經濟部中央檩準局貝工消費合作社印裳 Λ7 B7 五、發明説明（/ ) 本發明係關於一種内建指狀平板式電容電阻及其製造 方法㈠，尤指一種利用全钱刻法於一基板的同一平面上所 同時形成的平板式電容電阻；以前述設計可大量釋出印刷 電路之表面空間’提高被動元件密度，並有助於降低傳輸 線上寄生之電容、電感及電阻，以增進信號輸送品質。 按’印刷電路板於表面或内部多層構造上分別形成有 線路，各線路主要用於電子元件間的電氣連接或信號傳送^ 然而在資訊快速發展及功能性要求大幅提升的趨勢下，產 生了兩種現象：其一為電路表面黏著元件的數量大幅增加， 其二為高密度印刷電路的需求日趨殷切，但前述趨勢卻產 生下列問題： 1，電子元件數量增加，相鄰元件間的距離縮短，當 電路開始工作時，元件間發生輻射干擾的機率大幅提升， 而直接影響電路工作的穩定性。 2 ·又因電子元件數量增加，元件信號可能必須透過 不同形式的路徑進行傳輸（如透過導通孔構成電氣連接或 信號傳輸），而增多了線路阻抗不匹配的情況及線路雜訊。 3 .再者，因電子元件數量增加，將使生產良率相對 降低，並因而提高製造成本。 4 ·另，電子元件數量的增加，亦不利於印刷電路板 表面面積之縮小。 由上述可知，高密度印刷電路所衍生的各項問題，為 有效解決前述問題，_EGA公司提出了在印刷電路板中内 建電阻的技術’以取代高密度印刷電路中於表面所設的電 表紙法尺度適用中國國家標| (^77規格（21QX297公们 ---------裳^--------訂------Ϊ^ (請先鬩讀背面之注意事項再填寫本頁) Λ7 _______B7 五、發明説明（〆） — 阻元件，其技術原理主要係根據以下的公式： R命咅 其中R=電阻值，p =電阻係數，厚度，w=寬度 由削述公式中可以看出’藉由L(長度）、w(寬度）的改 變可用以調整R(電阻值），因此，〇HMEGA公司以控制不同 的p (電阻係數）/ t (厚度），並利用L(長度）、w(寬 度）的改變以生產所須阻抗值的電阻（R)。 且利用目前運用十分普遍的多層印刷電路製造技術， 將電阻製作於印刷電路板之結構中而形成内建電阻，而内 建於印刷電路板結構中的電阻，可有效取代印刷電路板表 面所須的電阻元件，因此可減少印刷電路板表面的元件數 量及面積佔有率。 除前述内建電阻外，電容亦經常以其他方式形成，以 既有的多層印刷電路板而言，其經常令兩個不同電位的電 源層（如VCC及GND)靠近，利用其二者所在的大銅面產 生一附加電容’以調節電壓。其公式係如下列：Yin Chang Λ7 B7, Shellfish Consumer Cooperative, Central Bureau of Standards, Ministry of Economic Affairs V. Description of the Invention (/) The present invention relates to a built-in finger-shaped plate-type capacitor resistor and its manufacturing method. Flat-plate capacitor resistors formed on the same plane of the substrate at the same time; the aforementioned design can free up a large amount of surface space of the printed circuit 'improve the density of passive components, and help reduce parasitic capacitance, inductance and resistance on the transmission line to improve the signal Conveying quality. According to the 'printed circuit board', there are lines formed on the surface or the internal multilayer structure. Each line is mainly used for electrical connection or signal transmission between electronic components. However, under the trend of rapid development of information and functional requirements, two One phenomenon is that the number of components on the circuit surface has increased significantly, and the other is that the demand for high-density printed circuits is increasing, but the aforementioned trends have caused the following problems: 1. The number of electronic components increases, and the distance between adjacent components decreases. When the circuit starts to work, the probability of radiated interference between components is greatly increased, which directly affects the stability of the circuit operation. 2 · Due to the increase in the number of electronic components, component signals may have to be transmitted through different forms of paths (such as electrical connections or signal transmission through vias), which increases the situation of line impedance mismatch and line noise. 3. Furthermore, as the number of electronic components increases, the production yield will be relatively reduced, and thus the manufacturing costs will be increased. 4 · In addition, the increase in the number of electronic components is not conducive to reducing the surface area of printed circuit boards. From the above, it can be known that in order to effectively solve the problems caused by high-density printed circuits, _EGA has proposed a technology of built-in resistors in printed circuit boards to replace the meter paper on the surface of high-density printed circuits. The legal standard is applicable to the Chinese national standard. (^ 77 specifications (21QX297) --------- Shang ^ -------- Order -------- Ϊ ^ (Please read the first Please note this page, please fill in this page) Λ7 _______B7 V. Description of the Invention (〆) — The technical principle of the resistive element is mainly based on the following formula: R = 咅 where R = resistance value, p = resistance coefficient, thickness, w = width by It can be seen from the description formula that 'R (resistance value) can be adjusted by changing L (length) and w (width). Therefore, OHMEGA company controls different p (resistance coefficient) / t (thickness), And the change of L (length) and w (width) is used to produce the resistance (R) with the required resistance value. And the resistance is made in the structure of the printed circuit board by using the widely used multilayer printed circuit manufacturing technology. Built-in resistor, and the resistor built into the printed circuit board structure can Effectively replace the resistance components required on the surface of the printed circuit board, so it can reduce the number of components and area occupancy on the surface of the printed circuit board. In addition to the built-in resistors mentioned above, capacitors are often formed in other ways, using existing multilayer printed circuit boards. In general, it often brings two power supply layers with different potentials (such as VCC and GND) close to each other and uses the large copper surface where they are located to generate an additional capacitor to adjust the voltage. The formula is as follows:
C(電容)=ε(介電係數)X d(距離） 經濟部中夬標準局貝工消費合作社印裂 --------，装-----·!ΐτ (锖先閱讀背面之注意事項再填寫本f ) 在前述公式中，ε (介電係數）係受材料特性所左右， 因此透過Α(面積）與d(距離）的改變可以控制產生所 須的電容》 由上述可知，將電阻及電容等被動元件内建埋置於印 刷電路的結構中，以有效減少表面元件數量並釋出表面空 間的作法是可行的，然而前述的内建電阻及埋置電容係分 _________ 4 本紙張尺度適用中國國家榇準（CNS ) A4規格（210X 297公釐） 421979 Λ* Β7 五、發明説明（ 經濟部中央標準扃貞工消費合作社印繁 別以不同的技術手段達成，未能在同一製程中完成，造成 應用上之不便，且由於前述内建電容及電阻分別位於不同 的基材上’亦有浪費材料不當增加成本之嫌。 因此，本發明主要目的在提供一種可於同一平面上同 時形成平板電容及電阻之製造方法，主要先利用壓板技術 於基材表、底面依序形成高電阻係數層及導電層而構成基 板； 又於基板上依序進行光阻塗佈、影像轉移、選擇性姓 刻等步驟，其中影像轉移步驟中將包含交又指狀的影像資 料轉移至基板上，經蝕刻後於基板表面形成指狀交叉的電 極經過塗佈高介電係數樹腊後，交又的指狀電極將隔著 高介電係數的樹脂分別構成適當容值的平板式電容； 而經過選擇性蝕刻於同一表面所形成的平板式電阻， 亦同時為樹脂所覆蓋，可防止其與空氣接觸而改變電阻值。 、本發明又:目的在於：前述平板式電容係根據下列公 式決定：c”十其中£為樹脂的介電係數，A為平板式 電容之面積，d為電極的間距；又八==1><_1，其中乙為 前述指狀電極的總長度，t則為電極之厚度化丨丨）； 在樹脂介電係數與電極厚度固定的條件下，透過電極 長度的變化’可間接控制電極面積，進而取得所須的電容 值。 又前述内建電阻係根據下列公式決定： ’其中p指高電阻係數層之電阻係 數’ L、W、τ依序為高電阻係數層的長度、寬度及厚度。 ______— ^ k紙張尺度適用中國國家榇準（CNS) Α4規格（2丨0χ29：7公犮） (請先閣讀背面之注意事項再填寫本頁)C (capacitance) = ε (dielectric coefficient) X d (distance) Printed by the Shellfish Consumer Cooperative of the China Standards Bureau of the Ministry of Economic Affairs --------, installed -----! Ϊ́τ (锖 read first Note on the back, fill in this f) In the above formula, ε (dielectric coefficient) is controlled by the characteristics of the material, so the required capacitance can be controlled by changing A (area) and d (distance) "from the above It can be known that it is feasible to embed passive components such as resistors and capacitors in the structure of a printed circuit to effectively reduce the number of surface components and free up surface space. However, the aforementioned built-in resistors and embedded capacitors are divided into _ ________ 4 This paper size applies to China National Standards (CNS) A4 specifications (210X 297 mm) 421979 Λ * Β7 V. Description of the invention Can be completed in the same process, causing inconvenience in application, and because the aforementioned built-in capacitors and resistors are located on different substrates, there is also a possibility of wasting materials improperly and increasing costs. Therefore, the main purpose of the present invention is to provide a Same flat The manufacturing method of simultaneously forming a plate capacitor and a resistor mainly uses a pressing plate technology to sequentially form a high-resistance layer and a conductive layer on the substrate surface and the bottom surface to form a substrate; and then sequentially performs photoresist coating and image transfer on the substrate And selective surname engraving. In the image transfer step, the image data including the interdigitated fingers is transferred to the substrate. After etching, the electrodes that form fingers intersect on the surface of the substrate are coated with high dielectric constant wax. The interdigitated electrode will form a flat capacitor with an appropriate capacitance through a resin with a high dielectric constant. The flat resistor formed by selective etching on the same surface is also covered by the resin, which can prevent it. Contact with air to change the resistance value. The present invention also aims at: the aforementioned flat capacitor is determined according to the following formula: c ", where £ is the dielectric constant of the resin, A is the area of the flat capacitor, and d is the electrode Distance; and eight == 1 > < _1, where B is the total length of the aforementioned finger electrode, and t is the thickness of the electrode 丨 丨); In the resin dielectric constant and electrode thickness Under fixed conditions, the electrode area can be controlled indirectly through the change in electrode length, and the required capacitance can be obtained. The built-in resistance is determined according to the following formula: 'where p is the resistivity of the high-resistance layer' L, W and τ are the length, width, and thickness of the high-resistivity layer in order. ______— ^ k Paper dimensions are applicable to China National Standards (CNS) Α4 specifications (2 丨 0χ29: 7 cm) (Please read the note on the back first) (Fill in this page again)
I -II Ϊ I i t ~I 1 n. 、1T~" I -^------------ . -I · 五、發明説明（ Λ7 Β7 經濟部中央標準局員工消費合作社印製 本發明再目的在於：前述的基板係於-高介電係數 的絕緣基材之表面分別料形成有高電阻係數之錄或始合 金層及鋼層。 ^為使貝審查委員進—步瞭解前述目的及本發明之技 術特徵，鉍附以圖式詳細說明如后： (一）圖式部分： 第一圖：係本發明之製程方塊圖。 第二圖A〜G:係本發明之製程步驟示意圖。 圖A〜E·係本發明平板式電容之製程步驟示意圖。 哲—·係'本發明平板式電阻之剖視圖。 係本發明於平板式電阻上塗佈樹脂之剖視圖。 係本發明平板式電容之剖視圖。 (一）圖说部分： (1 0)基板 （1 1 )基材 (1 2) ( 1 3)高電阻係數層 (14) (15)銅層 (141) (142)指狀電極 (143) (144)局部銅層 (1 6 )樹脂 （2 0)光阻 (3 0)影像資料 （3 1 )曲折線段 R電阻 c電容 有關本發明用以製作平板式電容電阻之製程步驟，請 參閱第一圖所示，其包括有「基板製作」、「光阻塗佈及 影像轉移」、「影像蝕刻」、「去除光阻」、「光阻塗佈 第四圖 第五圖 第六圖 (請先閱讀背面之泣意事項异填寫本育) .裝. —訂 本紙張尺度適财關家料（⑽} A4· Qx297公楚 421 979 經濟部中央標準局貝工消費合作社印製 五、發明説明（厂） 及影像轉移」、「影像選擇性蝕刻」及「樹脂塗佈」等步 驟，其中： 有關「基板製作」步驟請參閱第二圖A所示，該基板 (1 0 )係一多層構造利用壓板技術所構成，主要係於一 玻璃布膠片上壓合内建電阻材料，而於一基材（i）雙 面上分別形成高電阻係數層（1 2) ( 1 3 )及鋼層（1 4) (15)之多層結構。 其中基材（1 1 )係由絕緣材料構成，又於本實施例 中，該高電阻係數層（12) (13)係由鎳、鈷等高電 阻係數材料所構成，其與基材（1 1 )分別具有固定的厚 度。 本發明即利用前述的基板（1 〇)構造在同一平面上 同時形成平板式電容及電阻。 「光阻塗佈及影像轉移」步驟：請參閱第二圖B所示， 其係於基板（1 〇 )之表面及底面分別塗佈以光阻（2 Q ) (photo-resister)，隨後利用光罩將設計完成的影像資料 (3 0 )轉移至光阻（2 〇 )上，該影像資料（3 〇 )攸 關所製成平板式電阻之電阻值及電容之容值，請配合參間 第二圖A所示，其揭示轉移至光阻（2〇)表面之影像資 料（3 0 )，該影像資料（3 〇 )係由適當線寬所構成的 十子線框’其中央部位並形成有連續且對稱的曲折線段（3 1 )，而位於該十字線框及曲折線段（3丄）處的光阻（2 0)均將予溶解去除。 衫像姓刻」步驟：經轉移影像資料（3 0)至光阻 I J Λ. ι^ϋ— m ^^^1 » - -i 士HI -- —.· I - - - - I - - - 、！ 矣 (請先閲讀背面之注意事項再填寫本頁) 0 7 Μ _____B7五、發明説明（A ) 經濟部中央標準局員工消費合作社印製 (2 0 )後，即針對該影像資料（3 〇 )涵蓋之高電阻係 數層（12)(13)及銅層（14)(15)進行蝕刻， 其使用的钮刻液係兼可触刻鋼層（1 4 )( 1 5 )及高電 阻係數層（1 2 ) ( 1 3 )者（如 HCl+H202+CuCl2)，其 蝕刻步騾完成後係如第二圖C所示，又經完成「去除光阻」 步驟後，即如第二圖D，而基板（丄〇 )表面的狀況即如 第三圖B所示，前述步驟依影像資料（3 〇 )之構圖姓去 部分銅層（14)，而在基板（1〇)中央形成兩組交叉 排列的指狀電極（141) (142)，兩組指狀電極（ι 4 1 )( 1 4 2 )的相對外側端又分別與蝕刻後形成的小 區域銅層（143) (144)相連。其中交又的指狀電 極（1 4 1 )( 1 4 2 )係以相同的間距作等距排列，又 2站狀電極（ι41) (142)經於相鄰間隙中注入 =介電係數材料，兩組指狀電極（141) 呈 等，交叉的各臂即分別隔著高介電係數材料構成—平板式 電容’至1電容之容值係、由下列公式決定： c = ，其中 Α = [ χ t —又前述ε為高介電係數材料的介電係數，A為平板式 電容之面積，其中L為独指狀f極（141) (142) 的^長度t則為指狀電極（1 4 1 )( 1 4 2 )之展声 在介電係數與指狀電極（141) (142)厚度固 定的條件下’經改變指狀電極（14 1H1 42)的油 長度，即可間接控制指狀電極（141) (142 , 本録尺度適用中國國 ---------¾衣— (請先閱讀背面之注意事項再填寫本頁) 訂---- ----------- • Her ·-· i* 421 979 ^ 經濟部中央標準局貝工消費合作社印裳 Λ7 五、發明説明（> ) ----- 進而利用前述公式換算取得所須的電容值。 至於電l阻的阻值則可透過下列的公式取得： Κ = ρχΙ = (τ)χφ 前述公式中，Ρ指高電阻係數層（1 2 ) ( 1 3 )之 電阻係數，L ' w、Τ分別為高電阻係數層（工2 )(丄 3 )之長度、寬度及厚度。 •7 7基材（1 1 )之電阻層厚度固定，即可透過控制 同電阻係數（1 2 )( 1 3 )之長度、宽度，則可取得所 需的電阻。 一次「光阻塗佈及影像轉移」步驟：如第二圖Ε所示， 係重覆在基板（10)上塗佈光阻（20)，並再將另-設計完成的影像資料（3 〇)以光罩轉移至光阻（2 〇) 上，同時溶解去除影像資料（3〇)㈤蓋範圍内之光阻（2 〇)。有關二次轉移的影像資料（3〇)主要係用以製作 平板式電阻（如第三圖C所示）。 「影像選擇性蝕刻」步驟：如第二圖F所示，其係利 用k擇)±餘刻液（如·驗性錢銅）選擇性的將部分銅層（1 4)去除，而保留高電阻係數層（12)，經去除光阻（2 0 )後係如第二圖G所示。 ,又如第三圖D所示，形成於基板（1〇)表層之平板 式電阻，其位於中央位置由轉移影像涵蓋範圍内之局部高 電阻係數層U2)(請參閱第四圖之另一方向剖視圖所 不）即為預定阻值之平板式電阻，位於高電阻係數層（工 2) —端之局部鋼層（144)係構成—傳輪線區，另端 本紙張尺度適财關家標準（CNS) A4規格（训㈣7公楚 —— -- -¾衣-- (請先閲讀背面之注意事磺再填寫本頁) 訂--- - B1 ^21979 五、發明説明（ 則與指狀電極（1 4 2)連接。 蓋範圍㈣：主要係依影料料（3〇)之涵 匕=介電係數的樹脂（16)塗佈於基板（10) 電阻的‘：囷㈣不）’該樹脂（16)除將覆蓋平板式 電阻的两電阻係數層（i2)( 命咖灰Λ 罘五圖所不），防止其 /、二虱接觸而改變電阻值外，樹脂卩! ft 1 t +、 兩組指狀電極（141) (";、(16)亦同時充填於 ^ _ i4i) (142)的相鄰間隙中（如第 六圖所示），而兩組交叉的指狀電極（141)(142、 2別隔著高介電係數的樹脂（丄6 )構成電容c，至於 其電容值係由前述的公式C = exA決定。 d 根據月ίι述公式’再將樹脂（丄6 )的介電係數與指狀 電極（141) (142)厚度及相鄰間距d設為固定值 的條件下’如改變指狀電極（141) (142)的總長 度，即可間接控制指狀電極（141) (142)面積， 進而利用前述公式換算取得所須的電容值。 以前述於同一面上同時形成有平板式電容、電阻之基 板（1 0 )經與印刷電路板配合，並進行壓板、鑽孔等p CB製程’即可構成一具備内建平板式電阻、電容元件之 印刷電路板’將有助於降低傳輸線上的寄生電容、寄生電 感及寄生電阻，而提供較佳的信號傳輸路徑，再者，可有 效減少印刷電路板表面所設電阻及電容數量而釋出印刷電 路板之表面空間，供作電氣連接、信號傳輸或其他加工、 功此升級用途。另由於在同一基板的同一平面上同時形成 平板式電容及電阻，除方便於運用外，更可有效減少材料 10 本紙張尺度適用中國國家標準（CNS } Α4规格（210Χ 297公釐） III-----Ί------1T------^ (請先閲讀背面之注意事續再填寫本頁) 經濟部中央標隼局員工消費合作社印裝 4 2 19 7 9 Λ7 ~--------B7 五、發明説明（y ) … 浪費’降低製造成本。 、由上述可知，本發明係利用特殊設計的基板配合全姓 刻去以同㈣成平板式電阻、電容，而電阻、電容等被動 元件纟般印刷電路板上使用的數量甚多，而利用本發明 將其内建於基板中，除可顯著減少印刷電路板表面的元件 數目外更可令印刷電路板表面釋出更多的空間，供作其 他電氣連接或信號傳輸料。再者，本發明之樹脂塗佈步 驟除配合指狀電極構成平板式電容外，並可隔離平板式電 阻，防止其因與空氣接觸而改變阻值，以確保其穩定性。 由此可見，本發明利用内建電阻、電容之方式，可有 效解決電路密度過高所衍生的各項問題，故已具備高度的 產業利用價值與進步性，並符合發明專利之要件，爰依法 提起申請。 (請先閲讀背面之注意事項再填寫本頁) 經濟部中夬榡準局貝工消費合作社印製 不紙汝尺度適用中國國家標準（CNS ) A4規格（210X297公楚)I -II Ϊ I it ~ I 1 n. 、 1T ~ " I-^ ------------. -I. V. Invention Description (Λ7 Β7 Staff Consumer Cooperative of Central Standards Bureau, Ministry of Economic Affairs The purpose of printing the present invention is to: the aforementioned substrate is formed on the surface of a high-dielectric-constant insulating base material with a high-resistance recording or starting alloy layer and a steel layer, respectively. Knowing the foregoing objects and the technical features of the present invention, the detailed description of bismuth with drawings is as follows: (1) Schematic part: The first picture: is a block diagram of the process of the present invention. The second picture A ~ G: is the invention Schematic diagram of the process steps. Figures A ~ E · are schematic diagrams of the process steps of the flat-plate capacitors of the present invention. Philosophy-is a cross-sectional view of the flat-type resistors of the present invention. Sectional view of a flat capacitor. (1) Illustrated part: (1 0) substrate (1 1) substrate (1 2) (1 3) high resistivity layer (14) (15) copper layer (141) (142) Finger electrode (143) (144) Local copper layer (1 6) Resin (2 0) Photoresist (3 0) Image data (3 1) Zigzag segment R resistance c Capacitance Please refer to the first picture for the process steps for making flat capacitor resistors, which include "substrate production", "photoresist coating and image transfer", "image etching", "removing photoresist", " Photoresist coating 4th picture 5th picture 6th picture (please read the crying items on the back and fill in this education first). Packing. —Book size paper suitable for financial affairs (⑽) A4 · Qx297 公 楚 421 979 Printed by Shelley Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Inventory (factory) and image transfer "," Image selective etching "and" Resin coating "steps, among which: For the steps of" substrate production "please refer to the second As shown in Figure A, the substrate (1 0) is a multi-layer structure made of pressing plate technology. It is mainly formed by laminating a built-in resistance material on a glass cloth film, and formed on both sides of a substrate (i). The multilayer structure of the high-resistance layer (1 2) (1 3) and the steel layer (1 4) (15). The substrate (1 1) is made of an insulating material, and in this embodiment, the high-resistance The layers (12) and (13) are made of high resistivity materials such as nickel and cobalt. The substrates (1 1) each have a fixed thickness. In the present invention, the aforementioned substrate (1 0) structure is used to form a flat capacitor and a resistor on the same plane at the same time. "Photoresist coating and image transfer" steps: see page As shown in Figure 2B, the surface and bottom of the substrate (10) are coated with photoresist (2Q) (photo-resister), and then the image data (30) is transferred to the design using a photomask. On the photoresist (20), the image data (30) is related to the resistance value and capacitance value of the plate-type resistor made, please cooperate with the second figure A in the reference, which reveals the transfer to the photoresist ( 2) The image data on the surface (30), the image data (30) is a ten-sub-wire frame formed by an appropriate line width at its center and formed with continuous and symmetrical meandering line segments (31) The photoresist (20) at the cross-line frame and the zigzag line segment (3 丄) will be dissolved and removed. "Shirt like last name carved" steps: After transferring the image data (30) to the photoresistor IJ Λ. Ι ^ ϋ — m ^^^ 1 »--i 士 HI-—. · I----I--- ,!矣 (Please read the precautions on the back before filling this page) 0 7 Μ _____B7 V. Description of invention (A) After printing (20) by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs, the image data (3) The covered high-resistivity layer (12) (13) and copper layer (14) (15) are etched, and the button liquid used is also capable of touching the steel layer (1 4) (1 5) and the high-resistance layer (1 2) (1 3) (such as HCl + H202 + CuCl2), after the etching step is completed, as shown in the second figure C, and after completing the "remove photoresist" step, as shown in the second figure D The condition of the surface of the substrate (丄 〇) is as shown in the third figure B. The foregoing steps remove part of the copper layer (14) according to the composition of the image data (30), and form two groups in the center of the substrate (10). The cross-shaped finger electrodes (141) (142), and the opposite outer ends of the two groups of finger electrodes (ι 4 1) (1 4 2) are respectively connected to a small area copper layer (143) (144) formed after etching. . The interdigitated finger electrodes (1 4 1) (1 4 2) are arranged at equal distances at the same pitch, and the two station electrodes (ι41) (142) are injected into adjacent gaps = dielectric constant material The two sets of finger electrodes (141) are equal, and the crossed arms are respectively formed by a high-dielectric-constant material—the capacitance of the flat-plate capacitor 'to 1 is determined by the following formula: c =, where A = [χ t —The aforementioned ε is the dielectric coefficient of the high-dielectric constant material, A is the area of the plate capacitor, where L is the finger length of the f-shaped electrode (141) (142), and t is the finger electrode ( Under the condition that the dielectric constant and the thickness of the finger electrode (141) (142) are fixed, the sound of 1 4 1) (1 4 2) can be controlled indirectly by changing the oil length of the finger electrode (14 1H1 42). Finger electrode (141) (142, the size of this record is applicable to the country of China -------- ¾ clothing — (Please read the precautions on the back before filling this page) Order ---- ----- ------ • Her ·-· i * 421 979 ^ Yin Chang 贝 7, Shellfish Consumer Cooperative, Central Bureau of Standards, Ministry of Economic Affairs 5. Description of the invention (>) ----- Then use the aforementioned formula to convert the required Capacitance. The resistance value of the electrical resistance can be obtained by the following formula: κ = ρχΙ = (τ) χφ In the foregoing formula, P refers to the resistivity of the high-resistance layer (1 2) (1 3), L ′ w, T Respectively the length, width and thickness of the high resistivity layer (work 2) (丄 3). • 7 7 The thickness of the resistive layer of the substrate (1 1) is fixed, which can be controlled by the same resistivity (1 2) (1 3 ) Length, width, you can obtain the required resistance. One "photoresist coating and image transfer" step: as shown in the second figure E, the photoresist (20) is coated on the substrate (10). , And then transfer the other-designed image data (30) to the photoresist (200) with a photomask, and at the same time dissolve and remove the photoresist (200) within the range of the image data (30). Related The image data of the second transfer (30) is mainly used to make flat-type resistors (as shown in the third figure C). "Image selective etching" step: as shown in the second figure F, it uses k selection) ± Residual solution (such as copper coin) selectively removes part of the copper layer (1 4), while retaining the high resistivity layer (12), after removing the photoresist (20) The second G in FIG. As shown in the third figure D, the flat-type resistor formed on the surface layer of the substrate (10) is located at the center of the local high-resistance layer U2 covered by the transfer image) (see the other figure in the fourth figure) Not shown in the cross-sectional view of the direction) is a flat-type resistor with a predetermined resistance value, which is located in the high-resistance coefficient layer (Work 2)-the local steel layer (144) at the end constitutes the transfer line area, and the other end of this paper is suitable for financial and family care. Standard (CNS) A4 Specification (Exam 7 Gongchu---¾ Clothing-(Please read the cautions on the back before filling out this page) Order ----B1 ^ 21979 V. Description of the invention The electrode (1 4 2) is connected. Cover range ㈣: Mainly depends on the material of the film (30) = resin (16) of the dielectric constant is coated on the substrate (10) Resistance ': 囷 ㈣ not) 'In addition to the resin (16), which will cover the two resistivity layers (i2) of the flat-type resistor (not shown in Figure 5), the resin will not change the resistance value due to its contact with lice, 卩! Ft 1 t +, two sets of finger electrodes (141) (", (16) are simultaneously filled in the adjacent gaps of ^ _i4i) (142) (as shown in the sixth figure), and two The interdigitated electrodes (141) (142, 2) constitute a capacitor c via a resin (丄 6) with a high dielectric constant. The capacitance value is determined by the aforementioned formula C = exA. D According to the formula described above Then, the dielectric constant of the resin (丄 6) and the thickness of the finger electrodes (141) (142) and the adjacent distance d are set to fixed values. 'If the total length of the finger electrodes (141) (142) is changed, That is, the area of the finger electrodes (141) and (142) can be controlled indirectly, and the required capacitance value can be obtained by the conversion of the foregoing formula. The substrate (1 0) with flat-type capacitors and resistors formed on the same surface at the same time is printed and printed. Matching circuit boards and performing p CB processes such as pressing and drilling can form a printed circuit board with built-in flat-type resistors and capacitors, which will help reduce parasitic capacitance, parasitic inductance, and parasitic resistance on the transmission line. Provides a better signal transmission path. Furthermore, it can effectively reduce the number of resistors and capacitors on the surface of the printed circuit board and release the surface space of the printed circuit board for electrical connection, signal transmission or other processing, and upgrade .another Since the flat capacitors and resistors are formed on the same plane of the same substrate at the same time, in addition to being convenient to use, the material can be effectively reduced. 10 This paper size is applicable to the Chinese national standard (CNS) Α4 size (210 × 297 mm) III --- --Ί ------ 1T ------ ^ (Please read the notes on the back before continuing on this page) Printed by the Consumer Cooperatives of the Central Bureau of Standards, Ministry of Economic Affairs 4 2 19 7 9 Λ7 ~- ------- B7 V. Description of the Invention (y)… Waste 'reduces manufacturing costs. As can be seen from the above, the present invention uses a specially-designed substrate to match the entire family name to form a flat-type resistor and capacitor, and passive components such as resistors and capacitors are often used on printed circuit boards in large numbers. The invention is built into the substrate, in addition to significantly reducing the number of components on the surface of the printed circuit board, it can also free up more space on the surface of the printed circuit board for other electrical connections or signal transmission materials. In addition, the resin coating step of the present invention, in addition to forming a flat capacitor with a finger electrode, can isolate the flat resistor and prevent its resistance from changing due to contact with air to ensure its stability. It can be seen that the invention uses built-in resistors and capacitors to effectively solve various problems caused by excessive circuit density. Therefore, it has high industrial use value and progress, and meets the requirements of invention patents. File an application. (Please read the notes on the back before filling out this page) Printed by the China Industrial Standards Administration Bureau Shellfish Consumer Cooperative Co., Ltd. Paperless scales are applicable to China National Standard (CNS) A4 specifications (210X297)