TW407857U - Heat conduction structure of flex circuit board - Google Patents

Heat conduction structure of flex circuit board

Info

Publication number
TW407857U
TW407857U TW87200006U TW87200006U TW407857U TW 407857 U TW407857 U TW 407857U TW 87200006 U TW87200006 U TW 87200006U TW 87200006 U TW87200006 U TW 87200006U TW 407857 U TW407857 U TW 407857U
Authority
TW
Taiwan
Prior art keywords
circuit board
heat conduction
flex circuit
conduction structure
flex
Prior art date
Application number
TW87200006U
Other languages
Chinese (zh)
Inventor
Fang-Lin Jau
Original Assignee
Jau Fang Lin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jau Fang Lin filed Critical Jau Fang Lin
Priority to TW87200006U priority Critical patent/TW407857U/en
Publication of TW407857U publication Critical patent/TW407857U/en

Links

TW87200006U 1998-01-02 1998-01-02 Heat conduction structure of flex circuit board TW407857U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW87200006U TW407857U (en) 1998-01-02 1998-01-02 Heat conduction structure of flex circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW87200006U TW407857U (en) 1998-01-02 1998-01-02 Heat conduction structure of flex circuit board

Publications (1)

Publication Number Publication Date
TW407857U true TW407857U (en) 2000-10-01

Family

ID=21632556

Family Applications (1)

Application Number Title Priority Date Filing Date
TW87200006U TW407857U (en) 1998-01-02 1998-01-02 Heat conduction structure of flex circuit board

Country Status (1)

Country Link
TW (1) TW407857U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8368188B2 (en) 2007-11-16 2013-02-05 Stats Chippac Ltd. Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8368188B2 (en) 2007-11-16 2013-02-05 Stats Chippac Ltd. Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees