpiece. Therefore, the workpiece is mounted on the water rail ⑽ in the cleaning station and remains in the water rail 802 until the washing station 820 is empty to accept the next workpiece. Referring more specifically to Figures 4 and 5, the water rail 802 includes segmented pins 808 to help maintain the workpiece within the water rail. When the flushing station 820 is vacated to accept the workpiece, the segment pin 8 08 is lowered. The forward-facing fluid nozzle 812 provides a bursting or steady-flowing fluid ' and the angled fluid nozzle 814 helps facilitate the workpiece onto the rinse station 820. In a similar manner, a 'water hold 80' can transfer workpieces from a washing station 8 2 0 to a washing station 845 'while a water rail 804 along with a water rail 806 moves workpieces from the washing station 845 to a chemically corrosive cleaning station 8 50.

The water rails 80 2, 803, 804, and 806 also contain multiple fluid nozzles, which eject the fluid upwards to support the workpiece and substantially eliminate mechanical contact between the workpiece and the water rail. The use of water rails 802, 803, 804, and 806 to transfer workpieces between stations has the additional advantage of keeping the workpieces wet, so it prevents dirt from drying on the surface of the workpieces. In a preferred embodiment, the water rails 802, 803, 804, and 806 are used to transfer the fluid of the workpiece, including deionized water. When the washing station 820 is empty, the water rail 804 moves the workpiece to the washing station 820, as shown in Figure 1. As shown. 6 and 7, the washing station 820 includes a plurality of pairs of rollers, a bottom plate 821, a top plate 822, a rear plate 823, and a front plate 824. Commercially available washing stations are available, such as those manufactured by Wacker Cheratronic, Germany.

The workpiece enters the washing station 820 at the workpiece input 825. A plurality of pairs of rollers simultaneously clean the top and bottom surfaces of the workpiece, forcing the workpiece through the washing station 820. The bottom rollers (ie, the rollers 826, 828, 830, 832, and 834) rotate clockwise 'as shown in FIG. In addition, the top rollers of each pair of rollers (ie, rollers 829, 8 33) also rotate clockwise as shown in FIG. 6. Finally, each odd pair rolls

Page 12 42427 2 V. Description of the invention (8) The top roller of the wheel (ie, the rollers 827, 831, 835) rotates counterclockwise. Therefore, the 'odd' pair of rollers (i.e., rollers 826, 827, 830, 831, 834, 835) force the workpiece through the washing station 820. The even-numbered pairs of rollers (ie, the rollers 828, 829, 832, 833) clean the top and bottom surfaces of the workpiece as it moves through the washing station 820. In addition, the brush can be rotated in the reverse direction to keep the wafer in the washing station 820 until the water rail 804 can accept the workpiece.

Referring to Figure 7 ', the top plate 8 22 includes one or more fluid inlets, constituting a separate portion or holding portion that distributes fluid to the flushing station 8 2 0. The top plate 8 2 2 should contain many manifolds and be configured to deliver fluid to a specific location within the flushing station 82. Specifically, the 'plate 8 2 2 includes a first fluid inlet 836 communicating with the first manifold 837. This first manifold 837 constitutes a first fluid to be distributed near a plurality of rollers in the roller box. The first manifold 837 should preferably be arranged to release fluid substantially evenly along the length of the top roller. The top plate 822 also includes a second fluid inlet t? 838, which also constitutes communication with the second manifold 839 'to distribute the second fluid to different locations throughout the roller box, for example, firstly, a plurality of pairs of rollers ^ occupy a region. The top plate 822 also includes a third fluid inlet $ 40, which communicates with the third manifold M! To form a third region that distributes the third fluid throughout the roller box. For example, the area of the last pair of rollers of the S top plate δ22 may also be used. Contains a fourth fluid 842 and fills the fourth manifold 843.

Each Qi dare constitutes no fluid communication with the rest of the manifold. However, one or more body inlets can be connected together so that a single fluid can be applied to more than one manifold: In the specific example of Figure 7, the 'manifold constitutes the distribution of cleaning liquid to or between adjacent rollers (the wave wheel is shown in the figure) 7). _ Many different chemical species such as water, cleaning β βππ, surfactants, abrasives

424272

Wipe reducer, pH control agent for various solutions), can be applied through the manifold on the top plate 822. Various fluid inlets can be coupled together so that different chemicals can be applied to separate areas of the roller box. In this way, the workpiece passing through the first set of rollers can be exposed to the first chemical solution and later to the second chemical solution in a later stage of the roller box. For example, the first roller box can distribute the cleaning liquid and deionized water mixture on the workpiece to facilitate heavy cleaning, while the second roller box can only distribute the deionized water to the workpiece to achieve leaching. In the preferred embodiment, the workpiece is transferred from the washing station 8 to the washing station 8 2 0 using water rails. Those skilled in this field know that the washing station 8 4 5 can avoid

The items are transferred directly from the flushing station 820 to the chemical erosion cleaning station 85, without departing from the spirit and scope of the present invention.

Rinse the workpiece once or twice. Rinse the workpiece with chemicals such as deionized water, which cannot remove the marks or surface defects, or dirt that may be implanted in the scratches or surface defects on the workpiece. Attempts are made to remove these moths and marks more effectively, and moths and rinses may be used. However, the use of both HF and mechanical rinsing will cause sub-micro scratches on the surface of the piece, and may trap metal ions = other / defective. The washing brush itself will also introduce particles in the erosion process. As mentioned earlier, dirt and scratches on the surface of a workpiece can cause malfunctions or permanently shorten the service life of the workpiece. Therefore, it is urgent to remove the special dirt and smooth the scratches from the surface of the workpiece. When the chemical erosion cleaning station 850 is vacated, the water rail 804 transfers the workpiece from the flushing station 820 to the chemical erosion cleaning station 850, as shown in FIG. 1. With particular reference to Figs. 10A and 10B, the segmentation pin 850 is lowered when an acceptable workpiece is vacated by the radon chemical intrusion instrument cleaning station. ‘Angle fluid nozzle 853 helps force the workpiece

Page 14 424272 V. Description of the Invention (ί) 刖 along the first water track 804 to the second water track 806. Similarly, the angled fluid nozzle 854 helps to force the workpiece forward along the second water rail 8 06 into the workpiece container 8 56 °. In the preferred embodiment, the “苐” 水 执 8 04 and the second water rail 806 are separated by a gap. 855 'so that the fluid used in the first water rail 804 will not mix with the fluid used in the second water rail 8006. In this way, separating the first water rail 804 and the second water 6' helps Prevent dirt from entering the workpiece container 856, reduce the dilution of the chemicals used in the workpiece hopper 856, and prevent the chemicals used in the workpiece container g56 from flowing into the first water rail 804. 3 See Figures 8 and 9, The work container tap 56 should preferably include an opening 852 (Figure 16). It can be used as a shutter assembly 866 to close. The receiving groove 874 under the work container 856 f can trap fluid that overflows or leaks from the work container 856. The work container 856 and The receiving groove 874 is formed of a suitable material having mechanical strength and resistance to chemicals. In a preferred embodiment, the workpiece container 856 and the receiving groove 874 are formed of a polymer material such as a commercial product ULTEM.

With continued reference to FIGS. 8 and 9, the actuating cymbal assembly 866 preferably includes a weir 868, a link 870, and an actuator 872. The 868 is connected to the connecting rod 87, and is thus connected to the actuator 872. In a preferred embodiment, the actuator 872 is a cylinder known in the art. Anyone skilled in this way knows that there are various other actuators that can be used to move the weir 868 as the actuator 8 7 2 to move to the first position, and the weir 8 β 8 is raised to the "closed" position 'as shown in FIG. 13. Specifically, the weir 86δ appropriately closes the opening 852 (FIG. 16) in the workpiece container 856, allowing the workpiece container 856 to be filled with fluid. The weir 868 is large enough that the workpiece container 856 can fill the filling body to its liquid level so that the workpiece is sufficiently immersed in the fluid. The weir 8 6 8 may also be appropriately configured to reduce turbulence when the fluid flows through the workpiece container 8 56. In the preferred embodiment, weirs are dumped when closed

4 2 42 7 2 V. Description of the invention (11), the fluid overflows through the weir 8 6 8 ′ and enters the receiving tank 8 7 4, thereby reducing the turbulence of the fluid flowing into the work container 856, as shown in FIG. 14. When the actuator 872 flows to the first position, the 'Kan 868' is lowered to the '' Open 'position. This is shown in Figure 15. Specifically, the weir 868 moves moderately away from the opening 852 (FIG. 16) of the workpiece container 8 56 so that fluid can be discharged from the workpiece container 856, allowing the robot to enter and exit to transfer the workpiece to the lower τ processing station. As shown in FIG. 15 in particular, the robot arm is appropriately configured to enter the workpiece container 856 with a wet-end actuator and take out the workpiece.

Q Before the workpiece volume g 856 accepts the workpiece, the actuator assembly 866 is closed to facilitate the workpiece container 8 5 6 to be filled with the eluent solution. Specifically, the fluid port 860 is configured to appropriately distribute eluent fluid such as deionized (DI) water into the workpiece container 856. Therefore, the 'fluid port 860 is moderately connected to the fluid supply system. Various tethered papers that supply the eluent fluid to the fluid ports are well known in the art. For example, the fluid port 860 may be connected to a nozzle attached to the supply pipe, and the D supply pipe may be connected to the eluent supply bus. A certain supply pressure is held in the supply bus so that the eluent in the workpiece container 856 flows evenly. The DI water from the main source is filtered and pumped to the supply bus. In addition, the first fluid port 860 constitutes a fluid which is completely separated from the second fluid port 862, which distributes a cleaning solution of a hydrogen fluoride (HF) solution. The second fluid port 862 is similar to the first fluid port 860 and is moderately connected to the IJF supply system. The fluid port 862 may be connected to a nozzle attached to the supply pipe. The supply pipe is thus connected to the HF solution supply bus. The programmed concentration of HF is supplied to the HF solution supply bus using a delicate mixer and consumer. HF can be supplied from the main source to the HF solution supply bus, or it can be filtered and recycled. Therefore, the first fluid port 860 is separated from the second fluid port 862 to distribute the eluent in the workpiece container 856.

Page 16 4 2 4 2 7 2 V. Description of the invention (12) In addition to the first fluid port 860, the 'fluid distribution manifold 864 also distributes the rinse fluid in the workpiece container 856. 16, the fluid distribution manifold 864 includes a plurality of nozzles 8 6 5a to distribute the eluent fluid in the workpiece container 85 6. In addition, the plurality of nozzles 865a are formed in a substantially horizontal manner and move the eluent in a substantially laminar flow form in the workpiece container 856. The eluent moves in a substantially laminar flow shape within the workpiece container 8 56, which helps to force the workpiece from the water rail 806 into the container 856. In addition, the nozzle 865a is appropriately configured so as to be fluidly separated from the nozzle 865b constituting the cleaning liquid. Therefore, the nozzle 865a and the nozzle 865b separate and distribute the rinsing liquid in the work container 856. The fluid distribution manifold 864 is also formed in the workpiece container 8 5 6 in various configurations. For example, the fluid distribution manifold 8 6 4 may be formed integrally with the workpiece container 856. In addition, the soul distribution manifold 864 may form a pipe or a nozzle attached to the work container 856 ,. Alternatively, the fluid may be supplied to the fluid distribution manifold 864 using various grain fluid supply systems known in the art. For example, the nozzle 865a may be configured to supply eluent in the same manner as the fluid port 860. Referring to FIGS. 10A and 10B, the workpiece is transferred to the 'water rail 806 using the water rail 804. The water rail 806 forces the workpiece forward into the workpiece container 85 6 filled with the eluent. The water rail 800, which is located above the water rail 806, can be used to help force the workpiece into the workpiece Rongwu 856. The eluent of the workpiece enters the workpiece container 856 at an angle, thereby reducing the bright bubbles attached to the surface of the workpiece. When the workpiece enters the eluent in the workpiece container 856, the workpiece comes into contact with the plurality of blade edge supports 858. Specifically, the blade edge support 858 is moderately bent near the place where the workpiece enters the workpiece container to help the workpiece enter the workpiece container holder 6. The eluent is substantially laminar within the container 856 using a fluid delivery manifold 864

Page 17 424272 V. Description of the invention (13) '--------: state = also helps to force the workpiece to support along the force edge. In a better courtesy, the blade edge support 858 is The friction between the Teflow polytetrafluoroethylene (f > TFE) material and the commercial production margin support 858. Therefore, the workpiece machine should be in line with the least contact between the workpiece and the knife edge support 858. Most: 8,58 'To reach the upright part 859 of the knife edge support 858, and then sign the private knife lack:' Gong a a is placed on the knife edge support body i holding: Γ shown, so 'blade edge support 858 The workpiece is supported with a substantially horizontal guide, and substantially all of the upper and lower surfaces of the workpiece are exposed. Referring to FIG. UA and FIG. 11B, another specific example of the present invention, ^ 7 # is used to stop the workpiece from moving forward when entering the workpiece container 856. Pin 857 = The structure makes the edge of the workpiece contact the pin 857, before the workpiece enters the workpiece container 856 Second: Stop the workpiece from moving forward. In the same way, when the movement is set by the fluid wheel feed manifold M4 in the work container 856, the work can be prevented from moving. As shown in FIG. 12A, FIG. 12B, and FIG. 12C, the blade edge support 8 is in point contact with the edge of the workpiece to support the work, thus increasing the area of the work path. In addition, the knife edge support 858 is chamfered to reduce surface contact with the workpiece. The blade edge support 858 is contracted near the end of the fluid transfer manifold. When the fluid in the workpiece container 856 is set to move using the fluid transfer manifold 864 ', turbulence can be reduced. The wafer presence detector is constructed to detect when the workpiece is inside the device 856. In a specific example, a zineology sensor is used. The light-emitting device 863 is mounted on the bracket 861, and the light-receiving device (not shown in the figure) is mounted on the workpiece and is aligned vertically with the light-emitting device 863. As shown in FIG. UA, when the light beam 63 is aligned so that the workpiece is approximately positioned in the workpiece container 856, it transmits light to the light.

4 2 4 2 7 2 V. Description of the invention (14) The beam of the receiver is interrupted. Anyone skilled in this field knows that a variety of detection devices are available. Referring to FIGS. 8 and 9, when the workpiece is substantially horizontally located in the workpiece container 856, the actuating brake assembly 866 is opened, and the eluent is discharged from the workpiece container 856. Supporting the workpiece is essentially level, helping to maintain a film of eluent on the surface of the workpiece, thus preventing dirt from drying on the surface of the workpiece. Therefore, the workpiece container 856 and the blade edge support 858 are set at an appropriate level to ensure that the workpiece support is guided substantially horizontally.

Once the eluent fluid is discharged from the work container 856, the brake assembly & 66 is closed, and the work container 856 is filled with the cleaning liquid. Specifically, the fluid port 862 suitably constitutes a dispensing cleaning liquid, such as a hydrogen fluoride (HF) solution, in the workpiece container 856. In addition to the fluid port 862, the fluid distribution manifold & 64 also dispenses the HF solution in the workpiece container 856. 16, the fluid distribution manifold 864 constitutes a plurality of nozzles & 65b, and the nozzle 865b is constituted to move the HF solution in a substantially laminar flow form in the workpiece container 856 in a substantially horizontal manner, especially near the surface of the workpiece. Therefore, the nozzles 8 6 5b are formed above and below the surface of the workpiece so that the fluid flows through the upper and lower surfaces of the workpiece in a laminar flow. In a preferred embodiment, the HF solution flows through the upper and lower surfaces of the workpiece in a laminar state. It then flows through the weir 8 6 8 'into the receiving groove 874' as shown in FIG. 14. Agitating the HF solution ' while the HF solution is flowing brings the fresh portion of the HF solution into contact with each surface of the workpiece, thereby resulting in a more even application of the solution. In addition, the HF solution is reduced in the workpiece container 856 to ensure that fresh parts of the HF solution are in contact with the workpiece. The laminar flow of the HF solution also helps to expel air bubbles that may adhere to the surface of the workpiece, thus avoiding the erosion effect in the course of rabbit erosion. In addition, the laminar flow of the HF solution helps to remove the air from the surface of the workpiece.

Page 19 424272 V. Description of the invention (15) Fluoride and water molecules formed by the reaction of oxidation and HF. In the context of the present invention, 'laminar flow' refers to the flow characterized by the layered motion of the HF solution. Specifically, the laminar and turbulent flows are different 'and there is no micromixing of adjacent fluid layers in the laminar flow. 〇 In a more specific example, a lower concentration of HF solution may be used. The concentration of the HF solution used can range from 25 parts water to 1 part HF to 200 parts water to 1 part HF. There are many pips when using lower HF solutions. For example, the lower the concentration of HF solution is, the slower the erosion rate is, the longer the swelling solution disperses, so that the erosion is more uniform. The slower erosion rate also provides a larger margin of processing time error between the workpiece and the workpiece, thereby increasing the uniformity of the workpiece and the workpiece. It takes less time to rinse lower concentrations of HF from the surface of the workpiece. In addition, it is safer to work with a low-concentration acid than a high-concentration acid, and therefore requires fewer hazardous chemical transportation procedures and equipment. However, if the HF solution is too strong, you will reduce the workpiece production in the system. In the most preferred embodiment of the present invention ', a concentration of 50 parts per pair of HF is used.

Immerse the workpiece in the HF solution for a sufficient time to remove the appropriate oxide layer. The removed oxide halo ranged from 50-100A. HF removes oxides from the workpiece '(in particular) as a function of HF solution concentration and temperature. High concentration of HF solution results in faster removal rates. Similarly, the higher the temperature of the HF solution, the faster the removal rate. However, high temperature of HF solution will produce harmful jjF vapor. In the most preferred embodiment of the present invention, "the workpiece is bubbled in the solution at a temperature of 50 ° C and the concentration is about 20 seconds", and about 50a of oxide is removed from the surface of the workpiece, thus removing dirt from the surface of the workpiece. To smooth micro scratches. 8 and FIG. 9, the actuating brake assembly 8 6 6 is opened, and the HF solution is discharged from the workpiece container 8 5 6. Actuating brake assembly § 6 6 and then closing, allowing workpiece container

Page 20 42427 2 V. Description of the invention (16) 856 Fill the eluent fluid. More specifically, an eluent such as deionized (DI) water is dispensed into the work container 8 5 ο through the fluid port 8 6 2. Dj water is also distributed through a plurality of nozzles 865a in the fluid distribution manifold 864. In addition, the eluent solution moves in the workpiece container 856 in a substantially laminar flow form, especially close to the surface. The eluent solution moves in a substantially laminar flow form in the work container 85β, removing any remaining dirt from the surface of the work piece, and Facilitates more thorough rinsing. One

Secondly, the operating brake assembly 8 6 6 is opened, and the eluent solution is discharged from the work container 85 6. The robot 12 then retrieves the rinsed workpiece and removes it from the workpiece container 8 56. When the workpiece is removed from the workpiece container S56, the brake assembly 8 66 is closed and the workpiece container 8 5 6 is filled with eluent to prepare for the next wafer. After the rinsed workpiece is retrieved from the workpiece container 856, the robot 12 That is, it is transferred to the spin dryer. Refer to circle 17, the spin dryer station 890 includes a spin dryer 892, which is enclosed in a room 892 defined by a cover or a shield 893. The spin dryer 892 includes a workpiece platform 894, which can firmly hold the workpiece on the platform when the platform is rotated at a high speed by a motor 895. It should be a plurality of mass reduction through-holes through the platform 894 to reduce the mass of the spinner 392, thereby reducing the acceleration and deceleration time of the spin cycle. A plurality of clamping fingers 896 are pivotally mounted around the periphery of the platform 8 94,

The robot 120 holds an edge of a workpiece placed on the platform 894. The finger guard includes a head 896a that extends above the platform 894 and combines with the workpiece, and a stem 896b that extends below the flat surface 8. The clamping finger 896 or at least the second part 896a is made of soft and flexible materials such as Ertalyte , Or to the workpiece held by the injury. The spring-loaded assembly mounted below the platform 894 is a column-shaped plug; 4 2 4 2 7 2 V. Description of the invention (17) # " p896b ^ a ^ The workpiece H6 on the spin dryer m is in a holding or holding position. The workpiece for the «Private Touring System" is not placed directly on the platform 8 94, but on a support pin 898 made of soft flexible material. 〇 The actuator assembly 899 installed under the platform 894 is used to pry open the clamping lever and release the workpiece to be held as follows. The assembly 899 can be moved upright by being attached to the cylinder 900. When the actuator assembly 899 moves upward, the cam ring 901 forming part of the assembly 899 is in contact with the stem 896b of the clamping finger 896, and the stem is forced to slide when it slides along the cam surface of the cam ring 901. Pivoting inward 'causes the head 896a to pivot radially outward to release the workpiece and provide clearance for the workpiece. Therefore, 'after the robot 1 2 retrieves the rinsed workpiece from the chemical erosion cleaning station 8 5 0', that is, the soil piece is transferred to the platform 894 of the spin dryer 89, and the gripper 896 uses the actuator assembly 899 Keep in the open position until the workpiece is loaded and properly positioned.俟 After the robot 120 leaves, the actuator assembly 899 is lowered, and the contact with the cadre 8 6b is removed. The plunger 897 biases the clamping finger 896 toward the closed position, and fixes the workpiece for spin-drying. The platform 894 utilizes a motor 895 to accelerate to about 4,000 rpm in about 1.0 seconds, and preferably rotates at this speed for about 20 seconds to remove all water and other particles from the surface of the workpiece, and preferably about 1. Decelerate back to the idling state within 0 seconds. Rotating 'applies a centrifugal force to the workpiece held on the platform 8 94, and pulls water droplets radially outward from the surface of the workpiece. To cope with this drying step, an air flow module can be installed above the shutter 8 9 3 to force the air column over the upper surface of the workpiece with guide pins.

4 2 4 2 7 2 V. Description of the invention (18) Once the drying is completed, the actuator assembly 899 moves upwards again to combine with the stem 896b, causing the gripping finger 896 to move to the release position, as described above. The assembly δ99 is maintained at this position until the dried workpiece has been retrieved by the robot 120 and the spin dry station 890 is vacated. The robot 120 is returning the dry workpiece to the slot of the original cassette. Although the present invention has been described with reference to the integrated CMP machine 100, the present invention can also be applied to a separate washing machine 750, as shown in Figs. 3A and 3B. 3A and 3B, the cleaning station 700 should preferably include first, second, third, and fourth water rails 702, 703, 704, 706, flushing stations 72 0, 745, chemical erosion cleaning station 750, and spin-drying. Station 790. In contrast to the cleaning station 800 (FIG. 1), in the cleaning station 750, the robot 120 moves a workpiece to the cleaning station 700. The workpiece is rinsed in the same way as the cleaning station 800, chemically washed and spin-dried. Although specific specific examples, including specific manufacturing method steps, manufacturing method parameters, solutions, etc. have been described above, those who are skilled in reading this content will know that there are various modifications to the specific examples disclosed. Therefore, it should be noted that this specific example is merely an illustration of a wide range of inventions and is not a limitation, so the present invention is not limited to the illustrations and the above specific specific examples.

Page 23. ΙΗΗΒΗ

Claims (1)

^^ (d 88 1 0Ί 9 2 9 A non-washing device 9 that removes dirt from workpieces and smooths micro-to-scores includes: workpiece container; flat guide: mechanism, 'U holds the workpiece in the workpiece container as a substantially water-fluid delivery assembly, which is rotated If the cleaning solution reaches the workpiece container, please contact me: Please clean the dates I in the first item of the patent scope, where the support machine is configured to support the workpiece, so that the surface of the workpiece is substantially exposed. 3. The cleaning device according to item 2 of the application for a patent, wherein the blade edge supporting body of the supporting machine is configured to introduce the workpiece into the workpiece container in the workpiece container and support the workpiece in the workpiece container: Insider. * 4. For example, the Qing i device of the patent application No. 3, in which the blade edge support boat is bent to support the workpiece by point contact at the edge of the workpiece? 5. For example, mi in the scope of patent application, in which the blade edge supports a part of the shrinkage, and when the workpiece container is filled with a flow boat, and the fluid is set in motion, the disturbance can be reduced. 6. If applied The third item of the patent group washes, in which a part of the blade edge support boat is raised to prevent the workpiece from moving in the workpiece container. I 7. The cleaning device of item 1 of the patent application scope further includes a pin formed in the workpiece container to connect the support mechanism to prevent the workpiece from moving in the workpiece container. · 8. As described in item 1 of the patent application group, wherein the workpiece container further includes an opening formed in the workpiece container, and an actuation assembly as a whole, in which the actuation Page 24 42427 2 VI. Patent application Fan gate assembly is convenient to discharge from the workpiece container when the opening is closed 9. If the scope of patent application is liquid fluorinated chlorine (HF) solution 1 0. If the scope of patent application is sent to the general The composition is further constituted for conveying. For example, if the patent application Fan Yuan liquid and the cleaning solution are separated from each other, the solution is rotated to 12. If the patent application scope is included, the delivery assembly includes a plurality of holes to fill the flow. 13. If the scope of the application for a patent, the delivery assembly also includes a plurality of flow devices. 14. If the patent application Fan Yuan delivery assembly is included in the workpiece containment manifold and includes a plurality of nozzles, the flow is close to the workpiece to be substantial 15. If the patent application Fan Yuan nozzle is constituted in a substantially horizontal manner 16. The nozzle includes the cleaning solution, the workpiece container is filled with fluid, and the container flows when the nozzle is opened. The cleaning device of item 1, wherein the cleaning solution is described. The cleaning device of item 1, wherein the fluid conveys the eluent solution to the workpiece container. The cleaning device of item 10, wherein the eluent is not compatible, so that the eluent solution and the workpiece container are cleaned. The cleaning device of item 1, wherein the fluid is formed in the workpiece container for The cleaning device of item 12 of the container, wherein the fluid outlets are respectively attached to the plurality of holes, and the different flow crosses can be transported to the cleaning device of item 1 in an isolated manner, wherein the flow in the fluid delivery device The wheel feeds a manifold, and the fluid conveys a fluid moving in the workpiece container to flow in a laminar flow form. The cleaning device of item 14, wherein the plurality of jets are directed toward the conveying flow «to the workpiece container. The odd washing device of item 14, wherein the plurality of spraying nozzles of the first group and the pumping solution for conveying the washing solution Page 25 424272 6. The scope of the patent application of the second group of nozzles, and the first and second groups of nozzles are not connected to each other A fluid to deliver the cleaning solution and the eluent solution to the workpiece container in an isolated manner. 1 7. —A cleaning device for removing dirt from a workpiece and smoothing micro-scratches' includes: a workpiece container having an opening formed therein, and an actuating brake assembly operatively connected to the workpiece container; a plurality of supports The body member is configured to support the workpiece to be guided substantially horizontally in the workpiece container; and a fluid transfer assembly to deliver a cleaning solution to the workpiece container. 18. The cleaning device according to item 17 of the patent application, wherein the fluid conveying assembly constitutes conveying an eluent solution to the workpiece container, and the eluent solution and the cleaning solution do not rush into each other, so that the eluent The solution and the cleaning solution are transferred to the workpiece container in a separated manner. 19. For example, the cleaning pad of claim 17 in which the actuating brake assembly further comprises: a weir; a connecting rod member having a first end and a second end connected to the weir; an actuator connected to the The second end of the connecting rod member, wherein the weir closes the opening in response to the movement of the actuator. 20. The cleaning device according to item 19 of the patent application, wherein the actuator is in the first position (such as closing the opening to facilitate the workpiece container to be filled with the cleaning solution) and the second wing (such as the weir is opened to Convenient to allow the cleaning solution to be discharged from the workpiece container) 21. If you apply for the cleaning device of Zunli Fanyuan Item 19, 424272 VI. Scope of patent application The size of the workpiece container is convenient for the workpiece container to be filled with the cleaning solution 'to substantially immerse the workpiece. 22. The cleaning device as claimed in claim 21, wherein when the workpiece container is filled with the cleaning solution, the weir is inclined to reduce spoilers. 23. The cleaning device according to item 17 of the patent application scope, wherein the supporting member 傣 constitutes a person who supports the workpiece and exposes the surface of the workpiece in real quality. 24. The cleaning device according to item 17 of the scope of patent application, wherein the fluid rotary assembly includes a fluid transport manifold in the workpiece container, and the fluid transport manifold includes a plurality of nozzles, which are formed in the workpiece container. The fluid is moved so that the fluid approaches the person flowing in a substantially laminar flow. 25. A cleaning device for removing dirt from a workpiece and smoothing micro-scratches, including: a container; a number of supporting members; and a body conveying assembly; The following table applies for a patent in which the workpiece container is reconstituted and the horizontal flow washing solution is on the ground. 26. If the delivery system is approaching; piece 27. If the device includes the assembly closed, it constitutes a supporting workpiece on the workpiece. The inside of the container is solid, so that the workpiece is exposed to the cleaning solution to move the liquid, and the cleaning solution is brought close to the cleaning device of the workpiece around item 25, wherein the fluid is transported to move the cleaning solution to the inside. The cleaning solution flows on the surface 'in a substantially laminar flow form. The cleaning device surrounding item 25, wherein the opening of the workpiece container and the brake assembly are formed, and the opening formed in the brake is convenient for the workpiece container. 27th stomach 424272 The washing device J is discharged from the workpiece container. The cleaning device J further includes a cleaning device 9 for the water rail 3, wherein the main rail holder 9 of the water rail bag and the cleaning device 9 forcing the workpiece to enter. Microtongue! | Smooth-spot cleaning device 7 stations for conveying workpieces »9 Forms supporting workpieces in the workpiece container to expose the workpiece to fluorine in the workpiece container 6. The patent application scope is filled with fluid 'and turned on to facilitate the flow. 28_ If the patent application scope item 25 is used to transfer the workpiece to the workpiece container 29. If the patent application scope item 28 includes the workpiece from the previous processing station Those who use the work container as a sub-water rail. 30. If the 29th water rail in the scope of the patent application is separated by a gap, there is no way 31.-a kind of removal of dirt from the workpiece and includes: water hold, constituting the container from the previous processing component; a plurality of supporting members are horizontally oriented in nature; The fluid is rotated by a system of hydrogenated (HF) solution. 32. The cleaning device of claim 31, wherein the water rail is configured to guide the workpiece conveyer in a substantially horizontal direction. 3 3. According to the cleaning and splitting of the scope of application for item 31, wherein the workpiece container further includes an opening formed therein, and an actuating brake assembly, wherein the actuating brake assembly is convenient for filling the workpiece container with fluid when the opening is closed. And it is convenient to discharge fluid from the workpiece container when opened. 34. The cleaning device of claim 31, wherein the fluid transmission assembly includes a fluid delivery manifold in the workpiece container, and the fluid delivery 42427 2 VI. Patent application Fan Manifold also includes a plurality of nozzles, which constitute a fluid moving in the workpiece container, so that the fluid approaches the workpiece flowing in a laminar flow. 35. An integrated machine for polishing and cleaning workpieces, including: an indexing station 'holds unpolished workpieces before further processing; a polishing station for polishing unpolished workpieces; a first transfer mechanism for removing unpolished workpieces therefrom The indicator station is transferred to the polishing station 'and the polished workpiece is transferred to the fingertip station; the cleaning station is used to clean the polished workpiece; the second transfer mechanism transfers the polished workpiece from the indicator station to the cleaning station ; A chemical attack cleaning station 'removes the damaged oxide layer from the cleaned workpiece; and a third transfer mechanism transfers the cleaned workpiece to the chemical attack cleaning station. 36. For the integration of polishing and cleaning of workpieces in the scope of application for patent 35, it also includes: a loading / unloading station with a plurality of platforms to accept the degree of clamping of the workpieces to be polished, cleaned, eroded and dried; and Four transfer mechanism, transfer the workpiece from the cassette to the index station By. 37. The integrated machine for polishing and cleaning workpieces according to item 35 of the scope of patent application ′ further includes: a drying station to dry the eroded workpieces; a fifth transfer mechanism ’to transfer the eroded workpieces to the drying station;