TW415709U - Connector assembly for accommodating BGA-style components - Google Patents

Connector assembly for accommodating BGA-style components

Info

Publication number
TW415709U
TW415709U TW87217163U TW87217163U TW415709U TW 415709 U TW415709 U TW 415709U TW 87217163 U TW87217163 U TW 87217163U TW 87217163 U TW87217163 U TW 87217163U TW 415709 U TW415709 U TW 415709U
Authority
TW
Taiwan
Prior art keywords
bga
accommodating
connector assembly
style components
style
Prior art date
Application number
TW87217163U
Other languages
English (en)
Inventor
Ryu Maeda
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Publication of TW415709U publication Critical patent/TW415709U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2485—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point for contacting a ball
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Connecting Device With Holders (AREA)
TW87217163U 1997-10-17 1998-10-28 Connector assembly for accommodating BGA-style components TW415709U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30350197A JP4085186B2 (ja) 1997-10-17 1997-10-17 Ｂｇａソケット

Publications (1)

Publication Number Publication Date
TW415709U true TW415709U (en) 2000-12-11

Family

ID=17921738

Family Applications (1)

Application Number Title Priority Date Filing Date
TW87217163U TW415709U (en) 1997-10-17 1998-10-28 Connector assembly for accommodating BGA-style components

Country Status (3)

Country Link
JP (1) JP4085186B2 (zh)
TW (1) TW415709U (zh)
WO (1) WO1999021227A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103378042A (zh) * 2012-04-27 2013-10-30 三星电机株式会社 半导体封装模块
TWI715200B (zh) * 2019-09-17 2021-01-01 泰可廣科技股份有限公司 導電片與包含導電片之電連接組件

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183483A (ja) * 1998-12-21 2000-06-30 Shinko Electric Ind Co Ltd 電子部品の検査用基板及びその製造方法並びに電子部品の検査方法
JP2001250907A (ja) * 2000-03-08 2001-09-14 Toshiba Corp 半導体装置及びその製造方法
JP2002050717A (ja) * 2000-08-03 2002-02-15 Nec Corp 半導体装置およびその製造方法
JP4079118B2 (ja) 2004-05-11 2008-04-23 オムロン株式会社 異方性導電フィルム
JP2008027773A (ja) * 2006-07-21 2008-02-07 Fujikura Ltd Ｉｃソケットおよびその製造方法
KR20220152807A (ko) * 2021-05-10 2022-11-17 삼성전자주식회사 인쇄 회로 기판 커넥터 및 이를 포함하는 전자 장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2533511B2 (ja) * 1987-01-19 1996-09-11 株式会社日立製作所 電子部品の接続構造とその製造方法
DE68913318T2 (de) * 1988-03-11 1994-09-15 Ibm Elastomerische Verbinder für elektronische Bausteine und für Prüfungen.
US5599193A (en) * 1994-08-23 1997-02-04 Augat Inc. Resilient electrical interconnect
WO1997013295A1 (en) * 1995-10-06 1997-04-10 The Whitaker Corporation Connector and manufacturing method therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103378042A (zh) * 2012-04-27 2013-10-30 三星电机株式会社 半导体封装模块
TWI715200B (zh) * 2019-09-17 2021-01-01 泰可廣科技股份有限公司 導電片與包含導電片之電連接組件

Also Published As

Publication number Publication date
JP4085186B2 (ja) 2008-05-14
WO1999021227A1 (en) 1999-04-29
JPH11121659A (ja) 1999-04-30

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model