4196 84 A7 -------B7 五、發明說明（1 ) 〔發明之領域〕 本發明是有關於附有導線之電子零件，尤其是附有導 線之電容器及使用於電容器之導線與其製造方法者。 〔發明之背景〕 向來’許多附有導線之電子零件被人所使用。這些電 子零件通常為了絕緣或保護元件之目的多以環氧樹脂等之 絕緣樹脂所包覆β 第10園表示一附有導線之高電壓用之電容器之構成做 為先前之電子零件之例。先前的電容器係在介電質薄膜la 之兩面將金屬箔或以蒸鍍形成之金屬層所構成之電極2a， 2b保持一定的間隔加以配置。由這些金屬層所構成之電極 2a ’ 2b ’配置成各別被絕緣之電極，而且電極㉛被配置成 與介電質溥膜la之另一面相鄰的兩個金屬層所構成之電極 2c ’ 2d相對。向外拉的端子引出線係在開始捲取部與捲取 終止部將導線3a及3b熔接於電極表面實行。電極與導線之 電氣連接是由熔接部4a及4b來進行。先前的電容器係將以 上述方法構成之介電質薄膜13與另一方的介電質薄膜11?重 叠而繞回者，因此具有如第U圖所示由產品之兩端部或一 端部將導線引出外部之構造。 使用於此種電池之導線是以銅線或鋼線做為原線材料 ’而在表面形成錫單質或錫鉛軟烊等數乃至數十"m 之厚度之電子零件通用導線，視電容器之用途選擇原線衬 料或表面金屬。 如上述所構成之電容器，如第12圖等價表示成為電容 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） <請先閱讀背面之注意事項再填寫本頁)4196 84 A7 ------- B7 V. Description of the Invention (1) [Field of Invention] The present invention relates to electronic parts with wires, especially capacitors with wires, and wires used in capacitors and their manufacture Method. [Background of the Invention] Conventionally, many electronic parts with wires are used. These electronic parts are usually covered with an insulating resin such as epoxy resin for the purpose of insulating or protecting components. The tenth circle shows a structure of a capacitor for high voltage with a lead wire as an example of the previous electronic parts. In the conventional capacitor, the electrodes 2a and 2b made of a metal foil or a metal layer formed by vapor deposition were arranged on both sides of the dielectric thin film la with a certain interval. The electrodes 2 a ′ 2 b ′ composed of these metal layers are arranged as individually insulated electrodes, and the electrodes 配置 are arranged as electrodes 2 c ′ composed of two metal layers adjacent to the other side of the dielectric 溥 film la. 2d relative. The terminal lead-out wire pulled outward is performed by welding the lead wires 3a and 3b to the electrode surface at the start-up winding section and the winding-up termination section. The electrodes and the lead wires are electrically connected by the welding portions 4a and 4b. The previous capacitors were formed by overlapping the dielectric thin film 13 formed by the above method and the other dielectric thin film 11? And winding them around. Therefore, as shown in FIG. Draw out the external structure. The wires used in such batteries use copper or steel wire as the original wire material, and the general wire for electronic parts with a thickness of several tens of tens " m, etc., is formed on the surface, depending on the capacitor. Use select the original wire lining or surface metal. Capacitors constructed as described above are equivalent to capacitors as shown in Figure 12. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) < Please read the precautions on the back before filling this page)
------- -訂-----—II1*^ I 經濟部智慧財產局員工消费合作社印製 4 4 19684 A7 _______B7______ 五、發明說明（2 ) 器Cl，C2 ’ C3，….C8串聯者。在各電容器Cl，C2, C3....C8 中’承受施加於導線3a，3b之間之電壓Vs被分割之v卜V2 ，V3.…V8，故其耐電壓提高，可以對電池施加高電壓。 此外’此種電壓在捲取元件後，需在環氧樹脂等液態 熱固性樹脂中進行真空浸滲。第13圖表示浸滲於環氧樹脂 令之電容器元件。電容器元件係以導線3a，3b所支撐，要 引出捲完側導線或起捲側之導線之端面是朝上浸滲的。 浸滲於環氡樹脂之電池元件於浸滲—定時間後袜取出 以硬化樹脂。藉由浸滲操作，存在於介電質薄膜13與11?之 間之空氣層（以下簡稱空隙〔air v〇id〕）為環氧樹脂相置換 ，另外介電質本身所具有之針孔（pin h〇le)等之缺陷部分 也以環氧樹脂加以填補。由於該浸滲操作，介電質每一定 厚度之耐電壓可以提昇，而且導線強度之增強與產品吸濕 性之防止可以同時兼顧。 這樣一來’即可以製得額定電壓10至30KV，靜電容 量1000至6000PF之小型而不需要容器之高壓電容器。此 種規格之電池通常將導線焊接於電子機器之腳端等在以 溶接’導電橡膠所做電氣連接中偶爾也使用。以電氣相連 接之電池係埋設於環氧樹脂等高耐壓樹脂中使用。 但是，環氧樹脂等硬化性樹脂由於浸滲後的熱固化， 在導線表面會形成厚度數_之堅固樹脂被膜。上述樹脂 被膜會成為焊接部分的導通不良之原因。另外，在藉由溶 接。導電橡膠之接觸以獲得電氣連接時，樹脂被膜也成為 導通不良的原因。 (請先閱讀背面之注意事項再填寫本頁) --------訂 -------•線！ 經濟部智慧財產局員工消費合作社印製 r n Bn . -fi I - 1 4 丨96 fid__B7__ 五、發明說明（3) 於是，有一種方法是在焊錫浴中浸滲導線，分解樹脂 被膜後再形成焊錫層以為其對策。但是，在上述對策中， 因為同時進行強固之環氧被膜之去除與烊錫層之形成，所 以有花費時間與降低生產力之問題。 為徹底解決上述導通不良的問題，導線上之環氧被膜 必須完全去除或不使其附著^要去除樹脂雖然有藉由研磨 劑等強制去除樹脂之方法，但是不但很難完全去除，而且 有時導線表面之焊層會被破壞以致焊接性降低。另外，在 去除時，有時導線會切斷。 因而，也有人想辧法在導線表面塗佈脫模性樹脂以防 土樹脂之附著或減少附著之方法。但是脫模劑如果附著於 電容器元件之端面或周圍時，則樹脂浸滲即不理想，電容 器之耐壓特性就降低。 亦即’在先前的薄膜電池，尤其是高壓電容器中，如 何以低成本實現提昇電池之耐電壓及兼顧小型化之追求與 導線之導通性是其課題。本發明係以薄膜電容器，尤其是 高壓用薄膜電容器所代表之需要浸滲於樹脂中之電子零件 零件，其目的在減少樹脂對導線之附著著，藉由容易去除 樹脂薄膜以確保電子零件之品質並提高其焊接性。 〔發明之要旨〕 本發明之電子零件係在導線之表面形成平均厚度ι〇Α 以上1000人以下之脫模性樹脂被膜著。上述樹脂被膜以含 有反應性聚矽氧烷之硬化物之樹脂或至少構造之一部分含 有碳氟化合物之樹脂較為適合。此外，本發明之導線之製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閲讀背面之注意事項再填寫本I) 丄 經濟部智慧財產局員工消費合作社印製------- -Order ------- II1 * ^ I Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 4 19684 A7 _______B7______ 5. Description of the invention (2) Devices Cl, C2 'C3, .... C8 in series. In each of the capacitors Cl, C2, C3, ..., and C8, the voltage Vs applied between the wires 3a, 3b and the divided Vs V2, V3, ..., V8 are received, so the withstand voltage is increased, and the battery can be applied with high voltage. Voltage. In addition, after such a voltage is wound up, it is necessary to vacuum impregnate a liquid thermosetting resin such as epoxy resin. Fig. 13 shows a capacitor element impregnated with epoxy resin. The capacitor element is supported by the wires 3a, 3b, and the end face of the lead on the winding side or the side of the winding side is impregnated upward. Cell elements impregnated with ring resin are impregnated—socks are removed after a fixed period of time to harden the resin. By the infiltration operation, the air layer (hereinafter referred to as the air gap) existing between the dielectric thin films 13 and 11? Is replaced by the epoxy resin phase, and the pinholes ( The defective parts such as pin hole are also filled with epoxy resin. Due to this infiltration operation, the withstand voltage of a certain thickness of the dielectric can be increased, and the enhancement of the strength of the wire and the prevention of the moisture absorption of the product can be taken into consideration at the same time. In this way, a small high-voltage capacitor with a rated voltage of 10 to 30KV and a capacitance of 1000 to 6000PF can be obtained without a container. Batteries of this specification are often occasionally used in electrical connections made by dissolving the conductive rubber by soldering wires to the feet of electronic equipment. Electrically connected batteries are embedded in high-voltage resins such as epoxy resin. However, a hardening resin such as an epoxy resin is hardened after being impregnated, and a strong resin film having a thickness of several Å is formed on the surface of the lead wire. The above resin coating may cause the conduction failure of the soldered portion. In addition, by welding. When the conductive rubber is contacted to obtain an electrical connection, the resin film also causes a poor conduction. (Please read the notes on the back before filling this page) -------- Order ------- • Line! Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs rn Bn. -Fi I-1 4 丨 96 fid__B7__ V. Description of the Invention (3) Therefore, there is a method to impregnate the wire in a solder bath, decompose the resin film, and then form solder. The layer considers its countermeasure. However, in the above countermeasures, since the removal of the strong epoxy coating and the formation of the tin layer are performed at the same time, there is a problem that it takes time and reduces productivity. In order to completely solve the above-mentioned problem of poor conduction, the epoxy coating on the wire must be completely removed or not adhered. ^ To remove the resin Although there is a method of forcibly removing the resin by using an abrasive, etc., it is not only difficult to completely remove it, but also sometimes The solder layer on the surface of the wire may be damaged so that the solderability is reduced. In addition, the lead may be cut during removal. Therefore, some people have also thought of a method of coating the surface of the lead wire with a release resin to prevent or reduce the adhesion of the earth resin. However, if the release agent adheres to the end face or the periphery of the capacitor element, the resin impregnation is not ideal, and the withstand voltage characteristic of the capacitor is reduced. That is, in previous thin-film batteries, especially high-voltage capacitors, how to increase the withstand voltage of the battery at a low cost and take into account the pursuit of miniaturization and the continuity of the lead wires are its subjects. The present invention is a film capacitor, especially an electronic component part which needs to be impregnated with resin, which is represented by a film capacitor for high voltage. Its purpose is to reduce the adhesion of the resin to the wire, and to easily remove the resin film to ensure the quality of the electronic part And improve its weldability. [Summary of the Invention] The electronic component of the present invention is formed on the surface of the lead wire with a moldable resin film having an average thickness of 〇Α to 1000 persons. The resin film is preferably a resin containing a cured product of a reactive polysiloxane or a resin containing at least a part of a structure containing a fluorocarbon. In addition, the paper wire of the present invention is made in accordance with the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the notes on the back before filling in this I) 丄 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs
I n n I B n n n if I- n 1 n u I n I 6 4 ,9684 A7 -------------B7_____ 五、發明說明（4 ) 造方法是將導線直接浸潰於液態絕緣樹脂或稀釋液態樹脂 之溶液中，或將在連續之導線塗布液態絕緣樹脂或稀釋液 態絕緣樹脂之溶液後再加熱導線而製得。使用上述導線倣 為電子零件之端子即可以確保對電子零件對電子機器之電 氣連接。 圖式之簡單說明 第1圖為根據本發明之一實施形態之電極引出導線之 剖面圓。 第2圖為比較先前之導線表面以及本發明之一實施形 態之導線表面所附著之液態環氧樹脂之潤濕狀態之圖。 第3圖為矽酮皮膜厚與導線之環氧樹脂撥落性及焊接 性之關係。 第4A圖表示本發明之實施形態中所使用之聚矽氧烷 之構造。 第4B圖表示本發明之實施形態中所使用之其他聚矽 氧姨;之構造。 第5圖表示本發明之一實施形態中所使用之ί夕酮樹脂 之構造β 第6圊表示本發明之一實施形態中之導線之製造方法 〇 第7圖表示本發明之一實施形態中之導線之製造方法 〇 第8圖表示本發明之一實施形態中之電容器之構造。 第9圖表示本發明之一實施形態中之電容器之製造方 本紙張尺度適用中國國家標準（CNS)A4規格（2]〇 X 297公釐） (諳先閲讀背面之注意ί項再填寫本頁> { I —訂-！ !線！ 經濟部智慧財產局員工消費合作社印製 4 ^684 A7 -------B7__ 五、發明說明（5 ) 法。 第10圖表示先前之高壓用薄膜電池之構造。 第u圖為先前之高壓用薄膜電容器之捲取後之外觀圖 6 第12囷表示先前之高壓用薄膜電容器之等償電路。 第13圖表示先前之高壓用薄膜電容器浸潰於浸滲樹脂 中。 〔第1具體例〕 茲以第1圖說明本發明之第一形態。 第1圖表示本發明之第1實施形態之導線之剖面。原線 材料為軟鋼絲，鋼絲之直徑為0 5mm。在軟鋼絲2A之外周 形成厚度30/i m之鍍銅層28與其外側形成厚度1〇只m之塗 焊錫層2C。2B，2C是在導線之伸線工程後，藉由電鍍法 形成為二定之厚度。2D為矽酮樹脂被模，係由後述之方 法所形成，平均厚度為1 〇〇入。 其次，第2圖表示未形成矽嗣被膜之導線以及附著於 形成矽明被膜之導線表面之液態環氧之潤濕狀態。在第2 圖中，rsl疋導線與環氧間之表面張力，^是導線之表面張 力，Η是液態環氧間之表面張力，0為接觸角。與形成有 矽酮被膜之導線表面與環氧樹脂之接觸角會增大。亦即， 本實施形態中所使用之導線表面形成有矽酮被膜，因此， 環氡樹脂呈容易撥落的狀態。 其次，第3圖表示含矽嗣樹脂之厚度在i人至1〇〇〇〇人 之間變化而獲得之導線之環氧樹脂之撥落性（環氧樹脂之 本紙張尺度適用中國固家標準（CNS)A4規格（2】0 X 297公釐） (請先M讀背面之注意事項再填寫本頁) — — — — — —— « — — —111 — — t 經濟部智慧財產局員工消費合作杜印製 ¥ n n n LI i - 經濟部智慧財產局員工消費合作社印製 幻9684 A7 ___ B7 五、發明說明（6) 容易撥落程度）與JIS-C-5102之烊接性之詳價結果。由第3 圖可知，矽酮樹脂之塗膜厚度在10 A至1 〇〇〇 A時，得到滿 足環氧樹脂之撥落性與焊接性雙方之特性。 矽酮樹脂被膜在1000A以下之極薄範圍内，導線與溶 融焊錫間之表面張力會超過導線表面之石夕酮被膜之表面張 力。因此’可以滿足焊接性》1 〇 A以下的厚度則不足形成 矽酮被膜而無法發揮環氧撥落性》 另一方面’矽酮樹脂之厚度如果超過300人時，焊錫 满濕試驗（美内斯可表法）有降低焊錫濁濕性（需要時間使 焊錫潤濕）之傾向’因此如果在短時間進行焊接時，石夕嗣 樹脂之被膜厚度範圍以50至300A左右為宜。 如上所述，一邊將脫模性之樹脂被模形成於導線上， 在短時間内確保電氣連接為本實施形態之特徵。 其次’就本實施形態所使用之材料，利用第4A圖與 第4B圖所示之化學式加以說明。第4圖所示之兩個化學式 表示本實施形態所使用之矽酮樹脂主成分反應性聚矽氧烷 (polysiloxane)。在第4圖所示之兩種反應性聚矽氧烷中添 加白金絡合物（complex)為主成分之觸媒攪拌後，經由塗 布於導線後，在導線表面形成具有甲基之矽酮樹脂層。 第5圖表示矽鲷樹脂被模之環氧樹脂機制之推定圖。 如第5圖所示，矽酮樹脂中之曱基係面向表面側，因此被 推定為可以撥落環氧樹脂。 另外，本實施形態中雖表面處理時使用矽酮樹脂，但 是本發明所使用之導線之表面處理材料並不限定於矽酮樹 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） .〇 - — I! — — — — 0 — llllllt (請先《讀背面之注意^項再填寫本頁) 4196 84 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（7 ) 脂。其他的表面處理材料可以使用構造中含有氟烷基之氟 樹脂，或以高脂肪酸等為主成分之蠟或含有該等之混合物 ，也可以獲得與本實施形態之同樣效果。 〔第2具體例〕 其次利用第6圖說明本發明的導線之製造方法。 在第6圖中’ A為收容導線之容器，B為所收容之導線 。（：為處理液，係在第4圖所示之兩種反應性聚矽氣烧之3 重量百分比之甲笨溶液中，添加6重量百分比之以白金絡 合物為主成分之觸媒以甲苯稀釋為100倍之溶液。將上述 之處理液放入容器中以浸潰導線30分鐘。然後，將上述之 處理液排出，此時在導線表面附著處理液。然後，在排出 處理液後在常溫乾燥約60分鐘以後，將容器直接放入恆溫 槽，在100°C中進行約100分鐘之熱固化。藉此，如將反應 性聚矽氧烷之濃度提高，則所形成之矽酮樹脂被臈變厚， 如將濃度降低，被膜即變薄。根據我人之實驗，反應性聚 矽氧烷之濃度為1.5至5重量％時，獲得了實施形態1所記 載之理想結果。 〔第3實施形態〕 其次要利用第7圖說明本發明之導線之製造方法之其 他實施形態。 在第7圖中’ a為矽酿1溶液之處理浴，該矽酮溶液係在 第4圖所示之兩個反應性聚矽氡烷丨〇〇分中添加以白金絡合 物為主要成分之觸媒2分者。b係為毛毡（非織布）所製成之 塗佈媒體，用於吸取處理浴a而塗佈於導線上。（；為表面形 (請先閲讀背面之注意事項再填莴本頁) -1 ^ 11 11111 訂-11 ! 111 — *I nn IB nnn if I- n 1 nu I n I 6 4, 9684 A7 ------------- B7_____ V. Description of the invention (4) The manufacturing method is to directly immerse the wire in liquid insulation The resin or the diluted liquid resin solution, or the continuous wire is coated with a liquid insulating resin or a solution of the diluted liquid insulating resin, and then the wire is heated. The use of the above-mentioned wires as terminals of electronic parts can ensure the electrical connection of electronic parts to electronic machines. Brief Description of the Drawings Fig. 1 is a sectional circle of an electrode lead wire according to an embodiment of the present invention. Fig. 2 is a graph comparing the wet state of the liquid epoxy resin attached to the surface of the previous wire and the surface of the wire according to one embodiment of the present invention. Figure 3 shows the relationship between the thickness of the silicone film and the drop-out and solderability of the epoxy resin of the wire. Fig. 4A shows the structure of the polysiloxane used in the embodiment of the present invention. Fig. 4B shows the structure of other polysiloxanes used in the embodiment of the present invention. FIG. 5 shows the structure of a fluorene resin used in one embodiment of the present invention. Β 6: shows a method for manufacturing a lead wire according to an embodiment of the present invention. FIG. 7 shows a method for manufacturing a lead wire according to an embodiment of the present invention. Method for manufacturing lead wires. Fig. 8 shows the structure of a capacitor in one embodiment of the present invention. Figure 9 shows the manufacturing method of the capacitor in one embodiment of the present invention. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (2) 0X 297 mm. (Please read the note on the back first and then fill out this page. > {I —Order-!! Line! Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 ^ 684 A7 ------- B7__ 5. Explanation of the invention (5). Figure 10 shows the previous high-pressure application. The structure of a thin film battery. Figure u shows the appearance of the previous high voltage film capacitor after winding. Figure 6 shows the equivalent circuit of the previous high voltage film capacitor. Figure 13 shows the previous high voltage film capacitor immersion. In the impregnated resin. [First specific example] The first form of the present invention will be described with reference to the first figure. The first figure shows the cross section of the lead wire according to the first embodiment of the present invention. The diameter is 0 5mm. A copper plating layer 28 with a thickness of 30 / im is formed on the outer periphery of the flexible steel wire 2A and a solder coating layer 2C with a thickness of 10 m is formed on the outer side. 2B, 2C are formed by electroplating after the wire is stretched. Method to form a predetermined thickness. 2D is a silicone resin mold, It is formed by the method described later, and the average thickness is 100 Å. Second, the second figure shows the wet state of the wire without the silicon dioxide film and the liquid epoxy adhered to the surface of the wire with the silicon film. In the figure, the surface tension between rsl 疋 wire and epoxy, ^ is the surface tension of the wire, Η is the surface tension between the liquid epoxy, and 0 is the contact angle. The surface of the wire with the silicone film and the epoxy resin The contact angle will increase. That is, the silicone coating is formed on the surface of the lead wire used in this embodiment. Therefore, the ring-shaped resin is easily pulled off. Next, the third figure shows that the thickness of the silicon-containing resin is i. Drop-out property of epoxy resin for wires obtained by changing from person to 10,000 person (the paper size of epoxy resin is applicable to China Solid Standard (CNS) A4 specification (2) 0 X 297 mm) (Please read the notes on the back before filling out this page) — — — — — — — «— — — 111 — — t Consumption cooperation by employees of the Intellectual Property Bureau of the Ministry of Economic Affairs ¥ nnn LI i-Intellectual Property Bureau of the Ministry of Economic Affairs Employee Consumer Cooperative Printed Magic 968 4 A7 ___ B7 V. Explanation of the invention (6) Degree of easy connection) and JIS-C-5102 The detailed results of the connection between JIS-C-5102. As shown in Figure 3, the thickness of the silicone resin coating film is 10 A to 1 〇 〇〇A, it can meet the characteristics of both the drop-out and solderability of epoxy resin. In the extremely thin range of silicone resin film below 1000A, the surface tension between the wire and the molten solder will exceed the lithone on the surface of the wire The surface tension of the film. Therefore, 'the solderability can be satisfied> "A thickness less than 10 A is insufficient to form a silicone film and cannot exhibit epoxy releasability" On the other hand, if the thickness of the silicone resin exceeds 300 people, the solder is full The wet test (Meines table method) tends to reduce solder turbidity (it takes time to wet the solder). Therefore, if soldering is performed for a short period of time, the thickness of the film thickness of Shi Xiyu resin is about 50 to 300A. should. As described above, it is a feature of this embodiment that a moldable resin is molded on a lead wire, and electrical connection is secured in a short time. Next, the materials used in this embodiment will be described using the chemical formulas shown in Figs. 4A and 4B. The two chemical formulas shown in FIG. 4 represent the reactive polysiloxane, which is the main component of the silicone resin used in this embodiment. After adding a platinum complex catalyst as the main component to the two types of reactive polysiloxanes shown in Figure 4, the silicone resin with methyl groups is formed on the surface of the wire after being coated on the wire. Floor. Fig. 5 shows an estimated mechanism of the epoxy resin mechanism of the silicon snapper resin. As shown in Fig. 5, since the fluorene group in the silicone resin faces the surface side, it is estimated that the epoxy resin can be dropped off. In addition, although a silicone resin is used for the surface treatment in this embodiment, the surface treatment material of the lead wire used in the present invention is not limited to the silicone tree. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297). Mm) .〇- — I! — — — — 0 — llllllt (please read “Notes on the back ^ before filling out this page) 4196 84 A7 B7 Printed by the Consumers’ Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 7) Fat. For other surface treatment materials, a fluororesin containing a fluoroalkyl group in the structure, a wax containing a high fatty acid or the like as a main component, or a mixture containing these can be used, and the same effects as those of this embodiment can be obtained. [Second Specific Example] Next, a method for manufacturing a lead wire according to the present invention will be described with reference to Fig. 6. In Fig. 6, 'A is a container for holding a lead, and B is a lead for holding. (: It is a treatment liquid, which is added to a 3 weight percent methylbenzyl solution of the two reactive polysilicon gas burners shown in Figure 4, and 6 weight percent of a platinum complex-based catalyst is toluene. Dilute the solution 100 times. Put the above-mentioned treatment solution into the container to impregnate the wire for 30 minutes. Then, discharge the above-mentioned treatment solution, at this time, attach the treatment solution to the surface of the wire. Then, after the treatment solution is discharged, it is left at room temperature After drying for about 60 minutes, the container was directly placed in a thermostatic bath and thermally cured at 100 ° C for about 100 minutes. With this, if the concentration of the reactive polysiloxane was increased, the formed silicone resin was The 臈 becomes thicker, and if the concentration is reduced, the film becomes thinner. According to my experiments, when the concentration of the reactive polysiloxane is 1.5 to 5% by weight, the ideal result described in Embodiment 1 is obtained. 〔3rd Embodiment] Next, another embodiment of the method for manufacturing the lead wire of the present invention will be described with reference to FIG. 7. In FIG. 7, 'a is a processing bath for a solution of silicon brewing 1 and the silicone solution is shown in FIG. 4. Two reactive polysiloxanes 丨 〇〇 Add 2 points of the catalyst with platinum complex as the main component. B is a coating medium made of felt (non-woven fabric), which is used to absorb the processing bath a and apply to the wire. (; For the surface (please read the precautions on the back before filling this page) -1 ^ 11 11111 Order -11! 111 — *
i —a I « I u -n ϋ I n 1 n J . 本纸張尺度適用中國國家標準<CNS>A4规格（2】0 X 297公爱） 10 4I9684 A7 B7___ 五、發明說明（8 ) 成著錄層之導線。當導線*^通過浸潰過*夕酮溶液之毛姑時 ，在導線表面會附著矽酮溶液。d為鑽石製之導線表面之 砑光模（calender die)’而模的直徑與導線直徑大致相同而 呈圓形。附著有碎酮溶液之導線通.過該模時，附著過多的 石夕嗣容液即被剝落’因而連續形成100人之極薄而均句的 矽酮樹脂被模。 在本實施形態中，經由調整導線通過模的速，即可調 節樹脂被模之厚度e 利用本實施形態之製造方法，形成矽酮樹脂被模之導 線之環氧樹脂撥落性及JIS-C-5102所規定之焊接性與實施 形態2之情形同樣良好。 〔第4具體例〕 其次，利用第8至第9囷說明本發明第3實施形態之高 壓用電容器之製造方法。第8圖表示本發明產品之高壓電 容器之一個實施例。在第8圖中，於介電質薄膜ia之兩面 配置有電極2a ’ 2b，其係以金屬箔或喷鍍而成之金屬層所 構成而以一定的間隔配置於長度方向。由此等金屬層所構 成之電極2a，2b係個別地被絕緣之電極而配置成島，而且 電極2b配置成與介電質薄膜la之另一方之面相鄰之兩個金 屬層所形成之電極2c，2d相面對。 電極向外之引出線是至少在開始捲取部或捲取終止部 之—之電極表面溶接具有矽酮樹脂被模之導線。在第8圖 所示的例子中，在捲取開始側溶接導線6a，在捲取終止側 溶接導線6b。電極與導線之電連接是藉溶接部4a及4b進行 本紙張尺度適用中國國家標準（CNS〉A4規格⑵Q χ挪公爱） <請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 -I ^ - — — — I— ^ 1- I I I I ^ I ^ I I β - I 1 I I I - 11 419684 A7 _ -____ __B7__— 五、發明說明（9 ) 0 本實施形態之高壓電容器是以兩面由金屬層所構成之 電極2a ’ 2b ’ 2c ’ 2d等形成之介電質薄膜la與其他介電質 薄膜lc層麼而捲回者，在捲取過程中，由產品的兩端部或 —侧端部可以將導線拉出。第9圖表示將本發明產品之高 壓電容器之樹脂浸潤硬化後之狀態。在浸潤於樹脂時，將 電容器元件之導線以黏合膠帶連接於浸潤模具，將包含導 線之元件整體浸潰於環氧樹脂後，把元件取出，將被浸潤 之環氧樹脂以一定之溫度硬化，以確保樹脂的物理性質。 此時，形成著矽酮樹脂之導線因需要撥落環氧樹脂，在導 線上的環氧樹脂之附著量極少。 此外，一部分附著硬化之環氧樹脂5a呈球形，與導線 之附著強度極小。因此，用对隆，duracon或非織布等夾 入導線，在導線方向擦拭數次，即可以簡易地除去附著的 環氧樹脂" 表1表示要除去具有矽酮樹脂被模之導線與沒有矽酮 樹脂被模之導線上所附著之環氧樹脂球所需要之力道（單 位：公斤）。 {請先閲讀背面之注意事項再填wif頁) — — — — — —— « — — 111 I I 1 I . 經濟部智慧財產局員工消費合作社印製 表 1 樣本號瑪 1 2 3 平均值 有矽酮樹脂被模 0.10 0.15 0.12 0.14 無矽酮樹脂被膜 1.5 3.5 2.8 2.6 12 本紙張又度適用中國國家標準（CNS)A4規格<2〗〇x 297公釐） 4 196 84 A7 ___ B7 五、發明說明（10) (請先閲讀背y之注意事項再填寫本頁) 由表1可知’要去除形成有矽酮樹脂被模之導線之附 著樹脂所需要的力道為未塗布品的10%以下，即可以用手 指頭可以去除之容易程度。因此，在本實施形態令，不對 導線造成任何傷害即可除去上述之樹脂球。與此相對的， 如使用上述沒有矽酮樹脂被模導線之電容器以機械方法去 除附著樹脂時，導線表面產生許多傷痕。 利用本實施形態所製造之電容器導線之焊接性顯示了 實施形態2之同樣的良好結果。 說明本實施形態時，雖然特別針對高壓電容器之實施 例加以敘述，但是在一般附有導線之薄膜電容器上使用事 先形成有脫模性之有機絕緣樹脂被模之導線，同樣地有容 易將製造電容器時所附著導線之多餘浸潤樹脂及外塗樹脂 加以去除之效果，本發明並非侷限於高壓電容器。 如上所述，依據本發明以收電容器之導線之容器為單 位，或在導線之製造工程中連續處理以形成樹脂被模，所 以浸潤樹脂時附著於導線之樹脂被模之量少。又，因要除 去附著之樹脂容易，故可以獲得充分的電容器特性與提高 對外部電極之電導通性之薄膜電容器。 經濟部智慧財產局員Η消費合作社印製 此外’在上述說明中主要針對電容器加以說明，但是 本發明之導線並不揭限於薄膜電池，對於陶吏電容器，固 體電解容器’氧化金屬被膜電阻器等須以樹脂浸潤或樹脂 被覆確保可靠性之附導線電子零件全部可以有效應用自不 待言。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公楚） 13 A7 經濟部智慧財產局員工消費合作社印製 4 19684 _B7 五、發明說明（11) 元件標號 la，lb…電介質薄膜 b…塗佈媒趙 2a，2b，2c，2d…電極 c…導線 2A…軟鋼系 d…呀光模 2B…錢銅層 3a，3b···導線 2C…塗焊錫層 4 a，4 b…溶接部 2D…矽酮樹脂被模 a，C2，C3...C8···電容器 A…容器 VI，V2，V3…V8.“ 電壓 B…導線 5a…環氧樹脂 C…處理液 6a…起捲側溶接導線 a…處理浴 6b…終捲側溶接導線 (請先閲讀背面之注意事項再填寫本頁)i —a I «I u -n ϋ I n 1 n J. This paper size is applicable to Chinese national standard < CNS > A4 specification (2) 0 X 297 public love) 10 4I9684 A7 B7___ V. Description of invention (8) Leads into the recording layer. When the wire is passed through the hair impregnated with the ketone solution, a silicone solution will adhere to the surface of the wire. d is a calender die 'on the surface of the wire made of diamond, and the diameter of the die is approximately the same as the diameter of the wire and is circular. The wire with the broken ketone solution passed through it. When passing through the mold, too much Shi Xiyu's liquid was peeled off ', thus forming a very thin and uniform silicone resin mold for 100 people. In this embodiment, the thickness of the resin mold can be adjusted by adjusting the speed of the wire passing through the mold. Using the manufacturing method of this embodiment, the epoxy resin drop-out property and JIS-C of the silicone resin mold wire can be adjusted. The weldability specified by -5102 is as good as that in the second embodiment. [Fourth specific example] Next, a method for manufacturing a high-voltage capacitor according to a third embodiment of the present invention will be described using the eighth to the ninth. Fig. 8 shows an embodiment of the high-voltage capacitor of the product of the present invention. In Fig. 8, electrodes 2a '2b are arranged on both sides of the dielectric thin film ia, which are formed of a metal foil or a metal layer formed by thermal spraying, and are arranged in the longitudinal direction at regular intervals. The electrodes 2a, 2b composed of such metal layers are individually arranged as islands by insulated electrodes, and the electrodes 2b are arranged as electrodes formed by two metal layers adjacent to the other side of the dielectric thin film la 2c, 2d face each other. The lead-out wire of the electrode is a wire with a silicone resin mold welded on the electrode surface at least at the beginning of the winding part or the winding end part. In the example shown in Fig. 8, the wire 6a is fused on the winding start side and the wire 6b is fused on the winding end side. The electrical connection between the electrode and the wire is carried out through the fusion joints 4a and 4b. This paper is in accordance with the Chinese national standard (CNS> A4 size ⑵Q χ Norwegian public love) < Please read the notes on the back before filling this page) Intellectual property of the Ministry of Economic Affairs Printed by the Bureau ’s Consumer Cooperative—I ^-— — — I— ^ 1- IIII ^ I ^ II β-I 1 III-11 419684 A7 _ -____ __B7 __— V. Description of the invention (9) 0 High pressure of this embodiment Capacitors are rolled up with a dielectric film la and other dielectric films lc formed by electrodes 2a '2b' 2c '2d and the like composed of metal layers on both sides. During the winding process, the two End or-The side end can pull the wire out. Fig. 9 shows a state in which the resin of the high-voltage capacitor of the product of the present invention is wet-hardened. When wetting in resin, connect the lead wire of the capacitor element to the infiltration mold with adhesive tape, immerse the whole element containing the lead wire in epoxy resin, take out the element, and harden the wetted epoxy resin at a certain temperature. To ensure the physical properties of the resin. At this time, the epoxy resin formed on the conductive wire formed by the silicone resin needs to be pulled off, and the amount of epoxy resin adhered to the conductive wire is extremely small. In addition, a part of the adhesion-hardened epoxy resin 5a has a spherical shape, and the adhesion strength to the wire is extremely small. Therefore, it is easy to remove the attached epoxy resin by sandwiching the wires with a pair of dulcon, duracon, or non-woven cloth, and wiping it several times in the direction of the wires. The force required for the epoxy ball attached to the wire of the silicone resin mold (unit: kg). {Please read the precautions on the back before filling out the wif page) — — — — — — — «— — 111 II 1 I. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economics 1 Sample No. Ma 1 2 3 The average value is silicon Ketone resin mold 0.10 0.15 0.12 0.14 Silicone-free resin film 1.5 3.5 2.8 2.6 12 This paper is again applicable to China National Standard (CNS) A4 specifications < 2〗 〇x 297 mm 4 196 84 A7 ___ B7 V. Invention Note (10) (Please read the precautions on the back of this page before filling in this page.) From Table 1, you can see that the force required to remove the adhesion resin on the wire where the silicone resin mold is formed is 10% or less of the uncoated product. That is how easy it can be removed with your fingers. Therefore, in this embodiment, the resin balls described above can be removed without causing any damage to the wires. In contrast, when the above-mentioned capacitors without a silicone resin molded lead are mechanically removed from the resin, a lot of scratches are generated on the surface of the lead. The solderability of the capacitor lead manufactured by this embodiment shows the same good results as in the second embodiment. In the description of this embodiment, although an example of a high-voltage capacitor is specifically described, generally, a film capacitor with a lead wire is formed by using a lead wire having a moldability of an organic insulating resin mold formed in advance, and it is similarly easy to manufacture the capacitor. The effect of removing excess wetting resin and overcoating resin on the attached wires at this time is not limited to high-voltage capacitors. As described above, according to the present invention, the container of the lead wire of the capacitor is used as a unit, or the resin is continuously molded during the manufacturing process of the lead wire, so that the amount of the resin die adhered to the lead wire when the resin is wetted is small. In addition, since it is easy to remove the adhered resin, it is possible to obtain a thin film capacitor having sufficient capacitor characteristics and improved electrical conductivity to external electrodes. Printed by a member of the Intellectual Property Bureau of the Ministry of Economic Affairs and printed by a consumer cooperative. In addition, in the above description, capacitors are mainly described, but the wire of the present invention is not limited to thin film batteries. It is needless to say that all the electronic components with lead wires that are impregnated with resin or covered with resin can be used effectively. This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297). 13 A7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 4 19684 _B7 V. Description of the invention (11) Component designation la, lb ... Dielectric film b … Coating media 2a, 2b, 2c, 2d… electrode c… lead 2A… soft steel system d… light mold 2B… copper layer 3a, 3b ·· conductor 2C… coated solder layer 4 a, 4 b… weld 2D ... silicone resin molds a, C2, C3 ... C8 ... capacitor A ... container VI, V2, V3 ... V8. "Voltage B ... lead 5a ... epoxy resin C ... processing liquid 6a ... roll up Side welding wire a ... Processing bath 6b ... Finally winding the side welding wire (please read the precautions on the back before filling this page)
.I 111 1 [ I ---I---ii — V I n n L* f . 本紙張尺度適用中國國家標準（CNS)A4規格（2〗0 X 297公釐） 14.I 111 1 [I --- I --- ii — V I n n L * f. This paper size applies to China National Standard (CNS) A4 (2〗 0 X 297 mm) 14