TW404563U - Utilizing mould sealing glue ball lattice array sealing packaging element - Google Patents

Utilizing mould sealing glue ball lattice array sealing packaging element

Info

Publication number
TW404563U
TW404563U TW88210647U TW88210647U TW404563U TW 404563 U TW404563 U TW 404563U TW 88210647 U TW88210647 U TW 88210647U TW 88210647 U TW88210647 U TW 88210647U TW 404563 U TW404563 U TW 404563U
Authority
TW
Taiwan
Prior art keywords
sealing
packaging element
lattice array
glue ball
utilizing mould
Prior art date
Application number
TW88210647U
Other languages
Chinese (zh)
Inventor
Su Tao
Yu-Ching Tsai
Meng-Huei Lin
Jr-Ming Jung
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW88210647U priority Critical patent/TW404563U/en
Publication of TW404563U publication Critical patent/TW404563U/en

Links

TW88210647U 1999-06-28 1999-06-28 Utilizing mould sealing glue ball lattice array sealing packaging element TW404563U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88210647U TW404563U (en) 1999-06-28 1999-06-28 Utilizing mould sealing glue ball lattice array sealing packaging element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88210647U TW404563U (en) 1999-06-28 1999-06-28 Utilizing mould sealing glue ball lattice array sealing packaging element

Publications (1)

Publication Number Publication Date
TW404563U true TW404563U (en) 2000-09-01

Family

ID=21650124

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88210647U TW404563U (en) 1999-06-28 1999-06-28 Utilizing mould sealing glue ball lattice array sealing packaging element

Country Status (1)

Country Link
TW (1) TW404563U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108327047A (en) * 2018-04-08 2018-07-27 长沙远大住宅工业集团股份有限公司 A kind of rib mould liner, rib mold and prefabricated components production method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108327047A (en) * 2018-04-08 2018-07-27 长沙远大住宅工业集团股份有限公司 A kind of rib mould liner, rib mold and prefabricated components production method
CN108327047B (en) * 2018-04-08 2023-12-26 长沙远大住宅工业集团股份有限公司 Edge blocking die lining, edge blocking die and prefabricated part production method

Similar Documents

Publication Publication Date Title
AU2001288119A1 (en) Epoxy resin molding material for sealing
SG52230A1 (en) Ball grid array plastic package
HK1049466A1 (en) Resin sealing mold
AU141931S (en) Packaging
AU2283801A (en) Microactuator array with integrally formed package
SG75154A1 (en) Plastic ball grid array package
GB9903837D0 (en) Packaging materials
TW404563U (en) Utilizing mould sealing glue ball lattice array sealing packaging element
EP1097808A4 (en) Layered plastic molding
GB2363752B (en) Plastic packaging
GB9913577D0 (en) Packaging array
GB0014237D0 (en) Packaging array
GB0009002D0 (en) Packaging
TW405582U (en) Adhesive free plastic packing box
GB0114461D0 (en) Packaging array
GB2396744B (en) A semiconductor element
GB2356387B (en) Packaging Flowers
GB9812565D0 (en) Packaging array
GB2362351B (en) Extruded packaging material
GB0011567D0 (en) Surface-metallised plastic package and method for fabricating the same
SG83706A1 (en) Die-pad for ball grid array package
GB0003646D0 (en) Packaging film
AU1373600A (en) Packaging element
GB0213775D0 (en) Packaging array
AU4791200A (en) A semiconductor element

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model