TW421985B - Substrate of semiconductor package - Google Patents

Abstract

The present invention relates to a substrate of a semiconductor package, in which an encapsulation region is provided on a substrate. The encapsulation region is placed with a film. The substrate underneath the film is provided with a circuit layout. The circuit layout is deposited with a layer of a soldering mask. When an encapsulant is injected into the encapsulation region, the encapsulant is isolated by the film and does not come into direct contact with the soldering mask, in which the adhesion capability between the film and the encapsulant is greater than the adhesion capability between the film and the soldering mask. When the encapsulant on the encapsulation passage is peeled off after encapsulation, the film can be peeled off along with the encapsulant of the encapsulation passage. Therefore, no film or encapsulant will remain on the substrate.

Description

42 1 98 5 V. Description of the invention (l) Field of the invention: The present invention relates to a substrate for a semiconductor package, and more particularly to a substrate for manufacturing a ball grid array integrated circuit. Between 'is a structure of a peelable insulation pad that isolates the sealant from direct contact with the surface of the substrate at the position of the injection. Prior technology: As the functions of integrated circuits become more and more complex, the integration degree of the number of circuits in units of transistors is getting higher and higher, so the traditional Quad Flat Pack (QFP) or Pin grid array (PGA) has gradually failed to meet the requirements of practical applications. Ball grid barrier integrated circuit (BGA 1C) is a new-generation high-pin integrated circuit package (IC Package), which is suitable for ultra-large-scale integrated circuits manufactured today with sub-micron resolution ( ultra_Large Seale

Integration; ULSI). This ball grid array package is a type of ball grid array integrated circuit that can meet such high pin count requirements. The most common is the plastic ball grid array (Plastic BGA) package, which is used to make the package. When the body is used, the mold is used for injection, and the molten liquid colloidal material is injected through the injection port of the mold, and the entire integrated body protruding on the surface of the substrate is encapsulated. The chip provides complete gas. Dense sealing ring r; 2 :: away = shape:; :: = Circuit adhesive package The area near the mold injection port of Ben Zhao must be trimmed = Fun C: \ Program Files \ Patents \ PK6441. Ptd Fifth, invention Explanation (2) Make 'to remove the plastic left over from the injection channel of the mold in the middle of the mold' to make a ball array array: (==== square: equipment = metal sheet with gold, which is formed on On the substrate of the ball grid package, when 掇 t body circuit. ± ^ ^ θ The animal mold is overlaid on the positioning of the substrate, the injection molding channel of the imitation injection molding mold is placed below the metal sheet. , As 掇 and 黹 & dagger into 仃, when the main glue, the isolation layer between the gold plating: with "! Mu injection channel and substrate = action 'as shown in the first —, the conventional package shown in the figure is used to perform the glue injection operation. When the glue injection operation is performed at the base = LI: The mold is shown in the second figure. At this time, the remaining sealant in the second channel of the gold-plated surface of the injection gate is easy to be removed from the substrate.

It is not separated from the surface of the package body like the body of the package], which is conducive to trimming the protruding shape of the package body. The existence of the conventional gold-plated metal sheet 13 above will estimate the substrate. The space of the circuit layout reduces the space that the substrate can manufacture the circuit layout. On the other hand, the cost of gold is high, and because the gold-plated metal sheet for demolding occupies a considerable area relative to the overall substrate, the cost is too large. In addition, when the metal sheet 13 thermally expands, 'the metal sheet 13 horizontally squeezes the welding cover 15 on both sides, so the circuit layout inside the welding cover 15 is also squeezed', thereby reducing the manufacturing yield of the substrate 11. To this end, the present invention improves the above disadvantages, whereby the film is placed

A peeling layer is formed on the glue position, which can be peeled off along with the glue injection channel. When the glue injection channel is peeled off, no film or glue is left on the substrate. The peelability can be broadened. It can increase the circuit layout area and not use it. The production cost of gold or other metal substrates can prevent the circuit layout of the substrate from being squeezed, increase the manufacturing yield, and can maintain the effectiveness of the injection position and the peeling of the injection channel after the injection. SUMMARY OF THE INVENTION The main purpose of the present invention is to provide a substrate for a semiconductor package, which can remove a glue injection port on a conventional substrate. In the present invention, a film is placed on the glue injection position to form a peeling layer that can be peeled off along with the glue injection channel. When the glue injection channel is peeled off, 'the film or glue does not remain on the substrate. The design of this peelable layer is not only Increasing the area of the circuit layout without using gold can save the substrate manufacturing cost, and can avoid squeezing the circuit layout of the substrate, increase the manufacturing yield, and maintain the effectiveness of the injection position and the peeling after the injection. According to the present invention, a thin film is provided on a substrate injection position. The thin pancreas can be adhered to the injection position with adhesive force, and the substrate under the film is provided with a circuit layout. A solder mask is deposited on the circuit layout. s〇lder mask] 'When the injection is injected from the injection position, the injection is isolated by the film and does not directly contact the welding cover. »At this time, the injection of the injection channel and the film create an adhesion force' to make the film adhere to Glue injection of the injection channel, where the film and note: The adhesive force is greater than the adhesion of the film and the welding cover, so when the injection channel is peeled off after the injection, because the film can be peeled off with the injection of the injection channel 'Therefore', no film or glue remains on the substrate.

C: \ Program Files \ Patents \ PK6441.ptd page 6

V. Description of the invention (4) Schematic description: Features and advantages can be more obvious | Examples' and the accompanying round form, in order to make the above and other purposes of the present invention easy to understand, hereinafter, the preferred implementation of the present invention is enumerated. The detailed description is as follows: Figure 1A: Schematic diagram of glue injection of conventional packaged electronic components; Figure 1B: Schematic diagram of demographic action of conventional packaged Lei Ziyuan Zhuma Muma to trigger ten vultures / main glue Fanbi; Figure 2. Partial cross-sectional schematic diagram of the conventional plastic electronic component "on the vulture's rubber mouth; Figure 3 · Top view of the entire substrate of the preferred embodiment of the present invention; Figure 4 · Section 3 of the present invention along the line 4-4 FIG. 5 and FIG. 5 are cross-sectional views of a gleaming state of FIG. 4 of the present invention. Description of drawing number: 10 packaged electronic components 11 substrate 12 Μ 0-: 13 metal sheet 14 circuit layout 15 solder cover 20 substrate 21 film 22 circuit layout 23 solder cover 24 glue 25 glue area Description of the invention: Please refer to the third figure, The preferred embodiment of the present invention mainly includes a substrate 20 | and a thin film 21. The substrate 20 is provided with a ball grid array integrated circuit. The substrate 20 is provided with a glue injection area 25. The circuit layout 22 can still be provided below the glue injection area 25, and the injection area 25 of the substrate 20 is located around the glue injection. . The film 21 is made of a non-metal material or a metal material such as a tape or a polymer compound.

C: \ PiOgramFiles \ Patents \ PK6441.ptd page 7

The film 21 of the present invention does not use the effect of a gold-plated metal sheet. It has the advantages of saving manufacturing cost. Referring to the fourth figure again, a film 2 i is placed on the glue injection area 25 of a substrate 20. The film 21 is preferably the same shape as the glue injection area 25 and has an adhesive force. The film 21 is adhered to the glue injection area 25, and the substrate 20 under the film 21 is provided with a circuit layout 22. The circuit layout 22 is covered with a solder mask 23 [solder mask] 'and the film 21 is adhered to the solder mask 23. . Since the film 21 is adhered to the junction cover 23, the circuit layout area can be vacated on the substrate 20 under the film. The present invention has an increased circuit layout area and does not use gold or other metal pieces, which can save substrate manufacturing costs. And: It can avoid the expansion of the metal sheet and force the circuit layout on both sides of the substrate 20 to increase the manufacturing yield. Please refer to the fifth figure again. When the injection is injected from the injection area 25, the injection and receiving film 21 is isolated and covered on the injection area 25 so that the injection 24 does not directly contact the welding cover 23. Because the mold (not shown) ] Make the glue injection 24 on the film 21 without exceeding the two sides of the film 21, so that the glue injection 24 will not remain on both sides of the film 21 'At this time, the glue injection 24 of the glue injection channel and the film 21 generate an adhesion force' The film 21 is adhered to the glue injection channel 24 of the glue injection channel, wherein the adhesion force of the film 2 and the glue injection 24 is greater than the adhesion force of the film 21 and the welding cover 23. When the glue injection channel is peeled off after the glue injection, because of the film 21 can be peeled off with the glue injection 24 of the glue injection channel 'so' there will be no thin film 21 or glue injection 24 on the welding grass 23 of the substrate 20. When the substrate 20 of the present invention is packaged, the peelable layer thereof after the injection process That is, it can be peeled off in a proper way. At this time, the remaining sealant residues in the injection channel of the mold injection 24 are all attached to the hair.

C: \ Program F i1es \ Patents \ PK6441. Ptd page 8 98 5. V. Description of the invention (6) When the peelable separation is clear, the note 23 is separated, and it says' The present invention belongs to the film Tang, but the use of gold plating does not Although the invention itself saves gold, although the adhesive 24 of the attached film 21 can be regarded as the residue of the adhesive 24, the welding cover 23 uses the substrate 20 only on the substrate 20, but the cost of plating is saved. Ming has better familiarized himself with this technique. Various modifications are patented. On the surface, the material may or may not be caused by the relative embodiment of the formation of the glue injection bit of electricity. Without the modification, the defined ones should be stripped. The layer film 22 is peeled and damaged by the peeling of the welding cover of the substrate 20 at the same time. The other way layout 22 does not need to form a gold layer to cover the film 21. The procedure is not complicated, the more important is the section: Li: It is not used to limit the spirit and scope of the present invention. When the scope of protection

Claims (1)

42 1 SQ Case No. 88100086 Amendment 6. Scope of Patent Application 1. A substrate for a semiconductor package, comprising: a substrate with a solder mask on its surface, with a glue injection area for glue injection; and a thin film, It adheres to the glue injection area of the substrate; wherein the adhesive force between the film and the glue is greater than the adhesive force between the film and the welding cover. When the glue injection channel is peeled off after the glue is injected, the film can follow the glue injection channel. Peel off. 2. The substrate of the semiconductor package according to item 1 of the scope of patent application, wherein the substrate is used to form a ball grid array package structure. 3. The substrate of the semiconductor package according to item 1 of the scope of the patent application, wherein the glue injection position of the substrate is located around the glue injection. 4. The substrate of the semiconductor package according to item 1 of the scope of patent application, wherein the thin film is made of a non-metal material. 5. The substrate of the semiconductor package according to item 4 of the scope of patent application, wherein the film is an adhesive tape. 6. The substrate of the semiconductor package according to item 1 of the scope of patent application, wherein the thin film is made of a metal material. POO-069-TW.ptc Page 10 2000. 08. 22.010