KR100582798B1 - Film capacitor and lead wire - Google Patents

Abstract

The electronic component of this invention uses the lead wire in which the resin film of uniform mold release property of average thickness of 10 micrometers-1000 micrometers was formed as a lead wire for external drawing. The said resin film is formed by directly immersing a lead wire in the liquid resin or the solution which diluted the resin with the solvent, removing a solvent, and heating a lead wire after that. In another manufacturing method of the lead wire of this invention, the resin film of a releasability is formed continuously in the middle of the manufacturing process of a lead wire. Using the lead wire of this invention improves the connection reliability of an electronic component. In particular, the film capacitor has the effect of improving the withstand voltage and increasing the connection reliability of the lead wire to the electronic device terminal.

Description

Electronic component, lead wire and lead wire manufacturing method, and manufacturing method of electronic component {FILM CAPACITOR AND LEAD WIRE}             

1 is a cross-sectional view of the lead wire for electrode extraction according to an embodiment of the present invention,

2 is a view showing a comparison between the conventional lead wire surface and the wet state of the liquid epoxy resin attached to the lead wire surface according to an embodiment of the present invention,

3 is a diagram showing the relationship between the thickness of the silicon film and the epoxy resin of the lead wire and the solderability;

Figure 4a is a view showing the structure of a polysiloxane used in the embodiment of the present invention,

Figure 4b is a view showing the structure of another polysiloxane used in the embodiment of the present invention,

5 is a view showing the structure of a silicone resin used in one embodiment of the present invention,

6 is a view showing a method of manufacturing a lead wire according to an embodiment of the present invention;

7 is a view showing a method of manufacturing a lead wire according to an embodiment of the present invention;

8 is a view showing the configuration of a capacitor according to an embodiment of the present invention;

9 is a view showing a manufacturing method of a capacitor according to an embodiment of the present invention;

10 is a view showing the configuration of a conventional high pressure film capacitor,

11 is an external view after winding of a conventional high pressure film capacitor;

12 is a view showing an equivalent circuit of a conventional high pressure film capacitor,

Fig. 13 is a view showing immersion in impregnating resin of a conventional high pressure film capacitor.

Explanation of symbols for the main parts of the drawings

1a, 1b; Dielectric films 2a, 2b, 2c, 2d; electrode

3a, 3b; Lead wires 4a and 4b; Weld

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component having a lead wire, in particular a capacitor having a lead wire, a lead wire used for the capacitor, and a manufacturing method thereof.

2. Description of the Related Art Conventionally, many electronic components to which lead wires are attached have been used. These electronic components are generally covered with insulating resins such as epoxy resins for the purpose of insulation or device protection.

As an example of the conventional electronic component, the structure of the high voltage capacitor with a lead wire is shown in FIG. Conventional capacitors are disposed on both surfaces of the dielectric film 1a, with electrodes 2a and 2b made of metal foil or metal layers formed by evaporation at predetermined intervals. The electrodes 2a and 2b made of these metal layers are arranged as insulated electrodes, respectively, and the electrodes 2b are made of two metal layers adjacent to each other on the other side of the dielectric film 1a. It is arranged to face). The extraction of the terminal to the outside is performed by welding the lead wires 3a and 3b to the electrode surface at the winding start section and the winding end section. Electrical connection between the electrode and the lead wire is performed at the weld portions 4a and 4b. In the conventional capacitor, the dielectric film 1a constructed as described above and the other dielectric film 1b are stacked and wound, and as shown in FIG. 11, the lead wire is drawn out from both ends or one end of the product. Has a structure to

Lead wire used in this type of capacitor is a copper wire or steel wire as a raw material, and the electrons formed with a thickness of several micrometers to several tens of micrometers or tin (lead-lead) solder on the surface This is a general-purpose lead wire for components, and raw material and surface metal are selected according to the use of the capacitor.

In the condenser configured as described above, as shown in Fig. 12, the condensers C1, C2, C3, ..., C8 are connected in series. In each capacitor C1, C2, C3, ..., C8, V1, V2, V3, ..., in which the voltage Vs applied between the lead wires 3a, 3b is divided. Since V8 is applied, the withstand voltage becomes high and high voltage can be applied to the capacitor.

In addition, this type of capacitor is vacuum impregnated in a liquid thermosetting resin such as an epoxy resin after winding up the device. Fig. 13 shows a condenser element being impregnated with an epoxy resin. The capacitor element is supported by the lead wires 3a and 3b, and impregnated so as to raise a cross section for leading the winding end side lead wire or the winding start side lead wire.

The capacitor element impregnated with the epoxy resin is pulled up after the predetermined impregnation time to cure the resin. By the impregnation operation, the air layer (hereinafter referred to as air void) existing between the dielectric films 1a and 1b is replaced with an epoxy resin, and defects such as pinholes that the dielectric film itself has The part is also compensated and filled by the epoxy resin. By this impregnation operation, the withstand voltage per predetermined thickness of the dielectric can be improved, and the lead wire strength can be improved and the product moisture absorption can be prevented at the same time.

In this way, a small high voltage capacitor having a rated voltage of 10 to 30 KV and an electrostatic capacity of 1000 to 6000 kV and a container is not required. Although the capacitor | condenser of this specification is normally soldered a lead wire to the pin terminal of an electronic device, etc., it is rarely used for the electrical connection by welding and electrically conductive rubber. The electrically connected capacitor is used by embedding it in high pressure resistance resin, such as an epoxy resin.

However, thermosetting resins, such as an epoxy resin, form the rigid resin film of several micrometers in thickness on the lead wire surface by the thermosetting after impregnation. The said resin film is a cause of the poor conduction of a soldering part. In addition, even in the case where an electrical connection is obtained by welding or contact using a conductive rubber, the resin film is a cause of poor conduction.

Therefore, as a countermeasure, there is a method in which a lead wire is immersed in a solder bath to decompose a resin film and form a solder layer again. However, in the above countermeasures, it is necessary to simultaneously remove the firm epoxy film and form the solder layer, which takes time and lowers the productivity.

In order to fundamentally solve the conduction defect, it is necessary to completely remove or not adhere the epoxy film on the lead wire. Although there is a method of forcibly removing the resin by an abrasive or the like for removing the resin, not only complete removal is difficult, but also the solder layer on the surface of the lead wire is broken, and the solderability may decrease. Moreover, the lead wire may be cut | disconnected at the time of removal.

Therefore, a method of preventing or reducing adhesion of the resin is also devised by applying a mold release resin to the surface of the lead wire. However, when a mold release agent is attached in the cross section or the circumferential direction of the capacitor element, the impregnation of the resin becomes poor and the breakdown voltage characteristics of the capacitor decrease.

That is, in a conventional film capacitor, especially a high voltage capacitor, how to realize both the improvement of the breakdown voltage of the capacitor, the miniaturization, and the conductivity of the lead wire at low cost is a problem. An object of the present invention is to reduce the amount of resin deposited on a lead wire in an electronic component that requires resin impregnation, which is represented by a film capacitor, particularly a film capacitor for high pressure, and to facilitate removal of the resin film, It aims to secure the reliability of electronic components and improve solderability.

The electronic component of this invention forms the mold release resin film which has an average thickness of 10 micrometers or more and 1000 micrometers or less on the surface of a lead wire. As said resin film, resin containing the hardened | cured material of reactive polysiloxane, and resin containing fluorocarbon in at least one part of a structure are suitable. In the method for producing a lead wire according to the present invention, the lead wire is directly immersed in a liquid insulation resin or a solution in which the liquid insulation resin is diluted, or the lead wire is applied to a continuous lead wire after applying the liquid insulation resin or a solution in which the liquid insulation resin is diluted. It is prepared by heating. By using this lead wire as a terminal of an electronic component, electrical connection to an electronic device of an electronic component is ensured.

The above and other objects, features, aspects, advantages, and the like of the present invention will become more apparent from the following detailed embodiments described with reference to the accompanying drawings.

(Example 1)

Embodiment 1 of the present invention will be described with reference to FIG.

Fig. 1 shows a cross section of the lead wire of the first embodiment of the present invention. The raw material is a mild steel wire, and the diameter of the steel wire is 0.5 mm. A copper plating layer 2B having a thickness of 30 μm and a solder plating layer 2C having a thickness of 10 μm are formed on the outer circumference of the mild steel wire 2A. The copper plating layer 2B and the solder plating layer 2C are formed to a predetermined thickness by the electroplating method after the extension process of the lead wire. Code | symbol 2D is a silicone resin film, It is formed by the manufacturing method mentioned later, and average thickness is 100 microseconds.

Next, FIG. 2 shows the wet state of the lead epoxy wire on which the silicon film is not formed and the liquid epoxy adhering to the lead wire surface on which the silicon film is formed. In Fig. 2, rs1 is the surface tension between the lead wire and the epoxy, rs is the surface tension of the lead wire, r1 is the surface tension of the liquid epoxy resin, and θ is the contact angle. The contact angle with an epoxy resin increases in the lead wire surface in which the silicon film was formed. That is, in the lead wire used in the present embodiment, since the silicon film is formed on the surface, it is in a state where the epoxy resin is easily rejected.

Next, the thickness of the silicone resin film was changed between 1 kPa and 10000 kPa in FIG. 3 to evaluate the lead epoxy resin property (easiness of discharging epoxy resin) and the solderability of JIS-C-5102. Results are shown. As apparent from FIG. 3, when the coating film thickness of the silicone resin was 10 kPa to 1000 kPa, the results satisfying both the foot epoxy resin properties and the solderability were obtained.

In a very thin range in which the silicone resin film is 1000 kPa or less, since the surface tension between the lead wire and the molten solder exceeds the surface tension of the silicon film on the lead wire surface, solderability can be satisfied. In the thickness of 10 GPa or less, the formation of the silicone film is insufficient, and foot epoxy properties cannot be exhibited.

On the other hand, when the thickness of the silicone resin exceeds 300 kPa, the solder wettability in the solder wettability test (Menesco graph method) tends to decrease (it takes time to wet the solder), and therefore soldering is performed in a short time. When it does, it is preferable to make the film thickness range of a silicone resin into about 50-300 GPa.

In this way, it is a feature of this embodiment that an electrical connection can be secured by soldering for a short time while forming a releasable resin film on the lead wire.

Next, the materials used in this embodiment will be described using the chemical formulas shown in Figs. 4A and 4B. The two chemical formulas shown in FIG. 4 represent reactive polysiloxanes which are main components of the silicone resin used in this embodiment. After adding and stirring the catalyst which has a platinum complex as a main component to the two reactive polysiloxanes shown in FIG. 4, apply | coating to a lead wire forms the silicone resin layer which has a methyl group on the lead wire surface.

The estimated figure of the foot epoxy resin mechanism of a silicone resin film is shown in FIG. As shown in FIG. 5, it is estimated that the methyl group in the silicone resin is directed to the surface side, thereby excluding the epoxy resin.

In addition, although the silicone resin was used for the surface treatment of a lead wire in this Example, the surface treatment material of the lead wire used for this invention is not limited to a silicone resin. As another surface treatment material, even when using a fluorine-based resin having a fluoroalkyl group in its structure, a wax mainly containing a higher fatty acid or the like, or a mixture containing them, the same effects as in the present embodiment can be obtained.

(Example 2)

Next, the manufacturing method of the lead wire of this invention is demonstrated using FIG.

In FIG. 6, A is a container which accommodates a lead wire, and B is a stored lead wire. C is a treatment liquid obtained by adding 6 wt% of a solution obtained by diluting a catalyst containing a platinum complex as a main component 100 times with toluene to a 3 wt% toluene solution of two reactive polysiloxanes shown in FIG. 4. The processing liquid is put in the container A, and the lead wire is immersed for 30 minutes. Next, the above treatment liquid is discharged, at which time the treatment liquid adheres to the lead wire surface. After the treatment liquid is discharged, it is dried at room temperature for about 60 minutes, then placed in a thermostatic bath with a container and thermosetted at a temperature of 100 ° C. for about 100 minutes. Thereby, reaction of a reactive polysiloxane and a catalyst advances and the silicone resin film of average thickness of 100 GPa is formed uniformly.

When the concentration of the reactive polysiloxane in the treatment liquid is increased, the formed silicone resin film becomes thick, and when the concentration is decreased, the film becomes thin. According to our experiments, the preferred results described in Example 1 were obtained when the concentration of the reactive polysiloxane was 1.5 to 5% by weight.

(Example 3)

Next, another Example of the manufacturing method of the lead wire of this invention is demonstrated using FIG.

In Fig. 7, a is a treatment bath composed of a silicon solution in which two parts of the reactive polysiloxane shown in Fig. 4 are added with two parts of a catalyst containing platinum as a main component. b sucks a process bath a with the coating medium which consists of a felt (nonwoven fabric), and apply | coats to a lead wire. c is a lead wire in which the solder plating layer was formed in the surface. As the lead wire c passes through the felt in which the silicon solution is soaked, the silicon solution adheres to the lead wire surface. d is a glossy die on the surface of the diamond lead wire, and the die diameter is almost the same as the lead wire diameter. By passing the die through the lead wire with the silicon solution, the excessively attached silicon solution falls off, and an extremely thin and uniform silicone resin film of 100 Å is continuously formed. In this embodiment, the thickness of the resin film can be adjusted by adjusting the speed at which the lead wire passes through the dice.

The foot epoxy resin property of the lead wire in which the silicone resin film was formed by the manufacturing method of this Example, and the solderability by JIS-C-5102 were favorable similarly to the case of Example 2.

(Example 4)

Next, the manufacturing method of the high pressure capacitor of Example 3 of this invention is demonstrated using FIGS. Fig. 8 shows one embodiment of the high pressure capacitor of the present invention. In FIG. 8, the electrodes 2a and 2b which consist of metal foil or the metal layer formed by vapor deposition are arrange | positioned at the both sides of the dielectric film 1a, maintaining the predetermined space | interval in the longitudinal direction. The electrodes 2a and 2b made of these metal layers are arranged in island shapes as insulated electrodes, respectively, and the electrodes 2b are made of two metal layers adjacent to each other on the other side of the dielectric film 1a. It is arrange | positioned so that the electrode 2c, 2d may be opposed.

The extraction of the electrode to the outside is performed by welding a lead wire having a silicone resin film on the surface of the electrode to at least one of the winding start section and the winding end section. In the example shown in FIG. 8, the lead wire 6a is welded to the winding start part side, and the lead wire 6b is welded to the winding end part side. Electrical connection between the electrode and the lead wire is performed at the weld portions 4a and 4b.

The high voltage capacitor according to the present embodiment is obtained by laminating (winding) a dielectric film 1a on which both surfaces of the electrodes 2a, 2b, 2c, 2d and the like formed of metal layers and other dielectric films 1b are stacked and wound. In the structure, the lead wire is drawn outward from both ends or one end of the product. Fig. 9 shows a state after the impregnation curing of the resin of the high pressure capacitor of the invention. At the time of resin impregnation, the lead wire of the capacitor element is attached to the jig for impregnation with an adhesive tape, the whole element including the lead wire is immersed in an epoxy resin, and then the element is pulled up to impregnate the impregnated epoxy resin. It is cured at the temperature of to secure the resin properties. At this time, since the lead wire in which the silicone resin was formed rejects the epoxy resin, the amount of adhesion of the epoxy resin to the lead wire is extremely small.

In addition, the partially bonded and cured epoxy resin 5a has a spherical shape, and the adhesion strength with the lead wire is extremely small. For this reason, the attached epoxy resin can be easily removed by inserting a lead wire with nylon, a juracon, a nonwoven fabric, etc., and rubbing several times in the longitudinal direction of a lead wire.

In Table 1, the force required for the removal of the epoxy resin sphere attached to the lead wire with a silicone resin film and the lead wire without a silicone resin film is shown (unit: kg).

Sample number One 2 3 medium If there is silicone resin film 0.10 0.15 0.12 0.14 Without silicone resin film 1.5 3.5 2.8 2.6

As can be seen from Table 1, the force required for the removal of the adhesive resin of the lead wire on which the silicone resin film was formed is 10% or less of the uncoated article, and the strength is such that the fingertip can be easily removed. As a result, in this embodiment, the resin sphere could be removed without causing any injury to the lead wires. On the other hand, in the capacitor | condenser which used the lead wire which does not have the said silicone resin film, when the adhesive resin was mechanically removed, a remarkable damage | wound appeared on the lead wire surface.

The solderability of the lead wire of the capacitor manufactured by this example showed good results as in the case of Example 2.

In the description of the present embodiment, the embodiment of the high-pressure capacitor has been described in particular, but in the case of a general film capacitor with a lead wire, it is similarly attached at the time of capacitor manufacture by using a lead wire in which an organic insulating resin film of a releasability is formed in advance. There is an effect that the excess resin to the lead wire of the impregnated resin and the exterior resin can be easily removed, and the present invention is not limited to the high pressure capacitor.

As described above, according to the present invention, the lead wire of the capacitor is continuously processed in the container unit or in the manufacturing process of the lead wire to form a resin film, whereby the amount of adhesion of the resin film on the lead wire during resin impregnation is reduced. In addition, since the attached resin can be easily removed, a film capacitor having sufficient capacitor characteristics and electrical conductivity to an external electrode can be obtained.

In the above description, the film capacitor is mainly described. However, the lead wire of the present invention is not limited to the film capacitor, and it is to ensure reliability by resin impregnation or resin coating such as a ceramic capacitor, a solid electrolytic capacitor, and a metal oxide film resistor. It goes without saying that the present invention can be efficiently applied to an entire electronic component with a lead wire.

As mentioned above, although the invention made by this inventor was demonstrated concretely according to the said Example, this invention is not limited to the said Example and can be variously changed in the range which does not deviate from the summary.

Claims (17)

An electronic component comprising at least one lead wire having a lead-release resin film having an average thickness of 10 mW to 1000 mW. The method of claim 1, The electronic component is a capacitor or a resistor. The method of claim 2, The electronic component whose said capacitor is a film capacitor. The method of claim 1, And the resin film comprises at least one selected from a resin comprising a cured product of a reactive polysiloxane, a resin containing a fluoroalkyl group in at least part of the structure, a wax, or a mixture thereof. Lead wire in which the resin film of the releasability of 10 micrometers or more and 1000 micrometers or less of average thickness was formed in the surface. The method of claim 5, wherein And wherein said resin coating comprises at least one selected from a resin comprising a cured product of a reactive polysiloxane, a resin containing a fluoroalkyl group in at least part of the structure, a wax, or a mixture thereof. A lead wire comprising a conductive core material, a solderable layer formed on the surface of the core material, and a resin film of a releasability having an average thickness of 10 kPa or more and 1000 kPa or less formed on the surface of the solderable layer. The method of claim 7, wherein A lead wire in which the solderable layer is made of tin or an alloy thereof. The method of claim 7, wherein And wherein said resin coating comprises at least one selected from a resin comprising a cured product of a reactive polysiloxane, a resin containing a fluoroalkyl group in at least part of the structure, a wax, or a mixture thereof. A step of immersing the lead wire in a solution obtained by diluting a liquid resin or a releasable resin with a solvent in a container; Removing the solvent from the container; Heating the lead wire to form a resin film of a releasability having an average thickness of 10 kPa or more and 1000 kPa or less on the surface; Method for producing a lead wire comprising a. The method of claim 10, And the resin film comprises at least one selected from a resin comprising a cured product of a reactive polysiloxane, a resin containing a fluoroalkyl group in at least part of the structure, a wax, or a mixture thereof. Applying a lead-diluted solution of a releasable resin or a resin precursor thereof to a solvent; Passing the lead wire through a die having an inner diameter substantially equal to that of the lead wire; Removing the solvent from the lead wire; Heating the lead wire Consist of, The manufacturing method of the lead wire which continuously forms the resin film of the releasability whose average thickness is 10 GPa-1000 GPa on the surface of the said lead wire outermost circumference metal layer. The method of claim 12, And the resin film comprises at least one selected from a resin comprising a cured product of a reactive polysiloxane, a resin containing a fluoroalkyl group in at least part of the structure, a wax, or a mixture thereof. The method of claim 12, The thickness of the said resin film is a manufacturing method of the lead wire adjusted by the conveyance speed of the dice | dies and lead wire provided in the process. A step of connecting a lead wire having a resin film of a releasability having an average thickness of 10 GPa to 1000 GPa to an electrode of the electronic component, and Resin impregnating the electronic component; Curing the impregnated resin, A step of mechanically removing the resin attached to the lead wire by the resin immersion after curing of the impregnated resin. Method of manufacturing an electronic component comprising a. The method of claim 15, The manufacturing method of an electronic component whose said electronic component is a capacitor | condenser. The method of claim 10, The average thickness is controlled by the concentration of the solution.

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